EP2636001A4 - Sim-karte und herstellungsverfahren dafür - Google Patents

Sim-karte und herstellungsverfahren dafür

Info

Publication number
EP2636001A4
EP2636001A4 EP11837644.1A EP11837644A EP2636001A4 EP 2636001 A4 EP2636001 A4 EP 2636001A4 EP 11837644 A EP11837644 A EP 11837644A EP 2636001 A4 EP2636001 A4 EP 2636001A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
sim card
sim
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11837644.1A
Other languages
English (en)
French (fr)
Other versions
EP2636001A2 (de
Inventor
Yean Wei Yeap
Wai Ping Mok
Bertrand Hoveman
Jean Jacques Mischler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Publication of EP2636001A2 publication Critical patent/EP2636001A2/de
Publication of EP2636001A4 publication Critical patent/EP2636001A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
EP11837644.1A 2010-11-02 2011-10-04 Sim-karte und herstellungsverfahren dafür Withdrawn EP2636001A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2010005182 2010-11-02
PCT/IB2011/002825 WO2012059813A2 (en) 2010-11-02 2011-10-04 Sim card and manufacturing method

Publications (2)

Publication Number Publication Date
EP2636001A2 EP2636001A2 (de) 2013-09-11
EP2636001A4 true EP2636001A4 (de) 2014-09-03

Family

ID=46024888

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11837644.1A Withdrawn EP2636001A4 (de) 2010-11-02 2011-10-04 Sim-karte und herstellungsverfahren dafür

Country Status (3)

Country Link
EP (1) EP2636001A4 (de)
TW (1) TW201229916A (de)
WO (1) WO2012059813A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494861B (zh) * 2013-04-12 2015-08-01 A Men Technology Corp Chip card combination structure and method thereof
WO2023011304A1 (en) * 2021-08-02 2023-02-09 Act Identity Technology Limited Subscriber identification module (sim) card assembly and method of forming a sim card

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1785916A1 (de) * 2005-11-14 2007-05-16 Tyco Electronics France SAS Smartcard-Körper, Smartcard und Herstellungsverfahren
WO2008081224A1 (en) * 2006-12-28 2008-07-10 Fci Flat substrates for identification cards and manufacturing methods of the same
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922355A (ja) * 1982-07-29 1984-02-04 Dainippon Printing Co Ltd Ｉｃカ−ド
JP2005149360A (ja) * 2003-11-19 2005-06-09 Dainippon Printing Co Ltd Ｓｉｍ用ｉｃカード
CN101228539A (zh) * 2004-06-30 2008-07-23 Nxp股份有限公司 插入夹持器的芯片卡

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1785916A1 (de) * 2005-11-14 2007-05-16 Tyco Electronics France SAS Smartcard-Körper, Smartcard und Herstellungsverfahren
WO2008081224A1 (en) * 2006-12-28 2008-07-10 Fci Flat substrates for identification cards and manufacturing methods of the same
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger

Also Published As

Publication number Publication date
WO2012059813A2 (en) 2012-05-10
EP2636001A2 (de) 2013-09-11
WO2012059813A9 (en) 2012-11-15
TW201229916A (en) 2012-07-16
WO2012059813A3 (en) 2012-07-19

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20130419

AK Designated contracting states

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Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140806

RIC1 Information provided on ipc code assigned before grant

Ipc: G06K 19/077 20060101AFI20140731BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150303