WO2012059813A3 - Sim card and manufacturing method - Google Patents
Sim card and manufacturing method Download PDFInfo
- Publication number
- WO2012059813A3 WO2012059813A3 PCT/IB2011/002825 IB2011002825W WO2012059813A3 WO 2012059813 A3 WO2012059813 A3 WO 2012059813A3 IB 2011002825 W IB2011002825 W IB 2011002825W WO 2012059813 A3 WO2012059813 A3 WO 2012059813A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- sim card
- chip
- manufacturing
- encapsulated
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention provides a method for manufacturing a SIM card without using a carrier card. An array of conductive modules is formed onto a first surface of a substrate. These conductive modules are spaced apart from each other with spacing configured to provide peripheral portions surrounding each conductive module. The peripheral portions are sized to provide sufficient substrate parts to form the SIM card body based on the industry standard. The substrate is then trimmed to form SIM card bodies and an IC chip is bonded to a second side of the substrate. The IC chip is then encapsulated and thereafter, a molding process is carried out to supply and form a molding part to cover the encapsulated IC chip and also flatten the bottom side of the substrate. The molding part together with the substrate forms a SIM card with the thickness conforming to the industry standard.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11837644.1A EP2636001A4 (en) | 2010-11-02 | 2011-10-04 | Sim card and manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2010005182 | 2010-11-02 | ||
MYPI2010005182 | 2010-11-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2012059813A2 WO2012059813A2 (en) | 2012-05-10 |
WO2012059813A3 true WO2012059813A3 (en) | 2012-07-19 |
WO2012059813A9 WO2012059813A9 (en) | 2012-11-15 |
Family
ID=46024888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2011/002825 WO2012059813A2 (en) | 2010-11-02 | 2011-10-04 | Sim card and manufacturing method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2636001A4 (en) |
TW (1) | TW201229916A (en) |
WO (1) | WO2012059813A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI494861B (en) * | 2013-04-12 | 2015-08-01 | A Men Technology Corp | Chip card combination structure and method thereof |
CN117730327A (en) * | 2021-08-02 | 2024-03-19 | 爱创达身份智能卡有限公司 | Subscriber Identity Module (SIM) card assembly and method of forming a SIM card |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922355A (en) * | 1982-07-29 | 1984-02-04 | Dainippon Printing Co Ltd | Integrated circuit card |
JP2005149360A (en) * | 2003-11-19 | 2005-06-09 | Dainippon Printing Co Ltd | Ic card for sim |
JP2008504627A (en) * | 2004-06-30 | 2008-02-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Chip card for holder insertion |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1785916B1 (en) * | 2005-11-14 | 2009-08-19 | Tyco Electronics France SAS | Smartcard body, smart card and method of manufacturing |
WO2008081224A1 (en) * | 2006-12-28 | 2008-07-10 | Fci | Flat substrates for identification cards and manufacturing methods of the same |
DE102008005320A1 (en) * | 2008-01-21 | 2009-07-23 | Giesecke & Devrient Gmbh | Card-shaped data carrier |
-
2011
- 2011-10-04 EP EP11837644.1A patent/EP2636001A4/en not_active Withdrawn
- 2011-10-04 WO PCT/IB2011/002825 patent/WO2012059813A2/en active Application Filing
- 2011-10-14 TW TW100137370A patent/TW201229916A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922355A (en) * | 1982-07-29 | 1984-02-04 | Dainippon Printing Co Ltd | Integrated circuit card |
JP2005149360A (en) * | 2003-11-19 | 2005-06-09 | Dainippon Printing Co Ltd | Ic card for sim |
JP2008504627A (en) * | 2004-06-30 | 2008-02-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Chip card for holder insertion |
Non-Patent Citations (1)
Title |
---|
See also references of EP2636001A4 * |
Also Published As
Publication number | Publication date |
---|---|
WO2012059813A9 (en) | 2012-11-15 |
EP2636001A4 (en) | 2014-09-03 |
EP2636001A2 (en) | 2013-09-11 |
WO2012059813A2 (en) | 2012-05-10 |
TW201229916A (en) | 2012-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014060355A3 (en) | Method for producing a multiplicity of optoelectronic semiconductor components | |
WO2012087474A3 (en) | A multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same | |
DE502005007956D1 (en) | Smartcard body, smartcard and manufacturing process | |
WO2008129526A3 (en) | Electronic interface apparatus and method and system for manufacturing same | |
TW200644187A (en) | Semiconductor device and method for manufacturing semiconductor device | |
CA2631744A1 (en) | Chip card and method for production of a chip card | |
WO2011093955A3 (en) | Dual carrier for joining ic die or wafers to tsv wafers | |
WO2010102151A3 (en) | Chip-scale packaging with protective heat spreader | |
WO2012048137A3 (en) | Flexible circuits and methods for making the same | |
MY155671A (en) | LED package and method for manufacturing same | |
WO2012140050A3 (en) | Method for producing a light-emitting semiconductor component, and light-emitting semiconductor component | |
TW200729449A (en) | Semiconductor device and manufacturing method thereof | |
EG26352A (en) | Transponder inlay for a personal document and method for the production thereof | |
TW200719468A (en) | Package, package module and manufacturing method of the package | |
WO2011150879A3 (en) | Method for encapsulating component and structure thereof | |
WO2011124716A3 (en) | Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side | |
EP2610905A3 (en) | Packaging method for electronic components using a thin substrate | |
WO2011090572A3 (en) | A method to form lateral pad on edge of wafer | |
WO2012059813A3 (en) | Sim card and manufacturing method | |
WO2013012634A3 (en) | Double-sided flip chip package | |
EP2851942A3 (en) | Packaging method for electronic components using a thin substrate | |
WO2015096946A3 (en) | Method for producing a chip module | |
WO2014118044A3 (en) | Semiconductor chip assembly and method for manufacturing the same | |
TW200739857A (en) | Semiconductor module and method of manufacturing the same | |
WO2012152672A3 (en) | Method for producing reconstituted wafers with support of the chips during their encapsulation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11837644 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011837644 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |