WO2012059813A9 - Sim card and manufacturing method - Google Patents

Sim card and manufacturing method Download PDF

Info

Publication number
WO2012059813A9
WO2012059813A9 PCT/IB2011/002825 IB2011002825W WO2012059813A9 WO 2012059813 A9 WO2012059813 A9 WO 2012059813A9 IB 2011002825 W IB2011002825 W IB 2011002825W WO 2012059813 A9 WO2012059813 A9 WO 2012059813A9
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
sim card
chip
manufacturing
encapsulated
Prior art date
Application number
PCT/IB2011/002825
Other languages
French (fr)
Other versions
WO2012059813A3 (en
WO2012059813A2 (en
Inventor
Yean Wei Yeap
Wai Ping Mok
Bertrand Hoveman
Jean Jacques Mischler
Original Assignee
Microconnections Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microconnections Sas filed Critical Microconnections Sas
Priority to EP11837644.1A priority Critical patent/EP2636001A4/en
Publication of WO2012059813A2 publication Critical patent/WO2012059813A2/en
Publication of WO2012059813A3 publication Critical patent/WO2012059813A3/en
Publication of WO2012059813A9 publication Critical patent/WO2012059813A9/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The present invention provides a method for manufacturing a SIM card without using a carrier card. An array of conductive modules is formed onto a first surface of a substrate. These conductive modules are spaced apart from each other with spacing configured to provide peripheral portions surrounding each conductive module. The peripheral portions are sized to provide sufficient substrate parts to form the SIM card body based on the industry standard. The substrate is then trimmed to form SIM card bodies and an IC chip is bonded to a second side of the substrate. The IC chip is then encapsulated and thereafter, a molding process is carried out to supply and form a molding part to cover the encapsulated IC chip and also flatten the bottom side of the substrate. The molding part together with the substrate forms a SIM card with the thickness conforming to the industry standard.
PCT/IB2011/002825 2010-11-02 2011-10-04 Sim card and manufacturing method WO2012059813A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11837644.1A EP2636001A4 (en) 2010-11-02 2011-10-04 Sim card and manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2010005182 2010-11-02
MYPI2010005182 2010-11-02

Publications (3)

Publication Number Publication Date
WO2012059813A2 WO2012059813A2 (en) 2012-05-10
WO2012059813A3 WO2012059813A3 (en) 2012-07-19
WO2012059813A9 true WO2012059813A9 (en) 2012-11-15

Family

ID=46024888

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/002825 WO2012059813A2 (en) 2010-11-02 2011-10-04 Sim card and manufacturing method

Country Status (3)

Country Link
EP (1) EP2636001A4 (en)
TW (1) TW201229916A (en)
WO (1) WO2012059813A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494861B (en) * 2013-04-12 2015-08-01 A Men Technology Corp Chip card combination structure and method thereof
EP4356291A1 (en) * 2021-08-02 2024-04-24 ACT Identity Technology Limited Subscriber identification module (sim) card assembly and method of forming a sim card

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922355A (en) * 1982-07-29 1984-02-04 Dainippon Printing Co Ltd Integrated circuit card
JP2005149360A (en) * 2003-11-19 2005-06-09 Dainippon Printing Co Ltd Ic card for sim
WO2006003548A2 (en) * 2004-06-30 2006-01-12 Koninklijke Philips Electronics N.V. Chip card for insertion into a holder
EP1785916B1 (en) * 2005-11-14 2009-08-19 Tyco Electronics France SAS Smartcard body, smart card and method of manufacturing
WO2008081224A1 (en) * 2006-12-28 2008-07-10 Fci Flat substrates for identification cards and manufacturing methods of the same
DE102008005320A1 (en) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Card-shaped data carrier

Also Published As

Publication number Publication date
TW201229916A (en) 2012-07-16
EP2636001A2 (en) 2013-09-11
EP2636001A4 (en) 2014-09-03
WO2012059813A3 (en) 2012-07-19
WO2012059813A2 (en) 2012-05-10

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