EP2636001A4 - Carte sim et procédé de fabrication - Google Patents
Carte sim et procédé de fabricationInfo
- Publication number
- EP2636001A4 EP2636001A4 EP11837644.1A EP11837644A EP2636001A4 EP 2636001 A4 EP2636001 A4 EP 2636001A4 EP 11837644 A EP11837644 A EP 11837644A EP 2636001 A4 EP2636001 A4 EP 2636001A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- manufacturing
- sim card
- sim
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2010005182 | 2010-11-02 | ||
PCT/IB2011/002825 WO2012059813A2 (fr) | 2010-11-02 | 2011-10-04 | Carte sim et procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2636001A2 EP2636001A2 (fr) | 2013-09-11 |
EP2636001A4 true EP2636001A4 (fr) | 2014-09-03 |
Family
ID=46024888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11837644.1A Withdrawn EP2636001A4 (fr) | 2010-11-02 | 2011-10-04 | Carte sim et procédé de fabrication |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2636001A4 (fr) |
TW (1) | TW201229916A (fr) |
WO (1) | WO2012059813A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI494861B (zh) * | 2013-04-12 | 2015-08-01 | A Men Technology Corp | Chip card combination structure and method thereof |
CN117730327A (zh) * | 2021-08-02 | 2024-03-19 | 爱创达身份智能卡有限公司 | 用户识别模块(sim)卡组件和形成sim卡的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1785916A1 (fr) * | 2005-11-14 | 2007-05-16 | Tyco Electronics France SAS | Corps de carte à puce, carte à puce et procédé de fabrication |
WO2008081224A1 (fr) * | 2006-12-28 | 2008-07-10 | Fci | Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci |
DE102008005320A1 (de) * | 2008-01-21 | 2009-07-23 | Giesecke & Devrient Gmbh | Kartenförmiger Datenträger |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922355A (ja) * | 1982-07-29 | 1984-02-04 | Dainippon Printing Co Ltd | Icカ−ド |
JP2005149360A (ja) * | 2003-11-19 | 2005-06-09 | Dainippon Printing Co Ltd | Sim用icカード |
US8695881B2 (en) * | 2004-06-30 | 2014-04-15 | Nxp B.V. | Chip card for insertion into a holder |
-
2011
- 2011-10-04 EP EP11837644.1A patent/EP2636001A4/fr not_active Withdrawn
- 2011-10-04 WO PCT/IB2011/002825 patent/WO2012059813A2/fr active Application Filing
- 2011-10-14 TW TW100137370A patent/TW201229916A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1785916A1 (fr) * | 2005-11-14 | 2007-05-16 | Tyco Electronics France SAS | Corps de carte à puce, carte à puce et procédé de fabrication |
WO2008081224A1 (fr) * | 2006-12-28 | 2008-07-10 | Fci | Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci |
DE102008005320A1 (de) * | 2008-01-21 | 2009-07-23 | Giesecke & Devrient Gmbh | Kartenförmiger Datenträger |
Also Published As
Publication number | Publication date |
---|---|
WO2012059813A9 (fr) | 2012-11-15 |
EP2636001A2 (fr) | 2013-09-11 |
WO2012059813A3 (fr) | 2012-07-19 |
WO2012059813A2 (fr) | 2012-05-10 |
TW201229916A (en) | 2012-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130419 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140806 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G06K 19/077 20060101AFI20140731BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150303 |