EP2636047A2 - Élément multicouche en céramique et procédé de fabrication d'un élément multicouche en céramique - Google Patents

Élément multicouche en céramique et procédé de fabrication d'un élément multicouche en céramique

Info

Publication number
EP2636047A2
EP2636047A2 EP11776771.5A EP11776771A EP2636047A2 EP 2636047 A2 EP2636047 A2 EP 2636047A2 EP 11776771 A EP11776771 A EP 11776771A EP 2636047 A2 EP2636047 A2 EP 2636047A2
Authority
EP
European Patent Office
Prior art keywords
ceramic
electrode
layer
multilayer component
inner electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11776771.5A
Other languages
German (de)
English (en)
Inventor
Gerald Kloiber
Gerhard Bisplinghoff
Christian Hesse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2636047A2 publication Critical patent/EP2636047A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Definitions

  • Ceramic multilayer component and methods for the manufacture ⁇ development of a ceramic multilayer component
  • the invention relates to a ceramic Vie 1Sch Anlagenbauelement and a method for producing such a ceramic multilayer component.
  • NTC ceramics thermoistors, English negative temperature coefficient thermistor
  • thermistors can be used for example as a temperature ⁇ sensors. They are relatively low-resistance semiconductors with which a temperature can be determined relatively simply by measuring the electrical resistance.
  • a ceramic multilayer component comprises a layer stack comprising a plurality of ceramic layers.
  • the ceramic multilayer component is preferably designed as a thermistor. det, in which the ceramic layers have, for example, one or more NTC or PTC ceramics.
  • the ceramic multilayer component further comprises a first and a second terminal contact. Between each two Schich ⁇ th of the layer stack are arranged a first and a second inner ⁇ electrode.
  • the ceramic multilayer component comprises a first via electrode for electrically coupling the first connection contact to the first inner electrode and a second via electrode for electrically coupling the second connection contact to the second inner electrode.
  • an active region by which primarily the electrical properties of the multilayer component are predetermined, can be laid into the interior of the component.
  • the active region is electrically contacted via the internal electrodes located inside the component.
  • the inner electrodes are in turn electrically contacted via the via electrodes from the outside by means of the connection contacts.
  • the electrical resistance of the component can be reduced, since the distance between the inner electrodes, which are of crucial importance for the electrical resistance, is reduced relative to one another.
  • the electrodes are attached to the active region of the component contact on the outer surfaces of the device, for example where the present invention to ⁇ connection contacts are arranged.
  • the inner electrodes are enclosed by at least two ceramic layers , they are well protected against environmental influences such as moisture. So a reliabil ⁇ allowable working of the multilayer component is enabled.
  • the connection contacts of gege ⁇ nüber strain surfaces of the layer stack are arranged.
  • the connection contacts are arranged in further embodiments on a common surface. In these embodiments, when the two terminal contacts are arranged on the same surface of the layer stack, the device is good, for example, with circuit boards ⁇ coupler bar.
  • the ceramic multilayer component is designed for electrical contacting by means of wires.
  • the multilayer component can be configured as leaded construction ⁇ element.
  • the ceramic multilayer component may have conductive terminals in the form of wires.
  • This conductive connections are preferably provided with a ⁇ means of soldering and / or welding process with the connection contacts ⁇ electrically conductively connected, so that the ceramic multi-layer component can be electrically contacted by means of the conductive connections from the outside.
  • the conductive terminals can be as lead wires out ⁇ leads, which have a metal such as copper or nickel.
  • the connecting wires can have different diameters .
  • the conductive connections can also be designed as so-called leadframes.
  • the ceramic multilayer ⁇ cal device may be designed such that it is suitable neither for surface mounting (SMD component) nor for flip-chip mounting.
  • At least one first ceramic layer is provided. On the at least one first ceramic layer, a first inner electrode is applied. At least a second ceramic layer is applied to the first inner electrode. A second internal electric ⁇ de is applied to the at least one second ceramic layer. At least a third ceramic layer is applied to the second inner electrode. A first via electrode is formed through the at least one first ceramic layer to the first inner electrode. A second via electrode through the at least one third ceramic layer to the second inner electrode is formed. A connection contact is arranged per via electrode, so that the internal electrodes can each be electrically contacted.
  • Shape guide in off a portion of the layer stack after the arrangement of the terminals in response to a given distance before ⁇ property of the component. For example, a portion of the layer stack is abraded transversely to the layer direction in order to set the electrical resistance to a predetermined value.
  • Ele ⁇ elements may be provided in the figures with the same reference numbers.
  • the elements illustrated and their size relationships to each other should not be regarded as a measure ⁇ rod; rather, individual elements, such as layers or regions, for better illustration and / or better comprehension exaggerated thick or large dimensions to be.
  • FIG. 1 shows a schematic representation of a ceramic multilayer component according to an embodiment
  • FIG. 2 shows a schematic representation of a multilayer component according to an embodiment
  • FIG. 3 shows a schematic representation of a multilayer component according to an embodiment
  • FIG. 4 shows a schematic representation of a multilayer component according to an embodiment.
  • FIG. 1 shows a ceramic multilayer component 100 in cross section, which is designed as a thermistor device.
  • the ceramic multilayer component 100 has a plurality of ceramic layers 102, 103 and 104, each of which may in turn comprise a plurality of partial layers.
  • the ceramic layers 102, 103 and 104 are stacked to form a layer stack 101.
  • the ceramic layers 102, 103 and 104 each have an NTC ceramic.
  • the ceramic layers 102, 103 and 104 may each comprise a PTC ceramic.
  • a first inner electrode 107 is arranged between the layer 102 and the layer 103. Between the layer 103 and the layer 104, a second inner electrode 108 angeord ⁇ net.
  • the inner electrodes 107 and 108 each extend across the entire surface of the layers 102 and 103 or 104 and 103 transversely to the stacking direction (X-direction).
  • the inner electrodes 107 and 108 cover the layers 102 and 104 only partially and not Completely. In embodiments, the cover Internal electrodes 107 and 108, the layers 102 and 104 over the entire surface.
  • via electrodes 109, 111 and 110, 112 extend transversely to the stacking direction to the respective ones closer internal electrodes.
  • the viaducts electrodes 109 and 111 extend starting from the outer major surface of the layer stack 101, which is the inner electric ⁇ en 107 closest through the ceramic layer 102 to the inner electrode 107.
  • the via electrodes 110 and 112 extend beginning at a second major surface of the layer stack, which is closest to the inner electrode 108, through the ceramic layer 104 to the inner electrode 108th
  • connection contact 105 is arranged for electrical contacting of the component, which is electrically coupled to the via electrodes 109 and 105.
  • a further terminal contact 106 is arranged on ⁇ , which is electrically coupled to the via electrodes 110 and 112.
  • contacts 119 may be designed, for example, as connecting wires or leadframes.
  • the connection wires or lead frames are preferably mechanically and electrically conductively connected to the connection contacts 105, 106 by means of a soldering and / or welding process and serve for electrical contacting of the component.
  • the contacts 119 protrude from
  • Layer stack 101 from.
  • the active area of the device is arranged primarily between the two internal electrodes 107 and 108, is electrically contacted via the internal electrodes 107 and 108, which in turn are electrically coupled via the via electrodes with the respectively associated terminal contact.
  • Direction between the inner electrode 107 and the inner electrode ⁇ erode 108 can be varied, the outer dimensions of the device 100 remain the same.
  • the electrical resistance or the characteristic of the NTC component is predetermined by the distance between the two internal electrodes 107 and 108. Thus, very small resistances are realized at given external dimensions.
  • the internal electrodes 107 and 108 are protected from environmental influences since they are arranged in the interior of the layer stack 101.
  • the internal electrodes 107 and 108 are protected by the ceramic layers between which they are respectively disposed. Since the internal electrodes 107 and 108 are each embedded between two ceramic layers, and have a smaller surface area than the ceramic
  • Layers 102, 103, 104, that is, not to the outer edges of the device, for example, a side surface 118, which extends transversely to the surfaces 113 and 114, rich, internal electrodes are safe with the adjacent ceramic
  • the inner electrodes do not extend to the side surfaces of the layer stack.
  • the risk that the internal electrodes of the adjacent ceramic layers solve, for example, by penetrating moisture is prevented or at least reduced.
  • the operation is improved over the entire life of the component, since the electrical resistance hardly changes over the term.
  • the internal electrodes 107 and 108 may each be coupled to the respective terminal contacts with more than two via electrodes, in embodiments the internal electrodes are
  • the ceramic layers 102, 103 and 104 have the same ceramic material in embodiments. In further embodiments , the ceramic layers 102, 103, 104 have mutually different ceramic materials. Parts of the layer stack 101 further can have the same ceramic mate rial ⁇ , for example, the layers 102 and 104, and another portion of the layer stack to a different ceramic, for example, the layer 103rd
  • FIG. 2 shows a further embodiment of the component 100.
  • the connection contacts 105 and 106 are arranged on a common surface 113 of the layer stack 101.
  • the internal electrodes are electrically coupled 107 and 108 via a single Via-electrode 109 or 111, respectively, each one of the at ⁇ circuit contacts 105, 106th
  • a single planar construction ⁇ main surface of the ceramic layer 102 has two terminals 105 and 106th Starting at the terminal contact 106, the via electrode 110 extends through the ceramic layer 102 to the inner electrode 107 and electrically couples it to the terminal contact 106. Starting at the terminal contact 105, the via electrode 109 extends through the ceramic layer 102 and the ceramic layer 103 up to the inner electrode 108 and electrically couples these to the terminal contact 105. In projection in the stacking direction, the inner electrodes 107 and 108 overlap in part and each have a further part which does not overlap. Such unilaterally contactable components, for example, well coupled with circuit boards.
  • FIG. 3 shows a further embodiment of the component 100.
  • the connection contacts 105 and 106 are arranged on a single side of the layer stack.
  • the two internal electrodes 107 and 108 are arranged between the same ceramic layers 102 and 103.
  • the internal electrodes 107 and 108 are arranged in the moving ⁇ chen plane of the layer stack and point in Pro ⁇ jection in the stacking direction do not have overlapping regions.
  • FIG. 4 shows a further embodiment of the component 100 comparable to the embodiment of FIG. 1, in which a part 116 of the layer stack 101 has been removed. By removing the part 116 of the layer stack 101, a fine adjustment of the electrical properties of the device 100, for example the electrical resistance, is performed. In particular, the part 116 is transversely performed by a ⁇ From grind of the layer stack 101 to the stack direction.
  • Electrodes by reducing at least one of the inner resistance of the device 100 is sett ⁇ bar.
  • no leitfähi ⁇ ges material for example material of the internal electrodes 107, 108 is smeared and thus the accuracy of the Ab ⁇ humor is high.
  • the grinding of the region 116 takes place in particular after the completion of the component, ie after the ceramic layers 102, 103 and 104 have been stacked alternately with the internal electrodes 107 and 108, the via electrodes have been formed, for example punched and filled with electrically conductive material, and the terminal contacts 105 and 106 have been applied.
  • the Bauele ⁇ ment can then be subjected to a test and removed at deviations of the electrical properties of the predetermined values of the area 116 in dependence of the deviation of the layer stack 101 to set the predetermined value of the electrical property accurately.
  • the side surface 118, in particular the exposed after abrasion ends of the internal electrodes 107 and 108 are sealed, to reduce the Kurz gleichge ⁇ propelled or to prevent and protect the construction ⁇ element from environmental influences.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

L'invention concerne un élément multicouche en céramique comprenant un empilement de couches (101) qui comporte une pluralité de couches (102, 103, 104) en céramique. L'élément multicouche présente un premier (105) et un deuxième (106) contact de raccordement ainsi qu'une première (107) et une deuxième (108) électrode intérieure qui sont disposées respectivement entre deux couches (102, 103; 103, 104) de l'empilement de couches (101). L'élément multicouche comporte une première (109) et une deuxième (110) électrode d'interconnexion pour le couplage électrique du premier contact de raccordement (105) avec la première électrode intérieure (107) et pour le couplage électrique du deuxième contact de raccordement (106) avec la deuxième électrode intérieure (108).
EP11776771.5A 2010-11-03 2011-10-27 Élément multicouche en céramique et procédé de fabrication d'un élément multicouche en céramique Withdrawn EP2636047A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010050370 2010-11-03
PCT/EP2011/068891 WO2012059401A2 (fr) 2010-11-03 2011-10-27 Élément multicouche en céramique et procédé de fabrication d'un élément multicouche en céramique

Publications (1)

Publication Number Publication Date
EP2636047A2 true EP2636047A2 (fr) 2013-09-11

Family

ID=44903225

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11776771.5A Withdrawn EP2636047A2 (fr) 2010-11-03 2011-10-27 Élément multicouche en céramique et procédé de fabrication d'un élément multicouche en céramique

Country Status (6)

Country Link
US (1) US20130300533A1 (fr)
EP (1) EP2636047A2 (fr)
JP (1) JP2013541852A (fr)
KR (1) KR20130128403A (fr)
CN (1) CN103180915A (fr)
WO (1) WO2012059401A2 (fr)

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SE538681C2 (sv) 2014-04-02 2016-10-18 Fidesmo Ab Koppling av betalning till säker nedladdning av applikationsdata
DE102016101246A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102015225584A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Startvorrichtung für eine Brennkraftmaschine
KR102603598B1 (ko) * 2016-11-30 2023-11-21 엘지디스플레이 주식회사 표시장치
CN112420297B (zh) * 2020-10-16 2022-04-15 深圳顺络电子股份有限公司 压敏电阻

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Also Published As

Publication number Publication date
WO2012059401A3 (fr) 2012-08-30
KR20130128403A (ko) 2013-11-26
JP2013541852A (ja) 2013-11-14
CN103180915A (zh) 2013-06-26
US20130300533A1 (en) 2013-11-14
WO2012059401A2 (fr) 2012-05-10

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