EP2588827A2 - Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques - Google Patents

Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques

Info

Publication number
EP2588827A2
EP2588827A2 EP11728796.1A EP11728796A EP2588827A2 EP 2588827 A2 EP2588827 A2 EP 2588827A2 EP 11728796 A EP11728796 A EP 11728796A EP 2588827 A2 EP2588827 A2 EP 2588827A2
Authority
EP
European Patent Office
Prior art keywords
channel
heat exchanger
plate
flow
flow channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11728796.1A
Other languages
German (de)
English (en)
Inventor
Marcus Franz
Matthias Reitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SGL Carbon SE
Original Assignee
SGL Carbon SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGL Carbon SE filed Critical SGL Carbon SE
Publication of EP2588827A2 publication Critical patent/EP2588827A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
    • F28D9/005—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another the plates having openings therein for both heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/10—Arrangements for sealing the margins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • Heat exchanger plate thus provided plate heat exchanger and method for producing a plate heat exchanger
  • the present invention relates to a heat exchanger plate, a plate heat exchanger provided therewith and a method for producing a plate heat exchanger.
  • the present invention also relates to a plate heat exchanger with ceramic plates.
  • so-called plate heat exchangers or plate heat exchangers are often used in which the heat transfer area between the two media is formed a stapeiförmigen arrangement of so-called heat exchanger plates or heat exchanger plates which lie in the manner of a package to each other or one above the other, with directly adjacent heat exchanger plates form a flow space between them, directly adjacent flow spaces are separated from each other fluidly and each associated with one of the two media.
  • heat exchanger plates or heat exchanger plates which lie in the manner of a package to each other or one above the other, with directly adjacent heat exchanger plates form a flow space between them, directly adjacent flow spaces are separated from each other fluidly and each associated with one of the two media.
  • heat transfer takes place via the respective flow chambers limiting and separating heat transfer plates, which thus serve as boundary walls of the flow spaces and are sealed against each other by providing appropriate seals.
  • Known heat exchanger plates are formed, for example, metallic, so that their arrangement can be welded or soldered from a plurality of heat exchanger plates, so that the solder seam or weld simultaneously acts as a seal.
  • the invention is based on the object to provide a heat exchanger plate for a plate heat exchanger, a plate heat exchanger itself and a method for producing a heat exchanger plate, in which with a particularly high reliability and mechanical stability in a particularly effective manner heat transfer can be realized.
  • the object of the invention is based on a heat exchanger plate for a plate heat exchanger according to the invention with the features of independent claim 1, in a plate heat exchanger according to the invention with the features of independent claim 1 7 and in a method for producing a heat exchanger plate for a plate heat exchanger according to the invention with the features of independent claim 18 solved.
  • Advantageous developments are the subject matter of the dependent claims.
  • One aspect of the present invention is therefore to provide a ceramic material and in particular a SiC material or a silicon carbide material as a material for the heat exchanger plate for a plate heat exchanger instead of a metal material which is normally provided.
  • Another aspect of the present invention is to ensure the mechanical stability of the heat exchanger plate in such a choice of materials that some or all of the intended flow channels of the flow channel arrangement partially or completely channel webs that form completely or partially channel channels delimiting channel walls.
  • channel lands stabilize the flow channels of the flow channel assembly and thus the plate substrate as a whole in a mechanical manner, particularly when in use and installation in a plate heat exchanger they interact with other heat transfer plates and substantially support a given heat transfer plate on a directly adjacent heat transfer plate allow planar manner, so that imprinted by the flowing media impressions can not lead to plate breaks in the underlying ceramic material.
  • the plate substrate and thus the heat transfer plate can have any desired shapes and dimensions, so that in particular an overall height and a total width of the plate substrate and thus of the heat transfer plate according to the invention are not limited.
  • a minimum channel depth can be predetermined, e.g. also in the range of about 0.2 mm in so-called micro-heat exchangers or micro-heat exchangers.
  • a deflection of the heat transfer medium or fluids can be realized, e.g. also in the sense of a plate heat exchanger with multiple passage and / or with multiple deflection of the heat transfer fluid or fluids.
  • the plate substrate may be formed with or from a sintered silicon carbide material or SSiC material. This choice of material has the particular advantage of further mechanical stabilization and increased chemical inertness.
  • It may be a minimum layer thickness Dmin and / or a mean layer thickness Dm of the disc substrate in the range of about 2 mm to about 4 mm, in particular about 3 mm or less, preferably about 2 mm. Due to the formed channel webs, it is possible to reduce the layer thicknesses of the heat transfer plates accordingly, without causing mechanical destabilization. Without the mechanical stabilization by providing the corresponding webs of the flow channels much higher layer thicknesses for stabilization of the heat exchanger plates would be necessary if they were made of ceramic materials. This would result in a weight and volume increase, so that with the same heat transfer larger equipment needed and higher costs would be the result.
  • the layer thickness Ds of the plate substrate may be greater than the minimum layer thickness Dmin of the plate substrate in the region of a channel web and / or as the average layer thickness Dm of the disk substrate, such that the relationship
  • a local width Bb of the bottom of the channel groove of the flow channel and the local width Bsb of a base of the channel web of the flow channel at the level of the bottom of the channel channel of the flow channel - each measured perpendicular to the local course direction of the channel - can have a ratio Bb: Bsb of approximately 1: 4, so that's about the relationship
  • the local width Bb of the bottom of the channel channels of the flow channel and the local width Bsp of a plateau of a channel web of a flow channel on the side facing away from the bottom of the channel channel of the flow channel - each measured perpendicular to the local course direction of the flow channel - a ratio Bb: Bsp in the range of have about 1 0: 3, so about the relationship
  • the local width Bsb of the base of the channel web of the flow channel at the level of the bottom of the channel channel of the flow channel and the local width Bsp of the plateau of the channel web of the flow channel on the side remote from the bottom of the channel channel of the flow channel - each measured perpendicular to the local direction of the flow channel have a ratio Bsb: Bsp in the range of about 1: 1 to about 4: 2, preferably about 4: 3, so that about the relationship
  • the channel walls of a flow channel with the normal to the bottom of the channel groove of the flow channel include an angle ⁇ which is in the range of more than 0 ° and less than 30 °, preferably about 1 5 °, so that about the relationship
  • the local width Bb of the bottom of the channel channel of the flow channel - measured perpendicular to the local direction of the flow channel - and the depth t of the channel channel of the flow channel - measured perpendicular to the bottom of the channel channel of the flow channel - a ratio Bb: t in the range of about 10: 1 0th to about 10: 4, preferably about 10: 4, so that about the relationship
  • the sheet substrate may be provided with top and bottom penetrating supply and discharge ports for supplying a first heat transfer fluid F1 to and from the top of the disk substrate, the flow channel assembly configured to transport the first heat transfer fluid F1 from the supply port to the discharge port ,
  • Flow channels of the flow channel arrangement can have completely or in sections a multiple undulated course.
  • the undulation direction U can run in a surface or plane defined by the plate substrate and / or perpendicular to the flow direction locally and / or in the middle defined by the respective flow channel.
  • the shape of the undulation of a respective flow channel may be one of a group of shapes including sawtooth shapes, alternating step shapes, waveforms, sine shapes, and combinations thereof.
  • a second flow channel arrangement for a second heat transfer fluid F2 having a plurality of corresponding flow channels.
  • the plate substrate may be provided with top and bottom penetrating second supply and discharge ports for supplying the second heat transfer fluid F2 to and from the back or bottom of the disc substrate, and the second flow channel assembly for transporting the second heat transfer fluid F2 from the second Feed opening is formed to the second discharge opening.
  • the heat exchanger plate according to the invention may be rotationally symmetrical with respect to the front or top side and the back or bottom side by 180 ° with respect to an axis of symmetry S. extending in the plate substrate.
  • the plate substrate may have a substantially rectangular shape.
  • supply and / or discharge openings can be formed in the area at opposite first, preferably shorter, sides of the rectangular shape, in particular in regions of the corners.
  • first and / or second heat transfer fluids F1, F2 and / or main directions of flow of flow channels can be essentially along the extension directions of opposite second - preferably longer - sides of the rectangular shape may be formed.
  • a plate heat exchanger as such having a plurality of heat transfer plates according to the invention, the heat transfer plates being constructed and arranged so that the back or bottom of the plate substrate is a respective preceding heat transfer plate.
  • a method of manufacturing a heat transfer plate for a plate heat exchanger comprising the steps of providing or forming a plate substrate with or made of a ceramic, SiC material or a silicon carbide material having a front or top surface and a return or terseite, forming a flow channel arrangement having a plurality of flow channels on the front or top of the disk substrate, wherein a part or all of the flow channels of the flow channel arrangement are formed completely or in sections with channel channels defining channel walls forming channel webs.
  • the plate substrate may be formed with or from a sintered silicon carbide material or SSiC material.
  • Flow channels of the flow channel arrangement can be formed completely or in sections with a multiple undulated course.
  • the undulation direction U can be formed to extend in a surface or plane defined by the plate substrate and / or perpendicular to the flow direction locally or in the middle defined flow direction.
  • the shape of the undulation may be a shape of the group of shapes including sawtooth shapes, alternating step shapes, waveforms, sine shapes, and combinations thereof.
  • Fig. 1A is a schematic plan view of the front side of an embodiment of the heat exchanger plate according to the invention.
  • FIG. 1 B shows a schematic plan view of the back side of FIG. 1 illustrated embodiment of the heat exchanger plate according to the invention.
  • FIGS. 1 and 2 another embodiment of the heat exchanger plate according to the invention, in which the Hauptfl warekanäle have a different geometry.
  • Embodiments of inventive heat transfer plates which are similar to those of FIGS. 1 A and 2A are constructed, but wherein the channel webs of the feed channels have a different geometry.
  • the present invention also relates to a plate heat exchanger 100 or plate heat exchanger 100 with a plurality of heat exchanger plates 1 according to the invention.
  • ceramic materials for the design of the heat exchanger plates 1 according to the invention are provided.
  • channel webs 20s which inherently stabilize the structure of the heat exchanger plate 1 made of a ceramic material and in particular of a SiC or SSiC material, and in particular also by supporting an arrangement of a plurality of inventive heat exchanger plates 1 in a plate heat exchanger 1 00 serve each other.
  • Fig. 1 shows a schematic plan view of a first embodiment of the heat exchanger plate 1 or heat exchanger plate 1 according to the invention.
  • This consists essentially of a plate substrate 1 0, which is also referred to simply as the substrate 1 0 for the heat exchanger plate 1 and with or at least one ceramic material 1 0 ', preferably a SiC material or Siliziumcarbidmaterial 1 0' and more preferably with or is formed of at least one sintered silicon carbide 1 0 'or SSiC material 1 0'.
  • the substrate 1 0 for the heat exchanger plate 1 has a plate structure with a front or top 1 0o and a back or bottom 1 0u; however, these may be particularly equal, especially with respect to a particular application, and they may also be structured in a similar or even identical manner.
  • a feed opening 2 for a first fluid F1 a discharge opening 3 for the first fluid F1
  • a feed opening 2 'for a second fluid F2 a discharge opening 3 for the second fluid F2.
  • All openings 2, 2 ', 3, 3' are formed at the edge or corner regions of the disk substrate 1 0.
  • the feed opening 2 for the first fluid F1 is shown in the view of FIG. 1 A formed in the upper, left corner.
  • the discharge opening 3 for the first fluid F1 is formed in the lower left corner. However, it may also be the discharge opening 3 for the first fluid F1 of the feed opening 2 for the first fluid F1 are formed diagonally opposite one another, ie in the in FIG. 1 A given view in the lower right corner.
  • the supply opening 2 'for the second fluid F2 is formed in the region of the upper, right-hand corner, while the discharge opening 3' for the second fluid F2 is formed in the region of the lower, right-hand corner.
  • the discharge opening 3 'for the second fluid may also be formed diagonally opposite the feed opening 2' for the second fluid, that is to say in the embodiment shown in FIG. 1 A view in the lower left corner.
  • the respective supply openings and discharge openings for a respective fluid are in relation to the longitudinal orientation of the disk substrate 1 0 each opposite. In the in Fig. Moreover, they are both arranged on the left side or on the right side of the disk substrate 10 with respect to the short edge k, respectively.
  • the feed opening 2 and the discharge opening 3 for the first fluid are surrounded or framed on the upper side 10a of the disk substrate 10 by a main seal 6 for the front side 10o and for the first fluid F1, so that outside the main seal 6 for the upper side 1 0o the supply port 2 'and the discharge opening 3' for the second fluid F2 lie.
  • an arrangement 20 for flow channels 20k is provided next to the feed opening 2 and the discharge opening 3 for the first fluid F1, which is also referred to as channel arrangement 20 or flow channel arrangement 20.
  • the plurality of flow channels 20k provided in this channel arrangement 20 extend on the surface or upper side 10o of the substrate 10, namely, the individual channels 20k in a plurality of reliefs on the upper side 10o of the plate substrate 10 within the main seal 6 for the upper side 10o form.
  • the channels 20k extend substantially between the feed opening 2 and the discharge opening 3 for the first fluid F1.
  • the entire channel assembly 20 is divided into a main channel assembly 21 or main heat transfer channel assembly 21, which is located in the middle between the supply port 2 and the discharge opening 3 for the first fluid and a little spaced therefrom and of main channels 21 k or main heat transfer channels 21 k is formed.
  • a feed or distribution channel arrangement 22 Directly adjacent to the feed opening 2 and to the discharge opening 3 for the first fluid F1 and directly connected to and / or adjacent to the main channel arrangement 21 are a feed or distribution channel arrangement 22 with distribution channels 22k or distribution channels 22k or a bundling, merging or discharge channel arrangement 23 with a plurality of bundling, merging, or discharge channels 23k.
  • Inn operation is supplied via the supply port 2, the first fluid F1 and practically introduced to the top 10 of the disk substrate 1 0 and distributed there. The distribution is taken over by the distribution channels 22k of the feed and distribution channel arrangement 22 adjoining the feed opening 2 for the first fluid F1.
  • the distribution channels 22k of the supply and distribution channel arrangement 22 transfer the first fluid F1 into the main channels 21k or main heat transfer channels 21k of the main channel arrangement 21 or main heat transfer channel arrangement 21.
  • the main channels 21 k and the main channel arrangement 21 are formed comparatively longer than the supply and distribution channel arrangement 22, so that there is a longer residence time of flowing in the channels 20 k first fluid F1 and thus sets a stronger heat transfer to the plate substrate 1 0.
  • the main channels 21 k then lead into the so-called bundling channels 23 k, which can also be referred to as discharge channels 23 k or 23k merging channels and receive the first fluid F1 from the main channels 21 k and the discharge opening 3 for the first fluid F1 supply, through which then the first fluid F1 after flowing through the channels 20k of the entire channel assembly 20, starting from the feed opening 2 for the first fluid F1, the channel assembly 20 and thus the top 10o of the substrate 1 0 leaves the heat exchanger plate 1 according to the invention again.
  • bundling channels 23 k which can also be referred to as discharge channels 23 k or 23k merging channels and receive the first fluid F1 from the main channels 21 k and the discharge opening 3 for the first fluid F1 supply, through which then the first fluid F1 after flowing through the channels 20k of the entire channel assembly 20, starting from the feed opening 2 for the first fluid F1, the channel assembly 20 and thus the top 10o of the substrate 1 0 leaves the heat exchanger plate 1 according to the invention again.
  • the first fluid F1 when flowing from the feed opening 2 to the discharge opening 3, reaches the outside area outside the main seal 6 and thus the areas of the feed opening 2 'and the discharge opening 3' for the first second fl uid F2 not.
  • the feed opening 2 'and the discharge opening 3' for the second fluid on first and two side seals 4-1 and 4-2, which the feed opening 2 'and the discharge opening 3' for the second fluid F2 for themselves once again by closing the feed opening 2 'and the lead opening 3 'for the second fluid F2 in the edge region surrounded from the outside.
  • the feed opening 2 and the discharge opening 3 for the first fluid F1 and the feed opening 2 'and the discharge opening 3' for the second fluid F2 are fluidly separated from each other or isolated, so that the first and the second fluid F1 or Do not mix F2 on top 1 0o of the plate substrate 1 0.
  • the main channel arrangement 21 or main heat transfer channel arrangement 21 with its main channels 21 k or main heat transfer channels 21 k forms the main heat transfer area or main heat exchange area 9 on the upper side 10o of the plate substrate 10 or of the first fluid F1 of the heat transfer plate 1 according to the invention.
  • the discharge opening 3 for the first fluid F1 and the bundling and discharge channel arrangement with their bundling channels 23k, merging channels 23k or discharge channels 23k form the so-called bundling and discharge region 8 for the front side 10o of the plate substrate 10 of the heat transfer plate according to the invention 1 or the first fluid.
  • the arrangement shown in plan view of FIG. 1 A is strictly axisymmetric with respect to the indicated symmetry axis x.
  • the symmetry axis y which is also drawn, at least the feed opening 2 for the first fluid F1 and the discharge opening 3 'for the second fluid F2 on the one hand and the discharge opening 3 for the first fluid F1 and the supply opening 2' for the second fluid F2 are strictly axially symmetrical arranged.
  • the outer shape of the substrate 10 is strictly axially symmetrical with respect to both axes x and y and has substantially the shape of one in the length drawn rectangles with rounded corners and an aspect ratio for the long edge I and the short edge k in the range of about 2: 1.
  • the feed channels 22k or distribution channels 22k directly transition into the main channels 21k in a 1-to-1 arrangement or assignment, and these in turn in a 1-to-1 arrangement into the trunking channels 23k or discharge channels 23k.
  • the channel cavities 20r or channel grooves 20r are shown white or light, whereas the channel lands 20s forming the channel walls 20w are shown in black or dark.
  • the channels 20k in total are in the arrangement of FIG. 1 A thus formed by a respective feed channel 22k, a directly associated main channel 21k and a directly associated discharge channel 23k.
  • the main channels 21 k here have the shape of a sawtooth or a zigzag line with triangular basic pattern. However, other embodiments are also conceivable.
  • the mechanical stability of the sheet-like substrate 1 0, which is formed in a planar manner, is stabilized per se by the sequence of depression or groove 20r and web 20s per se.
  • the Fig. 1B shows from the direction of view from the upper side 110o of the substrate 110 from the arrangement of FIG. 1 A from - quasi in review - the structure of the back 1 0u or bottom 10u of the same substrate 1 0. All structures are therefore shown dotted or dashed lines.
  • the arrangement of the here provided main seal 6 'for the second fluid F2 for the back 1 0u and the first and second side seals 4-1' and 4-2 'for the supply port 2 and for the discharge opening 3 for the first fluid F1 in relation on the back 10u is strictly axis or mirror symmetry to the axis of symmetry x and appears in comparison to the in Fig. 1 A shown corresponding arrangement with respect to the main seal 6 for the first fluid F1 and the secondary seals 4-1 and 4-2 for the second fluid with respect to the front 1 0o to the symmetry axis y strictly axis or mirror symmetry.
  • the main seal 6 surrounds the supply port 2' and the second fluid discharge port 3 ', fluidically outwardly separates the supply port 2 and the first fluid discharge port 3 with the corresponding first and second side seals 4-1' and 4-2 'and has in its interior the channel arrangement 20' or flow channel arrangement 20 'for the second fluid F2 on the back 1 0u of the plate substrate 1 0 of the heat exchanger plate 1 according to the invention.
  • FIG. 1B for the rear side 10u or lower side 10u of the disk substrate 10 essentially the one for the front side 10o of the disk substrate 10, which is shown in FIG. 1 A is shown.
  • a supply portion 7 'or distribution portion 7', a bundling portion 8 'or discharge portion 8' and a main heat transfer portion 9 'or main heat exchange portion 9' are formed for the back 10u or second fluid F2 by cooperation of the supply port 2 'for the second fluid F2 and the supply channel arrangement 22 'or distribution channel arrangement 22' with the supply channels 22k 'or distribution channels 22k' for the second fluid F2, through the main channel arrangement 21 'or main heat transfer channel arrangement 21' with the main channels 21k 'or main heat transfer channels 21k' for the second fluid F2 or by cooperation of the discharge opening 3 'for the second fluid F2 with the bundling channel arrangement 23',
  • Reca supply portion 7 'or distribution portion 7', a bundling portion 8 'or discharge portion 8' and a main heat transfer portion 9 'or main heat exchange portion 9' are formed for the back 10u or second fluid F2 by cooperation of the supply port 2 'for the second fluid F2 and the supply channel arrangement 22 'or distribution channel arrangement
  • FIGS. 2A and 2B arrangements correspond to those of FIGS. 1 A and 1 B, except that in Figs. 1 A and 1 B the main channels 21 k for the first fluid F1 and 21 k 'for the second fluid F2 and the respective webs 20s, 20s' have a sawtooth shape or a zigzag shape, whereas in the embodiment according to FIGS. 2A and 2B is a waveform, in particular in the manner of a sinusoidal course.
  • the undulation itself leads in each case to a longer dwell time of the fluid F1, F2 flowing or flowing in the channel 20k, 20k 'and thus to a more intimate heat exchange with the material 10' of the substrate 10.
  • FIGS. 3 and 4 show plan views of upper sides 10o of substrates 10 of two other embodiments for the heat exchanger plate 1 according to the invention.
  • the main channels 21k, 21k 'of the channels 20k, 20k' essentially correspond in their structure to the channels of the arrangements of FIGS. 1A, B on the one hand and FIGS. 2A, B on the other hand, ie. they have a sawtooth, a waveform.
  • FIG. 3 and 4 In contrast to the arrangements of FIG. 1A to 2B show the arrangements of FIG. 3 and 4 supply channels 22k, 22k 'and discharge channels 23k, 23k', which are no longer in 1-to-1 correspondence with the main channels 21k, 21k '. Rather, here are the channel webs 20s, 20s' - in particular 22s, 22s', 23s, 23s' - formed greatly widened, so that a total of the number of feed channels 22k, 22k 'and the discharge channels 23k, 23k' is less than the number of main channels 21 k, 21 k '.
  • FIGS. 5 and 6 show partial sectional views through a substrate 10 of two embodiments of the heat exchanger plate 1 according to the invention, namely, when the arrangements of FIGS. 1 A to 4 - viewed in the direction Y
  • the respective channel groove 20r, 20r 'and the respective channel web 20s, 20s' of the respective channel 20k, 20k' have approximately a rectangular or square shape and are substantially equal to one another.
  • the webs or channel webs 20s, 20s ' having a height which forms the depth t of the channel channel 20r, 20r', which corresponds to the width Bb of the bottom 20b, 20b 'the channel groove 20r of the flow channel 20k, 20k' but also the width Bsb of the channel web 20s, 20s 'at the level of the bottom 20b, 20b' and also the local width Bsp of the plateau 20sp, 20sp 'of the web 20s, 20s' corresponds.
  • the channel walls 20W, 20W' are formed vertically.
  • the base of the channel web 20s, 20s' and the plateaus 20sp, 20sp 'of the channel webs 20s, 20s' such chosen that the channel webs 20s, 20s' to the channel bottom 20b, 20b 'side facing away from a tapered course results, wherein the inclination angle ⁇ of the respective channel wall 20w, 20w' is different from 0 °, it is therefore: Bsb> Ex.
  • the arrows indicate the flow conditions with respect to the outward and return flow, that is to say from inflow and outflow.
  • the respective seals 6, 4-1, 4-2 and the various channel arrangements 20, 20 ' are not indicated in this illustration.
  • FIGS. 8A to 8D show, in sectional side and plan views, the schematic arrangement shown in the arrangement 100 'of FIG. 7 present flow conditions with respect to the first and second fluids F1 and F2.
  • first and second secondary seals 4-1, 4-2, 4-1 ', 4-2' for the first and second fluids F1, F2 are shown.
  • FIG. 8A to 8D are not to scale here because the main seals 6, 6 'and the side seals 4-1, 4-2, 4-1', 4-2 'are designed too strong in strength; However, this serves to clarify the geometric and flow conditions.
  • Fig. 10A and 10B describe another embodiment of the heat exchanger plate 1 according to the invention with or consisting of a ceramic substrate 10.
  • the heat exchanger plate 1 also has a substantially rectangular configuration, but with an edge ratio of the long and short edges I and k of about 4: 1. Otherwise, in connection with FIGS. 2A, 2B and 4 and 6 described before. That is, the actual main heat transfer channels 21k, 21k 'are approximately undulating, with no 1-to-1 correspondence or allocation between the supply and discharge channels 22k, 22k', 23k, 23k 'on the one hand and the main heat transfer channels 21 k, 21 k 'is present and that the webs 20s, 20s' - in particular 22s, 22s ', 23s, 23s' - the underlying flow channels 20k, 20k 'in cross-section have a trapezoidal shape, with the respective channel bottom 20b, 20b' facing away from tapering Course.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention concerne une plaque d'échange de chaleur (1), sa fabrication ainsi que l'utilisation de la plaque d'échange de chaleur (1) selon l'invention dans un échangeur de chaleur à plaques (100). Un substrat (10) pour plaque est conçu de manière à présenter au moins sur sa face supérieure (10o) un réseau de canaux d'écoulement (20) comportant une pluralité de canaux d'écoulement (20k), une partie ou l'ensemble des canaux d'écoulement (20k) comprenant sur leur totalité ou sur certains segments des nervures (20s) formant des parois de canal (20w) qui délimitent une rigole (20r) du canal d'écoulement correspondant (20k).
EP11728796.1A 2010-06-30 2011-06-09 Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques Withdrawn EP2588827A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010030781A DE102010030781A1 (de) 2010-06-30 2010-06-30 Wärmeübertragerplatte, damit versehener Plattenwärmeübertrager und Verfahren zum Herstellen eines Plattenwärmeübertragers
PCT/EP2011/059638 WO2012000767A2 (fr) 2010-06-30 2011-06-09 Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques

Publications (1)

Publication Number Publication Date
EP2588827A2 true EP2588827A2 (fr) 2013-05-08

Family

ID=44627728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11728796.1A Withdrawn EP2588827A2 (fr) 2010-06-30 2011-06-09 Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques

Country Status (9)

Country Link
US (1) US20130327513A1 (fr)
EP (1) EP2588827A2 (fr)
JP (1) JP2013534608A (fr)
KR (1) KR20130056279A (fr)
CN (1) CN103026164A (fr)
BR (1) BR112012033628A2 (fr)
CA (1) CA2803972C (fr)
DE (1) DE102010030781A1 (fr)
WO (1) WO2012000767A2 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006003317B4 (de) 2006-01-23 2008-10-02 Alstom Technology Ltd. Rohrbündel-Wärmetauscher
US9557119B2 (en) 2009-05-08 2017-01-31 Arvos Inc. Heat transfer sheet for rotary regenerative heat exchanger
US9644899B2 (en) * 2011-06-01 2017-05-09 Arvos, Inc. Heating element undulation patterns
US9200853B2 (en) 2012-08-23 2015-12-01 Arvos Technology Limited Heat transfer assembly for rotary regenerative preheater
US10175006B2 (en) 2013-11-25 2019-01-08 Arvos Ljungstrom Llc Heat transfer elements for a closed channel rotary regenerative air preheater
TR201911112T4 (tr) * 2013-12-10 2019-08-21 Swep Int Ab Geliştirilmiş akışa sahip ısı değiştirici.
JP6325674B2 (ja) * 2014-07-29 2018-05-16 京セラ株式会社 熱交換器
JP6363485B2 (ja) * 2014-12-03 2018-07-25 京セラ株式会社 セラミック流路体およびこれを備える熱交換器
WO2016145526A1 (fr) * 2015-03-16 2016-09-22 Dana Canada Corporation Échangeurs de chaleur à plaques comportant des motifs de surface permettant d'améliorer la planéité et procédés de fabrication associés
JP2016221461A (ja) * 2015-06-01 2016-12-28 東京理化器械株式会社 理化学実験用コンデンサー
US10094626B2 (en) 2015-10-07 2018-10-09 Arvos Ljungstrom Llc Alternating notch configuration for spacing heat transfer sheets
JP6659374B2 (ja) * 2016-01-22 2020-03-04 株式会社神戸製鋼所 熱交換器及び熱交換方法
DE102016205353A1 (de) * 2016-03-31 2017-10-05 Mahle International Gmbh Stapelscheibenwärmetauscher
CN106001662B (zh) * 2016-06-28 2017-12-05 洛阳红奇机械科技有限公司 一种大板热压机一体式水套加热板的制造工艺
CN107687727B (zh) * 2016-08-04 2020-03-27 丹佛斯微通道换热器（嘉兴）有限公司 用于平行流换热器的分配器和平行流换热器
US10415901B2 (en) * 2016-09-12 2019-09-17 Hamilton Sundstrand Corporation Counter-flow ceramic heat exchanger assembly and method
DE102016218370A1 (de) 2016-09-23 2018-03-29 Deutsches Zentrum für Luft- und Raumfahrt e.V. Wärmeübertragervorrichtung und Verfahren zur Herstellung einer Wärmeübertragervorrichtung
CN106802104B (zh) * 2017-01-13 2024-03-26 江门市东联热工设备有限公司 换热器波纹板
AT520072B1 (de) * 2017-07-28 2019-01-15 Zkw Group Gmbh Kühlkörper und Fahrzeugscheinwerfer
JP6642603B2 (ja) 2018-02-28 2020-02-05 株式会社富士通ゼネラル 隔壁式熱交換器
JP6496067B1 (ja) * 2018-06-29 2019-04-03 カルソニックカンセイ株式会社 熱交換器
KR102073625B1 (ko) * 2018-09-18 2020-02-05 두산중공업 주식회사 인쇄기판형 열교환기 및 이를 포함하는 열교환 장치
US11333448B2 (en) 2018-09-18 2022-05-17 Doosan Heavy Industries & Construction Co., Ltd. Printed circuit heat exchanger and heat exchange device including the same
KR102146101B1 (ko) * 2018-09-21 2020-08-20 두산중공업 주식회사 인쇄기판형 열교환기 및 이를 포함하는 열교환 장치
JP6881516B2 (ja) * 2019-07-29 2021-06-02 株式会社富士通ゼネラル 隔壁式熱交換器

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1770254A (en) * 1928-03-07 1930-07-08 Seligman Richard Heat-exchange apparatus
DE1601216B2 (de) * 1967-11-03 1971-06-16 Linde Ag, 6200 Wiesbaden Blechtafel fuer platten waermetauscher mit einem stapel solcher blechtafeln
GB1477703A (en) * 1974-07-11 1977-06-22 Advanced Materials Eng Heat exchanger
SE415928B (sv) * 1979-01-17 1980-11-10 Alfa Laval Ab Plattvermevexlare
US4749032A (en) * 1979-10-01 1988-06-07 Rockwell International Corporation Internally manifolded unibody plate for a plate/fin-type heat exchanger
US4523638A (en) * 1979-10-01 1985-06-18 Rockwell International Corporation Internally manifolded unibody plate for a plate/fin-type heat exchanger
US4347896A (en) * 1979-10-01 1982-09-07 Rockwell International Corporation Internally manifolded unibody plate for a plate/fin-type heat exchanger
JPS6016876U (ja) * 1983-07-12 1985-02-05 株式会社ノリタケカンパニーリミテド 熱交換用構造体
DE3564340D1 (en) * 1985-05-29 1988-09-15 Sigri Gmbh Procedure for manufacturing a plate heat exchanger
DE8607689U1 (de) * 1986-03-20 1986-07-03 Roehm Gmbh, 6100 Darmstadt Zu einem Plattenstapel verschweißbare Kunststoffplatte und daraus gefertigter Plattenstapel
JP2847090B2 (ja) * 1990-02-20 1999-01-13 株式会社日阪製作所 プレート式熱交換器
JPH11509616A (ja) * 1996-04-12 1999-08-24 アライドシグナル・インコーポレーテッド 炭素／炭素熱交換器およびその製造法
JP2000266490A (ja) * 1999-03-17 2000-09-29 Daikin Ind Ltd 熱交換エレメントおよびその製造方法並びに製造装置
GB2348481A (en) * 1999-03-27 2000-10-04 Chart Marston Limited Heat exchanger and/or fluid mixing means with perforated plates
JP2002005593A (ja) * 2000-06-23 2002-01-09 Kyocera Corp セラミック熱交換器構成部品
DE102006013503A1 (de) * 2006-03-23 2008-01-24 Esk Ceramics Gmbh & Co. Kg Plattenwärmetauscher, Verfahren zu dessen Herstellung und dessen Verwendung
FR2900067B1 (fr) * 2006-04-20 2008-07-18 Commissariat Energie Atomique Systeme d'echangeur de chaleur comportant des zones de circulation fluidique revetues de facon selective par un catalyseur de reaction chimique
FR2905754B1 (fr) * 2006-09-12 2008-10-31 Boostec Sa Sa Procede de fabrication d'un dispositif de type echangeur de chaleur en carbure de silicium et dispositif en carbure de silicium realise par le procede
KR100877574B1 (ko) * 2006-12-08 2009-01-08 한국원자력연구원 원자력 수소생산용 고온, 고압 및 내식성 공정 열교환기
DE102008048014A1 (de) * 2008-09-12 2010-04-15 Esk Ceramics Gmbh & Co. Kg Bauteil aus einem Stapel keramischer Platten
JP5253116B2 (ja) * 2008-12-01 2013-07-31 株式会社日阪製作所 プレート式熱交換器
EP2228615B1 (fr) * 2009-03-12 2018-04-25 MAHLE Behr GmbH & Co. KG Echangeur de chaleur à plaque, en particulier pour récupération de chaleur d'échappement de véhicule automobile

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2012000767A2 *

Also Published As

Publication number Publication date
KR20130056279A (ko) 2013-05-29
CA2803972A1 (fr) 2012-01-05
WO2012000767A2 (fr) 2012-01-05
CN103026164A (zh) 2013-04-03
JP2013534608A (ja) 2013-09-05
BR112012033628A2 (pt) 2016-11-22
US20130327513A1 (en) 2013-12-12
WO2012000767A3 (fr) 2012-04-19
DE102010030781A1 (de) 2012-01-05
CA2803972C (fr) 2015-05-12

Similar Documents

Publication Publication Date Title
EP2588827A2 (fr) Plaque d'échange de chaleur, échangeur de chaleur à plaques pourvu de ladite plaque et procédé de fabrication d'un échangeur de chaleur à plaques
EP1572335B1 (fr) Micromelangeur lamellaire statique
DE19617396C2 (de) Strömungsmodul
DE19540292C1 (de) Statischer Mikrovermischer
DE3622316C1 (de) Plattenwaermeaustauscher
EP1866066B1 (fr) Système melangeur, reacteur et systéme reacteur
DE19528117B4 (de) Wärmeübertrager mit Plattenstapelaufbau
EP2045556B1 (fr) Echangeur thermique à plaques
EP0978874A2 (fr) Refroidisseur
EP0221095B1 (fr) Materiau de garnissage tourbillonnaire et procede de sa fabrication
WO2007025766A1 (fr) Dispositif echangeur de chaleur pour chauffer ou refroidir rapidement des fluides
DE19709601A1 (de) Plattenwärmeübertrager
DE3641458A1 (de) Plattenwaermeaustauscher
EP1477761B1 (fr) Échangeur de chaleur à plaques
DE10034343C2 (de) Plattenwärmetauscher
DE102004032353A1 (de) Plattenwärmetauscher
EP3414508B1 (fr) Echangeur de chaleur et/ou d'humidité à plaques à courants croisés
AT406301B (de) Plattenwärmetauscher
DE102006005339A1 (de) Medienplatte für eine Brennstoffzelle sowie Medienverteilungsstruktur einer Anodenplatte einer Brennstoffzelle
DE19853750A1 (de) Kühler zur Verwendung als Wärmesenke für elektrische oder elektronische Komponenten
WO2006034666A1 (fr) Recuperateur a microcanaux produit a partir de feuilles empilees
DE1601228A1 (de) Waermetauscher
EP3625511A1 (fr) Dispositif de refroidissement, chauffage ou transfert thermique
DE4223699A1 (de) Wärmetauscher
DE102018006455A1 (de) Wärmetauscherplatine ineinanderragend - Profil rechteckig - pultdachförmig

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130130

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: FRANZ, MARCUS

Inventor name: REITZ, MATTHIAS

DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170103