EP2594120A2 - Boîtier de circuit électronique pour une pompe à carburant - Google Patents

Boîtier de circuit électronique pour une pompe à carburant

Info

Publication number
EP2594120A2
EP2594120A2 EP11730012.9A EP11730012A EP2594120A2 EP 2594120 A2 EP2594120 A2 EP 2594120A2 EP 11730012 A EP11730012 A EP 11730012A EP 2594120 A2 EP2594120 A2 EP 2594120A2
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
housing according
housing
barrier layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11730012.9A
Other languages
German (de)
English (en)
Inventor
Rolf Graf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP2594120A2 publication Critical patent/EP2594120A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0686—Mechanical details of the pump control unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M37/00—Apparatus or systems for feeding liquid fuel from storage containers to carburettors or fuel-injection apparatus; Arrangements for purifying liquid fuel specially adapted for, or arranged on, internal-combustion engines
    • F02M37/04—Feeding by means of driven pumps
    • F02M37/08—Feeding by means of driven pumps electrically driven
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a housing of an electronic circuit for a fuel pump, consisting of a printed circuit board, arranged on the printed circuit board electrical and / or electronic components, a bottom and a bottom connected to the lid, wherein the bottom and cover form the housing.
  • Such electronic circuits are used in fuel pumps of motor vehicles in order to promote fuel from a fuel tank to an internal combustion engine.
  • the electronic circuit is needed to operate the electronically controlled electric motor of the fuel pump.
  • the printed circuit boards used in this case are usually made of fiber-reinforced plastic, being used as plastics epoxides but also thermosets and thermoplastics or special
  • Plastics such as PTFE find use.
  • the fiber materials used are glass fibers, plastic and carbon fibers, as well as plant fibers and paper. Due to the arrangement of the electronic circuit in the fuel pump or in the immediate vicinity of the electronic components and tracks must be protected from the aggressive components of the fuel. Since fuel components also diffuse through printed circuit boards, this does not provide adequate protection. Therefore, to protect the electronic circuit, the printed circuit board is arranged with the components within a sealed metal housing.
  • the bushings for the electrical connections are designed as glass-to-metal bushings. The disadvantage of these glass-to-metal bushings is the expense and the cost of producing the seal. It is also known to arrange components on a ceramic floor and to solder the ceramic floor with a metal lid, so that the components are arranged protected between ceramic floor and lid. The ceramic floor acts as a diffusion barrier for the fuel.
  • a disadvantage of both embodiments is the considerable cost factor of such housing, which allows economic use only in high-quality applications.
  • the invention is therefore an object of the invention to provide a housing of an electronic circuit, the components are sufficiently protected against fuel.
  • the protection of the electronic circuit should be achieved in a cost effective manner.
  • the object is achieved in that on the side of the circuit board on which the components are arranged, a self-contained metallic sheet is arranged, that the components are arranged in the area enclosed by the web that a cover by means of soldered to the closed track is connected such that the circuit board as the bottom and the lid form a housing, and that the circuit board has at least one locking position.
  • the barrier layer is arranged on the side facing away from the components of the circuit board. This side of the circuit board is regularly free of components, so that a barrier layer can be arranged with very little effort on this side of the circuit board.
  • the barrier layer can be provided already in the manufacture of the circuit board, when the barrier layer is arranged as a layer in the circuit board. To increase the blocking effect, it contributes, in the circuit board several locking layers, preferably two to three
  • Locked positions to arrange, with the individual locking layers are spaced from each other. That is, the barrier layers are separated from each other by the insulating material of the circuit board.
  • the arranged in the circuit board locking layers can both have the dimensions of the outside of the circuit board arranged blocking position, as well as have different dimensions.
  • Both embodiments also have the advantage that the blocking position can already be arranged with the production of a printed circuit board before the printed circuit board is singulated to the desired dimensions, or fitted.
  • the arrangement of the locking position can be carried out particularly economically.
  • the barrier layer may consist of a single layer or of several individual layers. Especially with higher requirements, appropriately designed layer systems can be used. A good barrier effect at the same time simple production is achieved with a barrier layer of copper, nickel, gold, aluminum or a metal alloy. These materials have the advantage that they are also used as material for the printed conductors. Therefore, methods and devices for applying the printed conductors can be used for arranging the barrier layer. As a result, the expenses for the blocking position can be kept low. It has been found that the thickness of the barrier layer, depending on the requirements, has an influence on the barrier effect. A sufficient barrier effect is achieved with barrier layers whose thickness is between 1 ⁇ and 300 ⁇ , preferably between 17.5 ⁇ and 150 ⁇ .
  • the barrier layer has substantially the same dimensions as the outer dimensions of the metallic web.
  • the metallic web for applying the lid can be produced particularly easily if it consists of the material of the conductor tracks, preferably of copper or gold.
  • the methods and apparatus for applying the printed conductors can be used for applying the metallic web.
  • the width of the closed web is greater than the area of the lid which is connected to the printed circuit board via the solder connection.
  • the width of the metal sheet is a measure of the barrier effect, since the metallic sheet as well as the barrier layer act as a diffusion barrier.
  • the diffusion path in the insulating material of the printed circuit board increases with increasing width of the metallic path, which increases the protective effect.
  • the housing can be manufactured particularly cost-effectively, if the barrier layer and the closed web are made of the same material. An improved barrier effect is achieved with a barrier layer which covers a larger area than the cover on the opposite side of the circuit board.
  • a further embodiment provides for making the contacting of the circuit and its components with externally supplied electrical lines by embedded in the printed circuit board connecting cables.
  • arranged on the circuit board contacts are provided which are connected to the embedded in the circuit board connecting cables. This avoids that the blocking position or the cover is interrupted for contacting, resulting in a reduction of the blocking effect would result.
  • the connecting lines may be formed as one or more conductor planes, which are insulated from one another, arranged one above the other in the circuit board.
  • connection lines are arranged outside of the metallic path and / or outside of the arranged on the opposite side of the circuit board locking position on the circuit board.
  • the contacts are arranged outside of the metallic path and / or outside of the arranged on the opposite side of the circuit board locking position on the circuit board.
  • the areas of the printed circuit board that are unprotected due to the contact arrangement can be reduced if the contacts are arranged inside the metallic track and / or within the barrier layer arranged on the opposite side of the printed circuit board, the metallic track and / or the barrier layer covering the contacts with one another surrounded by a gap formed as an annular gap.
  • the diffusion of fuel over the outer edge, which forms the circumference of the circuit board, is prevented by a further blocking position, wherein this further blocking position is arranged on the circumference of the circuit board, that the metallic sheet and arranged on the opposite side of the printed circuit barrier layer with each other get connected.
  • FIG. 1 shows the printed circuit board of a housing according to the invention
  • Housing of Figure 1 a second embodiment of the circuit board of Figure 1 and further embodiments of the housing of Figure 2.
  • Figure 1 shows a circuit board 1 in a plan view, with no lid is drawn for clarity.
  • electronic components 2 of an electronic circuit are arranged, which are interconnected via interconnects 3.
  • a self-contained metallic sheet 4 is arranged, which surrounds the electronic circuit.
  • the self-contained metallic web 4 consists, like the conductor tracks 3, of copper.
  • the circuit board 1 is made of an epoxy resin.
  • the circuit board 1 outside of the self-contained metallic sheet 4 on several openings 9, which are lined with copper.
  • the openings 9 form contacts 10 for connecting the electronic circuit to corresponding electrical connection lines, which are not shown here.
  • the circuit board 1 in section with the components 2.
  • Printed circuit board 1 and cover 5 thus form the housing. 7
  • a barrier layer 8 of copper is arranged over a large area, which has approximately the dimensions of the metallic sheet 4 in their outer dimensions.
  • the cover 5 protects the electronic circuit directly from contact with fuel, while the locking layer 8 prevents fuel from diffusing through the circuit board 1 from below. Only the unprotected circumferential edge of the printed circuit board 1 is now exposed to contact with fuel or fuel vapors. This fuel can only between metallic web 4 and the
  • Locking layer 8 pass through the printed circuit board material in the space covered by the lid 5 space.
  • the width of the metallic web 4 thus determines the length of the printed circuit board material through which the fuel must diffuse until the components 2 are reached. Therefore, with a widening of the metallic sheet 4, the barrier effect can be further improved.
  • connection line conductor level 11 which connects the components 2 of the electronic circuit with the respective contacts 10.
  • the printed circuit board 1 shown in FIGS. 3 and 4 is characterized by a modified metallic web 4 and barrier layer 8.
  • the width of the metallic Track 4 and the barrier layer 8 so far spread that they completely enclose the contacts 10. Only a narrow annular gap 12 around each contact 10 ensures the electrical separation of contact 10 and metallic track 4 or barrier layer 8. With this configuration, a further improved protection is achieved.
  • the printed circuit board 1 has a further blocking position 8 a, which is arranged within the printed circuit board 1.
  • the second barrier layer 8a creates an additional blocking effect, inter alia, that the distance between the locking position and cover 5 is shortened.
  • the blocking layer 8b has slightly different dimensions than the barrier layer 8 arranged on the outside of the printed circuit board 1. In particular in the area of the contacts 10, the blocking position is arranged closer to the contacts 10 than the blocking position 8 due to the necessary annular gap 12. By this overlap of the individual locking layers 8, 8a, an additional protection in the region of the contacts 10 is achieved.
  • the previously exposed peripheral edge is provided with a further barrier layer 8b in the form of a copper layer, wherein the barrier layer 8b connects the barrier layer 8 with the metallic sheet 4, so that the surface of the circuit board 1 only in the region of the annular gap 12 is free.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Fuel-Injection Apparatus (AREA)

Abstract

Boîtier (7) de circuit électronique pour une pompe à carburant, qui comporte un fond et un couvercle (5) relié au fond, une carte de circuits imprimés (1) et des composants électriques et/ou électroniques (2) situés sur une face de la carte à circuits imprimés (1). Selon l'invention, sur la face de la carte à circuits imprimés (1) qui porte les composants (2), est agencée une piste métallique (4) fermée sur elle-même, les composants (2) étant situés dans la zone entourée par la piste (4). Un couvercle (5) est relié par liaison soudée à la piste fermée (4) de manière telle que la carte à circuits imprimés (1), en tant que fond, et le couvercle (5) forment un boîtier (7), et que ladite carte à circuits imprimés (1) comporte au moins une zone barrière (8).
EP11730012.9A 2010-07-12 2011-07-07 Boîtier de circuit électronique pour une pompe à carburant Withdrawn EP2594120A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010026954A DE102010026954B4 (de) 2010-07-12 2010-07-12 Gehäuse einer elektronischen Schaltung für eine Kraftstoffpumpe
PCT/EP2011/061543 WO2012007355A2 (fr) 2010-07-12 2011-07-07 Boîtier de circuit électronique pour une pompe à carburant

Publications (1)

Publication Number Publication Date
EP2594120A2 true EP2594120A2 (fr) 2013-05-22

Family

ID=44628089

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11730012.9A Withdrawn EP2594120A2 (fr) 2010-07-12 2011-07-07 Boîtier de circuit électronique pour une pompe à carburant

Country Status (6)

Country Link
US (1) US9307668B2 (fr)
EP (1) EP2594120A2 (fr)
KR (1) KR20130128369A (fr)
CN (1) CN102986316B (fr)
DE (1) DE102010026954B4 (fr)
WO (1) WO2012007355A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014217552A1 (de) * 2014-09-03 2016-03-03 Conti Temic Microelectronic Gmbh Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen
TWI710183B (zh) 2015-01-11 2020-11-11 美商莫仕有限公司 電路板旁路組件及其構件
DE102015218706B4 (de) 2015-09-29 2017-04-06 Conti Temic Microelectronic Gmbh Elektronische Komponente
US10424856B2 (en) * 2016-01-11 2019-09-24 Molex, Llc Routing assembly and system using same
TWI597896B (zh) 2016-01-19 2017-09-01 Molex Llc Integrated routing components
CN207490738U (zh) * 2017-09-04 2018-06-12 深圳市光峰光电技术有限公司 电源组件及投影设备
JP6742469B1 (ja) * 2019-04-16 2020-08-19 三菱電機株式会社 燃料供給装置

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US4998865A (en) * 1988-07-11 1991-03-12 Aisan Kogyo Kabushiki Kaisha Brushless DC pump with enclosed circuit board
DE4237870A1 (de) * 1992-11-10 1994-03-10 Daimler Benz Ag Verfahren zur Herstellung eines elektronischen Steuergeräts für ein Kraftfahrzeug, und nach diesem Verfahren herstellbares Steuergerät
DE19516548A1 (de) * 1995-05-05 1996-11-14 Blaupunkt Werke Gmbh Abdeckkappe für elektronisches Bauelement
DE10026756C2 (de) * 2000-05-30 2002-11-21 Bosch Gmbh Robert Elektrische Schaltung
DE10162600A1 (de) * 2001-12-20 2003-07-10 Bosch Gmbh Robert Gehäuseanordnung für ein elektrisches Gerät
US7474024B2 (en) 2004-09-15 2009-01-06 Aisan Kogyo Kabushiki Kaisha Electronic control unit and electric pump
CN101111673A (zh) 2005-01-27 2008-01-23 爱三工业株式会社 燃料供给装置
JP4410183B2 (ja) 2005-01-27 2010-02-03 愛三工業株式会社 燃料供給装置
DE102005043818A1 (de) * 2005-09-13 2007-03-22 Siemens Ag Zur Abdichtung einer Öffnung eines Kraftstoffbehälters eines Kraftfahrzeuges vorgesehenen Flansch
US20080115772A1 (en) 2006-11-21 2008-05-22 Ti Group Automotive Systems, L.L.C. Fluid encapsulant for protecting electronics
DE102007017529B4 (de) * 2007-04-13 2012-04-26 Continental Automotive Gmbh Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls
JP2009091936A (ja) * 2007-10-05 2009-04-30 Aisan Ind Co Ltd 燃料ポンプ用制御装置
US20090231825A1 (en) * 2008-03-14 2009-09-17 Universal Scientific Industrial Co., Ltd. Electromagnetic shielding device

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Title
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See also references of WO2012007355A2 *

Also Published As

Publication number Publication date
DE102010026954B4 (de) 2013-04-11
KR20130128369A (ko) 2013-11-26
WO2012007355A3 (fr) 2012-03-29
US20130114221A1 (en) 2013-05-09
CN102986316A (zh) 2013-03-20
US9307668B2 (en) 2016-04-05
DE102010026954A1 (de) 2012-01-12
CN102986316B (zh) 2015-09-09
WO2012007355A2 (fr) 2012-01-19

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