TW200727176A - Package method for flash memory card and structure thereof - Google Patents

Package method for flash memory card and structure thereof

Info

Publication number
TW200727176A
TW200727176A TW095121679A TW95121679A TW200727176A TW 200727176 A TW200727176 A TW 200727176A TW 095121679 A TW095121679 A TW 095121679A TW 95121679 A TW95121679 A TW 95121679A TW 200727176 A TW200727176 A TW 200727176A
Authority
TW
Taiwan
Prior art keywords
memory card
card module
substrate
flash memory
those
Prior art date
Application number
TW095121679A
Other languages
Chinese (zh)
Inventor
En-Min Jow
Original Assignee
En-Min Jow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by En-Min Jow filed Critical En-Min Jow
Priority to TW095121679A priority Critical patent/TW200727176A/en
Priority to US11/602,204 priority patent/US20070152071A1/en
Priority to JP2006317096A priority patent/JP2007183928A/en
Priority to KR20060120631A priority patent/KR20070073583A/en
Publication of TW200727176A publication Critical patent/TW200727176A/en

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Abstract

A package method for a flash memory card and structure thereof is disclosed. A plurality of memory card module substrates are arranged on the substrate and those memory card module substrates are suspended and connecting with the substrate by a plurality of connecting bars. Chips are arranging on those memory card module substrates and the molding compound is utilizing to respectively cover those memory card module substrates, wherein the covering area for each memory card module substrate is larger than the area of the memory card module substrate. Then punch, grind and chamfer the plurality of rugged bumps of those connecting bars to gain good cutting surface of the product and lower the cost.
TW095121679A 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof TW200727176A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW095121679A TW200727176A (en) 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof
US11/602,204 US20070152071A1 (en) 2006-01-05 2006-11-21 Package method for flash memory card and structure thereof
JP2006317096A JP2007183928A (en) 2006-01-05 2006-11-24 Method for forming flash memory card and its structure
KR20060120631A KR20070073583A (en) 2006-01-05 2006-12-01 Package method for flash memory card and structure thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW95100500 2006-01-05
TW095121679A TW200727176A (en) 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof

Publications (1)

Publication Number Publication Date
TW200727176A true TW200727176A (en) 2007-07-16

Family

ID=38339918

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095121679A TW200727176A (en) 2006-01-05 2006-06-16 Package method for flash memory card and structure thereof
TW095135543A TW200727177A (en) 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095135543A TW200727177A (en) 2006-01-05 2006-09-26 Package method for flash memory card and structure thereof

Country Status (2)

Country Link
JP (1) JP2007183899A (en)
TW (2) TW200727176A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843447B2 (en) * 2006-03-31 2011-12-21 株式会社東芝 Semiconductor device and memory card using the same
JP4989323B2 (en) * 2007-06-12 2012-08-01 株式会社ディスコ Memory card manufacturing method
CN108831839B (en) * 2018-06-22 2020-03-24 苏州震坤科技有限公司 Method for removing burrs generated in semiconductor plastic packaging process

Also Published As

Publication number Publication date
JP2007183899A (en) 2007-07-19
TW200727177A (en) 2007-07-16

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