TW200727177A - Package method for flash memory card and structure thereof - Google Patents
Package method for flash memory card and structure thereofInfo
- Publication number
- TW200727177A TW200727177A TW095135543A TW95135543A TW200727177A TW 200727177 A TW200727177 A TW 200727177A TW 095135543 A TW095135543 A TW 095135543A TW 95135543 A TW95135543 A TW 95135543A TW 200727177 A TW200727177 A TW 200727177A
- Authority
- TW
- Taiwan
- Prior art keywords
- memory card
- card module
- module substrates
- substrate
- those
- Prior art date
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
A package method for a flash memory card and structure thereof is disclosed. A plurality of independent memory card module substrates are arranged on the substrate and those memory card module substrates are suspended and connecting with the substrate by a plurality of connecting bars. Chips are arranging on those memory card module substrates and the molding compound is utilizing to respectively cover chips, the upper surface of those memory card module substrates and to expose the bottom surface of those memory card module substrates, wherein the molding compound is formed as a chamfered standard profile by performing a molding process with a upper molding substrate and a support substrate. Then punch, and grind the plurality of rugged bumps of those connecting bars to gain good cutting surface of the product and lower the cost.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095135543A TW200727177A (en) | 2006-01-05 | 2006-09-26 | Package method for flash memory card and structure thereof |
US11/602,204 US20070152071A1 (en) | 2006-01-05 | 2006-11-21 | Package method for flash memory card and structure thereof |
JP2006317096A JP2007183928A (en) | 2006-01-05 | 2006-11-24 | Method for forming flash memory card and its structure |
KR20060120631A KR20070073583A (en) | 2006-01-05 | 2006-12-01 | Package method for flash memory card and structure thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95100500 | 2006-01-05 | ||
TW095135543A TW200727177A (en) | 2006-01-05 | 2006-09-26 | Package method for flash memory card and structure thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200727177A true TW200727177A (en) | 2007-07-16 |
Family
ID=38339918
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121679A TW200727176A (en) | 2006-01-05 | 2006-06-16 | Package method for flash memory card and structure thereof |
TW095135543A TW200727177A (en) | 2006-01-05 | 2006-09-26 | Package method for flash memory card and structure thereof |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121679A TW200727176A (en) | 2006-01-05 | 2006-06-16 | Package method for flash memory card and structure thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007183899A (en) |
TW (2) | TW200727176A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI646707B (en) * | 2018-06-22 | 2019-01-01 | 大陸商蘇州震坤科技有限公司 | Method for removing burrs generated during semiconductor plastic packaging process |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4843447B2 (en) * | 2006-03-31 | 2011-12-21 | 株式会社東芝 | Semiconductor device and memory card using the same |
JP4989323B2 (en) * | 2007-06-12 | 2012-08-01 | 株式会社ディスコ | Memory card manufacturing method |
-
2006
- 2006-03-13 JP JP2006067678A patent/JP2007183899A/en active Pending
- 2006-06-16 TW TW095121679A patent/TW200727176A/en unknown
- 2006-09-26 TW TW095135543A patent/TW200727177A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI646707B (en) * | 2018-06-22 | 2019-01-01 | 大陸商蘇州震坤科技有限公司 | Method for removing burrs generated during semiconductor plastic packaging process |
Also Published As
Publication number | Publication date |
---|---|
JP2007183899A (en) | 2007-07-19 |
TW200727176A (en) | 2007-07-16 |
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