EP2710295B1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
EP2710295B1
EP2710295B1 EP12720217.4A EP12720217A EP2710295B1 EP 2710295 B1 EP2710295 B1 EP 2710295B1 EP 12720217 A EP12720217 A EP 12720217A EP 2710295 B1 EP2710295 B1 EP 2710295B1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
base part
light source
heat sink
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP12720217.4A
Other languages
German (de)
English (en)
Other versions
EP2710295A1 (fr
Inventor
Michael Eusterbrock
Andreas Miemczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella KGaA Huek and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella KGaA Huek and Co filed Critical Hella KGaA Huek and Co
Priority to PL12720217T priority Critical patent/PL2710295T3/pl
Publication of EP2710295A1 publication Critical patent/EP2710295A1/fr
Application granted granted Critical
Publication of EP2710295B1 publication Critical patent/EP2710295B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device having at least one semiconductor light source and a heat-conducting associated heat sink, wherein the cooling body has a semiconductor light source facing the base part, are formed on the cooling fins, and wherein the cooling body has openings for the passage of cooling air
  • Such a lighting device is off DE 20 2009 001475 U1 known. It has, as a semiconductor light source, a light-emitting diode which is mounted on the underside of a printed circuit board and emits light downwards. The light-emitting diode remote from the rear side of the circuit board is connected in a heat-conducting surface with a arranged over the circuit board heat sink.
  • the heat sink is designed as an elongate bending punched part, which is made of a rectangular piece of sheet metal, whose longitudinal edges are bent to form cooling fins such that the heat sink has an approximately semicircular cylindrical basic shape.
  • the heat sink on a flat base part with a mounting surface for the circuit board and two and two adjoining the longitudinal edges of the base part thereto cooling fins, each with a quarter circle cylindrical section.
  • the heat sink has slit-shaped lower and upper openings. The lower openings are located at the bottom and the upper openings at the upper end of the quarter-circle cylindrical section.
  • US 2010/012058 A1 shows an LED spot, in which a board equipped with LEDs, which is arranged a planar base as a carrier in a housing. Part of the housing is a separate heat sink surrounding the base and thus also the circuit board ring-shaped. To the front, the lamp is completed as usual by a lens.
  • DE 20 2010 004 317 U1 shows an LED light with a heat sink.
  • the heat sink is plugged from the outside onto a housing and has an approximately circular disk-shaped base.
  • cooling fins are attached on the narrow side of the circular disc-shaped base.
  • the lower part of the cooling fins is angled, so that the heat sink as such gives the impression of a pot.
  • the invention has for its object to provide a lighting device of the type mentioned, which allows for compact dimensions effective cooling of the semiconductor light source and thus a correspondingly long life of at least one semiconductor light source.
  • WO 2011/000056 A1 discloses an LED lamp according to the preamble of claim 1, with a housing which is formed as a heat sink.
  • the heat sink has a base with a plane heat input surface via which indirectly the heat emitted by LEDs is coupled.
  • On the back of the base are cooling fins. Between the approach of the cooling fins are ventilation holes in the base.
  • WO 2008/06108 A1 discloses an LED light.
  • the LED lamp sits in a housing with a housing bottom and a frustoconical and thus oblique side wall.
  • the housing is surrounded by a lampshade, wherein between the lampshade and the housing cooling fins may be arranged, which are either part of the housing or the lampshade.
  • the bottom of the lampshade has holes so that cooling air can pass through the channels formed between the cooling fins.
  • CN 2017 48 237 U shows a heat sink with a semiconductor light source facing base to which an oblique side wall is formed.
  • a semiconductor light source facing base to which an oblique side wall is formed.
  • To the base part and the outside of the bevel cooling fins are formed, which extend in the plan view of the base part in transversely arranged directions away from the semiconductor light source. Forward, a reflector is attached to the oblique side wall.
  • WO 2010/107781 A2 shows an LED Leucnte with an LED module, which has an insulating base. Heat is transferred to a heat dissipating plate via a so-called "heat puck" on the underside of the LED module. For cooling, a heat sink is attached to the heat dissipation plate. The heat sink has cooling fins, which are integrally formed on the outside of a hollow profile. The interior of the hollow profile serves as a receptacle for the power supply of the LED.
  • this object is achieved, in particular, by the fact that, in the plan view of the base part, the cooling ribs extend away from the at least one semiconductor light source in directions arranged transversely to one another, and in that the openings are arranged in the base part between the cooling ribs.
  • a chimney effect may then occur during operation of the semiconductor light source between the cooling fins, in which cooling air flows past the cooling fins on a relatively large surface. Since the cooling fins may extend away from the semiconductor light source in directions arranged transversely to one another, the heat emitted by the semiconductor light source can be effectively dissipated on all sides via the cooling fins to the locations which come into contact with the cooling air flow occurring due to the chimney effect.
  • the lighting device therefore allows for compact dimensions effective cooling and thus a long life of the semiconductor light source.
  • the lighting device is preferably used in building interiors. It can also be used for other applications.
  • the at least one semiconductor light source is provided in the plan view of the base part in the center of the heat sink, wherein the cooling fins are arranged approximately radially to the at least one semiconductor light source.
  • the semiconductor light source can be cooled even more effectively.
  • the cooling air flow generated by the chimney effect is preferably passed at a distance from the semiconductor light source to the cooling fins, so that the largest possible surface of the cooling fins can be cooled.
  • the openings are configured as slots, which extend in the plan view onto the base part radially to the at least one semiconductor light source.
  • the cooling air passing through the slots can then flow to a relatively large area of the cooling fins.
  • the base part is designed substantially cup-shaped with a bottom and a side wall, which delimit an inner cavity, wherein the at least one semiconductor light source is arranged in the inner cavity at the bottom of the base part.
  • the inner cavity can also be referred to as a recess.
  • the heat loss occurring during operation of the semiconductor light source via the side walls can be dissipated even more extensive to the ambient air.
  • the semiconductor light source in the inner cavity of the base part is protected against mechanical damage.
  • an optical system for shaping the light emitted by the at least one semiconductor light source is arranged in the inner cavity.
  • the optics can have at least one lens and / or at least one reflector.
  • At least one air passageway is formed between the optics and the inner surface of the sidewall facing the inner cavity, wherein the air passageway is connected to at least one of the openings.
  • the optical system then fulfills a dual function in which on the one hand it serves to direct the light emitted by the semiconductor light source and on the other hand it guides the cooling air flow occurring in the chimney effect so that it flows past the largest possible surface area of the heat sink.
  • the cooling ribs penetrate the bottom and / or the side wall of the base part and come with a on the floor and / or the side wall in the inner cavity projecting portion of the optics to the plant. This allows an even larger surface area of the heat sink.
  • the side wall has a slope at which the inside width of the inner cavity increases, starting from the bottom to the free edge of the side wall remote from the bottom, the openings extending from the bottom to the slope. In this case, virtually all of the cooling air passing through the openings can flow past the cooling fins.
  • An illumination device designated as a whole by 1 has a plurality of semiconductor light sources 2, which are only shown schematically in the drawing and designed as light-emitting diodes, which are each integrated in a semiconductor chip.
  • the semiconductor chips are arranged on a common carrier, which consists of a good heat-conducting material, such as aluminum.
  • the individual semiconductor chips are each connected at their rear side facing away from the emission side in a heat-conductive manner to the carrier.
  • the carrier is connected with its side facing away from the semiconductor chips backside heat-conducting with a arranged above the carrier heat sink 3, which consists of a thermally conductive material, such as aluminum. Of the Carrier comes with its back surface at the bottom of the heat sink 3 to the plant.
  • the heat loss occurring during operation of the illumination device 1 in the semiconductor light sources 2 is introduced from the semiconductor chips of the semiconductor light sources 2 through the carrier into the heat sink 3 and discharged from there to the ambient air.
  • the heat sink 3 As in Fig. 1 and 2 can be seen, the heat sink 3, a cup-shaped base part 4.
  • the base part 4 has in the in Fig. 3 shown supervision on its back an approximately circular outer contour.
  • the base part 4 has a bottom 5 and a side wall 6 connected thereto laterally, which runs around the bottom 5.
  • cooling fins 7 are formed, each extending radially from the center of the base part 4 away to the outside.
  • the cooling fins 7 are arranged in transversely arranged directions around the center of the base part 4.
  • the cooling fins 7 extend in radial planes, which are spanned by the central axis 8 of the base part 4 and radially extending axes.
  • the heat transport direction is schematically indicated by an arrow 9.
  • the cooling fins 7 are spaced apart in the circumferential direction of the base part 4 by lateral gaps.
  • the base part 4 openings 10 for the passage of cooling air.
  • the apertures 10 are configured as slot-shaped wall apertures which extend in radial planes passing through the central axis 8 of the base part 4 and radially extending axes are clamped.
  • Fig. 3 It can be seen that the openings 10 are arranged in the outer region of the heat sink 3 at a distance from the center thereof.
  • the bottom 5 and the side wall 6 define an inner cavity, and that the semiconductor light sources are arranged in the inner cavity at the bottom 5 of the base part 4.
  • an optical system 11 for shaping the light emitted by the semiconductor light sources 2 is arranged in the inner cavity.
  • FIG. 1 It can be seen that an air passageway 12 is formed between the optics 11 and the inner surface of the side wall 6 facing this.
  • the air passage channel 12 has at its lower end to a suction port 13 which extends between the free edge of the side wall 6 and the outer periphery of the optical system 11 in the form of an annular or circular ring segment around the optical system 11.
  • the Lsymmetric maltopskanal 12 is connected to the openings 10.
  • a chimney effect occurs in the air passage channel 12, causing an air flow which flows along the dotted line 14 from the suction opening 13 through the openings 10 past the cooling ribs 7.
  • Fig. 1 is still seen that the cooling fins 7 the bottom 5 and the side wall 6 of the base part 4 penetrated.
  • the optic is spaced from the bottom 5 of the base part 4 by a free space 15 and that the semiconductor light sources 2 are arranged in the free space 15.
  • the drive device for the semiconductor light sources 2 can also be provided in the free space 15.
  • the side wall 6 has an at least segmentally circumferential in the circumferential direction about the central axis 8 slope at which the inside diameter of the inner cavity, starting from the bottom 5 to the from the bottom 5 remote bottom edge of the side wall 6, increases.
  • the openings are located in the bottom 5 and in the slope.
  • cooling fins 7 are connected to one another by a circular bead 16 concentrically surrounding the central axis 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (6)

  1. Installation d'éclairage (1) avec au moins une source lumineuse à semi-conducteur (2) et un élément refroidisseur, dans laquelle
    - l'élément refroidisseur (3) est relié à la source lumineuse à semi-conducteur de manière à conduire la chaleur,
    - l'élément refroidisseur (3) présente une partie de base (4) tournée vers la source lumineuse à semi-conducteurs (2) ;
    - la partie de base (4) est au moins pour l'essentiel en forme de godet avec un fond (5) et une paroi latérale (6) qui délimitant une cavité intérieure, et l'au moins une source lumineuse à semi-conducteurs (2) est disposée dans la cavité intérieure sur le fond (5) de la partie de base (4),
    - la paroi latérale (6) présente une surface inclinée au niveau duquel la largeur d'ouverture de la cavité intérieure augmente à partir du fond (5) et jusqu'au bord libre de la paroi latérale (6) éloigné du fond (5),
    - des ailettes de refroidissement (7) sont formées sur la partie de base (4),
    - l'élément de refroidissement (3) présente des ouvertures (10) pour le passage d'air de refroidissement,
    - les ailettes de refroidissement (7) s'étendent, en vue de dessus sur la partie de base (4), dans des directions perpendiculaires les unes aux autres en s'éloignant de l'au moins une source lumineuse à semi-conducteurs (2),
    - les ouvertures (10) dans la partie de base (4) sont disposées entre les ailettes de refroidissement (7),
    caractérisée en ce que les ouvertures (10) s'étendent du fond (5) jusque dans la surface inclinée.
  2. Installation d'éclairage (1) selon la revendication 1, caractérisée en ce que l'au moins une source lumineuse à semi-conducteurs (2) est prévue, en vue de dessus sur la partie de base (4), au centre de l'élément de refroidissement (3) et en ce que les ailettes de refroidissement (7) sont disposées en position au moins approximativement radiale par rapport à l'au moins une source lumineuse à semi-conducteurs (2).
  3. Installation d'éclairage (1) selon la revendication 1 ou 2, caractérisée en ce que les ouvertures (10) sont conformées comme des fentes et en ce que les fentes s'étendent dans le sens radial, en vue de dessus sur la partie de base (4), jusqu'à l'au moins une source lumineuse à semi-conducteurs (2).
  4. Installation d'éclairage (1) selon l'une des revendications 1 à 3, caractérisée en ce qu'il est prévu dans la cavité intérieure une optique (11) pour mettre en forme la lumière émise par l'au moins une source lumineuse à semi-conducteurs (2).
  5. Installation d'éclairage (1) selon l'une des revendications 1 ou 4, caractérisée en ce qu'au moins un canal de passage d'air (12) est formé entre l'optique (11) et la surface intérieure de la paroi latérale (6) orientée vers la cavité intérieure et en ce que le canal de passage d'air (12) communique avec au moins une des ouvertures (10).
  6. Installation d'éclairage (1) selon l'une des revendications 1 à 5, caractérisée en ce que les ailettes de refroidissement (7) traversent le fond (5) et/ou la paroi latérale (6) de la partie de base (4) et viennent s'appuyer sur l'optique (11) par une partie dépassant dans la cavité intérieure sur le fond (5) et/ou la paroi latérale (6).
EP12720217.4A 2011-05-16 2012-05-14 Dispositif d'éclairage Not-in-force EP2710295B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL12720217T PL2710295T3 (pl) 2011-05-16 2012-05-14 Urządzenie oświetleniowe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011050380.3A DE102011050380B4 (de) 2011-05-16 2011-05-16 Beleuchtungseinrichtung
PCT/EP2012/058930 WO2012156366A1 (fr) 2011-05-16 2012-05-14 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP2710295A1 EP2710295A1 (fr) 2014-03-26
EP2710295B1 true EP2710295B1 (fr) 2015-04-29

Family

ID=46052793

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12720217.4A Not-in-force EP2710295B1 (fr) 2011-05-16 2012-05-14 Dispositif d'éclairage

Country Status (6)

Country Link
EP (1) EP2710295B1 (fr)
DE (1) DE102011050380B4 (fr)
DK (1) DK2710295T3 (fr)
ES (1) ES2543443T3 (fr)
PL (1) PL2710295T3 (fr)
WO (1) WO2012156366A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160201892A1 (en) * 2013-09-02 2016-07-14 Hui Chiang CHEN Lamp Base with Heat Dissipation Structure and Lamp Thereof, and Illumination Device
EP3612771B1 (fr) 2017-04-18 2023-03-22 Nortek Air Solutions Canada, Inc. Systèmes et procédés de refroidissement par évaporation, améliorés par déshydratant

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3885206B2 (ja) 2002-11-11 2007-02-21 胡 龍潭 八行程内燃機関
WO2008061082A1 (fr) * 2006-11-14 2008-05-22 Cree Led Lighting Solutions, Inc. Ensemble moteur d'éclairage
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
DE202009001475U1 (de) 2009-02-06 2009-04-16 Osram Gesellschaft mit beschränkter Haftung Kühlkörper für eine Leuchtvorrichtung
CN201936911U (zh) * 2009-03-16 2011-08-17 莫列斯公司 光学模块及具有光学模块的光学系统
AU2010268692A1 (en) * 2009-07-02 2012-02-02 Associated Controls (Australia) Pty Ltd Cooling for LED illumination device
DE202009005266U1 (de) * 2009-09-10 2009-12-03 Davinci Industrial Inc., Hsinchuang LED-Lampe mit hoher Wärmeabführleistung und Sicherheit
DE202010004317U1 (de) * 2010-03-29 2010-06-10 Chicony Power Technology Co., Ltd., Wu-Ku LED-Leuchte und Kühlkörper
CN201748237U (zh) * 2010-08-31 2011-02-16 史杰 一种led筒灯

Also Published As

Publication number Publication date
DK2710295T3 (da) 2015-08-03
DE102011050380B4 (de) 2014-07-03
DE102011050380A1 (de) 2012-11-22
ES2543443T3 (es) 2015-08-19
EP2710295A1 (fr) 2014-03-26
WO2012156366A1 (fr) 2012-11-22
PL2710295T3 (pl) 2015-10-30

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