EP2710295A1 - Lighting device - Google Patents

Lighting device

Info

Publication number
EP2710295A1
EP2710295A1 EP12720217.4A EP12720217A EP2710295A1 EP 2710295 A1 EP2710295 A1 EP 2710295A1 EP 12720217 A EP12720217 A EP 12720217A EP 2710295 A1 EP2710295 A1 EP 2710295A1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
base part
light source
lighting device
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12720217.4A
Other languages
German (de)
French (fr)
Other versions
EP2710295B1 (en
Inventor
Michael Eusterbrock
Andreas Miemczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella KGaA Huek and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella KGaA Huek and Co filed Critical Hella KGaA Huek and Co
Priority to PL12720217T priority Critical patent/PL2710295T3/en
Publication of EP2710295A1 publication Critical patent/EP2710295A1/en
Application granted granted Critical
Publication of EP2710295B1 publication Critical patent/EP2710295B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device having at least one semiconductor light source and a heat-conducting associated heat sink, wherein the cooling body has a semiconductor light source facing the base part, are integrally formed on the cooling fins, and wherein the cooling body has openings for the passage of cooling air
  • Such a lighting device is known from DE 20 2009 001 475 Ul. It has, as a semiconductor light source, a light-emitting diode which is mounted on the underside of a printed circuit board and emits light downwards.
  • the light-emitting diode facing away from the rear side of the circuit board is heat-conductively connected to a surface arranged over the circuit board heat sink.
  • the heat sink is designed as an elongate bending punched part, which is made of a rectangular piece of sheet metal, whose longitudinal edges are bent to form cooling fins such that the cooling body has an approximately semicircular cylindrical basic shape.
  • the heat sink on a flat base part with a mounting surface for the circuit board and two and two adjoining the longitudinal edges of the base part thereto cooling fins, each with a quarter circle cylindrical section.
  • the heat sink has slit-shaped lower and upper openings. The lower openings are located at the bottom and the upper openings at the upper end of the quarter-circle cylindrical section.
  • US 2010/012058 A1 shows an LED spot in which a board equipped with LEDs, which is arranged on a flat base as a carrier in a housing. Part of the housing is a separate heat sink surrounding the base and thus also the circuit board ring-shaped. To the front, the lamp is completed as usual by a lens.
  • DE 20 2010 004 317 U1 shows an LED luminaire with a heat sink. The heat sink is plugged from the outside onto a housing and has an approximately circular disk-shaped base.
  • the invention has for its object to provide a lighting device of the type mentioned, which allows for compact dimensions effective cooling of the semiconductor light source and thus a correspondingly long life of at least one semiconductor light source.
  • a chimney effect can then occur during operation of the semiconductor light source between the cooling fins, in which cooling air flows past the cooling fins on a relatively large surface. Since the cooling fins may extend away from the semiconductor light source in directions arranged transversely to one another, the heat emitted by the semiconductor light source can be effectively dissipated on all sides via the cooling fins to the points which come into contact with the cooling air flow occurring due to the chimney effect.
  • the lighting device therefore enables compact dimensions and effective cooling and thus a long life of the semiconductor light source.
  • the lighting device is preferably used in building interiors. It can also be used for other applications.
  • the at least one semiconductor light source is provided in the plan view of the base part in the center of the heat sink, wherein the cooling fins are arranged approximately radially to the at least one semiconductor light source.
  • the cooling air flow generated by the chimney effect is preferably passed at a distance from the semiconductor light source to the cooling fins, so that the largest possible surface of the cooling fins can be cooled.
  • the openings are expediently designed as slots a, which in the plan view extend radially to the base part to the at least one semiconductor light source. CKEN. The cooling air passing through the slots can then flow to a relatively large area of the cooling fins.
  • the base part is substantially cup-shaped with a bottom and a side wall defining an inner cavity, wherein the at least one semiconductor light source is arranged in the inner cavity at the bottom of the base part.
  • the inner cavity can also be referred to as a recess.
  • the heat loss occurring during operation of the semiconductor light source via the side walls can be dissipated even more extensive to the ambient air.
  • the semiconductor light source in the inner cavity of the base part is protected against mechanical damage.
  • an optical system for shaping the light emitted by the at least one semiconductor light source is arranged in the inner cavity.
  • the optics can have at least one lens and / or at least one reflector.
  • At least one air passageway is formed between the optics and the inner surface of the sidewall facing the inner cavity, wherein the air passageway is connected to at least one of the openings.
  • the optical system then fulfills a dual function in which on the one hand it serves to direct the light emitted by the semiconductor light source and on the other hand leads to the cooling air flow occurring in the chimney effect in such a way that it flows past the largest possible surface area of the heat sink.
  • the cooling ribs penetrate the bottom and / or the side wall of the base part and come with a on the floor and / or the side wall in the inner cavity projecting portion of the optics to the plant.
  • the side wall has a slope at which the inside width of the inner cavity, starting from the bottom to the free edge of the side wall remote from the ground, increases, wherein the openings extend from the bottom to the slope. In this case, virtually all of the cooling air passing through the openings can flow past the cooling fins.
  • Fig. 2 is a side view of the back of a lighting device
  • Fig. 3 is a plan view of the back of the lighting device.
  • An illumination device designated as a whole by 1 has a plurality of semiconductor light sources 2, which are only shown schematically in the drawing and designed as light-emitting diodes, which are each integrated in a semiconductor chip.
  • the semiconductor chips are arranged on a common carrier, which consists of a good heat-conducting material, such as aluminum.
  • the individual semiconductor chips are each connected at their rear side facing away from the emission side in a heat-conductive manner to the carrier.
  • the carrier is connected with its side facing away from the semiconductor chips backside heat-conducting with a arranged above the carrier heat sink 3, which consists of a thermally conductive material, such as aluminum.
  • the Carrier comes with its back surface at the bottom of the heat sink 3 to the plant. The heat loss occurring during operation of the lighting device 1 in the semiconductor light sources 2 is introduced from the semiconductor chips of the semiconductor light sources 2 through the carrier into the heat sink 3 and discharged from there to the ambient air.
  • the heat sink 3 has a cup-shaped base part 4.
  • the base part 4 has an approximately circular outer contour on its rear side.
  • the base part 4 has a bottom 5 and a side wall 6 connected thereto laterally, which runs around the bottom 5.
  • cooling fins 7 are formed, each extending radially from the center of the base part 4 away to the outside.
  • the cooling fins 7 are arranged in transversely arranged directions about the center of the base part 4 around.
  • the cooling fins 7 extend in radial planes, which are spanned by the central axis 8 of the base part 4 and radially extending axes.
  • the heat transport direction is indicated schematically by an arrow 9.
  • the cooling fins 7 are spaced apart in the circumferential direction of the base part 4 by lateral interspaces.
  • the base part 4 openings 10 for the passage of cooling air.
  • the openings 10 are configured as slot-shaped wall openings which extend in radial planes which are defined by the middle axis 8 of the base part 4 and radially extending axes are clamped.
  • Fig. 3 it can be seen that the openings 10 are arranged in the outer region of the heat sink 3 at a distance from the center thereof.
  • the bottom 5 and the side wall 6 delimit an inner cavity, and that the semiconductor light sources are arranged in the inner cavity at the bottom 5 of the base part 4.
  • an optical system 11 for shaping the light emitted by the semiconductor light sources 2 is arranged in the inner cavity.
  • FIG. 1 it can be seen that between the optics 11 and the inner surface facing the side wall 6, an air passage 12 is formed.
  • the air passage channel 12 has at its lower end to a suction port 13 which extends between the free edge of the side wall 6 and the outer periphery of the optical system 11 in the form of an annular or circular ring about the optics 11 around.
  • the air passage channel 12 is connected to the openings 10.
  • a chimney effect occurs in the air passage 12, causing an air flow which flows along the dotted line 14 from the suction opening 13 through the openings 10 past the cooling fins 7.
  • FIG. 1 also shows that the cooling fins 7 penetrated the base 5 and the side wall 6 of the base part 4.
  • the optic is spaced from the bottom 5 of the base part 4 by a free space 15 and that the semiconductor light sources 2 are arranged in the free space 15.
  • the drive means for the semiconductor light sources 2 may be provided in the free space 15.
  • the side wall 6 has an at least segmentally circumferentially circumferential about the central axis 8 slope on which the inside diameter of the inner cavity, starting from the bottom 5 to the from the bottom 5 remote bottom edge of the side wall 6, increases. The openings are located in the bottom 5 and in the slope.
  • cooling fins 7 are connected to one another by a circular bead 16 concentrically surrounding the central axis 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to a lighting device (1), comprising at least one semiconductor light source (2) and one heat sink (3) connected thereto in a thermally conductive manner, the heat sink having a circular cup shape. The heat sink (3) has a base part (4) facing the semiconductor light source (2), on which base part cooling fins (7) are formed, which in the top view onto the base part (4) extend away from the at least one semiconductor light source (2) in directions arranged perpendicular to one another. Between the cooling fins (7), the heat sink (3) has openings (10) in the base part (4) for the passage of cooling air.

Description

Beleuchtungseinrichtung  lighting device
Technisches Gebiet Technical area
Die Erfindung betrifft eine Beleuchtungseinrichtung mit mindestens einer Halbleiterlichtquelle und einem wärmeleitend damit verbundenen Kühlkörper, wobei der Kühlkörper ein der Halbleiterlichtquelle zugewandtes Basisteil aufweist, an das Kühlrippen angeformt sind, und wobei der Kühlkörper Öffnungen für den Durchtritt von Kühlluft aufweist The invention relates to a lighting device having at least one semiconductor light source and a heat-conducting associated heat sink, wherein the cooling body has a semiconductor light source facing the base part, are integrally formed on the cooling fins, and wherein the cooling body has openings for the passage of cooling air
Stand der Technik State of the art
Eine derartige Beleuchtungseinrichtung ist aus DE 20 2009 001 475 Ul bekannt. Sie weist als Halbleiterlichtquelle eine Leuchtdiode auf, die an der Unterseite einer Leiterplatte montiert ist und nach unten Licht abstrahlt. Die der Leuchtdiode abgewandten Rückseite der Leiterplatte ist flächig wärmeleitend mit einem- über der Leiterplatte angeordneten Kühlkörper verbunden. Der Kühlkörper ist als längliches Biegestanzteil ausgestaltet, das aus einem rechteckigen Stück Blech hergestellt ist, dessen Längsränder zur Bildung von Kühlrippen derart umgebogen sind, dass der Kühlkörper eine etwa halbkreiszylindrische Grundform hat. Dabei weist der Kühlkörper ein ebenes Basisteil mit einer Befestigungsfläche für die Leiterplatte und zwei und zwei an den Längsrändern des Basisteils daran anschließenden Kühlrippen mit jeweils einem viertelkreiszylindrischen Abschnitt auf. An den Kühlrippen weist der Kühlkörper schlitzförmige untere und obere Öffnungen auf. Die unteren Öffnungen befinden sich jeweils am unteren und die oberen Öffnungen am oberen Ende des viertelkreiszylindrischen Abschnitts. Wenn sich die Leuchtdiode beim Betrieb erwärmt kann durch die Öffnungen ein Kamineffekt in dem Kühlkörper entstehen, bei dem Kühlluft an den unteren Öff- nungen in den durch das Basisteil und die Kühlrippen begrenzten Innenraum des halbkreiszylindrischen Kühlkörpers eintritt und nach Durchströmen des Innenraums an den oberen Öffnungen aus dem Kühlkörper austritt. Dennoch ermög- licht der Kühlkörper nur eine begrenzte Kühlung der Leuchtdiode. Dies ist insbesondere bei Hochleistungs-Leuchtdioden, die eine entsprechend hohe Verlustleistung aufweisen, und bei hohen Umgebungstemperaturen ungünstig. Ungünstig ist außerdem, dass der Kühlkörper relativ große Abmessungen aufweist. US 2010/012058 AI zeigt einen LED-Spot, bei der eine mit LEDs bestückte Platine, die einer planen Basis als Träger in einem Gehäuse angeordnet ist. Teil des Gehäuses ist eine die Basis und somit auch die Platine ringförmig umgebender separater Kühlkörper. Nach vorne wird die Leuchte wie üblich durch eine Abschlussscheibe abgeschlossen. DE 20 2010 004 317 Ul zeigt eine LED-Leuchte mit einem Kühlkörper. Der Kühlkörper wird von außen auf ein Gehäuse aufgesteckt und hat eine näherungsweise kreisscheibenförmige Basis. An die Schmalseite der kreisscheibenförmigen Basis sind Kühlrippen angesetzt. Der untere Teil der Kühlrippen ist abgewinkelt, so dass der Kühlkörper als solches den Eindruck eines Topfes vermittelt. DE 20 2009 005 266 Ul zeigt eine LED-Lampe, bei der LEDs auf einer Platine angeordnet sind. Die Platine liegt in einer Ausnehmung eines Kühlkörpers, der radial nach außen weisende Kühlrippen aufweist. Der Kühlkörper ist Teil des Gehäuses. Such a lighting device is known from DE 20 2009 001 475 Ul. It has, as a semiconductor light source, a light-emitting diode which is mounted on the underside of a printed circuit board and emits light downwards. The light-emitting diode facing away from the rear side of the circuit board is heat-conductively connected to a surface arranged over the circuit board heat sink. The heat sink is designed as an elongate bending punched part, which is made of a rectangular piece of sheet metal, whose longitudinal edges are bent to form cooling fins such that the cooling body has an approximately semicircular cylindrical basic shape. In this case, the heat sink on a flat base part with a mounting surface for the circuit board and two and two adjoining the longitudinal edges of the base part thereto cooling fins, each with a quarter circle cylindrical section. At the cooling fins, the heat sink has slit-shaped lower and upper openings. The lower openings are located at the bottom and the upper openings at the upper end of the quarter-circle cylindrical section. When the LED heats up during operation, a chimney effect can be produced in the cooling body through the openings, in which cooling air at the lower openings enters the interior of the semicircular cooling body delimited by the base part and the cooling fins and, after passing through the interior, at the upper openings exits the heat sink. Nevertheless, the heat sink only limited cooling of the light emitting diode. This is unfavorable in particular with high-performance light-emitting diodes, which have a correspondingly high power loss, and at high ambient temperatures. Unfavorable is also that the heat sink has relatively large dimensions. US 2010/012058 A1 shows an LED spot in which a board equipped with LEDs, which is arranged on a flat base as a carrier in a housing. Part of the housing is a separate heat sink surrounding the base and thus also the circuit board ring-shaped. To the front, the lamp is completed as usual by a lens. DE 20 2010 004 317 U1 shows an LED luminaire with a heat sink. The heat sink is plugged from the outside onto a housing and has an approximately circular disk-shaped base. On the narrow side of the circular disc-shaped base cooling fins are attached. The lower part of the cooling fins is angled, so that the heat sink as such gives the impression of a pot. DE 20 2009 005 266 U1 shows an LED lamp in which LEDs are arranged on a circuit board. The board is located in a recess of a heat sink, which has radially outwardly facing cooling fins. The heat sink is part of the housing.
Darstellung der Erfindung Der Erfindung liegt die Aufgabe zugrunde, eine Beleuchtungseinrichtung der eingangs genannten Art zu schaffen, die bei kompakten Abmessungen eine effektive Kühlung der Halbleiterlichtquelle und somit eine entsprechend lange Lebensdauer der mindestens einen Halbleiterlichtquelle ermöglicht. The invention has for its object to provide a lighting device of the type mentioned, which allows for compact dimensions effective cooling of the semiconductor light source and thus a correspondingly long life of at least one semiconductor light source.
Diese Aufgabe wird durch eine Vorrichtung nach Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben. Bei einer einleitend angegebenen Beleuchtungsvorrichtung wird diese Aufgabe insbesondere dadurch gelöst, dass sich in der Aufsicht auf das Basisteil die Kühlrippen in quer zueinander angeordneten Richtungen von der mindestens einen Halbleiterlichtquelle weg erstrecken, und dass die Öffnungen in dem Basisteil zwischen den Kühlrippen angeordnet sind. This object is achieved by a device according to claim 1. Advantageous embodiments of the invention are specified in the subclaims. In an illuminating device given in the introduction, this object is achieved, in particular, by the fact that, in the plan view of the base part, the cooling ribs extend away from the at least one semiconductor light source in directions arranged transversely to one another, and in that the openings are arranged in the base part between the cooling ribs.
I n vorteilhafter Weise kann dann beim Betrieb der Halbleiterlichtquelle zwischen den Kühlrippen ein Kamineffekt auftreten, bei dem Kühlluft an einer relativ großen Oberfläche an den Kühlrippen vorbei strömt. Da die Kühlrippen in quer zueinander angeordneten Richtungen von der Halbleiterlichtquelle weg verlaufen kann die von der Halbleiterlichtquelle abgegebene Wärme wirkungsvoll nach allen Seiten über die Kühlrippen zu den Stellen abgeleitet werden, die mit dem bei dem aufgrund des Kamineffekts auftretenden Kühlluftstrom in Kontakt geraten. Die Beleuchtungseinrichtung ermöglicht daher bei kompakten Abmessungen eine effektive Kühlung und somit eine lange Lebensdauer der Halbleiterlichtquel- le. Die Beleuchtungseinrichtung kommt bevorzugt in Gebäudeinnenräumen zum Einsatz. Sie kann aber auch für andere Anwendungen verwendet werden. In an advantageous manner, a chimney effect can then occur during operation of the semiconductor light source between the cooling fins, in which cooling air flows past the cooling fins on a relatively large surface. Since the cooling fins may extend away from the semiconductor light source in directions arranged transversely to one another, the heat emitted by the semiconductor light source can be effectively dissipated on all sides via the cooling fins to the points which come into contact with the cooling air flow occurring due to the chimney effect. The lighting device therefore enables compact dimensions and effective cooling and thus a long life of the semiconductor light source. The lighting device is preferably used in building interiors. It can also be used for other applications.
Bei einer bevorzugten Ausgestaltung der Erfindung ist die mindestens eine Halbleiterlichtquelle in der Aufsicht auf das Basisteil im Zentrum des Kühlkörpers vorgesehen, wobei die Kühlrippen etwa radial zu der mindestens einen Halbleiter- lichtquelle angeordnet sind. Durch diese Maßnahme kann die Halbleiterlichtquelle noch effektiver gekühlt werden. Der durch den Kamineffekt erzeugte Kühlluftstrom wird bevorzugt mit Abstand zur Halbleiterlichtquelle an den Kühlrippen vorbei geleitet, damit eine möglichst große Oberfläche der Kühlrippen gekühlt werden kann. Zweckmäßigerweise sind die Öffnungen als Schlitze a usgestaltet, die sich in der Aufsicht auf das Basisteil radial zur mindestens einen Halbleiterlichtquelle erstre- cken. Die durch die Schlitze hindurch tretende Kühlluft kann dann eine relativ große Fläche der Kühlrippen anströmen. In a preferred embodiment of the invention, the at least one semiconductor light source is provided in the plan view of the base part in the center of the heat sink, wherein the cooling fins are arranged approximately radially to the at least one semiconductor light source. By this measure, the semiconductor light source can be cooled even more effectively. The cooling air flow generated by the chimney effect is preferably passed at a distance from the semiconductor light source to the cooling fins, so that the largest possible surface of the cooling fins can be cooled. The openings are expediently designed as slots a, which in the plan view extend radially to the base part to the at least one semiconductor light source. CKEN. The cooling air passing through the slots can then flow to a relatively large area of the cooling fins.
Bei einer vorteilhaften Ausführungsform der Erfindung ist das Basisteil im Wesentlichen becherförmig mit einem Boden und einer Seitenwand ausgestaltet, welche eine Innenhöhlung begrenzen, wobei die mindestens eine Halbleiterlichtquelle in der Innenhöhlung am Boden des Basisteils angeordnet ist. Die Innenhöhlung kann auch als Ausnehmung bezeichnet werden. Dabei kann die beim Betrieb der Halbleiterlichtquelle auftretende Verlustwärme über die Seitenwände noch großflächiger an die Umgebungsluft abgeführt werden. Außerdem ist die Halbleiterlichtquelle in der Innenhöhlung des Basisteils vor mechanischer Beschädigung geschützt. In an advantageous embodiment of the invention, the base part is substantially cup-shaped with a bottom and a side wall defining an inner cavity, wherein the at least one semiconductor light source is arranged in the inner cavity at the bottom of the base part. The inner cavity can also be referred to as a recess. In this case, the heat loss occurring during operation of the semiconductor light source via the side walls can be dissipated even more extensive to the ambient air. In addition, the semiconductor light source in the inner cavity of the base part is protected against mechanical damage.
Bei einer bevorzugten Ausführungsform der Erfindung ist in der Innenhöhlung eine Optik zur Formung des von der mindestens einen Halbleiterlichtquelle ausgesendeten Lichts angeordnet. Die Optik kann mindestens eine Linse und/oder wenigstens einen Reflektor aufweisen. In a preferred embodiment of the invention, an optical system for shaping the light emitted by the at least one semiconductor light source is arranged in the inner cavity. The optics can have at least one lens and / or at least one reflector.
Vorteilhaft ist, wenn zwischen der Optik und der der Innenhöhlung zugewandten Innenfläche der Seitenwand mindestens ein Luftdurchtrittskanal gebildet wird, wobei der Luftdurchtrittskanal mit mindestens einer der Öffnungen verbunden ist. Die Optik erfüllt dann eine Doppelfunktion, bei der sie einerseits zur Lenkung des von der Halbleiterlichtquelle ausgesendeten Lichts dient und andererseits den bei dem Kamineffekt auftretenden Kühlluftstroms so führt, dass dieser an einem möglichst großen Oberflächenbereich des Kühlkörpers vorbeiströmt. It is advantageous if at least one air passageway is formed between the optics and the inner surface of the sidewall facing the inner cavity, wherein the air passageway is connected to at least one of the openings. The optical system then fulfills a dual function in which on the one hand it serves to direct the light emitted by the semiconductor light source and on the other hand leads to the cooling air flow occurring in the chimney effect in such a way that it flows past the largest possible surface area of the heat sink.
Bei einer zweckmäßigen Ausgestaltung der Erfindung durchsetzten die Kühlrippen den Boden und/oder die Seitenwand des Basisteils und kommen mit einem am Boden und/oder der Seitenwand in die Innenhöhlung vorstehenden Teilbereich an der Optik zur Anlage. Dadurch wird eine noch größere Oberfläche des Kühlkörpers ermöglicht. Bevorzugt weist die Seitenwand eine Schräge auf, an der die lichte Weite der Innenhöhlung, ausgehend vom Boden zu dem vom Boden entfernten freien Rand der Seitenwand, zunimmt, wobei sich die Öffnungen vom Boden bis in die Schräge erstrecken. Dabei kann praktisch die gesamte durch die Öffnungen hindurch tretende Kühlluft an den Kühlrippen vorbeiströmen. In an expedient embodiment of the invention, the cooling ribs penetrate the bottom and / or the side wall of the base part and come with a on the floor and / or the side wall in the inner cavity projecting portion of the optics to the plant. This allows an even larger surface area of the heat sink. Preferably, the side wall has a slope at which the inside width of the inner cavity, starting from the bottom to the free edge of the side wall remote from the ground, increases, wherein the openings extend from the bottom to the slope. In this case, virtually all of the cooling air passing through the openings can flow past the cooling fins.
Beschreibung der Zeichnungen Description of the drawings
Die Erfindung wird nachstehend ohne Beschränkung des allgemeinen Erfindungsgedankens anhand eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnungen exemplarisch beschrieben. Es zeigt: The invention will now be described by way of example without limitation of the general inventive idea using an exemplary embodiment with reference to the drawings. It shows:
Fig. 1 einen Teilquerschnitt durch eine Beleuchtungseinrichtung, die 1 shows a partial cross section through a lighting device, the
Leuchtdioden aufweist, die wärmeleitend mit einem Kühlkörper verbunden ist, wobei die Querschnittsebene des Teilquerschnitts radial zur Leuchtdiode angeordnet ist,  Having light-emitting diodes, which is connected to a heat sink in a heat-conducting manner, the cross-sectional plane of the partial cross-section being arranged radially relative to the light-emitting diode,
Fig. 2 eine Seitenansicht auf die Rückseite einer Beleuchtungseinrichtung und Fig. 2 is a side view of the back of a lighting device and
Fig. 3 eine Aufsicht auf die Rückseite der Beleuchtungseinrichtung. Fig. 3 is a plan view of the back of the lighting device.
Eine im Ganzen mit 1 bezeichnete Beleuchtungseinrichtung weist als Leuchtmittel mehrere, in der Zeichnung nur schematisch dargestellte, als Leuchtdioden ausgestaltete Halbleiterlichtquellen 2 auf, die jeweils in einen Halbleiterchip integriert sind. Die Halbleiterchips sind auf einem gemeinsamen Träger angeordnet sind, der aus einem gut wärmeleitenden Material, wie zum Beispiel Aluminium, besteht. Die einzelnen Halbleiterchips sind an ihrer der Abstrahlseite abgewandten Rückseite jeweils flächig wärmeleitend mit dem Träger verbunden. An illumination device designated as a whole by 1 has a plurality of semiconductor light sources 2, which are only shown schematically in the drawing and designed as light-emitting diodes, which are each integrated in a semiconductor chip. The semiconductor chips are arranged on a common carrier, which consists of a good heat-conducting material, such as aluminum. The individual semiconductor chips are each connected at their rear side facing away from the emission side in a heat-conductive manner to the carrier.
Der Träger ist mit seiner den Halbleiterchips abgewandten Rückseite flächig wärmeleitend mit einem über dem Träger angeordneten Kühlkörper 3 verbunden, der aus einem wärmeleitfähigen Werkstoff, wie z.B. Aluminium besteht. Der Träger kommt mit seiner Rückseite flächig an der Unterseite des Kühlkörpers 3 zur Anlage. Die beim Betrieb der Beleuchtungseinrichtung 1 in den Halbleiterlichtquellen 2 auftretende Verlustwärme wird von den Halbleiterchips der Halbleiterlichtquellen 2 durch den Träger hindurch in den Kühlkörper 3 eingeleitet und von dort an die Umgebungsluft abgegeben. The carrier is connected with its side facing away from the semiconductor chips backside heat-conducting with a arranged above the carrier heat sink 3, which consists of a thermally conductive material, such as aluminum. The Carrier comes with its back surface at the bottom of the heat sink 3 to the plant. The heat loss occurring during operation of the lighting device 1 in the semiconductor light sources 2 is introduced from the semiconductor chips of the semiconductor light sources 2 through the carrier into the heat sink 3 and discharged from there to the ambient air.
Wie in Fig. 1 und 2 erkennbar ist, weist der Kühlkörper 3 ein becherförmiges Basisteil 4 auf. Das Basisteil 4 hat in der in Fig. 3 gezeigten Aufsicht auf seine Rückseite eine etwa kreisförmige Außenkontur. Das Basisteil 4 hat einen Boden 5 und eine seitlich damit verbundene Seitenwand 6, die um den Boden 5 herumläuft. An das Basisteil 4 sind rückseitig Kühlrippen 7 angeformt, die jeweils radial vom Zentrum des Basisteils 4 weg nach außen verlaufen. In Fig. 2 ist deutlich erkennbar, dass die Kühlrippen 7 in quer zueinander angeordneten Richtungen um das Zentrum des Basisteils 4 herum angeordnet sind. Dabei erstrecken sich die Kühlrippen 7 in Radialebenen, die durch die Mittelachse 8 des Basisteils 4 und radial dazu verlaufende Achsen aufgespannt sind. As can be seen in FIGS. 1 and 2, the heat sink 3 has a cup-shaped base part 4. In the plan view shown in FIG. 3, the base part 4 has an approximately circular outer contour on its rear side. The base part 4 has a bottom 5 and a side wall 6 connected thereto laterally, which runs around the bottom 5. On the back of the base 4 cooling fins 7 are formed, each extending radially from the center of the base part 4 away to the outside. In Fig. 2 it can be clearly seen that the cooling fins 7 are arranged in transversely arranged directions about the center of the base part 4 around. Here, the cooling fins 7 extend in radial planes, which are spanned by the central axis 8 of the base part 4 and radially extending axes.
In der Aufsicht auf die Abstrahlseite der Beleuchtungseinrichtung befinden sich die Halbleiterlichtquellen 2 im Zentrum des Kühlkörpers 3 auf der Mittelachse 8 oder dicht benachbart zu dieser, so dass die beim Betrieb der Beleuchtungseinrichtung 1 in den Halbleiterlichtquellen 2 auftretende Verlustwärme nach allen Seiten gut abgeführt und über eine entsprechend große Kühlkörperoberfiäche an die Umgebungsluft angegeben wird. In Fig. 1 ist die Wärmetransportrichtung schematisch durch einen Pfeil 9 angedeutet. In the plan view of the emission side of the illumination device are the semiconductor light sources 2 in the center of the heat sink 3 on the central axis 8 or closely adjacent to this, so that the occurring during operation of the lighting device 1 in the semiconductor light sources 2 loss of heat well dissipated on all sides and a correspondingly large Kühlkörperoberfiäche is specified to the ambient air. In Fig. 1, the heat transport direction is indicated schematically by an arrow 9.
Wie in Fig. 1 besonders gut erkennbar ist, sind die Kühlrippen 7 in Umfangsrich- tung des Basisteils 4 durch seitliche Zwischenräume voneinander beabstandet. Im Bereich der Zwischenräume weist das Basisteil 4 Öffnungen 10 für den Durchtritt von Kühlluft auf. Die Öffnungen 10 sind als schlitzförmige Wandungsdurchbrüche ausgestaltet, die sich in Radialebenen erstrecken, die durch die Mittel- achse 8 des Basisteils 4 und radial dazu verlaufende Achsen aufgespannt sind. In Fig. 3 ist erkennbar, dass die Öffnungen 10 im äußeren Bereich des Kühlkörpers 3 mit Abstand von dessen Zentrum angeordnet sind. As can be seen particularly clearly in FIG. 1, the cooling fins 7 are spaced apart in the circumferential direction of the base part 4 by lateral interspaces. In the area of the intermediate spaces, the base part 4 openings 10 for the passage of cooling air. The openings 10 are configured as slot-shaped wall openings which extend in radial planes which are defined by the middle axis 8 of the base part 4 and radially extending axes are clamped. In Fig. 3 it can be seen that the openings 10 are arranged in the outer region of the heat sink 3 at a distance from the center thereof.
Anhand von Fig. 1 wird deutlich, dass der Boden 5 und die Seitenwand 6 eine Innenhöhlung begrenzen, und dass die Halbleiterlichtquellen in der Innenhöhlung am Boden 5 des Basisteils 4 angeordnet sind. In der Innenhöhlung ist außerdem eine Optik 11 zur Formung des von den Halbleiterlichtquellen 2 ausgesendeten Lichts angeordnet. It is clear from FIG. 1 that the bottom 5 and the side wall 6 delimit an inner cavity, and that the semiconductor light sources are arranged in the inner cavity at the bottom 5 of the base part 4. In addition, an optical system 11 for shaping the light emitted by the semiconductor light sources 2 is arranged in the inner cavity.
In Fig. 1 ist erkennbar, dass zwischen der Optik 11 und der dieser zugewandten Innenfläche der Seitenwand 6 ein Luftdurchtrittskanal 12 gebildet ist. Der Luft- durchtrittskanal 12 weist an seinem unteren Ende eine Ansaugöffnung 13 auf, die zwischen dem freien Rand der Seitenwand 6 und dem Außenumfang der Optik 11 kreisringförmig oder kreisringsegmentförmig um die Optik 11 herum verläuft. An seinem oberen Ende ist der Luftdurchtrittskanal 12 mit den Öffnun- gen 10 verbunden. Beim Betrieb der Halbleiterlichtquellen 2 tritt im Luftdurchtrittskanal 12 ein Kamineffekt auf, bei dem eine Luftströmung entsteht, die entlang der punktierten Linie 14 von der Ansaugöffnung 13 durch die Öffnungen 10 hindurch an dem Kühlrippen 7 vorbeiströmt. In Fig. 1 it can be seen that between the optics 11 and the inner surface facing the side wall 6, an air passage 12 is formed. The air passage channel 12 has at its lower end to a suction port 13 which extends between the free edge of the side wall 6 and the outer periphery of the optical system 11 in the form of an annular or circular ring about the optics 11 around. At its upper end, the air passage channel 12 is connected to the openings 10. During operation of the semiconductor light sources 2, a chimney effect occurs in the air passage 12, causing an air flow which flows along the dotted line 14 from the suction opening 13 through the openings 10 past the cooling fins 7.
In Fig. 1 ist noch erkennbar, dass die Kühlrippen 7 den Boden 5 und die Seiten- wand 6 des Basisteils 4 durchsetzten. Außerdem ist erkennbar, dass die Optik durch einen Freiraum 15 vom Boden 5 des Basisteils 4 beabstandet ist und dass die Halbleiterlichtquellen 2 in dem Freiraum 15 angeordnet sind. Bei Bedarf kann in dem Frei räum 15 auch die Ansteuereinrichtung für die Halbleiterlichtquellen 2 vorgesehen sein. Anhand von Fig. 1 wird deutlich, dass die Seitenwand 6 eine zumindest segmentweise in Umfangsrichtung um die Mittelachse 8 umlaufende Schräge aufweist, an der die lichte Weite der Innenhöhlung, ausgehend vom Boden 5 zu dem vom Boden 5 entfernten unteren Rand der Seitenwand 6, zunimmt. Die Öffnungen befinden sich im Boden 5 und in der Schräge. FIG. 1 also shows that the cooling fins 7 penetrated the base 5 and the side wall 6 of the base part 4. In addition, it can be seen that the optic is spaced from the bottom 5 of the base part 4 by a free space 15 and that the semiconductor light sources 2 are arranged in the free space 15. If necessary, in the free space 15, the drive means for the semiconductor light sources 2 may be provided. 1, it becomes clear that the side wall 6 has an at least segmentally circumferentially circumferential about the central axis 8 slope on which the inside diameter of the inner cavity, starting from the bottom 5 to the from the bottom 5 remote bottom edge of the side wall 6, increases. The openings are located in the bottom 5 and in the slope.
Erwähnt werden soll noch, dass die Kühlrippen 7 durch einen konzentrisch um die Mittelachse 8 umlaufenden Ringwulst 16 miteinander verbunden sind. It should also be mentioned that the cooling fins 7 are connected to one another by a circular bead 16 concentrically surrounding the central axis 8.
Bezugszeichenliste LIST OF REFERENCE NUMBERS
1 Beleuchtungseinrichtung1 lighting device
2 Halbleiterlichtquellen2 semiconductor light sources
3 Kühlkörper 3 heatsinks
4 Basisteil  4 base part
5 Boden  5 floor
6 Seitenwand  6 side wall
7 Kühlrippe  7 cooling fin
8 Mittelachse  8 central axis
9 Pfeil  9 arrow
10 Öffnung  10 opening
11 Optik  11 optics
12 Luftdurchtrittskanal 12 air passage
13 Ansaugöffnung 13 intake opening
14 punktierte Linie  14 dotted line
15 Freiraum  15 free space
16 Ringwulst  16 ring bulge

Claims

Patentansprüche claims
1. Beleuchtungseinrichtung (1) mit mindestens einer Halbleiterlichtquelle (2) und einem Kühlkörper, wobei 1. lighting device (1) with at least one semiconductor light source (2) and a heat sink, wherein
- der Kühlkörper (3) wärmeleitend der Halbleiterlichtquelle verbundenen ist, - The heat sink (3) is thermally conductively connected to the semiconductor light source,
- der Kühlkörper (3) ein der Halbleiterlichtquelle (2) zugewandtes Basisteil (4) aufweist, the heat sink (3) has a base part (4) facing the semiconductor light source (2),
- an das Basisteil (4) Kühlrippen (7) angeformt sind, - On the base part (4) cooling ribs (7) are integrally formed,
- der Kühlkörper (3) Öffnungen (10) für den Durchtritt von Kühlluft aufweist, dadurch gekennzeichnet, dass - The heat sink (3) has openings (10) for the passage of cooling air, characterized in that
(i) sich die Kühlrippen (7) in der Aufsicht auf das Basisteil (4) in quer zueinander angeordneten Richtungen von der mindestens einen Halbleiterlichtquelle (2) weg erstrecken, und (i) the cooling fins (7) extend in a plan view of the base part (4) in transversely arranged directions away from the at least one semiconductor light source (2), and
(ii) die Öffnungen (10) in dem Basisteil (4) zwischen den Kühlrippen (7) angeordnet sind. (Ii) the openings (10) in the base part (4) between the cooling fins (7) are arranged.
2. Beleuchtungseinrichtung (1) nach Anspruch 1, 2. Lighting device (1) according to claim 1,
dadurch gekennzeichnet, dass  characterized in that
die mindestens eine Halbleiterlichtquelle (2) in der Aufsicht auf das Basisteil (4) im Zentrum des Kühlkörpers (3) vorgesehen ist und dass die Kühlrippen (7) zumindest in etwa radial zu der mindestens einen Halbleiterlichtquelle (2) angeordnet sind. Beleuchtungseinrichtung (1) nach Anspruch 1 oder 2, the at least one semiconductor light source (2) is provided in the plan view of the base part (4) in the center of the heat sink (3) and that the cooling fins (7) are arranged at least approximately radially to the at least one semiconductor light source (2). Lighting device (1) according to claim 1 or 2,
dadurch gekennzeichnet, characterized,
dass die Öffnungen (10) als Schlitze ausgestaltet sind, und dass sich die Schlitze in der Aufsicht auf das Basisteil (4) radial zur mindestens einen Halbleiterlichtquelle (2) erstrecken. in that the openings (10) are configured as slots, and in that the slots extend in a plan view onto the base part (4) radially to the at least one semiconductor light source (2).
Beleuchtungseinrichtung (1) nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass Lighting device (1) according to one of claims 1 to 3, characterized in that
das Basisteil (4) zumindest im Wesentlichen becherförmig mit einem Boden (5) und einer Seitenwand (6) ausgestaltet ist, welche eine Innenhöhlung begrenzen, und dass die mindestens eine Halbleiterlichtquelle (2) in der I nnenhöhlung am Boden (5) des Basisteils (4) angeordnet ist. the base part (4) is at least substantially cup-shaped with a base (5) and a side wall (6) defining an inner cavity, and that the at least one semiconductor light source (2) in the inner cavity at the bottom (5) of the base part (5) 4) is arranged.
Beleuchtungseinrichtung (1) nach Anspruch 4, Lighting device (1) according to claim 4,
dadurch gekennzeichnet, dass characterized in that
in der Innenhöhlung eine Optik (11) zur Formung des von der mindestens einen Halbleiterlichtquelle (2) ausgesendeten Lichts angeordnet ist. an optic (11) for shaping the light emitted by the at least one semiconductor light source (2) is arranged in the inner cavity.
Beleuchtungseinrichtung (1) nach einem der Ansprüche 4 oder 5, dadurch gekennzeichnet, dass Lighting device (1) according to one of claims 4 or 5, characterized in that
zwischen der Optik (11) und der der Innenhöhlung zugewandten I nnenfläche der Seitenwand (6) mindestens ein Luftdurchtrittskanal (12) gebildet ist, und dass der Luftdurchtrittskanal (12) mit mindestens einer der Öffnungen (10) verbunden ist. at least one air passageway (12) is formed between the optical system (11) and the interior cavity facing inner surface of the side wall (6), and that the air passageway (12) is connected to at least one of the openings (10).
Beleuchtungseinrichtung (1) nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, dass Lighting device (1) according to one of claims 4 to 6, characterized in that
die Kühlrippen (7) den Boden (5) und/oder die Seitenwand (6) des Basisteils (4) durchsetzten und mit einem am Boden (5) und/oder der Seiten- wand (6) in die I nnenhöhlung vorstehenden Teilbereich an der Optik (11) zur Anlage kommen. the cooling ribs (7) penetrate the bottom (5) and / or the side wall (6) of the base part (4) and are provided with a support on the bottom (5) and / or the side wall (6). wall (6) in the inner cavity projecting portion of the optics (11) come to rest.
Beleuchtungseinrichtung (1) nach einem der Ansprüche 4 bis 7, Lighting device (1) according to one of claims 4 to 7,
dadurch gekennzeichnet, dass characterized in that
die Seitenwand (6) eine Schräge aufweist, an der die lichte Weite der Innenhöhlung, ausgehend vom Boden (5) zu dem vom Boden (5) entfernten freien Rand der Seitenwand (6), zunimmt, und dass sich die Öffnungen (10) vom Boden (5) bis in die Schräge erstrecken. the side wall (6) has a slope, at which the inside width of the inner cavity, starting from the bottom (5) to the free edge of the side wall (6) remote from the bottom (5), increases, and in that the openings (10) of Floor (5) extend into the slope.
EP12720217.4A 2011-05-16 2012-05-14 Lighting device Not-in-force EP2710295B1 (en)

Priority Applications (1)

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DE102011050380.3A DE102011050380B4 (en) 2011-05-16 2011-05-16 lighting device
PCT/EP2012/058930 WO2012156366A1 (en) 2011-05-16 2012-05-14 Lighting device

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EP2710295B1 EP2710295B1 (en) 2015-04-29

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US20160201892A1 (en) * 2013-09-02 2016-07-14 Hui Chiang CHEN Lamp Base with Heat Dissipation Structure and Lamp Thereof, and Illumination Device
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US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
DE202009001475U1 (en) 2009-02-06 2009-04-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for a lighting device
CN201936911U (en) * 2009-03-16 2011-08-17 莫列斯公司 Optical module and optical system with optical modules
AU2010268692A1 (en) * 2009-07-02 2012-02-02 Associated Controls (Australia) Pty Ltd Cooling for LED illumination device
DE202009005266U1 (en) * 2009-09-10 2009-12-03 Davinci Industrial Inc., Hsinchuang LED lamp with high heat dissipation and safety
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DE102011050380B4 (en) 2014-07-03
DE102011050380A1 (en) 2012-11-22
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EP2710295B1 (en) 2015-04-29
WO2012156366A1 (en) 2012-11-22
PL2710295T3 (en) 2015-10-30

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