TW200727177A - Package method for flash memory card and structure thereof - Google Patents

Package method for flash memory card and structure thereof

Info

Publication number
TW200727177A
TW200727177A TW095135543A TW95135543A TW200727177A TW 200727177 A TW200727177 A TW 200727177A TW 095135543 A TW095135543 A TW 095135543A TW 95135543 A TW95135543 A TW 95135543A TW 200727177 A TW200727177 A TW 200727177A
Authority
TW
Taiwan
Prior art keywords
memory card
card module
module substrates
substrate
those
Prior art date
Application number
TW095135543A
Other languages
Chinese (zh)
Inventor
En-Min Jow
Original Assignee
En-Min Jow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by En-Min Jow filed Critical En-Min Jow
Priority to TW095135543A priority Critical patent/TW200727177A/en
Priority to US11/602,204 priority patent/US20070152071A1/en
Priority to JP2006317096A priority patent/JP2007183928A/en
Priority to KR20060120631A priority patent/KR20070073583A/en
Publication of TW200727177A publication Critical patent/TW200727177A/en

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Abstract

A package method for a flash memory card and structure thereof is disclosed. A plurality of independent memory card module substrates are arranged on the substrate and those memory card module substrates are suspended and connecting with the substrate by a plurality of connecting bars. Chips are arranging on those memory card module substrates and the molding compound is utilizing to respectively cover chips, the upper surface of those memory card module substrates and to expose the bottom surface of those memory card module substrates, wherein the molding compound is formed as a chamfered standard profile by performing a molding process with a upper molding substrate and a support substrate. Then punch, and grind the plurality of rugged bumps of those connecting bars to gain good cutting surface of the product and lower the cost.
TW095135543A 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof TW200727177A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW095135543A TW200727177A (en) 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof
US11/602,204 US20070152071A1 (en) 2006-01-05 2006-11-21 Package method for flash memory card and structure thereof
JP2006317096A JP2007183928A (en) 2006-01-05 2006-11-24 Method for forming flash memory card and its structure
KR20060120631A KR20070073583A (en) 2006-01-05 2006-12-01 Package method for flash memory card and structure thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW95100500 2006-01-05
TW095135543A TW200727177A (en) 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof

Publications (1)

Publication Number Publication Date
TW200727177A true TW200727177A (en) 2007-07-16

Family

ID=38339918

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095121679A TW200727176A (en) 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof
TW095135543A TW200727177A (en) 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW095121679A TW200727176A (en) 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof

Country Status (2)

Country Link
JP (1) JP2007183899A (en)
TW (2) TW200727176A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646707B (en) * 2018-06-22 2019-01-01 大陸商蘇州震坤科技有限公司 Method for removing burrs generated during semiconductor plastic packaging process

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843447B2 (en) * 2006-03-31 2011-12-21 株式会社東芝 Semiconductor device and memory card using the same
JP4989323B2 (en) * 2007-06-12 2012-08-01 株式会社ディスコ Memory card manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646707B (en) * 2018-06-22 2019-01-01 大陸商蘇州震坤科技有限公司 Method for removing burrs generated during semiconductor plastic packaging process

Also Published As

Publication number Publication date
JP2007183899A (en) 2007-07-19
TW200727176A (en) 2007-07-16

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