WO2008081224A1 - Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci - Google Patents

Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci Download PDF

Info

Publication number
WO2008081224A1
WO2008081224A1 PCT/IB2006/055065 IB2006055065W WO2008081224A1 WO 2008081224 A1 WO2008081224 A1 WO 2008081224A1 IB 2006055065 W IB2006055065 W IB 2006055065W WO 2008081224 A1 WO2008081224 A1 WO 2008081224A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
card
flat substrate
contacts
format
Prior art date
Application number
PCT/IB2006/055065
Other languages
English (en)
Inventor
Christophe Mathieu
Laurent Berdalle
Stéphane BARLERIN
Original Assignee
Fci
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci filed Critical Fci
Priority to PCT/IB2006/055065 priority Critical patent/WO2008081224A1/fr
Publication of WO2008081224A1 publication Critical patent/WO2008081224A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface

Definitions

  • the instant invention relates to f lat substrates for identi f ication cards , manufacturing methods of the same , and antennas for contactles s RFI D card .
  • the present invention relates generally to a flat substrate for an identification card, and cards comprising the same. It further relates to a manufacturing method of such flat substrates and cards.
  • Identification cards having dual functionalities of RFID and smart card also called combi cards
  • These cards are generally formed using lamination techniques to form typically four layers comprising the antenna and the chip for the smart card.
  • the present invention seeks to mitigate these drawbacks by proposing a substrate that is more efficient to manufacture .
  • the invention thus relates to a flat substrate for an identification card, made of a flexible material and having two opposite main faces, the flat substrate comprising: a loop shaped antenna for contactless communication, disposed on at least one main face, and - a plurality of contacts for establishing, on one of said two main faces, an electrical connection by contact with a card reader terminal .
  • the substrate made of a single layer of polymeric material permits easier manufacturing and disposal of the substrate.
  • the invention is a SIM-format card or an ISO-format card, for instance an injection molded card, comprising the flat substrate of the invention .
  • the invention is a phone comprising SIM-card reader terminals and a SIM-format card, wherein the contacts of the SIM-format card are electrically connected by contact with the terminals of the SIM-card reader, the antenna providing contactless communication of the phone.
  • the invention relates to a method of manufacturing a flat substrate destined for an identification card, comprising the following steps: -providing a flexible material having two opposite main faces,
  • the invention relates to an antenna for a contactless-card RFID reader, the antenna having a first loop portion adapted for contactless communication with an antenna suitable to be borne by an ISO-format card, and a second loop portion adapted for contactless communication with an antenna suitable to be borne by a SIM-format card, said first and second loop portion having dissimilar loop dimensions and being electrically connected to one another.
  • the first loop portion may be about of the dimensions of an ISO-format card and the second loop portion may be about the dimensions of a SIM-format card.
  • the invention relates to a system comprising such an RFID antenna.
  • FIG. 1 is a lateral schematic view of an installation of manufacture of flat substrates according to one embodiment of the invention
  • FIG. 2 is a partial view of a ribbon comprising a flat substrate obtained from the installation of Fig. 1,
  • FIG. 3a is a perspective view of the top face of an individual flat substrate
  • FIG. 3b is an exploded perspective view of the back face of the flat substrate of Fig. 3a and a chip for connection to the flat substrate,
  • -Fig. 4 is a sectional view of Fig. 3a
  • -Fig. 5 is a perspective exploded view of an ISO- format card incorporating the flat substrate of Fig. 3a and 3b, and
  • FIG. 6 is a plan top view of an RFID-Tag according to an embodiment of the invention.
  • the same reference signs designate like or similar elements .
  • an apparatus 1 for continuous high-speed manufacturing of electronic parts.
  • the apparatus 1 comprises a treatment enclosure 2 for the treatment of a flat substrate 3 continuously unwound from a take-off roll 4 and wound ontO an intake roll 5.
  • the flat substrate is a flexible substrate comprising a layer of dielectric polymeric material, for example glass epoxy material, the thickness of which is suitable for being wound and unwound as shown, while ensuring to stay mechanically viable during the manufacturing process.
  • the layer of dielectric material has a thickness of between 50 an 250 micrometers. In some embodiments, the thickness is chosen between 75 and 110 micrometers, for example 100 micrometers.
  • the flat substrate 3 further comprises a layer of copper on both sides of the layer of epoxy material.
  • the layers of copper are for example each between 10 and 50 micrometers thick, for instance 35. These layers of copper may for example be applied on the epoxy layer as a first manufacturing process step in enclosure.
  • the treatment enclosure is suitable for continuously treating the above-described flat substrate 3 into an electronic component. It may comprise a plurality of treatment chambers in series for performing various manufacturing steps on the substrate. These steps are in their principles well known from the one skilled in the art. These steps include for example etching the copper layer and Nickel-Gold metallisation by electrolytic deposition, on one or both faces of the flat substrate. For instance, the antenna tracks resulting from etching are of about 125 ⁇ m width and about 250 ⁇ m spaced apart at the closest.
  • the flat substrate When exiting the treatment enclosure 2, the flat substrate is sensibly as shown on Fig. 2 according to this embodiment of the invention. It comprises a plurality of juxtaposed modules 6 which will later be separated into individual modules for manufacturing individual cards. For example, individual modules of the size of a SIM-format card (15x25 millimetres) are formed.
  • each of these modules comprises contacts 7 suitable for establishing an electrical connection by contact between the card which will comprise the flat substrate 3 and a terminal of a complementary contacting card reader outside the card.
  • each of the contacts 7 has a rectangular shape and the whole contact area forms a rectangular footprint.
  • An antenna 8 is provided in the module.
  • the antenna is provided with a number of turns suitable for contactless communication with a suitable contactless complementary device at a distance of at least four centimetres.
  • the turns are disposed on the main face 10a of the flexible flat substrate 3 receiving the contacts, or on the opposite main face 10b.
  • the antenna could be provided, as in the embodiment shown on Fig. 3a, 3b and 4, in the form of a first loop 8a on the main face of the substrate 3 which receives the contacts 7, and a second loop 8b provided on the opposite face.
  • the first loop is mainly provided side by side with the contacts 7, and wires 9 extend from the first loop to be connected to some of the contacts 7. Possibly, some turns are provided around the contacts 7 for increasing the length of the antenna.
  • the second loop is directly opposite the first loop. Some turns of the second loop could also extend around the chip (not shown) .
  • the two loops 8a and 8b are electrically connected together through metallised holes 11 extending through the layer of epoxy material.
  • connecting features 12 are provided on the back main face lob of the substrate for connection of the chip 13. These connecting features are for example blind holes formed in the back main face of the substrate, and electrically connected by a conductive layer to the contacts 7 through the remaining thickness of epoxy material.
  • the chip is also connected to the antenna, which is connected to at least two of the contacts at its extremities.
  • the substrate as shown on Fig. 3a and 3b, with its integrated chip, can be readily integrated into a SIM
  • SIM-format card by injection moulding.
  • the obtained SIM-format card can be readily inserted into a mobile phone comprising a card reader comprising terminals contacting the contacts 7 of the SIM- format card for enabling use of the mobile phone.
  • the mobile phone comprising the SIM-format card of the invention will provide contactless communication to some adapted contactless complementary reader antenna external to the phone through the antenna provided on the SIM-format card.
  • the manufactured flat substrate of Fig. 3a and 3b can be integrated into an ISO-format card of standard dimensions 86x54 millimetres.
  • This integration may be performed in a standard way such as by injection moulding or by laminating two PVC sheets 15.
  • a window 16 is provided in one of the PVC sheets 15 for enabling contact of the contacts 7 with a complementary contacting reader.
  • contactless communication is performed by communication with a complementary RFID antenna.
  • any kind of existing RFID antenna would be suitable for contactless communication with such a card, Fig.
  • the RFID-antenna 17 of Fig. 6 comprises a first loop 18a which corresponds to about the dimensions of the ISO-format card.
  • the reader antenna 18 further comprises a second loop 18b connected to the first loop 18a and encompassed in a rectangle of the size of a SIM-format card.
  • This antenna provides with a good magnetic coupling both with regular ISO-format RFID cards (or dual cards) and with SIM-format cards as described above.
  • a mark can be performed on a cover sheet that covers the antenna 18, at the place where the first and/or the second loop is designed, so that the user will identify how he should place his/her contactless-card/phone for a better coupling with the reader.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un substrat plat destiné à une carte d'identification, fabriquée en un matériau flexible ayant deux surfaces principales opposées, le substrat plat comportant: une antenne en forme de boucle (8) pour une communication sans contact, disposée sur au moins une face principale ; une pluralité de contacts (7) pour établir une connexion électrique par contact avec un terminal de lecteur de carte sur l'une desdites deux faces principales.
PCT/IB2006/055065 2006-12-28 2006-12-28 Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci WO2008081224A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/IB2006/055065 WO2008081224A1 (fr) 2006-12-28 2006-12-28 Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2006/055065 WO2008081224A1 (fr) 2006-12-28 2006-12-28 Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci

Publications (1)

Publication Number Publication Date
WO2008081224A1 true WO2008081224A1 (fr) 2008-07-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/055065 WO2008081224A1 (fr) 2006-12-28 2006-12-28 Substrats plats pour cartes d'identification et procédés de fabrication de ceux-ci

Country Status (1)

Country Link
WO (1) WO2008081224A1 (fr)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063706A1 (de) * 2008-12-19 2010-07-01 Austria Card Gmbh Dual Interface Karte mit SIM-Karten-Stanzung
EP2280489A1 (fr) * 2009-07-31 2011-02-02 Gemalto SA Dispositif adaptateur sans contact
US20110065476A1 (en) * 2009-09-16 2011-03-17 Phytrex Technology Corporation Antenna device
WO2011157693A1 (fr) 2010-06-18 2011-12-22 Fci Circuit imprimé multi-couche souple et son procédé de fabrication
EP2636001A2 (fr) * 2010-11-02 2013-09-11 Linxens Holding Carte sim et procédé de fabrication
FR2998395A1 (fr) * 2012-11-21 2014-05-23 Smart Packaging Solutions Sps Module electronique simple face pour carte a puce a double interface de communication
WO2014191277A1 (fr) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Structures d'ablation par laser de modules d'antenne pour des cartes à puce à double interface
US20150269474A1 (en) * 2011-08-08 2015-09-24 David Finn Rfid transponder chip modules
US20150269471A1 (en) * 2011-08-08 2015-09-24 David Finn Rfid transponder chip modules
US9239982B2 (en) 2010-08-12 2016-01-19 Féinics Amatech Teoranta RFID antenna modules and increasing coupling
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4105869A1 (de) * 1991-02-25 1992-08-27 Edgar Schneider Ic-karte und verfahren zu ihrer herstellung
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
FR2753305A1 (fr) * 1996-09-12 1998-03-13 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire sans contact
US20020162894A1 (en) * 2000-10-24 2002-11-07 Satoru Kuramochi Contact / noncontact type data carrier module
EP1610261A1 (fr) * 2004-06-25 2005-12-28 Giesecke & Devrient GmbH Module pour carte à puce

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4105869A1 (de) * 1991-02-25 1992-08-27 Edgar Schneider Ic-karte und verfahren zu ihrer herstellung
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
FR2753305A1 (fr) * 1996-09-12 1998-03-13 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire sans contact
US20020162894A1 (en) * 2000-10-24 2002-11-07 Satoru Kuramochi Contact / noncontact type data carrier module
EP1610261A1 (fr) * 2004-06-25 2005-12-28 Giesecke & Devrient GmbH Module pour carte à puce

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063706A1 (de) * 2008-12-19 2010-07-01 Austria Card Gmbh Dual Interface Karte mit SIM-Karten-Stanzung
EP2280489A1 (fr) * 2009-07-31 2011-02-02 Gemalto SA Dispositif adaptateur sans contact
US20110065476A1 (en) * 2009-09-16 2011-03-17 Phytrex Technology Corporation Antenna device
WO2011157693A1 (fr) 2010-06-18 2011-12-22 Fci Circuit imprimé multi-couche souple et son procédé de fabrication
US9239982B2 (en) 2010-08-12 2016-01-19 Féinics Amatech Teoranta RFID antenna modules and increasing coupling
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
EP2636001A2 (fr) * 2010-11-02 2013-09-11 Linxens Holding Carte sim et procédé de fabrication
EP2636001A4 (fr) * 2010-11-02 2014-09-03 Linxens Holding Carte sim et procédé de fabrication
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US20150269471A1 (en) * 2011-08-08 2015-09-24 David Finn Rfid transponder chip modules
US20150269474A1 (en) * 2011-08-08 2015-09-24 David Finn Rfid transponder chip modules
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
FR2998395A1 (fr) * 2012-11-21 2014-05-23 Smart Packaging Solutions Sps Module electronique simple face pour carte a puce a double interface de communication
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US11568195B2 (en) 2013-01-18 2023-01-31 Amatech Group Limited Smart cards with metal layer(s) and methods of manufacture
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11836565B2 (en) 2013-01-18 2023-12-05 Amatech Group Limited Smartcards with multiple coupling frames
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11037044B2 (en) 2013-01-18 2021-06-15 Amatech Group Limited Smartcard constructions and methods
EP3005243B1 (fr) 2013-05-28 2022-04-20 Féinics AmaTech Teoranta Structures d'ablation par laser de modules d'antenne pour des cartes à puce à double interface
WO2014191277A1 (fr) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Structures d'ablation par laser de modules d'antenne pour des cartes à puce à double interface
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
US11853824B2 (en) 2018-03-07 2023-12-26 X-Card Holdings, Llc Metal card
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module

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