EP2724421A1 - Einpresspin für eine elektrische einpressverbindung zwischen einer elektronischen komponente und einer substratplatte - Google Patents
Einpresspin für eine elektrische einpressverbindung zwischen einer elektronischen komponente und einer substratplatteInfo
- Publication number
- EP2724421A1 EP2724421A1 EP12726773.0A EP12726773A EP2724421A1 EP 2724421 A1 EP2724421 A1 EP 2724421A1 EP 12726773 A EP12726773 A EP 12726773A EP 2724421 A1 EP2724421 A1 EP 2724421A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- press
- pin
- substrate plate
- contact hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 15
- 230000007704 transition Effects 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 24
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000003825 pressing Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037427 ion transport Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010053759 Growth retardation Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
- H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
Definitions
- the invention relates to a press-in pin for an electrical press-fit connection between an electronic component and a substrate plate with an electrical contact hole.
- a press-in zone of such a press-in pin is usually covered with a tin layer, which forms a low-resistance metallic contact when pressed into a metallized contact hole of the substrate plate.
- Lead-free tin alloys with a tin content of more than 90% by weight tend to break down mechanical stresses by ion transport to form filamentary monocrystalline whiskers. This involves the risk that the thread-like, several millimeters long whiskers on the
- Substrate plate in particular between adjacent contact areas of electronic components cause short circuits that are not tolerable for electronic components such as ABS or ESP circuits in vehicles.
- whisker formation is also an obstacle
- Tin layers are prevented by a subsequent resin coating of the copper-tin compound, but so that whisker formation is not prevented after a press-fitting of tin-coated Einpastepins an electronic component in a contact hole of a substrate plate. Disclosure of the invention
- the invention provides a press-in pin for an electrical press-fit connection between an electronic component and a substrate plate with electrical contact hole.
- the press-in pin has a press-in pin head which has a press-in head length which is adapted to at least one thickness of the substrate plate.
- a Einpresspinbein extends between the electronic component and the Einpresspinkopf.
- a Einpresspinkragen forms a transition between Einpresspinbein and Einpresspinkopf and has a Arret michsabsatz or a Einpresspinschulter.
- the press-in pin head is coated with a lead-free tin alloy. At least the Einpresspinkragen with the Arret réellesabsatz has an electrically insulating coating.
- the electrical contact hole can be coated with a metal alloy, and the tin alloy of the press-in pin head can be materially bonded during pressing
- Such an electrically insulating coating may comprise a polymer from the group of thermosets which, at a corresponding curing temperature, have a crosslinking of polymer molecular chains and thus can ensure long-lasting protection of the injection pin from whisker formation.
- the coating to be provided above a press-in zone may comprise a non-conductive passivation.
- the coating may e.g. an organic passivation include (OSP, "Organic Surface Protection").
- the electrically insulating coating may be selectively sprayed, dip coated or painted, with at least the locking shoulder and the press-fit head collar being selectively provided with the electrically-insulating coating, but also coatings extending beyond these areas, which may also cover portions of the press-fit head, are suitable for the actual press-fitting harmless, since the shear forces shearing off excess portions of the electrically insulating coating when pressing the Einpresspins in the metallized contact hole and the Zinnlottik of
- the tin content [Sn] of the lead-free tin alloy coating is between 90% by weight ⁇ [Sn] ⁇ 100% by weight.
- the lead-free tin alloy has a thickness d Sn between 5 ⁇ ⁇ d Sn ⁇ 50 ⁇ and can be electrodeposited, dip-coated or physically applied.
- the electrically insulating coating can be made significantly thinner and have a minimum coating thickness d iso of 0.5 ⁇ m. Although there is no limit to the upper limit, it is recommended that the thickness of the insulating coating d iso be between 0.5 ⁇ ⁇ d iso ⁇ 50 ⁇ in order to ensure sufficient clearance between several press-fit pins of a component.
- An efficient electrical press-fit connection can be produced by pressing the press-in pin head of the press-in pin into the contact hole of the substrate plate, for example in the form of a printed circuit board, thereby producing a gas-tight, electrical
- Self-injection pin head itself be included.
- Tin alloy coating is plastically deformed, and the force is absorbed during the pressing mainly from the contact hole of the substrate plate.
- the cross section of a Einpresspinkopfes with solid press-fit is square or polygonal, so that a pressing through the solid edges of this cross-section, for example in a round metallic contact hole a
- the invention offers an advantageous alternative to pure thermal soldering technology in many applications. These advantages are not limited to the fact that a heating step such as a soldering process can be avoided, but due to the shape or elasticity of the Einpresspinkopfes in
- a non-contact electrical connection between the tin coating of the injection pin head and the contact material of the contact hole of the substrate plate can be provided.
- electrically insulating coating is practically the long-term stability for such
- Einpresspinharmen ensured because the thread-like Whisker Struktur is prevented.
- Another advantage of Einpresspins invention is that now for safety-critical applications of electronics, for example, in ABS or ESP systems in motor vehicles, a sufficient long-term stability is ensured, so that can be dispensed with the previously indispensable lead-containing solders.
- whisker growth suppression layers such as nickel, silver or gold coatings may be eliminated.
- whisker growth suppression layers such as nickel, silver or gold coatings
- Fig. 1 is a schematic view of a Einpresspinkopfes a Einpresspins according to a first embodiment of the invention
- Figure 2 is a schematic view of a Einpresspinkopfes a Einpresspins according to a second embodiment of the invention.
- Fig. 3 shows a pair of Einpresspins according to Figure 2 with a connection position of a
- FIG. 4 shows a plurality of the press-fit pins according to FIG. 2 with a plurality of connection positions for connections to an electronic component.
- Fig. 1 shows a schematic view of a Einpresspinkopfes 6 of a Einpresspins 1 according to a first embodiment of the invention.
- the Einpresspinkopf 6 has a length l K , which is adapted to the thickness of a substrate plate shown in Figure 4.
- the tip 25 of the press-fit pin 6 has an oval shape in longitudinal section, which is adapted in its cross section to a press fit to a metallized contact hole of the substrate plate shown in FIG. The oval tip then merges into a shape with a polygonal cross-section.
- a massive press-in zone 21 extends almost over the entire length l K of Einpresspinkopfes 6 and is covered with a layer 20 of a tin alloy 15 having a thickness d Sn between 5 ⁇ ⁇ d Sn ⁇ 50 ⁇ and a proportion of tin [Sn] between 90% by weight ⁇ [Sn] ⁇ 100% by weight.
- Arret michsabsatz or a Einpresspinschulter 14 merges into a Einpresspinbein 7.
- the Einpresspinbein 7 may have any cross-sections. It is crucial that with the help of the Arret michsabsatzes 14, the contact hole in the substrate plate is completely covered, so that when pressing the Einpresspins 1 in the contact hole of the press-in pin 1 is locked on top of the substrate plate.
- at least the Einpresspinkragen 13 and the Arret michsabsatz 14 with an electrically insulating coating 16 are made of a thermosetting plastic in a thickness d iso between 0.5 ⁇ ⁇ d iso ⁇ 50 ⁇ coated.
- FIG. 1 shows a press-fit pin head 6 with a solid press-fit zone 21 in the region of polygonal cross-section, which can form a frictional metallic connection with the metallization of a contact hole with its solid polygonal edges
- a schematic view of a press-in pin head 6 of FIG. 1 shows a press-fit pin head 6 with a solid press-fit zone 21 in the region of polygonal cross-section, which can form a frictional metallic connection with the metallization of a contact hole with its solid polygonal edges
- Einpresspins 2 shown according to a second embodiment of the invention. This second embodiment of the invention differs from the first in which
- Einpresspinkopf 6 has flexible press-in zones 19, so that the press-in force is absorbed by the press-in head 6 and thus of the press-in pin 2 itself and a deformation of the contact hole and thus the substrate plate is avoided.
- Components having the same functions as in FIG. 1 are identified by the same reference symbols in FIG. 2 and are not discussed separately.
- FIG. 3 shows a single pair of press-fit pins 2 according to FIG. 2 with one
- the pair of Einpresspins 2 via a connection hole 28 in the connection position 22 at the
- FIG. 4 shows a plurality of the press-fit pins 2 according to FIG. 2 with a plurality of connection positions 22, 23 and 24 for connections to an electronic component 3, which is here marked with a double-dotted dashed line.
- the substrate plate 4 has metallized contact holes 5, which have a metal alloy 17 on their inner walls.
- the length l K of Elinpresspinkexcellent 6 is adapted to the thickness d of the substrate plate 4.
- the substrate plate 4 itself is made of an insulating circuit board material and has on its top or bottom conductor tracks made of a copper alloy to connect the electronic component 3 with other components via Einpresspinbeine 7 to 12. Due to the high power requirements of the electronic component 3 are here
- the Einpresspinkragen 13 is provided with the Arretianssabsatz 14 with an insulating coating 16, but also a part 18 of the Einpresspinbeine 7 to 12 following the press-fit pin collar 13.
- the press-fit heads 6 of this second embodiment of the press-fit pins 2 are designed such that they yield elastically and flexibly when pressed into a contact hole 5. Thus, the press-in forces are taken over directly by the press-in heads 6 and do not deform the substrate plate 4 or the contact hole 5 of the substrate plate 4.
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011077915A DE102011077915A1 (de) | 2011-06-21 | 2011-06-21 | Einpresspin für eine elektrische Einpressverbindung zwischen einer elektronischen Komponente und einer Substratplatte |
PCT/EP2012/059970 WO2012175286A1 (de) | 2011-06-21 | 2012-05-29 | Einpresspin für eine elektrische einpressverbindung zwischen einer elektronischen komponente und einer substratplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2724421A1 true EP2724421A1 (de) | 2014-04-30 |
EP2724421B1 EP2724421B1 (de) | 2016-11-23 |
Family
ID=46246053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12726773.0A Active EP2724421B1 (de) | 2011-06-21 | 2012-05-29 | Einpresspin für eine elektrische einpressverbindung zwischen einer elektronischen komponente und einer substratplatte |
Country Status (5)
Country | Link |
---|---|
US (1) | US9331412B2 (de) |
EP (1) | EP2724421B1 (de) |
CN (1) | CN103620872B (de) |
DE (1) | DE102011077915A1 (de) |
WO (1) | WO2012175286A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014111772B4 (de) * | 2014-08-18 | 2016-03-24 | Borgwarner Ludwigsburg Gmbh | Sicherung für einen elektrischen Stromkreis sowie Leiterplatte mit einer Sicherung |
DE102014219126A1 (de) * | 2014-09-23 | 2016-03-24 | Continental Automotive Gmbh | Anordnung mit Schaltungsträger für ein elektronisches Gerät |
DE202015008773U1 (de) | 2015-12-22 | 2016-01-28 | Continental Automotive Gmbh | Steckkontakt mit organischer Beschichtung und Leiterplattenanordnung |
DE102016124072B4 (de) * | 2016-12-12 | 2020-07-16 | Te Connectivity Germany Gmbh | Kontakteinrichtung und Anordnung |
US11183779B2 (en) * | 2017-07-12 | 2021-11-23 | ept Holding GmbH & Co. KG | Press-in pin and method for producing same |
DE102018203800B4 (de) * | 2018-03-13 | 2019-11-21 | Te Connectivity Germany Gmbh | Kontaktstift und Anordnung zur Verbindung von elektrischen Leitern aus Kupfer und Aluminium |
DE102018218001B4 (de) * | 2018-10-22 | 2021-09-30 | Schott Ag | Verfahren zur Herstellung eines Anschlussstiftes für Durchführungen, sowie Anschlussstift |
US11296436B2 (en) * | 2019-06-10 | 2022-04-05 | Rohm And Haas Electronic Materials Llc | Press-fit terminal with improved whisker inhibition |
CN111403937A (zh) * | 2020-03-24 | 2020-07-10 | 东莞立德精密工业有限公司 | 金属端子及其制作方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB826634A (en) | 1955-03-10 | 1960-01-13 | British Aluminium Co Ltd | Improvements in or relating to electrolytic reduction cells for the production of aluminium |
US3582978A (en) * | 1969-08-28 | 1971-06-01 | Tektronix Inc | Rivet-shaped electrical lead-through contact |
US4655517A (en) * | 1985-02-15 | 1987-04-07 | Crane Electronics, Inc. | Electrical connector |
DE3936843A1 (de) * | 1989-11-06 | 1990-05-17 | Asea Brown Boveri | Verfahren zur herstellung einer schutzlackierten leiterplatte |
JP3106957B2 (ja) * | 1996-05-27 | 2000-11-06 | 住友電装株式会社 | 基板用コネクタ |
JP4302545B2 (ja) * | 2004-02-10 | 2009-07-29 | 株式会社オートネットワーク技術研究所 | プレスフィット端子 |
JP2005252064A (ja) | 2004-03-05 | 2005-09-15 | Fujikura Ltd | フレキシブル配線基板或いはフレキシブルフラットケーブルとコネクタとの接続部 |
EP1755195A1 (de) * | 2005-08-18 | 2007-02-21 | Franz Broch | Hochstromkontaktelemente mit elastischen Einpresszonen |
US20080057767A1 (en) * | 2006-08-10 | 2008-03-06 | O'rourke Kevin | Electrical adaptor having an anchor |
DE102008004882A1 (de) * | 2008-01-17 | 2009-07-23 | Robert Bosch Gmbh | Einpresskontakt mit einem Sockel, einem Kontaktstift und einem zweiten Stift |
DE102009008118B4 (de) * | 2008-02-08 | 2020-01-30 | Ept Automotive Gmbh & Co. Kg | Verfahren zum Herstellen eines elektrischen Kontakts auf einer Leiterplatte, sowie Einpressstift für das Herstellen eines elektrischen Kontakts auf einer Leiterplatte |
WO2009117639A2 (en) * | 2008-03-20 | 2009-09-24 | Interplex Nas, Inc. | Press fit (compliant) terminal and other connectors with tin-silver compound |
ES2404104T3 (es) | 2008-05-19 | 2013-05-23 | Phoenix Contact Gmbh & Co. Kg | Unidad de contacto y procedimiento para la producción de una unidad de contacto |
DE202008015028U1 (de) * | 2008-11-13 | 2009-03-12 | Bühler Motor GmbH | Elektrischer Antrieb mit einer Leiterplatte |
JP5337520B2 (ja) | 2009-02-13 | 2013-11-06 | 日立オートモティブシステムズ株式会社 | プレスフィットピン、プレスフィットピン接続構造及びその製造方法 |
DE102009047043A1 (de) * | 2009-10-19 | 2011-04-21 | Robert Bosch Gmbh | Lötfreie elektrische Verbindung |
-
2011
- 2011-06-21 DE DE102011077915A patent/DE102011077915A1/de not_active Withdrawn
-
2012
- 2012-05-29 WO PCT/EP2012/059970 patent/WO2012175286A1/de active Application Filing
- 2012-05-29 US US14/127,722 patent/US9331412B2/en not_active Expired - Fee Related
- 2012-05-29 CN CN201280030306.0A patent/CN103620872B/zh active Active
- 2012-05-29 EP EP12726773.0A patent/EP2724421B1/de active Active
Non-Patent Citations (1)
Title |
---|
See references of WO2012175286A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN103620872B (zh) | 2017-10-03 |
WO2012175286A1 (de) | 2012-12-27 |
EP2724421B1 (de) | 2016-11-23 |
US20140113504A1 (en) | 2014-04-24 |
CN103620872A (zh) | 2014-03-05 |
US9331412B2 (en) | 2016-05-03 |
DE102011077915A1 (de) | 2012-12-27 |
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