EP2710295B1 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
EP2710295B1
EP2710295B1 EP12720217.4A EP12720217A EP2710295B1 EP 2710295 B1 EP2710295 B1 EP 2710295B1 EP 12720217 A EP12720217 A EP 12720217A EP 2710295 B1 EP2710295 B1 EP 2710295B1
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EP
European Patent Office
Prior art keywords
semiconductor light
base part
light source
heat sink
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
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EP12720217.4A
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German (de)
French (fr)
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EP2710295A1 (en
Inventor
Michael Eusterbrock
Andreas Miemczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella KGaA Huek and Co
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Priority to PL12720217T priority Critical patent/PL2710295T3/en
Publication of EP2710295A1 publication Critical patent/EP2710295A1/en
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Publication of EP2710295B1 publication Critical patent/EP2710295B1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device having at least one semiconductor light source and a heat-conducting associated heat sink, wherein the cooling body has a semiconductor light source facing the base part, are formed on the cooling fins, and wherein the cooling body has openings for the passage of cooling air
  • Such a lighting device is off DE 20 2009 001475 U1 known. It has, as a semiconductor light source, a light-emitting diode which is mounted on the underside of a printed circuit board and emits light downwards. The light-emitting diode remote from the rear side of the circuit board is connected in a heat-conducting surface with a arranged over the circuit board heat sink.
  • the heat sink is designed as an elongate bending punched part, which is made of a rectangular piece of sheet metal, whose longitudinal edges are bent to form cooling fins such that the heat sink has an approximately semicircular cylindrical basic shape.
  • the heat sink on a flat base part with a mounting surface for the circuit board and two and two adjoining the longitudinal edges of the base part thereto cooling fins, each with a quarter circle cylindrical section.
  • the heat sink has slit-shaped lower and upper openings. The lower openings are located at the bottom and the upper openings at the upper end of the quarter-circle cylindrical section.
  • US 2010/012058 A1 shows an LED spot, in which a board equipped with LEDs, which is arranged a planar base as a carrier in a housing. Part of the housing is a separate heat sink surrounding the base and thus also the circuit board ring-shaped. To the front, the lamp is completed as usual by a lens.
  • DE 20 2010 004 317 U1 shows an LED light with a heat sink.
  • the heat sink is plugged from the outside onto a housing and has an approximately circular disk-shaped base.
  • cooling fins are attached on the narrow side of the circular disc-shaped base.
  • the lower part of the cooling fins is angled, so that the heat sink as such gives the impression of a pot.
  • the invention has for its object to provide a lighting device of the type mentioned, which allows for compact dimensions effective cooling of the semiconductor light source and thus a correspondingly long life of at least one semiconductor light source.
  • WO 2011/000056 A1 discloses an LED lamp according to the preamble of claim 1, with a housing which is formed as a heat sink.
  • the heat sink has a base with a plane heat input surface via which indirectly the heat emitted by LEDs is coupled.
  • On the back of the base are cooling fins. Between the approach of the cooling fins are ventilation holes in the base.
  • WO 2008/06108 A1 discloses an LED light.
  • the LED lamp sits in a housing with a housing bottom and a frustoconical and thus oblique side wall.
  • the housing is surrounded by a lampshade, wherein between the lampshade and the housing cooling fins may be arranged, which are either part of the housing or the lampshade.
  • the bottom of the lampshade has holes so that cooling air can pass through the channels formed between the cooling fins.
  • CN 2017 48 237 U shows a heat sink with a semiconductor light source facing base to which an oblique side wall is formed.
  • a semiconductor light source facing base to which an oblique side wall is formed.
  • To the base part and the outside of the bevel cooling fins are formed, which extend in the plan view of the base part in transversely arranged directions away from the semiconductor light source. Forward, a reflector is attached to the oblique side wall.
  • WO 2010/107781 A2 shows an LED Leucnte with an LED module, which has an insulating base. Heat is transferred to a heat dissipating plate via a so-called "heat puck" on the underside of the LED module. For cooling, a heat sink is attached to the heat dissipation plate. The heat sink has cooling fins, which are integrally formed on the outside of a hollow profile. The interior of the hollow profile serves as a receptacle for the power supply of the LED.
  • this object is achieved, in particular, by the fact that, in the plan view of the base part, the cooling ribs extend away from the at least one semiconductor light source in directions arranged transversely to one another, and in that the openings are arranged in the base part between the cooling ribs.
  • a chimney effect may then occur during operation of the semiconductor light source between the cooling fins, in which cooling air flows past the cooling fins on a relatively large surface. Since the cooling fins may extend away from the semiconductor light source in directions arranged transversely to one another, the heat emitted by the semiconductor light source can be effectively dissipated on all sides via the cooling fins to the locations which come into contact with the cooling air flow occurring due to the chimney effect.
  • the lighting device therefore allows for compact dimensions effective cooling and thus a long life of the semiconductor light source.
  • the lighting device is preferably used in building interiors. It can also be used for other applications.
  • the at least one semiconductor light source is provided in the plan view of the base part in the center of the heat sink, wherein the cooling fins are arranged approximately radially to the at least one semiconductor light source.
  • the semiconductor light source can be cooled even more effectively.
  • the cooling air flow generated by the chimney effect is preferably passed at a distance from the semiconductor light source to the cooling fins, so that the largest possible surface of the cooling fins can be cooled.
  • the openings are configured as slots, which extend in the plan view onto the base part radially to the at least one semiconductor light source.
  • the cooling air passing through the slots can then flow to a relatively large area of the cooling fins.
  • the base part is designed substantially cup-shaped with a bottom and a side wall, which delimit an inner cavity, wherein the at least one semiconductor light source is arranged in the inner cavity at the bottom of the base part.
  • the inner cavity can also be referred to as a recess.
  • the heat loss occurring during operation of the semiconductor light source via the side walls can be dissipated even more extensive to the ambient air.
  • the semiconductor light source in the inner cavity of the base part is protected against mechanical damage.
  • an optical system for shaping the light emitted by the at least one semiconductor light source is arranged in the inner cavity.
  • the optics can have at least one lens and / or at least one reflector.
  • At least one air passageway is formed between the optics and the inner surface of the sidewall facing the inner cavity, wherein the air passageway is connected to at least one of the openings.
  • the optical system then fulfills a dual function in which on the one hand it serves to direct the light emitted by the semiconductor light source and on the other hand it guides the cooling air flow occurring in the chimney effect so that it flows past the largest possible surface area of the heat sink.
  • the cooling ribs penetrate the bottom and / or the side wall of the base part and come with a on the floor and / or the side wall in the inner cavity projecting portion of the optics to the plant. This allows an even larger surface area of the heat sink.
  • the side wall has a slope at which the inside width of the inner cavity increases, starting from the bottom to the free edge of the side wall remote from the bottom, the openings extending from the bottom to the slope. In this case, virtually all of the cooling air passing through the openings can flow past the cooling fins.
  • An illumination device designated as a whole by 1 has a plurality of semiconductor light sources 2, which are only shown schematically in the drawing and designed as light-emitting diodes, which are each integrated in a semiconductor chip.
  • the semiconductor chips are arranged on a common carrier, which consists of a good heat-conducting material, such as aluminum.
  • the individual semiconductor chips are each connected at their rear side facing away from the emission side in a heat-conductive manner to the carrier.
  • the carrier is connected with its side facing away from the semiconductor chips backside heat-conducting with a arranged above the carrier heat sink 3, which consists of a thermally conductive material, such as aluminum. Of the Carrier comes with its back surface at the bottom of the heat sink 3 to the plant.
  • the heat loss occurring during operation of the illumination device 1 in the semiconductor light sources 2 is introduced from the semiconductor chips of the semiconductor light sources 2 through the carrier into the heat sink 3 and discharged from there to the ambient air.
  • the heat sink 3 As in Fig. 1 and 2 can be seen, the heat sink 3, a cup-shaped base part 4.
  • the base part 4 has in the in Fig. 3 shown supervision on its back an approximately circular outer contour.
  • the base part 4 has a bottom 5 and a side wall 6 connected thereto laterally, which runs around the bottom 5.
  • cooling fins 7 are formed, each extending radially from the center of the base part 4 away to the outside.
  • the cooling fins 7 are arranged in transversely arranged directions around the center of the base part 4.
  • the cooling fins 7 extend in radial planes, which are spanned by the central axis 8 of the base part 4 and radially extending axes.
  • the heat transport direction is schematically indicated by an arrow 9.
  • the cooling fins 7 are spaced apart in the circumferential direction of the base part 4 by lateral gaps.
  • the base part 4 openings 10 for the passage of cooling air.
  • the apertures 10 are configured as slot-shaped wall apertures which extend in radial planes passing through the central axis 8 of the base part 4 and radially extending axes are clamped.
  • Fig. 3 It can be seen that the openings 10 are arranged in the outer region of the heat sink 3 at a distance from the center thereof.
  • the bottom 5 and the side wall 6 define an inner cavity, and that the semiconductor light sources are arranged in the inner cavity at the bottom 5 of the base part 4.
  • an optical system 11 for shaping the light emitted by the semiconductor light sources 2 is arranged in the inner cavity.
  • FIG. 1 It can be seen that an air passageway 12 is formed between the optics 11 and the inner surface of the side wall 6 facing this.
  • the air passage channel 12 has at its lower end to a suction port 13 which extends between the free edge of the side wall 6 and the outer periphery of the optical system 11 in the form of an annular or circular ring segment around the optical system 11.
  • the Lsymmetric maltopskanal 12 is connected to the openings 10.
  • a chimney effect occurs in the air passage channel 12, causing an air flow which flows along the dotted line 14 from the suction opening 13 through the openings 10 past the cooling ribs 7.
  • Fig. 1 is still seen that the cooling fins 7 the bottom 5 and the side wall 6 of the base part 4 penetrated.
  • the optic is spaced from the bottom 5 of the base part 4 by a free space 15 and that the semiconductor light sources 2 are arranged in the free space 15.
  • the drive device for the semiconductor light sources 2 can also be provided in the free space 15.
  • the side wall 6 has an at least segmentally circumferential in the circumferential direction about the central axis 8 slope at which the inside diameter of the inner cavity, starting from the bottom 5 to the from the bottom 5 remote bottom edge of the side wall 6, increases.
  • the openings are located in the bottom 5 and in the slope.
  • cooling fins 7 are connected to one another by a circular bead 16 concentrically surrounding the central axis 8.

Description

Technisches GebietTechnical area

Die Erfindung betrifft eine Beleuchtungseinrichtung mit mindestens einer Halbleiterlichtquelle und einem wärmeleitend damit verbundenen Kühlkörper, wobei der Kühlkörper ein der Halbleiterlichtquelle zugewandtes Basisteil aufweist, an das Kühlrippen angeformt sind, und wobei der Kühlkörper Öffnungen für den Durchtritt von Kühlluft aufweistThe invention relates to a lighting device having at least one semiconductor light source and a heat-conducting associated heat sink, wherein the cooling body has a semiconductor light source facing the base part, are formed on the cooling fins, and wherein the cooling body has openings for the passage of cooling air

Stand der TechnikState of the art

Eine derartige Beleuchtungseinrichtung ist aus DE 20 2009 001475 U1 bekannt. Sie weist als Halbleiterlichtquelle eine Leuchtdiode auf, die an der Unterseite einer Leiterplatte montiert ist und nach unten Licht abstrahlt. Die der Leuchtdiode abgewandten Rückseite der Leiterplatte ist flächig wärmeleitend mit einemüber der Leiterplatte angeordneten Kühlkörper verbunden. Der Kühlkörper ist als längliches Biegestanzteil ausgestaltet, das aus einem rechteckigen Stück Blech hergestellt ist, dessen Längsränder zur Bildung von Kühlrippen derart umgebogen sind, dass der Kühlkörper eine etwa halbkreiszylindrische Grundform hat. Dabei weist der Kühlkörper ein ebenes Basisteil mit einer Befestigungsfläche für die Leiterplatte und zwei und zwei an den Längsrändern des Basisteils daran anschließenden Kühlrippen mit jeweils einem viertelkreiszylindrischen Abschnitt auf. An den Kühlrippen weist der Kühlkörper schlitzförmige untere und obere Öffnungen auf. Die unteren Öffnungen befinden sich jeweils am unteren und die oberen Öffnungen am oberen Ende des viertelkreiszylindrischen Abschnitts. Wenn sich die Leuchtdiode beim Betrieb erwärmt kann durch die Öffnungen ein Kamineffekt in dem Kühlkörper entstehen, bei dem Kühlluft an den unteren Öffnungen in den durch das Basisteil und die Kühlrippen begrenzten Innenraum des halbkreiszylindrischen Kühlkörpers eintritt und nach Durchströmen des Innenraums an den oberen Öffnungen aus dem Kühlkörper austritt. Dennoch ermöglicht der Kühlkörper nur eine begrenzte Kühlung der Leuchtdiode. Dies ist insbesondere bei Hochleistungs-Leuchtdioden, die eine entsprechend hohe Verlustleistung aufweisen, und bei hohen Umgebungstemperaturen ungünstig. Ungünstig ist außerdem, dass der Kühlkörper relativ große Abmessungen aufweist.Such a lighting device is off DE 20 2009 001475 U1 known. It has, as a semiconductor light source, a light-emitting diode which is mounted on the underside of a printed circuit board and emits light downwards. The light-emitting diode remote from the rear side of the circuit board is connected in a heat-conducting surface with a arranged over the circuit board heat sink. The heat sink is designed as an elongate bending punched part, which is made of a rectangular piece of sheet metal, whose longitudinal edges are bent to form cooling fins such that the heat sink has an approximately semicircular cylindrical basic shape. In this case, the heat sink on a flat base part with a mounting surface for the circuit board and two and two adjoining the longitudinal edges of the base part thereto cooling fins, each with a quarter circle cylindrical section. At the cooling fins, the heat sink has slit-shaped lower and upper openings. The lower openings are located at the bottom and the upper openings at the upper end of the quarter-circle cylindrical section. When the LED heats up during operation, a chimney effect can be created in the cooling body through the openings, in which cooling air at the lower openings enters the interior of the semicircular cooling body bounded by the base part and the cooling fins and, after flowing through the interior, at the upper openings Heatsink emerges. Still possible the heat sink only a limited cooling of the LED. This is unfavorable in particular with high-performance light-emitting diodes, which have a correspondingly high power loss, and at high ambient temperatures. Unfavorable is also that the heat sink has relatively large dimensions.

US 2010/012058 A1 zeigt einen LED-Spot, bei der eine mit LEDs bestückte Platine, die einer planen Basis als Träger in einem Gehäuse angeordnet ist. Teil des Gehäuses ist eine die Basis und somit auch die Platine ringförmig umgebender separater Kühlkörper. Nach vorne wird die Leuchte wie üblich durch eine Abschlussscheibe abgeschlossen. US 2010/012058 A1 shows an LED spot, in which a board equipped with LEDs, which is arranged a planar base as a carrier in a housing. Part of the housing is a separate heat sink surrounding the base and thus also the circuit board ring-shaped. To the front, the lamp is completed as usual by a lens.

DE 20 2010 004 317 U1 zeigt eine LED-Leuchte mit einem Kühlkörper. Der Kühlkörper wird von außen auf ein Gehäuse aufgesteckt und hat eine näherungsweise kreisscheibenförmige Basis. An die Schmalseite der kreisscheibenförmigen Basis sind Kühlrippen angesetzt. Der untere Teil der Kühlrippen ist abgewinkelt, so dass der Kühlkörper als solches den Eindruck eines Topfes vermittelt. DE 20 2010 004 317 U1 shows an LED light with a heat sink. The heat sink is plugged from the outside onto a housing and has an approximately circular disk-shaped base. On the narrow side of the circular disc-shaped base cooling fins are attached. The lower part of the cooling fins is angled, so that the heat sink as such gives the impression of a pot.

DE 20 2009 005 266 U1 zeigt eine LED-Lampe, bei der LEDs auf einer Platine angeordnet sind. Die Platine liegt in einer Ausnehmung eines Kühlkörpers, der radial nach außen weisende Kühlrippen aufweist. Der Kühlkörper ist Teil des Gehäuses. DE 20 2009 005 266 U1 shows an LED lamp in which LEDs are arranged on a circuit board. The board is located in a recess of a heat sink, which has radially outwardly facing cooling fins. The heat sink is part of the housing.

Darstellung der ErfindungPresentation of the invention

Der Erfindung liegt die Aufgabe zugrunde, eine Beleuchtungseinrichtung der eingangs genannten Art zu schaffen, die bei kompakten Abmessungen eine effektive Kühlung der Halbleiterlichtquelle und somit eine entsprechend lange Lebensdauer der mindestens einen Halbleiterlichtquelle ermöglicht.The invention has for its object to provide a lighting device of the type mentioned, which allows for compact dimensions effective cooling of the semiconductor light source and thus a correspondingly long life of at least one semiconductor light source.

Diese Aufgabe wird durch eine Vorrichtung nach Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.This object is achieved by a device according to claim 1. Advantageous embodiments of the invention are specified in the subclaims.

WO 2011/000056 A1 offenbart eine LED-Leuchte gemäß dem Oberbegriff des Anspruchs 1, mit einem Gehäuse, das als Kühlkörper ausgebildet ist. Der Kühlkörper hat eine Basis mit einer planen Wärmeeinkoppelfläche, über die mittelbar die von LEDs abgegebene Wärme eingekoppelt wird. Auf der Rückseite der Basis sind Kühlrippen. Zwischen dem Ansatz der Kühlrippen sind Belüftungsöffnungen in der Basis. WO 2011/000056 A1 discloses an LED lamp according to the preamble of claim 1, with a housing which is formed as a heat sink. The heat sink has a base with a plane heat input surface via which indirectly the heat emitted by LEDs is coupled. On the back of the base are cooling fins. Between the approach of the cooling fins are ventilation holes in the base.

WO 2008/06108 A1 offenbart eine LED-Leuchte. Die LED-Leuchte sitzt in einem Gehäuse mit einem Gehäuseboden und einer kegelstumpfartigen und somit schrägen Seitenwandung. Das Gehäuse wird von einem Lampenschirm umgeben, wobei zwischen dem Lampenschirm und dem Gehäuse Kühlrippen angeordnet sein können, die entweder Teil des Gehäuses oder aber des Lampenschirms sind. Der Boden des Lampenschirms hat Löcher, so dass Kühlluft durch die zwischen den Kühlrippen ausgebildeten Kanäle hindurchtreten kann. WO 2008/06108 A1 discloses an LED light. The LED lamp sits in a housing with a housing bottom and a frustoconical and thus oblique side wall. The housing is surrounded by a lampshade, wherein between the lampshade and the housing cooling fins may be arranged, which are either part of the housing or the lampshade. The bottom of the lampshade has holes so that cooling air can pass through the channels formed between the cooling fins.

CN 2017 48 237 U zeigt einen Kühlkörper mit einem einer Halbleiterlichtquelle zugewandten Basisteil an das eine schräge Seitenwand angeformt ist. An das Basisteil und die Außenseite der Schräge sind Kühlrippen angeformt, die sich in der Aufsicht auf das Basisteil in quer zueinander angeordneten Richtungen von der Halbleiterlichtquelle weg erstrecken. Nach Vorne ist an die schräge Seitenwand ein Reflektor angesetzt. CN 2017 48 237 U shows a heat sink with a semiconductor light source facing base to which an oblique side wall is formed. To the base part and the outside of the bevel cooling fins are formed, which extend in the plan view of the base part in transversely arranged directions away from the semiconductor light source. Forward, a reflector is attached to the oblique side wall.

WO 2010/107781 A2 zeigt eine LED-Leucnte mit einem LED-Modul, das eine isolierende Basis aufweist. Über einen so genannten "Heat Puck" an der Unterseite des LED-Moduls wird Wärme an ein Wärmeableitblech abgegeben. Zur Kühlung ist an dem Wärmeableitblech ein Kühlkörper befestigt. Der Kühlkörper hat Kühlrippen, die an der Außenseite eines Hohlprofils angeformt sind. Der Innenraum des Hohlprofils dient als Aufnahme für die Stromzuführung der LED. WO 2010/107781 A2 shows an LED Leucnte with an LED module, which has an insulating base. Heat is transferred to a heat dissipating plate via a so-called "heat puck" on the underside of the LED module. For cooling, a heat sink is attached to the heat dissipation plate. The heat sink has cooling fins, which are integrally formed on the outside of a hollow profile. The interior of the hollow profile serves as a receptacle for the power supply of the LED.

Bei einer einleitend angegebenen Beleuchtungsvorrichtung wird diese Aufgabe insbesondere dadurch gelöst, dass sich in der Aufsicht auf das Basisteil die Kühlrippen in quer zueinander angeordneten Richtungen von der mindestens einen Halbleiterlichtquelle weg erstrecken, und dass die Öffnungen in dem Basisteil zwischen den Kühlrippen angeordnet sind.In an illuminating device given in the introduction, this object is achieved, in particular, by the fact that, in the plan view of the base part, the cooling ribs extend away from the at least one semiconductor light source in directions arranged transversely to one another, and in that the openings are arranged in the base part between the cooling ribs.

In vorteilhafter Weise kann dann beim Betrieb der Halbleiterlichtquelle zwischen den Kühlrippen ein Kamineffekt auftreten, bei dem Kühlluft an einer relativ großen Oberfläche an den Kühlrippen vorbeiströmt. Da die Kühlrippen in quer zueinander angeordneten Richtungen von der Halbleiterlichtquelle weg verlaufen kann die von der Halbleiterlichtquelle abgegebene Wärme wirkungsvoll nach allen Seiten über die Kühlrippen zu den Stellen abgeleitet werden, die mit dem bei dem aufgrund des Kamineffekts auftretenden Kühlluftstrom in Kontakt geraten. Die Beleuchtungseinrichtung ermöglicht daher bei kompakten Abmessungen eine effektive Kühlung und somit eine lange Lebensdauer der Halbleiterlichtquelle. Die Beleuchtungseinrichtung kommt bevorzugt in Gebäudeinnenräumen zum Einsatz. Sie kann aber auch für andere Anwendungen verwendet werden.In an advantageous manner, a chimney effect may then occur during operation of the semiconductor light source between the cooling fins, in which cooling air flows past the cooling fins on a relatively large surface. Since the cooling fins may extend away from the semiconductor light source in directions arranged transversely to one another, the heat emitted by the semiconductor light source can be effectively dissipated on all sides via the cooling fins to the locations which come into contact with the cooling air flow occurring due to the chimney effect. The lighting device therefore allows for compact dimensions effective cooling and thus a long life of the semiconductor light source. The lighting device is preferably used in building interiors. It can also be used for other applications.

Bei einer bevorzugten Ausgestaltung der Erfindung ist die mindestens eine Halbleiterlichtquelle in der Aufsicht auf das Basisteil im Zentrum des Kühlkörpers vorgesehen, wobei die Kühlrippen etwa radial zu der mindestens einen Halbleiterlichtquelle angeordnet sind. Durch diese Maßnahme kann die Halbleiterlichtquelle noch effektiver gekühlt werden. Der durch den Kamineffekt erzeugte Kühlluftstrom wird bevorzugt mit Abstand zur Halbleiterlichtquelle an den Kühlrippen vorbei geleitet, damit eine möglichst große Oberfläche der Kühlrippen gekühlt werden kann.In a preferred embodiment of the invention, the at least one semiconductor light source is provided in the plan view of the base part in the center of the heat sink, wherein the cooling fins are arranged approximately radially to the at least one semiconductor light source. By this measure, the semiconductor light source can be cooled even more effectively. The cooling air flow generated by the chimney effect is preferably passed at a distance from the semiconductor light source to the cooling fins, so that the largest possible surface of the cooling fins can be cooled.

Zweckmäßigerweise sind die Öffnungen als Schlitze ausgestaltet, die sich in der Aufsicht auf das Basisteil radial zur mindestens einen Halbleiterlichtquelle erstrecken. Die durch die Schlitze hindurch tretende Kühlluft kann dann eine relativ große Fläche der Kühlrippen anströmen.Expediently, the openings are configured as slots, which extend in the plan view onto the base part radially to the at least one semiconductor light source. The cooling air passing through the slots can then flow to a relatively large area of the cooling fins.

Gemäß der Erfindung ist das Basisteil im Wesentlichen becherförmig mit einem Boden und einer Seitenwand ausgestaltet, welche eine Innenhöhlung begrenzen, wobei die mindestens eine Halbleiterlichtquelle in der Innenhöhlung am Boden des Basisteils angeordnet ist. Die Innenhöhlung kann auch als Ausnehmung bezeichnet werden. Dabei kann die beim Betrieb der Halbleiterlichtquelle auftretende Verlustwärme über die Seitenwände noch großflächiger an die Umgebungsluft abgeführt werden. Außerdem ist die Halbleiterlichtquelle in der Innenhöhlung des Basisteils vor mechanischer Beschädigung geschützt.According to the invention, the base part is designed substantially cup-shaped with a bottom and a side wall, which delimit an inner cavity, wherein the at least one semiconductor light source is arranged in the inner cavity at the bottom of the base part. The inner cavity can also be referred to as a recess. In this case, the heat loss occurring during operation of the semiconductor light source via the side walls can be dissipated even more extensive to the ambient air. In addition, the semiconductor light source in the inner cavity of the base part is protected against mechanical damage.

Bei einer bevorzugten Ausführungsform der Erfindung ist in der Innenhöhlung eine Optik zur Formung des von der mindestens einen Halbleiterlichtquelle ausgesendeten Lichts angeordnet. Die Optik kann mindestens eine Linse und/oder wenigstens einen Reflektor aufweisen.In a preferred embodiment of the invention, an optical system for shaping the light emitted by the at least one semiconductor light source is arranged in the inner cavity. The optics can have at least one lens and / or at least one reflector.

Vorteilhaft ist, wenn zwischen der Optik und der der Innenhöhlung zugewandten Innenfläche der Seitenwand mindestens ein Luftdurchtrittskanal gebildet wird, wobei der Luftdurchtrittskanal mit mindestens einer der Öffnungen verbunden ist. Die Optik erfüllt dann eine Doppelfunktion, bei der sie einerseits zur Lenkung des von der Halbleiterlichtquelle ausgesendeten Lichts dient und andererseits den bei dem Kamineffekt auftretenden Kühlluftstroms so führt, dass dieser an einem möglichst großen Oberflächenbereich des Kühlkörpers vorbeiströmt.It is advantageous if at least one air passageway is formed between the optics and the inner surface of the sidewall facing the inner cavity, wherein the air passageway is connected to at least one of the openings. The optical system then fulfills a dual function in which on the one hand it serves to direct the light emitted by the semiconductor light source and on the other hand it guides the cooling air flow occurring in the chimney effect so that it flows past the largest possible surface area of the heat sink.

Bei einer zweckmäßigen Ausgestaltung der Erfindung durchsetzten die Kühlrippen den Boden und/oder die Seitenwand des Basisteils und kommen mit einem am Boden und/oder der Seitenwand in die Innenhöhlung vorstehenden Teilbereich an der Optik zur Anlage. Dadurch wird eine noch größere Oberfläche des Kühlkörpers ermöglicht.In an expedient embodiment of the invention, the cooling ribs penetrate the bottom and / or the side wall of the base part and come with a on the floor and / or the side wall in the inner cavity projecting portion of the optics to the plant. This allows an even larger surface area of the heat sink.

Gemäß der Erfindung weist die Seitenwand eine Schräge auf, an der die lichte Weite der Innenhöhlung, ausgehend vom Boden zu dem vom Boden entfernten freien Rand der Seitenwand, zunimmt, wobei sich die Öffnungen vom Boden bis in die Schräge erstrecken. Dabei kann praktisch die gesamte durch die Öffnungen hindurch tretende Kühlluft an den Kühlrippen vorbeiströmen.According to the invention, the side wall has a slope at which the inside width of the inner cavity increases, starting from the bottom to the free edge of the side wall remote from the bottom, the openings extending from the bottom to the slope. In this case, virtually all of the cooling air passing through the openings can flow past the cooling fins.

Beschreibung der ZeichnungenDescription of the drawings

Die Erfindung wird nachstehend ohne Beschränkung des allgemeinen Erfindungsgedankens anhand eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnungen exemplarisch beschrieben. Es zeigt:

Fig. 1
einen Teilquerschnitt durch eine Beleuchtungseinrichtung, die Leuchtdioden aufweist, die wärmeleitend mit einem Kühlkörper verbunden ist, wobei die Querschnittsebene des Teilquerschnitts radial zur Leuchtdiode angeordnet ist,
Fig. 2
eine Seitenansicht auf die Rückseite einer Beleuchtungseinrichtung und
Fig. 3
eine Aufsicht auf die Rückseite der Beleuchtungseinrichtung.
The invention will now be described by way of example without limitation of the general inventive idea using an exemplary embodiment with reference to the drawings. It shows:
Fig. 1
a partial cross section through an illumination device having light emitting diodes, which is thermally conductively connected to a heat sink, wherein the cross sectional plane of the partial cross section is arranged radially to the light emitting diode,
Fig. 2
a side view of the back of a lighting device and
Fig. 3
a view of the back of the lighting device.

Eine im Ganzen mit 1 bezeichnete Beleuchtungseinrichtung weist als Leuchtmittel mehrere, in der Zeichnung nur schematisch dargestellte, als Leuchtdioden ausgestaltete Halbleiterlichtquellen 2 auf, die jeweils in einen Halbleiterchip integriert sind. Die Halbleiterchips sind auf einem gemeinsamen Träger angeordnet sind, der aus einem gut wärmeleitenden Material, wie zum Beispiel Aluminium, besteht. Die einzelnen Halbleiterchips sind an ihrer der Abstrahlseite abgewandten Rückseite jeweils flächig wärmeleitend mit dem Träger verbunden.An illumination device designated as a whole by 1 has a plurality of semiconductor light sources 2, which are only shown schematically in the drawing and designed as light-emitting diodes, which are each integrated in a semiconductor chip. The semiconductor chips are arranged on a common carrier, which consists of a good heat-conducting material, such as aluminum. The individual semiconductor chips are each connected at their rear side facing away from the emission side in a heat-conductive manner to the carrier.

Der Träger ist mit seiner den Halbleiterchips abgewandten Rückseite flächig wärmeleitend mit einem über dem Träger angeordneten Kühlkörper 3 verbunden, der aus einem wärmeleitfähigen Werkstoff, wie z.B. Aluminium besteht. Der Träger kommt mit seiner Rückseite flächig an der Unterseite des Kühlkörpers 3 zur Anlage. Die beim Betrieb der Beleuchtungseinrichtung 1 in den Halbleiterlichtquellen 2 auftretende Verlustwärme wird von den Halbleiterchips der Halbleiterlichtquellen 2 durch den Träger hindurch in den Kühlkörper 3 eingeleitet und von dort an die Umgebungsluft abgegeben.The carrier is connected with its side facing away from the semiconductor chips backside heat-conducting with a arranged above the carrier heat sink 3, which consists of a thermally conductive material, such as aluminum. Of the Carrier comes with its back surface at the bottom of the heat sink 3 to the plant. The heat loss occurring during operation of the illumination device 1 in the semiconductor light sources 2 is introduced from the semiconductor chips of the semiconductor light sources 2 through the carrier into the heat sink 3 and discharged from there to the ambient air.

Wie in Fig. 1 und 2 erkennbar ist, weist der Kühlkörper 3 ein becherförmiges Basisteil 4 auf. Das Basisteil 4 hat in der in Fig. 3 gezeigten Aufsicht auf seine Rückseite eine etwa kreisförmige Außenkontur. Das Basisteil 4 hat einen Boden 5 und eine seitlich damit verbundene Seitenwand 6, die um den Boden 5 herumläuft.As in Fig. 1 and 2 can be seen, the heat sink 3, a cup-shaped base part 4. The base part 4 has in the in Fig. 3 shown supervision on its back an approximately circular outer contour. The base part 4 has a bottom 5 and a side wall 6 connected thereto laterally, which runs around the bottom 5.

An das Basisteil 4 sind rückseitig Kühlrippen 7 angeformt, die jeweils radial vom Zentrum des Basisteils 4 weg nach außen verlaufen. In Fig. 2 ist deutlich erkennbar, dass die Kühlrippen 7 in quer zueinander angeordneten Richtungen um das Zentrum des Basisteils 4 herum angeordnet sind. Dabei erstrecken sich die Kühlrippen 7 in Radialebenen, die durch die Mittelachse 8 des Basisteils 4 und radial dazu verlaufende Achsen aufgespannt sind.On the back of the base 4 cooling fins 7 are formed, each extending radially from the center of the base part 4 away to the outside. In Fig. 2 It can be clearly seen that the cooling fins 7 are arranged in transversely arranged directions around the center of the base part 4. Here, the cooling fins 7 extend in radial planes, which are spanned by the central axis 8 of the base part 4 and radially extending axes.

In der Aufsicht auf die Abstrahlseite der Beleuchtungseinrichtung befinden sich die Halbleiterlichtquellen 2 im Zentrum des Kühlkörpers 3 auf der Mittelachse 8 oder dicht benachbart zu dieser, so dass die beim Betrieb der Beleuchtungseinrichtung 1 in den Halbleiterlichtquellen 2 auftretende Verlustwärme nach allen Seiten gut abgeführt und über eine entsprechend große Kühlkörperoberfläche an die Umgebungsluft angegeben wird. In Fig. 1 ist die Wärmetransportrichtung schematisch durch einen Pfeil 9 angedeutet.In the plan view of the emission side of the illumination device are the semiconductor light sources 2 in the center of the heat sink 3 on the central axis 8 or closely adjacent to this, so that the occurring during operation of the lighting device 1 in the semiconductor light sources 2 loss of heat well dissipated on all sides and a correspondingly large heat sink surface is specified to the ambient air. In Fig. 1 the heat transport direction is schematically indicated by an arrow 9.

Wie in Fig. 1 besonders gut erkennbar ist, sind die Kühlrippen 7 in Umfangsrichtung des Basisteils 4 durch seitliche Zwischenräume voneinander beabstandet. Im Bereich der Zwischenräume weist das Basisteil 4 Öffnungen 10 für den Durchtritt von Kühlluft auf. Die Öffnungen 10 sind als schlitzförmige Wandungsdurchbrüche ausgestaltet, die sich in Radialebenen erstrecken, die durch die Mittelachse 8 des Basisteils 4 und radial dazu verlaufende Achsen aufgespannt sind. In Fig. 3 ist erkennbar, dass die Öffnungen 10 im äußeren Bereich des Kühlkörpers 3 mit Abstand von dessen Zentrum angeordnet sind.As in Fig. 1 is particularly well recognizable, the cooling fins 7 are spaced apart in the circumferential direction of the base part 4 by lateral gaps. In the area of the intermediate spaces, the base part 4 openings 10 for the passage of cooling air. The apertures 10 are configured as slot-shaped wall apertures which extend in radial planes passing through the central axis 8 of the base part 4 and radially extending axes are clamped. In Fig. 3 It can be seen that the openings 10 are arranged in the outer region of the heat sink 3 at a distance from the center thereof.

Anhand von Fig. 1 wird deutlich, dass der Boden 5 und die Seitenwand 6 eine Innenhöhlung begrenzen, und dass die Halbleiterlichtquellen in der Innenhöhlung am Boden 5 des Basisteils 4 angeordnet sind. In der Innenhöhlung ist außerdem eine Optik 11 zur Formung des von den Halbleiterlichtquellen 2 ausgesendeten Lichts angeordnet.Based on Fig. 1 It is clear that the bottom 5 and the side wall 6 define an inner cavity, and that the semiconductor light sources are arranged in the inner cavity at the bottom 5 of the base part 4. In addition, an optical system 11 for shaping the light emitted by the semiconductor light sources 2 is arranged in the inner cavity.

In Fig. 1 ist erkennbar, dass zwischen der Optik 11 und der dieser zugewandten Innenfläche der Seitenwand 6 ein Luftdurchtrittskanal 12 gebildet ist. Der Luftdurchtrittskanal 12 weist an seinem unteren Ende eine Ansaugöffnung 13 auf, die zwischen dem freien Rand der Seitenwand 6 und dem Außenumfang der Optik 11 kreisringförmig oder kreisringsegmentförmig um die Optik 11 herum verläuft. An seinem oberen Ende ist der Lüftdurchtrittskanal 12 mit den Öffnungen 10 verbunden. Beim Betrieb der Halbleiterlichtquellen 2 tritt im Luftdurchtrittskanal 12 ein Kamineffekt auf, bei dem eine Luftströmung entsteht, die entlang der punktierten Linie 14 von der Ansaugöffnung 13 durch die Öffnungen 10 hindurch an dem Kühlrippen 7 vorbeiströmt.In Fig. 1 It can be seen that an air passageway 12 is formed between the optics 11 and the inner surface of the side wall 6 facing this. The air passage channel 12 has at its lower end to a suction port 13 which extends between the free edge of the side wall 6 and the outer periphery of the optical system 11 in the form of an annular or circular ring segment around the optical system 11. At its upper end, the Lüftdurchtrittskanal 12 is connected to the openings 10. During operation of the semiconductor light sources 2, a chimney effect occurs in the air passage channel 12, causing an air flow which flows along the dotted line 14 from the suction opening 13 through the openings 10 past the cooling ribs 7.

In Fig. 1 ist noch erkennbar, dass die Kühlrippen 7 den Boden 5 und die Seitenwand 6 des Basisteils 4 durchsetzten. Außerdem ist erkennbar, dass die Optik durch einen Freiraum 15 vom Boden 5 des Basisteils 4 beabstandet ist und dass die Halbleiterlichtquellen 2 in dem Freiraum 15 angeordnet sind. Bei Bedarf kann in dem Freiraum 15 auch die Ansteuereinrichtung für die Halbleiterlichtquellen 2 vorgesehen sein.In Fig. 1 is still seen that the cooling fins 7 the bottom 5 and the side wall 6 of the base part 4 penetrated. In addition, it can be seen that the optic is spaced from the bottom 5 of the base part 4 by a free space 15 and that the semiconductor light sources 2 are arranged in the free space 15. If required, the drive device for the semiconductor light sources 2 can also be provided in the free space 15.

Anhand von Fig. 1 wird deutlich, dass die Seitenwand 6 eine zumindest segmentweise in Umfangsrichtung um die Mittelachse 8 umlaufende Schräge aufweist, an der die lichte Weite der Innenhöhlung, ausgehend vom Boden 5 zu dem vom Boden 5 entfernten unteren Rand der Seitenwand 6, zunimmt. Die Öffnungen befinden sich im Boden 5 und in der Schräge.Based on Fig. 1 It is clear that the side wall 6 has an at least segmentally circumferential in the circumferential direction about the central axis 8 slope at which the inside diameter of the inner cavity, starting from the bottom 5 to the from the bottom 5 remote bottom edge of the side wall 6, increases. The openings are located in the bottom 5 and in the slope.

Erwähnt werden soll noch, dass die Kühlrippen 7 durch einen konzentrisch um die Mittelachse 8 umlaufenden Ringwulst 16 miteinander verbunden sind.It should also be mentioned that the cooling fins 7 are connected to one another by a circular bead 16 concentrically surrounding the central axis 8.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Beleuchtungseinrichtunglighting device
22
HalbleiterlichtquellenSemiconductor light sources
33
Kühlkörperheatsink
44
Basisteilbase
55
Bodenground
66
SeitenwandSide wall
77
Kühlrippecooling fin
88th
Mittelachsecentral axis
99
Pfeilarrow
1010
Öffnungopening
1111
Optikoptics
1212
LuftdurchtrittskanalAir passage channel
1313
Ansaugöffnungsuction
1414
punktierte Liniedotted line
1515
Freiraumfree space
1616
Ringwulsttorus

Claims (6)

  1. Lighting device (1) having at least one semiconductor light source (2) and a heat sink, wherein
    - the heat sink (3) is connected thermally conductive to the semiconductor light source,
    - the heat sink (3) has a base part (4) facing towards the semiconductor light source (2),
    - the base part (4) being formed at least substantially in the shape of a cup with a bottom (5) and a side wall (6), which confine an inner cavity, and the at least one semiconductor light source (2) is arranged at the bottom (5) of the base part (4) in the inner cavity,
    - the side wall (6) has a chamfer at which the clear width of the inner cavity increases, starting from the bottom to the free edge of the side wall being remote from the bottom (5),
    - cooling ribs (7) are formed to the base part (4),
    - the heat sink (3) has openings (10) for the passage of cooling air,
    - the cooling ribs (7) protrude from the at least one semiconductor light source (2) in directions arranged transversely to one another, when seen in a top view on the base part (4),
    - the openings are arranged in the base part (4) between the cooling ribs (7), and
    characterized in that
    the openings (10) protrude from the bottom (5) into the chamfer.
  2. Lighting device (1) according to claim 1,
    characterized in that
    the at least one semiconductor light source (2) is provided in the center of the heat sink (3), when seen in the top view on the base part (4), and the cooling ribs (7) are arranged at least substantially radially to the at least one semiconductor light source (2).
  3. Lighting device (1) according to claim 1 or 2,
    characterized in that
    the openings (10) are formed as slits, and the slits protrude radially to the at least one semiconductor light source (2) in the top view on the base part (4).
  4. Lighting device (1) according to one of claims 1 to 3,
    characterized in that
    an optics for shaping the light emitted from the at least one semiconductor light source (2) is arranged in the inner cavity.
  5. Lighting device (1) according to one of claims 1 or 4,
    characterized in that
    at least one air duct (12) is formed between the optics (11) and the sidewall's (6) inner surface facing towards the inner cavity, and that the air duct (12) is connected with at least one of the openings (10).
  6. Lighting device (1) according to one of claims 1 to 5,
    characterized in that
    the cooling ribs (7) penetrate the bottom (5) and/or the sidewall (6) of the base part (4), and come into contact at the optics (11) with a partial region protruding into the inner cavity from the bottom (5) and/or the sidewall (6).
EP12720217.4A 2011-05-16 2012-05-14 Lighting device Not-in-force EP2710295B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL12720217T PL2710295T3 (en) 2011-05-16 2012-05-14 Lighting device

Applications Claiming Priority (2)

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DE102011050380.3A DE102011050380B4 (en) 2011-05-16 2011-05-16 lighting device
PCT/EP2012/058930 WO2012156366A1 (en) 2011-05-16 2012-05-14 Lighting device

Publications (2)

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EP2710295A1 EP2710295A1 (en) 2014-03-26
EP2710295B1 true EP2710295B1 (en) 2015-04-29

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EP (1) EP2710295B1 (en)
DE (1) DE102011050380B4 (en)
DK (1) DK2710295T3 (en)
ES (1) ES2543443T3 (en)
PL (1) PL2710295T3 (en)
WO (1) WO2012156366A1 (en)

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WO2015027511A1 (en) * 2013-09-02 2015-03-05 Chen Hui Chiang Lamp base with heat dissipation structure and lamp thereof, and illumination device
WO2018191806A1 (en) 2017-04-18 2018-10-25 Nortek Air Solutions Canada, Inc. Desiccant enhanced evaporative cooling systems and methods

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JP3885206B2 (en) 2002-11-11 2007-02-21 胡 龍潭 Eight stroke internal combustion engine
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US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
DE202009001475U1 (en) 2009-02-06 2009-04-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for a lighting device
WO2010107781A2 (en) * 2009-03-16 2010-09-23 Molex Incorporated Light module
US20130016511A1 (en) * 2009-07-02 2013-01-17 Matthew Arthur Mansfield Cooling for led illumination device
DE202009005266U1 (en) * 2009-09-10 2009-12-03 Davinci Industrial Inc., Hsinchuang LED lamp with high heat dissipation and safety
DE202010004317U1 (en) * 2010-03-29 2010-06-10 Chicony Power Technology Co., Ltd., Wu-Ku LED light and heat sink
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EP2710295A1 (en) 2014-03-26
WO2012156366A1 (en) 2012-11-22
DK2710295T3 (en) 2015-08-03
ES2543443T3 (en) 2015-08-19
PL2710295T3 (en) 2015-10-30
DE102011050380A1 (en) 2012-11-22

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