EP2693568A1 - Modulverbinder zur unterbrechungsfreien Kommunikation - Google Patents

Modulverbinder zur unterbrechungsfreien Kommunikation Download PDF

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Publication number
EP2693568A1
EP2693568A1 EP13178736.8A EP13178736A EP2693568A1 EP 2693568 A1 EP2693568 A1 EP 2693568A1 EP 13178736 A EP13178736 A EP 13178736A EP 2693568 A1 EP2693568 A1 EP 2693568A1
Authority
EP
European Patent Office
Prior art keywords
module
connector
pair
pins
mating pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13178736.8A
Other languages
English (en)
French (fr)
Other versions
EP2693568B1 (de
Inventor
Milind Mohaniraj Karodi
Sunil Nagnathrao Kulkarni
Rahul Rameshrao Kulkarni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/943,201 external-priority patent/US9077097B2/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP2693568A1 publication Critical patent/EP2693568A1/de
Application granted granted Critical
Publication of EP2693568B1 publication Critical patent/EP2693568B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/26—Clip-on terminal blocks for side-by-side rail- or strip-mounting
    • H01R9/2625—Clip-on terminal blocks for side-by-side rail- or strip-mounting with built-in electrical component
    • H01R9/2633—Clip-on terminal blocks for side-by-side rail- or strip-mounting with built-in electrical component with built-in switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/70—Structural association with built-in electrical component with built-in switch
    • H01R13/703—Structural association with built-in electrical component with built-in switch operated by engagement or disengagement of coupling parts, e.g. dual-continuity coupling part
    • H01R13/7031—Shorting, shunting or bussing of different terminals interrupted or effected on engagement of coupling part, e.g. for ESD protection, line continuity
    • H01R13/7034—Shorting, shunting or bussing of different terminals interrupted or effected on engagement of coupling part, e.g. for ESD protection, line continuity the terminals being in direct electric contact separated by double sided connecting element

Definitions

  • the present subject matter in general, relates to circuit based systems, and in particular, relates to a module connector for circuit based systems.
  • I/O modules may be used as building blocks in circuit based systems, such as sensor assemblies or computing systems. For example, in systems managing control or measurement operations, sensor assemblies are implemented for various purposes, such as temperature control, gas detection, and fire detection.
  • the I/O modules may be configured to perform desired control actions as per user requirements.
  • the I/O modules may process data received from sensors or detectors installed at field sites and transmit the processed data to a central control board (CCB) for the required control action to be implemented.
  • CCA central control board
  • the various I/O modules in a sensor assembly are connected to a circuit board that provides for connection between the I/O modules and the CCB.
  • the I/O modules may be connected to the circuit board through module connectors placed on the circuit board.
  • the module connectors serve as sockets into which the I/O modules may be inserted or removed as per the requirement.
  • the assembly formed by the I/O modules mounted on the circuit board through module connectors may be further mounted onto a supporting structure for various purposes, such as mounting the assembly in a desired location.
  • the assembly may be mounted onto a Deutsches Institut für Normung (DIN) rail.
  • the DIN rail is a standard type metallic rail or track widely used for mounting the I/O modules for various control operation in industries.
  • a user can, for example, attach the circuit board with the module connectors to the DIN rail and mount the I/O modules onto the DIN rail by simply plugging the I/O modules in the module connectors or even remove the I/O modules from the DIN rail by unplugging the I/O modules from the module connectors.
  • the user may mount one or more I/O modules for gas detection control or measurement operation, onto a DIN rail through module connectors.
  • the I/O modules may receive field data from one or more gas sensor for processing.
  • the processed data may be further transmitted to the CCB, through the module connectors and the circuit board, for the further data processing or for performing some control action, such as generating an alarm or opening of exhaust vents.
  • An I/O module mounted onto the circuit board through the module connector may be removed in case the I/O module is no longer needed.
  • the I/O module may be removed and may be replaced by another I/O module.
  • an existing I/O module may be replaced with another I/O module having an updated version of software in a processor of the I/O module.
  • any one of the several I/O modules present in a sensor assembly may become malfunctional and may be removed for repair or for replacement by another I/O module.
  • a module connector for uninterrupted communication comprises a slot for receiving connector pins of an I/O module. At least one pair of mating pins is disposed in the slot. The at least one pair of mating pins is normally closed in absence of the connector pins in the slot. Further, the at least one pair of mating pins in a normally closed state moves to an open state upon receiving the connector pins of the I/O module in the slot.
  • Figure 1 illustrates a perspective top view of a backplane assembly with a plurality of module connectors, in accordance with an embodiment of the present subject matter.
  • Figure 2 illustrates a top view of a circuit board, in accordance with an embodiment of the present subject matter.
  • Figure 3(a) and 3(b) illustrate a top view and a perspective top view of a DIN rail respectively, in accordance with an embodiment of the present subject matter.
  • Figure 4 illustrates a perspective top view of a supported assembly with the backplane assembly affixed to the DIN rail, in accordance with an embodiment of the present subject matter.
  • FIGS. 5(a) and 5(b) illustrate perspective top views of the supported assembly with I/O modules, in accordance with an embodiment of the present subject matter.
  • FIGS. 6(a) to 6(d) illustrate a module connector respectively, in accordance with an embodiment of the present subject matter.
  • Figure 7(a) illustrates a side view of the module connector in an open state, in accordance with an embodiment of the present subject matter.
  • Figure 7(b) illustrates a side view of the module connector in a normally closed state, in accordance with an embodiment of the present subject matter.
  • module connectors For building circuit based systems, for example, sensor assemblies, usually one or more module connectors are attached to a circuit board to form a backplane assembly.
  • the module connectors may be understood as socket like structures attached to the circuit board and I/O modules, configured to perform various control or measurement related operations, may be inserted into the module connectors.
  • the I/O modules comprise processors that process data required for performing the control or measurement operations for which the circuit based system is implemented.
  • an I/O module in a sensor assembly configured for fire detection may receive data, such as temperature and level of carbon dioxide from respective field sensors and process the data to generate a control signal.
  • the control signal may in turn indicate to a central control board (CCB) of the sensor assembly that a control operation, such as the activation of water sprinklers is required to be performed.
  • a control operation such as the activation of water sprinklers is required to be performed.
  • the I/O modules comprise the intelligence for the data processing while the backplane assembly provides for communication between various components of the sensor assemblies.
  • the backplane assembly serves a means for communication of data and signals between the field sensors, the I/O modules and the CCB.
  • the backplane assembly also allows distribution of power distribution from a power supply to the I/O Modules, sensors and field devices.
  • the one or more module connectors are connected to the circuit board through a plurality of connecting pins.
  • the plurality of connecting pins is provided in a predefined pattern on a bottom surface of a module connector.
  • the connecting pins may be provided in two rows on the bottom surface of the module connector.
  • the connecting pins of a module connector may be configured to act as input or output pins for communication of data and signal for an I/O module coupled to that module connector.
  • the I/O modules may receive data, such as data from the field sensors and detectors, through the connecting pins provided in one row of the module connector.
  • the I/O module may process the received data, and transmit the processed data to another I/O module or the CCB through the connecting pins provided in other row of the module connector.
  • the backplane assembly formed by the module connectors and the circuit board may often need a supporting structure, for example, to mount or affix the backplane assembly in an appropriate location.
  • the backplane assembly may be mounted onto a DIN rail.
  • the DIN rail is a metallic rail or track used to mount various I/O modules in accordance with the DIN standard. DIN is a worldwide standard for dimensional uniformity for products regardless of the manufacturer.
  • the I/O modules are plugged-in into the module connectors.
  • I/O modules are mounted onto the DIN rail through the module connectors in series for performing the control and measurement operations.
  • the I/O modules may communicate processed data received from the field sensors to the CCB through a ring communication protocol.
  • the I/O modules are not plugged in each of the module connectors. In such cases, the communication of the signals or power supply distribution from one I/O module to the other I/O module and I/O modules to the CCB may get interrupted because of communication link failure.
  • dummy I/O modules may be used to avoid breaking of the communication link.
  • Use of the dummy I/O modules to avoid breaking of the communication link often proves costly, more so in cases where a large number of module connectors of the circuit board are without the I/O modules.
  • a large number of module connectors of the circuit board are without the I/O modules.
  • the use of four dummy devices may increase the cost of the sensor assembly in terms of procurement of the components as well as the cost of operation of the sensor assembly for performing the control and measurement operation.
  • Hot insertion in this context may be understood as insertion of an I/O module onto a module connector of the backplane assembly when power supply and data communication within the IO modules and CCB is in an 'ON' state, without disturbing other I/O modules or the communication of signals and data that may be ongoing between the I/O modules and the CCB.
  • hot removal refers to removal of an I/O module from a module connector of the backplane assembly when the power supply and the data communication is in an 'ON" state of the assembly without disturbing the other I/O modules or the communication of signals and data that may be ongoing between the I/O modules and the CCB.
  • hot insertion/removal is addition/disengagement of the I/O modules in the power 'ON' state of the assembly without affecting the ring communication of the signals and data.
  • the existing architecture of the module connector fails to provide for the same.
  • the ring communication of data gets affected due to removal of the I/O modules from the module connector or the removal of dummy I/O modules which are plugged-in the module connector to complete the communication link.
  • the communication link between the other I/O modules and the CCB responsible for the ring communication may break because of the removal of the I/O module or the dummy IO module, as the case may be, from the module connector.
  • the present subject matter describes a module connector for an uninterrupted communication.
  • the module connector provides uninterrupted communication between the I/O modules and the CCB in a circuit based system and is independent of the presence of an I/O module for completing the communication link.
  • the module connector ensures that the other I/O modules or the communication of signals and data or power supply distribution that may be ongoing between the I/O modules and the CCB remain unaffected whenever hot insertion or removal of an I/O module coupled to the module connector are performed.
  • At least one pair of mating pins is disposed in the module connector within a slot where an I/O module is inserted onto the module connector.
  • the mating pins are disposed in the slot of the module connector that receives connector pins of the I/O module to couple the I/O module to the module connector and in turn to the circuit board.
  • each pair of mating pins is a normally closed pin, i.e., opposite mating pins of the pair of mating pins are normally closed to complete a communication link through the module connector.
  • the opposite mating pins in the slot of the module connector remain in a normally closed state, shorted to each other, and complete the communication link.
  • the opposite mating pins of the pair of mating pins separate and move to an open state to accommodate connector pins of the I/O module.
  • the communication link may be established through the I/O module while in case of absence of the I/O module, the mating pins, in a closed position, complete the communication link between the I/O modules and the CCB, or the I/O module and other I/O modules as the case may be. Therefore, the module connector allows an uninterrupted communication between the I/O modules and the CCB, and between different I/O modules.
  • the at least one pair of mating pins in the open state move back to the normally closed state ensuring that the communication link between the I/O modules and the CCB and between different I/O modules remains completed.
  • the module connector includes a guiding rib on a side surface of the module connector.
  • the guiding rib may allow proper alignment of the I/O modules on the module connector.
  • the guiding rib may help in ensuring safety of the I/O module by ensuring that a ground connection is secured first before connection to a power supply.
  • the specification provided here explains in a detailed manner the module connector for an uninterrupted communication in circuit based assemblies.
  • the module connector has been explained herein in context of an assembly of backplane PCB having multiple module connectors soldered to it and affixed to a DIN rail.
  • the module connector has been described with respect to an assembly of backplane PCB, multiple module connectors, and a DIN rail, the concept explained in context thereto may be extended to any other circuit board to which the module connector may be connected, and any other metallic rail or hard circuit on which the module connectors may be mounted, without deviating from the scope and spirit of the invention.
  • the module connector may be soldered to a stripboard which is in turn mounted onto a metal sheet.
  • FIG. 1 illustrates a perspective top view of a backplane assembly 100, in accordance with an embodiment of the present subject matter.
  • Figure 1 shows multiple module connectors 102-1, 102-2...102-n, hereinafter collectively referred to as the module connectors 102 and individually referred to as a module connector 102.
  • the number of module connectors 102 included in a backplane assembly 100 is determined by the design of a circuit based system (not shown in Figures) in which the backplane assembly 100 will be implemented and may vary accordingly.
  • the backplane assembly 100 may be implemented in various circuit based systems or computing systems, hereinafter interchangeably referred to as systems.
  • systems include, but is not limited to, data acquisition systems, industrial control system, programmable logic controllers, building automation and control systems, distributed control systems and supervisory control and data acquisition (SCADA) systems.
  • SCADA supervisory control and data acquisition
  • the module connectors 102 are connected to a circuit board 104.
  • the module connectors 102 may be connected to a circuit board 104, such as a printed circuit board (PCB), a stripboard or any other equivalent structure that may provide an electrical coupling between the various module connectors 102 placed on the circuit board 104.
  • the module connectors 102 may be connected to the circuit board 104 through various methods, such as soldering and riveting.
  • the module connectors 102 upon being connected to the circuit board 104 forms the backplane assembly 100.
  • the backplane assembly 100 may also have a power supply socket 106 connected to the circuit board 104.
  • the power supply socket 106 may provide power supply to the backplane assembly 100 from a power supply source.
  • the power supply again, is based on the design of the system. In one implementation, a power supply of 24 V dc and 3 A may be provided to the module connectors 102 connected to the circuit board 104.
  • Each of the module connectors 102-1, 102-2...102-n may also be provided with a pair of arm like protruding structures, known as modular snaps 108-1, 108-2...108-n, respectively.
  • the modular snaps 108-1, 108-2...108-n collectively, referred to as modular snaps 108, are used to affix the backplane assembly 100 to a supporting structure.
  • Each of the module connectors 102 may have at least one pair of contact pins (not shown in Figure 1 ) disposed within the module connectors 102.
  • the contact pins in one example, are in a normally closed state. Both the contact pins in the pair of contact pins remain shorted to each other in the absence of an electronic device in the module connector 102. This allows an uninterrupted communication of signals or uninterrupted power supply distribution in the backplane assembly 100 through the pair of contact pins even in the absence of the electronic device. Details of the contact pins of the module connectors 102 have been elaborated later in the present description.
  • FIG. 2 illustrates a top view of the circuit board 104, in accordance with an embodiment of the present subject matter.
  • the circuit board 104 is a PCB 104-1.
  • the PCB 104-1 has a plurality of plated through-holes 202 for connecting various electronic components, such as the module connectors 102.
  • the plurality of plated through-holes 202 are provided in a particular arrangement depending design of the assembly.
  • each electronic component comprises a number of connecting pins through which the electrical component may be connected to the PCB 104-1.
  • the number of plated through-holes 202 provided in the PCB 104-1 is in accordance with number of connecting pins in the electronic components that is to be connected.
  • Each of the module connectors 102 may comprise five connecting pins (not shown in Figure 2 ) placed in two rows.
  • the plurality of plated through-holes 202 in the PCB 102-1 are provided in sets of two rows of five plated through-holes 202 each to allow soldering of a module connector 102 to the PCB 104-1.
  • the two rows of pins may be referred to as the input pins and the output pins since electrical signal enter in to the module connector 102 through the input pins and exit through the output pins.
  • the circuit board 104 comprises in-built electrical connections that provide a communication link between one or more module connectors 102 in accordance with the design of the system. Also, usually, connections from the power supply socket 106 to each of the module connector 102 are also provided.
  • the backplane assembly 100 may be affixed to a supporting structure.
  • the supporting structure imparts strength to the backplane assembly 100 and often serves as a means to mount the backplane assembly 100 on desired location, for example, onto a wall-like structure.
  • Examples of supporting structure include, but are not limited to, a DIN rail or any other wooden, metallic or plastic panels on to which the backplane assembly 100 may be affixed.
  • the backplane assembly 100 may be mounted on a supporting structure, such as a metal sheet and cardboard.
  • FIG. 3(a) and 3(b) illustrate a top view and a perspective top view of a DIN rail 300 respectively, in accordance with an embodiment of the present subject matter.
  • the DIN rail 300 is a standardized metallic rail, to which an electrical panel, such as the backplane assembly 100 may be mounted.
  • the DIN rail 300 may be of different types.
  • the DIN rail 300 as show in the Figure 3(a) and 3(b) is a top-hat type rail.
  • the depicted DIN rail 300 is referred so because of its hat-shaped cross section.
  • other types of DIN rails such as a 'C' Type or a 'G' type DIN rail may be used for mounting the backplane assembly 100.
  • the DIN rail 300 has an accommodating surface 302 to accommodate the electrical panel, such as the backplane assembly 100, onto the DIN rail 300.
  • the accommodating surface 302 has mounting holes 304 to provide a medium for fixing the DIN rail 300 on to a wall or an equipment rack.
  • the DIN rail 300 has a first flange 306 and a second flange 308 on either side of the accommodating surface 302 for providing support to the backplane assembly 100 mounted onto the DIN rail 300.
  • the DIN rail 300 of different width may be used depending upon requirements of an assembly. For example, a DIN rail 300 having a width of 35 mm may be used for mounting the backplane assembly 100.
  • Figure 4 illustrates a perspective top view of a supported assembly 400 with the backplane assembly 100 affixed to the DIN rail 300, in accordance with an embodiment of the present subject matter.
  • Figure 4 shows the DIN rail 300, on which the backplane assembly 100 is accommodated by methods, such as by press fitting.
  • the modular snaps 108 of the module connectors 102 latches to the first flange 306 and the second flange 308 of the DIN rail 300 upon press fitting and rigidly connects the backplane assembly 100 to the DIN rail 300.
  • the supported assembly 400 may now be mounted on wall or an equipment rack.
  • the supported assembly 400 Once the supported assembly 400 is mounted at a desired location, other components of the system may be plugged into the module connectors 102. It is also possible that the components may be first plugged in and thereafter the supported assembly 400, along with the plugged-in components, be mounted at the desired location.
  • FIG. 5(a) and 5(b) illustrate perspective top views of the supported assembly 400 with components, such as I/O modules 500-1, 500-2...500-n, collectively referred to as I/O modules 500, connected to the module connectors 102, in accordance with an embodiment of the present subject matter.
  • the I/O modules 500 may be understood as a processing device, which receives the data/signals for processing and outputs the processed data/signals.
  • the I/O module 500 may include a microprocessor to process the data/signals received.
  • the I/O modules 500 may be configured to receive field data from sensors and process that same such that appropriate control operation may be enabled.
  • the control operation is not restricted to generating an alarm or opening of exhaust vents.
  • control operation may also include indicating information and monitoring. It will be appreciated by one skilled in the art that the examples are included merely for easy of understanding and should not be construed as limitations.
  • the module connectors 102 serve as sockets onto which the I/O modules 500 are plugged in and the circuit board 104 serves as a means for electrical communication between the I/O modules 500 and the CCB that enables the control operation.
  • electrical signals travel through the electrical connections provided on the circuit board 104, into an I/O module 500, for example I/O module 500-1 via the inputs pins of the module connector 102-1 and exit through the output pins of the module connector 102-1.
  • the electrical signals then, based on the electrical connections provided on the circuit board 104, may then enter I/O module 500-2 and exit there from to the next I/O module 500-n.
  • module connectors 102 are without the I/O module 500.
  • absence of an I/O module 500 from a module connector 102 leads to communication link failure since the path of the electrical signals fails to be completed.
  • module connectors 102 are configured to complete the communication link without the I/O module 500. The subsequent description, elaborates the construction and working of a module connector 102 such that it may be understood how the module connector 102 enables the completion the communication link without the I/O module 500.
  • FIGS. 6(a) to 6(d) illustrate a module connector 102 respectively, in accordance with an embodiment of the present subject matter.
  • FIGs 6(a) shows a perspective side view of the module connector 102.
  • the module connector 102 has a slot 602, which allows plugging of the I/O modules 500 onto the backplane assembly 100.
  • the slot 602 is carved to obtain multiple grooves 604.
  • a pair of mating pins 606 is disposed in each of the grooves 604.
  • at least one pair of mating pins 606 is present in at least one of the multiple grooves 604.
  • the mating pins 606 are the contact pins, explained in context of Figure 1 previously.
  • the pairs of the mating pins 606 are normally closed pins. In absence of the I/O module 500, the pair of mating pins 606 may remain in a normally closed state such that the opposite pins of a pair of mating pins 606 are in contact with each other such that an electrical signal may flow through them.
  • the example illustrated in Figure 6(b) shows five pair of mating pins 606 in the slot 602. In one implementation, two pair of mating pins 606 may act as data pins, two pair of mating pins 606 may act as power pins, and one pair of mating pins 606 may be kept as spare pins.
  • mating pins 606 may be plated with metals or alloys depending upon operating conditions of the system.
  • mating pins 606 may be made of various materials that are electrically conductive and possess elasticity. The examples of such material include, but are not limited to, Phosphor bronze or Beryllium copper.
  • the mating pins 606 may be plated with materials, such as conductive materials, material that withstand high temperature or materials that are corrosion resistant. Some examples of such plating include, but are not limited to, a selective Gold plating with a Nickel undercoat that have operating temperature substantially ranging from - 40 to 85 Degree Celsius and are corrosion resistant.
  • the mating pins 606 may be coated with Silver plating or Tin plating or Tin-Nickel plating. It will be appreciated by one skilled in the art that the choice of material of the mating pins 606 or the material for plating the mating pins 606 is based on various considerations, such as the range of operating temperature, number of insertion and removal cycles of the I/O module 500, other operating conditions, and cost of the system.
  • a plurality of solder pins 608 is provided on a bottom surface of the module connector 102.
  • the plurality of solder pins 608 is used to solder the module connector 102 to the circuit board 104.
  • Figure 6(c) illustrates a bottom view of the module connector 102, in accordance with an embodiment of the present subject matter.
  • Figure 6(c) shows the plurality of solder pins 608.
  • the solder pins 608 are connecting pins as explained in context of Figure 2 previously. In one example, five solder pins each, in two rows, are provided in accordance with the plated through holes 202 in the circuit board 104.
  • solder pins 608 are used only as an example for the purposes of illustration. It will be evident to a person skilled in the art that various other types of connecting pins, such as wire wrapped pins may be used in place of solder pins 608 to connect the module connector 102 to the circuit board 104.
  • the solder pins 608 are made of conductive material of various types, such as alloys of copper and may be coated with various materials to enhance solderablity and conductivity.
  • the solder pins 608 may have Copper plating or Phosphor bronze plating or selective Gold plating with a Nickel undercoat to have better soldering capability.
  • the choice of material of the solder pins 608 or the material for plating the solder pins 608 is based on various considerations, such as the range of operating temperature of the system.
  • Figure 6(d) illustrates another perspective side view of the module connector 102, in accordance with an embodiment of the present subject matter.
  • Figure 6(d) shows a guiding rib 610 on a side surface of the module connector 102.
  • the guiding rib 610 assists in plugging the I/O module 500 onto the module connector 102 which is further connected to the backplane assembly 100.
  • the I/O module 500 may be plugged in a tilted manner, to first fit in the guiding rib 610. This ensures proper placement of the I/O module 500 in the module connector 102.
  • the guiding rib 610 may help in ensuring safety of the I/O module 500 by ensuring that a ground connection is secured first before connection to a power supply.
  • Figure 7(a) illustrates a side view of a module connector 102 with the mating pins 606 in an open state, in accordance with an embodiment of the present subject matter.
  • Figure 7(a) shows a connector pin 702 of an I/O module 500 inside the slot 602 of the module connector 102.
  • the connector pin 702 may be, for example, a metallic connector, a PCB based connector, such as a circuit board foot print or an edge connector.
  • the connector pin 702 upon its insertion into the slot 602 moves the mating pins 606 from a normally closed state to the open state. In the open state, the communication of signals and data or distribution of power supply takes place through I/O module 500.
  • the communication signals enter the module connector 102 through the solder pin 608 which is configured to act as an input pin.
  • the connector pin 702 of the I/O module 500 receives the signals from a mating pin 606 in the module connector 102 for processing the same.
  • the processed signals are transmitted to the solder pin 608 which is configured to act as an output pin, through an opposite mating pin 606 in the module connector 102.
  • the processed signal may be then transmitted to other I/O modules 500 or to CCB through the output pin.
  • Figure 7(b) illustrates a side view of the module connector in the normally closed state, in accordance with an embodiment of the present subject matter.
  • Figure 7(b) shows the module connector 102 without the I/O module 500.
  • the mating pins 606 get back to the normally closed state.
  • the communication link establishes through the mating pins 606 and an uninterrupted communication is achieved.
  • the communication signals enter the module connector 102 through the solder pin 608 acting as an input pin. The signals are further passed on to a mating pin in the module connector 102.
  • the module connector 102 in absence of the I/O module 500 plugged into the slot 602 completes a communication link through the pair of mating pins 606.
  • a system may have an assembly of five module connectors 102 soldered to a circuit board 104 and only three of them have I/O modules 500 plugged into them. In such cases, communication between the I/O modules 500 and between the I/O module 500 and the CCB will be uninterrupted.
  • Two module connectors 102 without I/O modules 500 complete the communication link through the pair of mating pins 606. Therefore, an uninterrupted communication is achieved even when the I/O modules 500 are not present in any or all the module connectors 102. Further, the module connector 102 eliminates the need for using dummy I/O modules.
  • one or more module connectors 102 may be present in a system independent of the backplane assembly 100 having and a supporting structure.
  • a module connector 102 may be coupled to a circuit board 104 without the circuit board 104 in turned being mounted on the supporting structure.
  • the module connectors 102 may have a slot 602 with at least one pair of mating pins 606 that are normally closed pins which establish a communication link in absence of any I/O module 500 being plugged to the module connectors 102.
  • Such a module connectors 102 may be employed in any system where uninterrupted communication link is required.
  • the module connector 102 may prove helpful in various industries where automated control and measurement operation is part of a system and an uninterrupted communication is required. Further, the module connector 102 is also cost effective. The module connector 102 reduces the overall cost of a system since dummy modules are not required for an uninterrupted communication. With the use of module connectors 102, the dummy module used for completing the communication link are no longer needed.
  • the module connectors 102 may be used in various systems and electronics products such as, data acquisition systems, industrial control systems, building automation and control systems, supervisory control and data acquisition (SCADA) systems, fire alarm systems, fire and gas detection/monitoring systems, safety shut-down systems, flow computer systems, hybrid controller systems, HVAC (heating, ventilation, and air conditioning) controllers, access controllers, flow controllers, and programmable logic controllers.
  • SCADA supervisory control and data acquisition
  • fire alarm systems fire and gas detection/monitoring systems
  • safety shut-down systems flow computer systems
  • hybrid controller systems hybrid controller systems
  • HVAC heating, ventilation, and air conditioning

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
EP13178736.8A 2012-08-03 2013-07-31 Modulverbinder zur unterbrechungsfreien Kommunikation Active EP2693568B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN3194CH2012 2012-08-03
US13/943,201 US9077097B2 (en) 2012-08-03 2013-07-16 Module connector for uninterrupted communication

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EP2693568A1 true EP2693568A1 (de) 2014-02-05
EP2693568B1 EP2693568B1 (de) 2016-08-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3715976A1 (de) * 2019-03-27 2020-09-30 Rockwell Automation Technologies, Inc. Modulare rückwandplatine für ein industrielles steuergerät

Citations (3)

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Publication number Priority date Publication date Assignee Title
US5160273A (en) * 1991-06-24 1992-11-03 Porta Systems Corp. Connector block assembly
EP0616397A2 (de) * 1993-03-19 1994-09-21 The Whitaker Corporation Elektrischer Steckverbinder mit Kurzschlussglied
US20080106266A1 (en) * 2006-11-08 2008-05-08 Phoenix Contact Gmbh & Co. Kg Series terminal, test plug and test terminal block

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
CH649871A5 (en) * 1980-05-13 1985-06-14 Schmid Fernmeldetechnik Interruptor bracket and interruptor module for separating a transmission line which is to be measured, without interrupting it
TW431683U (en) * 1998-10-30 2001-04-21 Hon Hai Prec Ind Co Ltd Electrical connector
US6456495B1 (en) * 2000-03-13 2002-09-24 Eaton Corporation Logic controller having DIN rail backplane and locking means for interconnected device module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160273A (en) * 1991-06-24 1992-11-03 Porta Systems Corp. Connector block assembly
EP0616397A2 (de) * 1993-03-19 1994-09-21 The Whitaker Corporation Elektrischer Steckverbinder mit Kurzschlussglied
US20080106266A1 (en) * 2006-11-08 2008-05-08 Phoenix Contact Gmbh & Co. Kg Series terminal, test plug and test terminal block

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3715976A1 (de) * 2019-03-27 2020-09-30 Rockwell Automation Technologies, Inc. Modulare rückwandplatine für ein industrielles steuergerät
US11347195B2 (en) 2019-03-27 2022-05-31 Rockwell Automation Technologies, Inc. Modular backplane for an industrial controller

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