EP2580794A1 - Structure stratifiée contenant des composants électrotechniques - Google Patents

Structure stratifiée contenant des composants électrotechniques

Info

Publication number
EP2580794A1
EP2580794A1 EP11725686.7A EP11725686A EP2580794A1 EP 2580794 A1 EP2580794 A1 EP 2580794A1 EP 11725686 A EP11725686 A EP 11725686A EP 2580794 A1 EP2580794 A1 EP 2580794A1
Authority
EP
European Patent Office
Prior art keywords
layer
layer structure
optionally
lec
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11725686.7A
Other languages
German (de)
English (en)
Inventor
Rainer Kunz
Wilfried Hedderich
Carsten Benecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Intellectual Property GmbH
Original Assignee
Bayer Intellectual Property GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Intellectual Property GmbH filed Critical Bayer Intellectual Property GmbH
Priority to EP11725686.7A priority Critical patent/EP2580794A1/fr
Publication of EP2580794A1 publication Critical patent/EP2580794A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/135—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising mobile ions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/10—Photovoltaic [PV]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the device should be as light and flat as possible. This requires that the layer structure with which the device is equipped must be as light and flat as possible. Therefore, the layer structure should also include the possibly necessary battery, which ensures the power supply of all electrical components of the layer structure.
  • the layer structure should comprise only one substrate and form only one component. So that the layer structure during assembly of the electrical or electrical equipment remains stable, the layer structure should be injected behind. In order to be as error-prone as possible and to be easy to clean on the surface, the layer structure should manage without moving components and form a continuous surface without interruptions.
  • ACPEL films have the disadvantage of requiring an electrical supply consisting of a high alternating voltage (typically 110V) at a high frequency (typically 400Hz). For this purpose, a special electronic driver must be provided, which generates additional costs.
  • Another disadvantage of combining ACPEL films with For example, capacitive switches means that the required electrical supply or the control signals a) interact for the ACPEL foil and b) for the capacitive switch.
  • This Barrierefolien- or layers typically have a water vapor permeability of 10- 6 g / m "2" day, and an oxygen permeability of 10 "5 cm 3 / m" 2 day.
  • the object of the invention is therefore to provide a layer structure on a single substrate, which has a lamp operated with electrical energy in combination with at least one further electrical component.
  • the lamp of the layer structure should not interact electromagnetically with the at least one further electrotechnical component. Also, this lamp should be able to be operated with a low electrical DC voltage.
  • the layer structure should further: have a small thickness, without moving components and form a continuous surface without interruptions, be as light as possible, have three-dimensionally deformed areas, and be injectable.
  • the layer structure should be simple and inexpensive to produce. Therefore, it should be possible to dispense with electrical components that require very complex barrier layers against oxygen and moisture for proper function.
  • the object is achieved by a layer structure with the features of the main claim, by a:
  • the layer structure By using a printing process, it is possible to manufacture the layer structure at low cost and in high quantities.
  • the LEC technology is particularly suitable compared to competing technologies.
  • the substrate consists essentially or entirely of a polymer selected from the group consisting of polycarbonates (PC), polyesters, preferably polyethylene terephthalates (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), polyamides, polyimides, polyarylates, organic thermoplastic cellulose esters and polyfluorohydrocarbons or mixtures of these polymers, preferably selected from polycarbonates, polyethylene terephthalates, polyethylene naphthalate and polyimides, particularly preferably selected from polycarbonates, Polyethylene terephthalates and polyethylene naphthalate.
  • the substrate is a film of one of the aforementioned materials.
  • Polycarbonates are, for example, those based on bisphenol A, in particular films with the designation Bayfol® CR (polycarbonate / polybutylene terephthalate film) Makrofol® TP or Makrofol® DE from Bayer Material Science AG.
  • Bayfol® CR polycarbonate / polybutylene terephthalate film
  • Makrofol® TP Makrofol® DE from Bayer Material Science AG.
  • PEN is that sold under the names Kaladex® and Teonex® by DuPont Teijin Films Luxembourg SA.
  • An LEC in the context of the present invention is understood to mean an electrotechnical component which may comprise, as essential functional parts, an anode, a light-emitting polymer which may contain as additives one or more electrolytes, one or more salts or further additives, for example surfactants, and a cathode includes.
  • the composition of the light-emitting layer may vary.
  • the additives can perform several functions during operation, for example they can serve as ion conductors, anions or cations. Further, the additives may be functionalized and chemically crosslinked with the light-emitting polymer.
  • LEP layer light emitting polymer
  • the LEC may be in various embodiments.
  • the vertical arrangement, the anode, the LEP layer and the cathode are stacked.
  • the planar arrangement, the anode, the LEP layer and the cathode may also be arranged side by side; For example, two opposing metal electrodes (anode, cathode) can be applied to an already printed LEP layer. These can be parallel or in another form.
  • the layer structure according to the invention comprises at least one LEC and one LEC at least one LEP
  • the layer structure according to the invention consequently also comprises at least one LEP.
  • pixelated light segments for example a seven-segment display, can be produced in almost any desired manner.
  • the LEC is not just a lamp, but is in itself an ad.
  • the LEC can include a so-called getter layer.
  • This getter layer if present, is preferably located on the side of the cathode facing away from the substrate.
  • the getter layer has the task to absorb the residual moisture that can come from the individual layers or from outside. This increases the life of the light-emitting element.
  • a getter layer is not essential, especially if the LEC need not have a long life. The advantages of a LEC over, for example, OLED and PLED are due to their simple structure.
  • the LEC consists of three layers (anode, LEP, cathode), the thickness of the LEP layer being in the region of a few hundred nanometers, in planar arrangements the thickness may even be in the range of a few millimeters, i. in printing technology easily realizable layer thicknesses are. Furthermore, the operation of the LEC is less sensitive to variations in the thickness of the LEP than is the case with the OLEDs and PLEDs.
  • all the layers of the LEC are applied by a simple printing process, for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing, or other printing processes known to those skilled in the art or by spray coating.
  • a simple printing process for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing, or other printing processes known to those skilled in the art or by spray coating.
  • electrode materials with an adapted work function are required for the OLEDs and PLEDs. These consist for the cathode for example of calcium, barium or magnesium, which are highly reactive under ambient conditions and rapidly oxidize.
  • the cathode for example of calcium, barium or magnesium, which are highly reactive under ambient conditions and rapidly oxidize.
  • a stable silver or aluminum electrode is used. This is inventively by a printing process, for example by screen printing, gravure, flexographic printing, gravure printing, trans-
  • vapor deposition is typically used, which in turn requires a vacuum process.
  • the workings of the LECs result in lower work function requirements so that a larger work function electrode material can be used.
  • the layer of the LEC Due to the chemical stability of the layers of the LEC, it can be produced without having to control or adjust the temperature, air pressure, air humidity or air composition or even an inert gas atmosphere, for example of pure nitrogen with a maximum water and oxygen content of each 0.1 ppm or from a comparable oxygen-free and dry gas or gas mixture would be necessary.
  • the at least one LEC is provided on its side facing the substrate with a first barrier layer.
  • the substrate is provided with a first barrier layer on at least one side, namely on the one which faces the LEC, over its entire area or only partially, but at least in the areas in which the at least one LEC is located.
  • a barrier layer may be a single layer or multiple layers that act as a single layer in terms of their barrier properties.
  • This ee rs barrier layer has a water vapor permeability of 10 "5 to 10 " 1 g / m “2" day, preferably from 10 "4 to 10 " 2 g / m “2” day, particularly preferably from 10 "4 to 10 " 3 g / m “2 day and an oxygen permeability of 10" 5 to 10 "1 cm 3 / m” 2 "day, preferably from 10" 4 to 10 "2 cm 3 / m” 2 day, more preferably from 10 "4 to 10 " 3 cm 3 / m "2, day up.
  • This barrier layer is therefore significantly less expensive than those required for OLEDs and PLEDs.
  • the first barrier layer preferably comprises a sequence of layers of each of a polymeric and an inorganic layer.
  • a polymeric layer typically consists of a photo-crosslinkable monomer or polymer (eg acrylate).
  • the thickness of a single polymeric layer is about 500 nm.
  • An inorganic layer typically consists of metal oxides, for example of SiO x or Al 2 O 3 .
  • the thickness of a single inorganic layer is about 50 nm.
  • the first barrier layer preferably comprises one to 10 layers, and consequently the thickness of the barrier layer may be about 500 nm to about 6000 nm.
  • the individual barrier layers attributable to substrate A) can be applied by physical vapor deposition (PVD) and chemical vapor deposition (CVD) in a roll-to-roll process
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • Useful barrier layers are disclosed in, for example, WO00 / 36665A1 and US6268695B1.
  • the substrate is provided with an electrode layer over its full area or only partially, in particular in the areas in which the at least one LEC is located.
  • the anode layer is also applied by means of a printing process, for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing or other printing processes known to the person skilled in the art, or by spray coating.
  • ITO and ATO can be applied by PVD, CVD, sputtering, dipping or by a sol-gel process.
  • the intrinsically conductive polymers can also be applied by vacuum crosslinking.
  • the anode layer may also serve as an electrode to other electrotechnical devices located on the same side of the substrate as the LEC. If not only on the side of the substrate, on which the at least one LEC is located, but also on the other side, at least one further electro-technical component is to be applied, both sides of the substrate can be provided with an electrode layer. It must then be ensured that these electrode layers are sufficiently isolated from each other.
  • substrates of polyethylene naphthalate (PEN), which are already provided on the entire surface on one side already with a first barrier layer and an anode made of ITO as described above, are offered for sale by 3M Kunststoff GmbH.
  • the anode is transparent in most cases, so that the electroluminescent light can pass through them.
  • the cathode can be transparent.
  • the anode may be optically transparent or partially transparent.
  • both the anode and the cathode may not be optically transparent, for example made of thin silver or gold.
  • transparent or “transparency” is understood to mean that a relevant layer or a respective layer sequence has a transmission in the major part of the visible or IR wavelength range of the light emitted by the LEC of more than 60%, preferably more than 70%, more preferably more than 80%, especially more than 90%. This also applies if the layer sequence comprises further layers not previously mentioned here.
  • the getter layer if present, preferably lies on the side of the cathode facing away from the substrate, for example between the cathode and the carrier layer described below with the second barrier layer or the metal film likewise described below.
  • PSA pressure sensitive adhesive
  • the getter layer can be applied on the side to the carrier layer as well as to the cathode. According to the invention, this is applied by a printing process, for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing, or other printing processes known to those skilled in the art, or by spray coating.
  • the LEP is applied to the anode layer.
  • printing processes for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing, or other printing processes known to those skilled in the art, or by spray coating.
  • a further electrode layer which is the cathode layer (cathode for short) for the at least one LEC, is then applied to the LEP.
  • the cathode layer contains silver, aluminum, copper and / or gold and is produced according to the invention by printing corresponding pastes, for example by screen printing, intaglio printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing or other printing processes known to the person skilled in the art. or applied by spray coating.
  • the materials suitable for the anode layer are also suitable for the cathode.
  • the cathode layer can also serve as an electrode for other electrotechnical components which are located on the same side of the substrate as the LEC.
  • Suitable materials for the conductor tracks necessary for the power supply of the electrodes are the substances listed under the sections anode and cathode. These can be applied by the application methods also mentioned in these sections.
  • the at least one LEC is provided on its side facing away from the substrate with a second barrier layer.
  • This second barrier layer can cover the substrate over the entire area or only partially, but at least in the areas in which the at least one LEC is located.
  • the second barrier layer may be constructed according to the first barrier layer.
  • this barrier layer is applied to a carrier layer, which may correspond to the substrate in terms of material and properties.
  • the second barrier layer can be applied to the carrier layer in the same way as the first barrier layer is applied to the substrate.
  • the carrier layer with the second barrier layer is applied in such a way that the barrier layer lies on the LEC-facing side of the carrier layer.
  • the carrier layer may be applied to the second barrier layer in such a way that the barrier layer lies on the side of the carrier layer facing away from the LEC.
  • This metal film consists essentially of aluminum, gold, silver, copper, chromium and has a thickness of 10 to 200 ⁇ , preferably from 50 to 100 ⁇ , more preferably from 60 to 80 ⁇ .
  • the metal film can be applied to the carrier layer in accordance with the barrier layer, for example by lamination, adhesive bonding or another method known to the person skilled in the art.
  • the metal film attributable to the substrate A) has been applied to the carrier layer by PVD methods such as sputtering.
  • PSA pressure sensitive adhesive
  • the adhesive layer can be introduced between the second barrier layer, on which a getter layer is applied, and the LEC. Thereafter, the adhesive layer can optionally be crosslinked with suitable UV radiation.
  • Another way to form the adhesive layer is to use a liquid adhesive instead of a PSA film.
  • This is applied, for example, by means of a dispensing system or by means of a printing process, for example by screen printing, gravure printing, flexographic printing, gravure printing, transfer printing, digital printing, for example inkjet printing, or other printing processes known to those skilled in the art, or by spray coating.
  • the carrier layer with the second barrier layer is positioned according to the LEC and optionally the other areas, laminated and then crosslinked with suitable UV radiation.
  • the at least one LEC and the at least one further electrotechnical component can be arranged both one above the other and next to one another with respect to the surface normal of the substrate.
  • the surface normal is a vector that is perpendicular to a plane, which theoretically can be arbitrarily small. For practical reasons, for the present invention, the smallest unit of this plane is described by a square with the edge length 1 mm.
  • the electrical conductor tracks can also electrically connect the at least one LEC and the at least one further electrical component to one another.
  • the at least one LEC can be electrically connected to at least one further electrotechnical component selected from the group consisting of antenna, switch, sensor, battery, photovoltaic cell, actuator, energy converter or combinations of two or more identical or different ones of these components the other electrical components can also be electrically connected to each other.
  • a higher-level power supply i. a power supply that is not on the layer structure, necessary.
  • a power supply can be for example: the battery of the device, which comprises the layer structure; the battery of the product, such as an automobile, in which the device is installed; the public power supply when the layer structure is installed, for example, in a household appliance.
  • the layer structure comprises at least one battery which ensures the power supply to the LEC and possibly further electrical components of the layer structure.
  • the layer structure comprises, in addition to the LEC and the battery, at least one further electrotechnical component selected from the group consisting of antenna, switch, sensor, photovoltaic cell, actuator, energy converter or combinations of two or more identical or different ones of these components.
  • the entire layer structure can be the substrate, the at least one LEC, the at least one further electrotechnical component, wherein the at least one LEC and the at least one further electrotechnical component with respect to the surface normal of the substrate can be arranged both one above the other and next to each other first barrier layer, the anode layer, the cathode layer, a second barrier layer with carrier layer or a metal film, an adhesive layer and optionally further layers such as one or more insulation layers, optionally one or more protective layers, optionally one or more decorative layers, optionally one or more Color filters, if necessary, comprise one or more diaphragms.
  • the thickness of this layer structure is from 200 ⁇ to 3000 ⁇ , preferably from 500 ⁇ to 2000 ⁇ , more preferably from 800 ⁇ to 1500 ⁇ .
  • the layer structure may have three-dimensionally deformed areas.
  • Three-dimensionally deformed in the sense of the invention means that, based on the substrate of the layer structure, there is at least one surface normal on this substrate, be it on the front side or on the backside of the substrate which is not parallel to at least one other surface normal on the same side of the substrate.
  • the normal, production-related unevenness of the surface of the substrate which is on the order of at most + / - 20 ⁇ m from the nominal value of the substrate, are not taken into account.
  • the layer structure in areas which are provided with a battery, an antenna, a switch, a sensor, a photovoltaic cell, an actuator or an energy converter be deformed three-dimensionally.
  • the radius of curvature of the layer structure in the deformed regions can be less than 10 mm, preferably less than 5 mm, particularly preferably less than 2 mm, very particularly preferably less than 1 mm.
  • the layer structure is provided in areas which are provided with a battery, an antenna, a switch, a sensor, a photovoltaic cell, an actuator or an energy converter, but provided with a bulge or indentation with the above-mentioned radius of curvature.
  • the radius of curvature at the median plane of the substrate is determined.
  • a round, ellipsoidal or otherwise geometrically designed combination of LEC and an electrical component for example a switch or sensor
  • an electrical component for example a switch or sensor
  • a switch or sensor can be configured in such a way that in the middle there is a switch which is everted towards the operator, that of a flat annular one , ellipsoidal-shaped or otherwise according to the scope of the protuberance designed LEC is surrounded.
  • the layer structure according to the invention is obtainable by the following method:
  • a further electrical component or a plurality of further electrical components the following layers are additionally applied: one or more electrical conductor tracks, optionally one or more insulation layers, optionally one or more protective layers, optionally one or more decorative layers, if appropriate one or more color filters, if appropriate one or more diaphragms, the layer structure is then deformed three-dimensionally in at least one region and / or as a whole, and the LEP layer, the cathode layer, the adhesive layer, optionally the second barrier layer, the electrical conductor tracks, the optional insulating layer, the optional protective layer and the optional decorative layer and optionally the anode layer are applied completely by a printing process.
  • step (7) and optionally step (8) are carried out at any point after step (2).
  • structural of the at least one electrically conductive layer is understood to mean that the relevant layer or the respective layer sequence is removed from the substrate in such a way, for example by chemical processes, laser ablation, punching or by covering at least one dielectric layer, For example, by printing an insulation layer, in turn, for example, by screen printing that only the areas remain as an electrode (anode) for the at least one LEC left or free, which are necessary for the operation of this LEC and / or the operation of other electrical components of If necessary, the electrical conductor tracks can be structured in a corresponding manner or be machined out of the at least one electrically conductive layer.
  • the layer structure In order to obtain a three-dimensionally deformed layer structure, the layer structure must be deformed. The deformation takes place for example by high-pressure isostatic deformation, as disclosed in EP 0 371 425 A2 and WO2009 / 043539 A2. Also, thermoforming deformation as disclosed in US5932167A, US6210623B1 and US6257866B1 is possible. Both the flat, that is the undeformed, as well as the three-dimensionally deformed layer structure can be back-injected with a plastic, as already disclosed in EP0371425A2 and WO2009 / 043539A2.
  • the layer structure according to the invention can be used for the formation of small and large display and control elements and for the formation of housing elements for mobile or stationary electronic devices or small or large domestic appliances or for the design of keyboard systems without moving components.
  • the layer structure according to the invention is illustrated in more detail by means of exemplary embodiments for the layer sequence, wherein the features essential to the invention are to be emphasized without restricting the invention thereto.
  • the LEC and the electrotechnical device are stacked with respect to the surface normal of the substrate, and the light emitted by the LEP leaves the layer structure in the direction in which the anode is located from the LEP. If no metal layer is present and the getter layer is absent or the getter layer is transparent, the light can leave the layer structure both in the direction of the anode and in the direction of the cathode, as far as all other layers are also transparent, which according to the invention is compulsory in the direction of the anode and towards the cathode is the rule.
  • Shutter switch, insulating layer, metal film, getter layer, adhesive layer, cathode, LEP, anode, barrier layer, substrate, color filter, decorative film.
  • Metal film gettering layer, adhesive layer, cathode, LEP, anode, barrier layer, substrate, color filter, switch, decorative film.
  • Example 5 Carrier layer, barrier layer, adhesive layer, switch, insulation layer, getter layer, insulation layer, cathode, LEP, anode, barrier layer, substrate, color filter, decorative film.
  • Metal film gettering layer, adhesive layer, cathode, LEP, anode, barrier layer, substrate, color filter, adhesive layer, switch, carrier layer, decorative film.
  • FIG. 1 a drawing
  • the layer structure is deformed three-dimensionally in such a way that the LEC 7 is related to all other composites nents 2-6 is located at a lower level.
  • the LEC 7 is related to all other composites nents 2-6 is located at a lower level.
  • the LEC 7 is related to all other composites nents 2-6 is located at a lower level.
  • electrical connections 3 are arranged in the present case.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)

Abstract

L'invention a pour objet une structure stratifiée comprenant un substrat (1), au moins une cellule électrochimique électroluminescente (LEC) (7) et au moins un autre composant électrotechnique (4, 5, 8), un procédé pour produire cette structure stratifiée et son utilisation pour former des éléments de commande et d'affichage de petites et de grandes dimensions et pour former des éléments de boîtier destinés à des appareils électroniques mobiles et fixes ou des appareils électroménagers de petites et de grandes dimensions ou pour former des systèmes de clavier sans composants mobiles.
EP11725686.7A 2010-06-10 2011-06-07 Structure stratifiée contenant des composants électrotechniques Withdrawn EP2580794A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11725686.7A EP2580794A1 (fr) 2010-06-10 2011-06-07 Structure stratifiée contenant des composants électrotechniques

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10165581A EP2395572A1 (fr) 2010-06-10 2010-06-10 Montage en couche comprenant des composants électrotechniques
PCT/EP2011/059383 WO2011154399A1 (fr) 2010-06-10 2011-06-07 Structure stratifiée contenant des composants électrotechniques
EP11725686.7A EP2580794A1 (fr) 2010-06-10 2011-06-07 Structure stratifiée contenant des composants électrotechniques

Publications (1)

Publication Number Publication Date
EP2580794A1 true EP2580794A1 (fr) 2013-04-17

Family

ID=42953804

Family Applications (2)

Application Number Title Priority Date Filing Date
EP10165581A Withdrawn EP2395572A1 (fr) 2010-06-10 2010-06-10 Montage en couche comprenant des composants électrotechniques
EP11725686.7A Withdrawn EP2580794A1 (fr) 2010-06-10 2011-06-07 Structure stratifiée contenant des composants électrotechniques

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP10165581A Withdrawn EP2395572A1 (fr) 2010-06-10 2010-06-10 Montage en couche comprenant des composants électrotechniques

Country Status (7)

Country Link
US (1) US20130140541A1 (fr)
EP (2) EP2395572A1 (fr)
JP (1) JP2013534642A (fr)
KR (1) KR20130119412A (fr)
CN (1) CN103081152A (fr)
TW (1) TW201218371A (fr)
WO (1) WO2011154399A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE537207C2 (sv) * 2012-10-26 2015-03-03 Lunalec Ab Förfarande för framställning av ljusemitterande elektrokemisk cell
TWI509844B (zh) * 2014-09-19 2015-11-21 Unity Opto Technology Co Ltd Applied to the backlight of the LED light-emitting structure
GB2538083A (en) * 2015-05-06 2016-11-09 Cambridge Display Tech Ltd High contrast light emitting device
DE102018131760A1 (de) * 2018-12-11 2020-06-18 Hueck Folien Gmbh Gewölbte Funktionsfolienstruktur und Verfahren zur Herstellung derselben
US11357103B1 (en) * 2020-01-21 2022-06-07 Signetik, LLC System-in-package cellular assembly

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE58909087D1 (de) 1988-12-01 1995-04-13 Bayer Ag Verfahren zur Herstellung tiefgezogener Kunststoff-Formteile.
US5361190A (en) * 1990-02-20 1994-11-01 K. W. Muth Co. Inc. Mirror assembly
US5189549A (en) * 1990-02-26 1993-02-23 Molecular Displays, Inc. Electrochromic, electroluminescent and electrochemiluminescent displays
US5460773A (en) 1993-08-11 1995-10-24 Fritz; Michael L. Seal for blow down platen
US6257866B1 (en) 1996-06-18 2001-07-10 Hy-Tech Forming Systems, Inc. Apparatus for accurately forming plastic sheet
DE19717740C2 (de) 1997-04-26 2001-07-05 Schoenberg & Cerny Gmbh Wien Kunststoff-Formkörper mit integriertem optoelektronischem Leuchtfeld und Verfahren zu seiner Herstellung
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
EP1524708A3 (fr) 1998-12-16 2006-07-26 Battelle Memorial Institute Matière de barrière contre les conditions d'ambiance et son procédé de fabrication
AU2002215385A1 (en) * 2000-10-23 2002-05-06 First Usa Bank, N.A. Plastic card with lep display
US7320845B2 (en) 2002-05-24 2008-01-22 The Intertech Group, Inc. Printed battery
NL1023680C2 (nl) * 2003-06-17 2004-12-20 Tno Sensor met polymeren componenten.
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
US20070163638A1 (en) 2004-02-19 2007-07-19 Nanosolar, Inc. Photovoltaic devices printed from nanostructured particles
US7221359B2 (en) 2004-03-17 2007-05-22 Lear Corporation Illuminated touch switch
WO2006046214A1 (fr) * 2004-10-29 2006-05-04 Koninklijke Philips Electronics N.V. Dispositif à afficheur intégré
US7486280B2 (en) 2005-08-04 2009-02-03 Uniplas Enterprises Pte, Ltd. Contoured capacitive touch control panel
US7808182B2 (en) * 2006-08-01 2010-10-05 Sarnoff Corporation Electron gun and magnetic circuit for an improved THz electromagnetic source
US7989725B2 (en) 2006-10-30 2011-08-02 Ink-Logix, Llc Proximity sensor for a vehicle
US8198979B2 (en) 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
CA2699166C (fr) 2007-09-12 2013-03-12 Victor Rabinovich Antenne dipolaire a meandres imprimes symetriques
DE102007046472B4 (de) 2007-09-28 2013-12-24 Bayer Materialscience Aktiengesellschaft Verfahren zur Herstellung eines tiefgezogenen Folienteils aus Polycarbonat oder aus Polymethylmethacrylat
DE102007059858A1 (de) 2007-12-12 2009-06-18 Bayer Materialscience Ag Energiewandler hergestellt aus filmbildenden wässrigen Polymer-Dispersionen, insbesondere Polyurethan-Dispersionen
CN102227439B (zh) * 2008-10-02 2015-08-19 巴斯夫欧洲公司 络盐
WO2010085180A1 (fr) * 2009-01-21 2010-07-29 Ludvig Edman Cellule et système électrochimique émettant de la lumière, utilisation associée, et procédé de fonctionnement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2011154399A1 *

Also Published As

Publication number Publication date
TW201218371A (en) 2012-05-01
CN103081152A (zh) 2013-05-01
EP2395572A1 (fr) 2011-12-14
KR20130119412A (ko) 2013-10-31
WO2011154399A1 (fr) 2011-12-15
JP2013534642A (ja) 2013-09-05
US20130140541A1 (en) 2013-06-06

Similar Documents

Publication Publication Date Title
DE102008031533B4 (de) Organisches elektronisches Bauelement
EP2580794A1 (fr) Structure stratifiée contenant des composants électrotechniques
WO2008003621A1 (fr) Élément el-hdvf 3d, procédé de fabrication et utilisation
DE102008053326A1 (de) Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung
DE102006054584A1 (de) Ablagemöbel
WO2012163637A1 (fr) Composant électroluminescent organique
WO2013007443A1 (fr) Composants émetteurs de lumière et procédé destiné à la fabrication d'un composant émetteur de lumière
EP3520098B1 (fr) Intégration non destructive de composants électroniques
DE102013106985A1 (de) Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung
WO2017080790A1 (fr) Dispositif à composants électroluminescents organiques, procédé de fabrication d'un dispositif à composants électroluminescents organiques et procédé de fonctionnement d'un dispositif à composants électroluminescents organiques
WO2016146630A1 (fr) Composant optoélectronique et procédé de fabrication d'un composant optoélectronique
WO2017162422A1 (fr) Procédé de fonctionnement d'une diode luminescente organique et feu de recul et feu de freinage combinés
DE102012109138A1 (de) Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelementes und optoelektronische Bauelementevorrichtung
DE102012024599B4 (de) Anordnung mit optisch transparenten und funktionalen Bauelementen
EP2924759B1 (fr) Module d'éclairage et procédé de fabrication d'un module d'éclairage
WO2008083671A1 (fr) Dispositif optoélectronique et procédé de fabrication d'un dispositif optoélectronique
EP1638155A1 (fr) Amélioration de la conductivité d'une électrode en polymère en utilisant une grille sous-jacente de lignes métalliques
DE102019128388B4 (de) Regalsystem zur Ausstellung von Waren, Regalboden für das Regalsystem, Herstellungsverfahren für den Regalboden
DE102019107423B4 (de) Verfahren zur Herstellung einer Sensorvorrichtung, Sensorvorrichtung, Bedienblende und Haushaltsgerät
DE102008039184A1 (de) Verfahren zum Herstellen eines Bedienelements für ein Kraftfahrzeugteil sowie ein Kraftfahrzeugteil mit einem Bedienelement
WO2016124587A1 (fr) Composant électroluminescent organique et dispositif électroluminescent
WO2016146438A1 (fr) Procédé de fabrication d'un composant opto-électronique
EP2043151B1 (fr) Dispositif émettant des rayonnements
DE202010017703U1 (de) Organisches optisches Bauelement, sowie Halbzeug zu seiner Herstellung
DE102010047397A1 (de) Organisches optisches Bauelement, sowie Verfahren und Halbzeug zu seiner Herstellung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130110

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20141117