EP2586067A2 - Cellule solaire - Google Patents
Cellule solaireInfo
- Publication number
- EP2586067A2 EP2586067A2 EP11705887.5A EP11705887A EP2586067A2 EP 2586067 A2 EP2586067 A2 EP 2586067A2 EP 11705887 A EP11705887 A EP 11705887A EP 2586067 A2 EP2586067 A2 EP 2586067A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- metal layer
- solar cell
- cell according
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 238000002161 passivation Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 5
- 230000003321 amplification Effects 0.000 claims description 3
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 238000007641 inkjet printing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000000992 sputter etching Methods 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 3
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 3
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022491—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of a thin transparent metal layer, e.g. gold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to the field of the semiconductor components, in particular the solar cells, and relates to a crystalline solar cell with an n- or p-doped semiconductor substrate and a passivated back.
- Silicon solar cells with a "passivated backside” have an improved optical mirroring and a much improved passivation of the rear surface compared to the previously standard aluminum back surface field (BSF), see A. Götzberger et al., “Sonnenenergie: Photovoltaics ", BG Teubner Stuttgart, 1997.
- the cell concept thus produced is called” passivated emitter and rear cell “(PERC), where the dielectric passivation adapted to the backside doping is locally opened at many small points, so that the metal layer deposited on the passivation layer can contact the semiconductor, but only at a small area fraction of the back surface, to minimize the strong recombination of the electron-hole pairs on metallized surfaces.
- the metallization of the rear side is in most cases made of aluminum and is deposited over the entire area on the entire back, usually with vacuum vapor deposition or sputtering.
- Documents which relate to such solar cells and methods for their production and are associated with rear-side structuring steps and / or the rear-side driving in of dopants are, for example, DE 19525720 C2, DE 102007059486 A1 or DE 102008 013446 AI and DE 102008033 169 AI (both latter of ErSol Solar Energy AG).
- connection structures in particular under the influence of soldered joints, is concerned for example with JP 2005027309 A, DE 102008017312 A1 or DE 102008020796 A1.
- LFC Laser Fired Contacts
- the backside emitter pn junction
- the backside emitter pn junction
- the formation of the Al-Si eutectic which typically melts to a few microns, would increase a breakthrough through the thin p + emitter into the n-base and there lead to a short circuit to the base. Therefore, the metallization with low temperatures (eg 400 ° C, optionally also in forming gas) must be tempered to a sufficiently good ohmic
- Sputter sources are provided for the aluminum coating.
- the compromise involves higher investment and / or process costs.
- the proposed solar cell is characterized by a thin dielectric cover layer covering the first metal layer, which has a first regular arrangement of narrow line-like openings and a second regular arrangement of substantially wider lines or elongated island-like openings, wherein the first and second opening arrangement at an angle, in particular transversely to each other, are aligned. It is further characterized by a highly conductive and solderable on the exposed surface second metal layer in the openings of the first and second opening arrangement, which contacts there the first metal layer.
- the solar cell according to the invention with a passivated and metallized large back side which was chemically or galvanically reinforced in the open in the dielectric cover layer narrow finger areas and busbar or Lötpad Schemeen current collecting, possesses the case in any case the following advantages over the prior art:
- the solar cell has in addition to the usual large-area
- Aluminum layer with local contacts to the semiconductor surface also solderable areas (busbars or soldering pads).
- the second metal layer comprises at least one metal of the group comprising Pd, Ni, Ag, Cu and Sn.
- the second metal layer has a sequence of metal layers, in particular the layer sequence Pd / Ni / Ag or Ni / Cu / Sn.
- the second metal layer is produced by a chemically or galvanically deposited reinforcing layer.
- the thin dielectric cover layer comprises at least one of the silicon oxide, silicon nitride,
- the substrate is a p-doped silicon substrate with a phosphorus-doped emitter on the first main surface.
- the semiconductor substrate is an n-doped silicon substrate having a boron- or aluminum-doped p + emitter on the second major surface.
- the first and second openings in the thin dielectric capping layer are formed by masked ion etching, particularly in the same plant in which the capping layer is formed.
- FIG. 1 to 3 in perspective schematic representations of an initial situation and a first and second process section of the production of a
- 4A and 4B are schematic plan views of two embodiments
- the emitter may be located either on the front side or on the back side. In the latter case, a doping for a front surface field (FSF) is usually produced on the front side.
- FSF front surface field
- the front side 2a is already completely processed, d. H. doped homogeneously or selectively, with passivation / antireflection coating or layer sequence and provided with a solderable contact grid.
- the back side 2b may be undoped or a homogeneous doping 3
- the surface is coated by means of chemical vapor deposition (CVD) or physical vapor deposition (PVD, ie vapor deposition or sputtering) with a passivation layer or layer sequence 4 which has been selected and optimized with regard to doping polarity and doping concentration and which is provided with a technique known per se from the prior art locally removed (opened).
- CVD chemical vapor deposition
- PVD physical vapor deposition
- ie vapor deposition or sputtering a passivation layer or layer sequence 4 which has been selected and optimized with regard to doping polarity and doping concentration and which is provided with a technique known per se from the prior art locally removed (opened).
- the resulting dot matrix in which the local contact openings 5 are arranged, depends on the sheet resistance of the surface: in the case of undoped surfaces (PERC cell), the distance between the points D
- the first process step according to the invention begins with the full surface coating (known per se from the prior art) with a metal layer sequence 6 (FIG. 2), it being possible to use either vapor deposition technology or sputtering technology. It may be z. B. aluminum which is optionally covered in the same plant with a thin nickel-containing seed layer (not shown) for later chemical or galvanic reinforcement. Alternatively, of course, other metals or metal layer sequences can be selected, for. Titanium / palladium / silver or nickel chromium / nickel / silver.
- the entire backside is covered with a thin dielectric thin film 7.
- all the deposited layers lie both on the passivation layer sequence 4 and on the semiconductor surface exposed in the local openings 5 in the passivation layer.
- the covering layer 7 may be an oxide or a nitride of aluminum or silicon. It can be evaporated or reactively sputtered from the metal target or deposited by RF sputtering from the dielectric target.
- the dielectric in the second step, with a suitable technique, the dielectric
- Cover layer in the form of many, narrow preferably equidistant and parallel to each other arranged lines 8 open ( Figure 3).
- the following techniques known per se from the prior art can be used: laser ablation, screen-printed or ink-jet printed etching paste, inkjet-masked wet-chemical etching.
- the distance W of the parallel openings 8 is typically of the order of 1mm to 10mm, preferably 2mm to 5mm.
- the width of the openings is typically about ⁇ to 1mm, preferably 200pm to 500 ⁇ .
- Bus bar strips 9a can have any desired width optimized for the soldering process. It could only be 2 busbars.
- Pad areas 9b can be as many as desired and of any size. They can be arranged along 2 or 3 lines, depending on the number and location of the busbars on the front.
- the metal surface exposed in the openings 8, 9a, 9b in the covering layer is reinforced in a suitable chemical or galvanic deposition process with a highly conductive and readily solderable metal layer sequence (FIG. 5).
- a highly conductive and readily solderable metal layer sequence (FIG. 5).
- the exposed metal for example, it may be palladium, nickel and silver or nickel, Copper and tin act. If aluminum with a nickel seed layer has been chosen, nickel will likely be deposited in the first bath, which will then be covered with sufficient silver.
- the wider busbar or pad regions 9a or 9b are also post-amplified and solderable with the same layer sequence 11 (FIG. 6).
- the post-reinforced narrow fingers 10 open either directly into the reinforced busbar surfaces IIa or solder pad surfaces IIb, or into narrow connecting lines between the pads (see FIG. Incidentally, the embodiment of the invention is not limited to the above-described examples and emphasized aspects, but only by the scope of the appended claims.
Abstract
L'invention concerne une cellule solaire comprenant : une succession de couches de passivation présentant une pluralité d'évidements sous forme d'îlots dans lesquels les couches de passivation sont totalement éliminées, sur la seconde surface principale; une première couche métallique mince disposée sur la succession de couches de passivation et dans les évidements sur la surface du substrat; une mince couche diélectrique de recouvrement recouvrant la première couche métallique et présentant un premier agencement régulier d'ouvertures étroites linéaires et un second agencement régulier d'ouvertures sensiblement plus larges, linéaires ou sous forme d'îlots allongés, le premier et le second agencement d'ouvertures étant orientés selon un certain angle, en particulier perpendiculairement l'un par rapport à l'autre; ainsi qu'une seconde couche métallique fortement conductrice pouvant être brasée sur la surface exposée, dans les ouvertures du premier et du second agencement d'ouvertures, cette seconde couche métallique mettant la première couche métallique en contact électrique à cet endroit.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102010028189.1A DE102010028189B4 (de) | 2010-04-26 | 2010-04-26 | Solarzelle |
PCT/EP2011/052954 WO2011134700A2 (fr) | 2010-04-26 | 2011-03-01 | Cellule solaire |
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EP2586067A2 true EP2586067A2 (fr) | 2013-05-01 |
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Family Applications (1)
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EP11705887.5A Withdrawn EP2586067A2 (fr) | 2010-04-26 | 2011-03-01 | Cellule solaire |
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US (1) | US9209321B2 (fr) |
EP (1) | EP2586067A2 (fr) |
JP (1) | JP2013526045A (fr) |
KR (1) | KR20130073900A (fr) |
CN (1) | CN102893406B (fr) |
DE (1) | DE102010028189B4 (fr) |
WO (1) | WO2011134700A2 (fr) |
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2010
- 2010-04-26 DE DE102010028189.1A patent/DE102010028189B4/de not_active Expired - Fee Related
-
2011
- 2011-03-01 KR KR1020127030801A patent/KR20130073900A/ko active Search and Examination
- 2011-03-01 CN CN201180020871.4A patent/CN102893406B/zh not_active Expired - Fee Related
- 2011-03-01 JP JP2013506556A patent/JP2013526045A/ja active Pending
- 2011-03-01 EP EP11705887.5A patent/EP2586067A2/fr not_active Withdrawn
- 2011-03-01 US US13/643,648 patent/US9209321B2/en not_active Expired - Fee Related
- 2011-03-01 WO PCT/EP2011/052954 patent/WO2011134700A2/fr active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
WO2011134700A2 (fr) | 2011-11-03 |
DE102010028189B4 (de) | 2018-09-27 |
DE102010028189A1 (de) | 2011-10-27 |
CN102893406A (zh) | 2013-01-23 |
US20130104975A1 (en) | 2013-05-02 |
JP2013526045A (ja) | 2013-06-20 |
CN102893406B (zh) | 2016-11-09 |
KR20130073900A (ko) | 2013-07-03 |
US9209321B2 (en) | 2015-12-08 |
WO2011134700A3 (fr) | 2012-06-07 |
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