WO2016124587A1 - Composant électroluminescent organique et dispositif électroluminescent - Google Patents

Composant électroluminescent organique et dispositif électroluminescent Download PDF

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Publication number
WO2016124587A1
WO2016124587A1 PCT/EP2016/052169 EP2016052169W WO2016124587A1 WO 2016124587 A1 WO2016124587 A1 WO 2016124587A1 EP 2016052169 W EP2016052169 W EP 2016052169W WO 2016124587 A1 WO2016124587 A1 WO 2016124587A1
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WO
WIPO (PCT)
Prior art keywords
electronic structure
organic light
encapsulation
electrodes
component according
Prior art date
Application number
PCT/EP2016/052169
Other languages
German (de)
English (en)
Inventor
Michael Popp
Kilian REGAU
Original Assignee
Osram Oled Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled Gmbh filed Critical Osram Oled Gmbh
Publication of WO2016124587A1 publication Critical patent/WO2016124587A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • Light sources are nowadays usually supplied with power via cables. This means that external power supplies supply the light sources with a voltage or an electric current via wired lines.
  • the problem may arise that, for example, in structural changes, the leads must be co-located with great effort when the light position is changed. This can mean a large material and cost, so that lights are often left in a non-optimal position. For example, in a seating change in an event hall, however, this may result in a poor lighting situation.
  • OLED organic light emitting diode
  • Receiver coil is converted directly to one of the electrodes of the OLED in an electric current for operation of the OLED.
  • inductive wireless Energy transfer is in principle the problem of efficiency, which requires the best possible overlap between energy transmitter and receiver.
  • At least one object of certain embodiments is to provide an organic light emitting device having an electronic structure. At least another object of certain embodiments is to provide a light
  • an organic light-emitting component has at least one transparent first electrode and a second electrode, between which an organic functional layer stack is arranged.
  • the organic functional layer stack has at least one organic light-emitting layer in the form of an organic electroluminescent layer, which is set up in the operation of the organic light
  • the organic light-emitting component can in particular as
  • OLED organic light-emitting diode
  • transparent refers to a layer which is permeable to visible light, whereby the transparent layer may be transparent or at least partially light-scattering and / or partially absorbing light, so that a layer designated as transparent, for example, also diffuse or milky
  • emitting element is as low as possible.
  • the organic functional layer stack may comprise layers with organic polymers, organic oligomers, organic monomers, organic small non-polymeric molecules ("small molecules") or combinations thereof
  • the organic functional layer stack may be in addition to the at least one organic light emitting layer
  • Charge carrier injection layers Charge carrier transport layers and / or
  • the organic light-emitting component has a substrate on which the transparent first electrode, above the organic
  • the substrate may for example comprise one or more materials in the form of a layer, a plate, a foil or a laminate, which are selected from glass, quartz, plastic, ceramic, silicon. Particularly preferably, the substrate glass and / or plastic, for example in the form of a glass layer, glass sheet,
  • Plastic plate or a glass-plastic laminate on or off it.
  • the substrate for example, in the case of plastic as the substrate material, one or more barrier layers have, with which the plastic material is sealed.
  • the organic light-emitting component has an encapsulation.
  • the encapsulation may in particular be arranged above the electrodes and the organic functional layer stack and is intended and arranged for this purpose
  • the encapsulation has an electronic structure. In other words, that is
  • the Electronic structure integrated into the encapsulation.
  • the Electronic structure is intended and arranged to receive electromagnetic energy.
  • Electromagnetic energy can be provided in particular by an electromagnetic field, the
  • the electronic structure can convert the received electromagnetic energy into an electrical current and / or an electrical voltage.
  • electromagnetic energy can be generated are applied to the electrodes, whereby the organic light-emitting device can be operated.
  • the electronic structure may be directly connected to at least one or both of the electrodes. That can
  • the electronic structure has at least one supply line, for example in the form of a conductor track, which is in direct contact with at least one of the electrodes.
  • an electrode connection piece is present, which in turn is in electrical contact with the electronic structure.
  • the electrodes and, if present, the electrode connection pieces may be designed in such a way that the organic light-emitting component is free of electrical connection possibilities protruding from the encapsulation.
  • the encapsulation has a cover element and / or a thin-film encapsulation.
  • the cover element which is arranged above the electrodes and the organic functional layer stack seen from the substrate, has at least one layer and / or plate which may comprise or consist of one or more of the following materials: glass, quartz, Plastic, ceramic, silicon, metal.
  • the cover element can in particular be as tight as possible against harmful substances from the environment such as moisture and / or oxygen.
  • the electronic structure may in particular be arranged at least partially in and / or on a side of the cover element facing the organic functional layer stack.
  • the cover element in contrast to a thin-film encapsulation, may be applied over the electrodes and the organic functional layer before application
  • Layer stacks are prepared and provided, while the thin-film encapsulation is produced by the deposition on the electrodes and the organic functional layer stack.
  • the encapsulation has a connection material with which the cover element is fastened to the substrate.
  • the connecting material can be
  • Connecting material have a closed annular structure, within which in a plan view of the
  • the electrodes and the organic functional layer stack are arranged.
  • the connecting material can be arranged completely directly on the substrate.
  • Connecting material can thus form a closed cavity in which the electrodes and the organic functional layer stack are arranged.
  • the connecting material may be formed in one or more layers and, for example, comprise or consist of one or more of the following materials: adhesive, glass solder, metallic solder.
  • the connecting material at least partially by a contact element, for example with or from a metallic solder or other metal material or an electrically conductive adhesive such as an anisotropically electrically conductive adhesive to
  • Thin-film encapsulation comprises or consists of one or more thin layers, which, for example, by means of a Atom fürabscheide Kunststoffs or a
  • Suitable materials for the layers of the thin-film encapsulation are, for example, aluminum oxide, zinc oxide, zirconium oxide,
  • the thin-film encapsulation preferably has a layer sequence with a plurality of the thin layers, each having a thickness between one atomic layer and 10 nm, wherein the Borders are included.
  • the thin-film encapsulation may comprise at least one or a plurality of further layers, ie in particular barrier layers and / or
  • Materials for this may be the aforementioned materials as well as silicon nitride, silicon oxide, silicon oxynitride,
  • the one or more further layers may each have a thickness between 1 nm and 5 ym and preferably between 1 nm and 400 nm, the limits being included.
  • the conductive layer 31 may, for example, comprise or consist of one or more of the following materials: AgPd, AgPt, Ag, Al, Au, Pt, Cr / Al / Cr.
  • the conductive layer may be formed at least partially in the form of a coil. Furthermore, the conductive layer may be at least partially formed as a conductor track and / or as an electrical feedthrough. Furthermore, it may be possible that the
  • Electronic structure at least one electrical and / or electronic component such as an electrical resistance element, a capacitor, a diode, a
  • Inductance or a plurality or a combination thereof.
  • Such electrical and electronic components in conjunction with a coil for example, as Receiving antenna for an electromagnetic field with
  • Electromagnetic field can be converted into a DC or DC voltage with which the organic light-emitting device can be operated.
  • the encapsulation has a cover element, at least one element of the electronic structure, that is, at least one conductive layer, for example, to form a coil, a conductor track and / or an electrical
  • a diode and / or a capacitor in and / or on a the organic functional layer stack facing side of the cover member may be arranged. Furthermore, conductive layers and / or further electrical and / or electronic components may be disposed on the cover element in a multilayer structure on an organic surface
  • the electronic structure can be produced on the cover element or together with the cover element, for example in thin-film and / or thick-film technology.
  • Electronic structure can be in a matrix material like
  • cover element materials embedded For example, be glass, ceramic or another of the above mentioned for the cover element materials embedded.
  • the electronic structure can be integrated, for example in the form of a ceramic multilayer component, on and / or at least partially in the cover element.
  • the cover element can thus be part of the ceramic
  • the encapsulation has a thin-film encapsulation, this can at least partially between the
  • Electronic structure and arranged on the organic functional layer stack second electrode may be arranged.
  • that can mean that
  • Thin-film encapsulation included.
  • the thin-film encapsulation can be at least one
  • Encapsulation layer which is free of elements of the electronic structure and between the
  • Electronic structure and arranged on the organic functional layer stack second electrode is arranged.
  • the electronic structure may also be possible for the electronic structure to have at least one conductive layer in the form of an electrical feed through which
  • Electrode ranges, so that these directly with the
  • Electronic structure is electrically connected. According to another embodiment is between the
  • the contact element for example, a
  • Metal in particular a metallic solder, have.
  • the contact element may, for example, also comprise an electrically conductive adhesive, such as an anisotropically electrically conductive adhesive.
  • an electrically conductive adhesive such as an anisotropically electrically conductive adhesive.
  • Electrode connector are produced. Furthermore, both electrodes by means of contact elements with the
  • Contact element is arranged for electrical connection. Alternatively, it may also be possible for the
  • an electrically conductive leadthrough which may be formed by at least one conductive layer of the electronic structure, which is in direct contact with at least one of the electrodes.
  • Such a direct connection may also be possible in the case of an encapsulation, which is a cover element with an at least partially applied therein and / or thereto
  • a light-emitting device comprises an organic light
  • the emitting device at least one energy transmitter, which transmits energy via an inductive coupling during operation to the electronic structure of the at least one organic light emitting device.
  • the energy transmitter which is provided separately from the organic light-emitting component, may for example comprise at least one or more coils which are arranged next to and / or above one another.
  • the energy transmitter can also have a matrix of independently controllable cells, by means of which local energy can be transmitted. Each of the cells may thus comprise at least one or a plurality of coils.
  • the energy transmitter can be an independent component or even a part of a wall, a floor or a ceiling of an object or room.
  • Drywall through conduits with appropriate lines and / or insulated cables.
  • appropriate Induction loops can also be applied later, for example, surface-mounted, in drywall or on specially designed surfaces, especially in the form of films that may need to be laid anyway
  • vapor barriers or screed barriers For example, vapor barriers or screed barriers.
  • the light-emitting device may also include a plurality of organic light-emitting devices
  • Components that may be the same or different, and / or have a plurality of energy transmitters.
  • an energy transmitter it is also possible to operate a plurality of organic light-emitting components.
  • the at least one organic light-emitting component is by means of a
  • the attachment of the at least one organic light-emitting component to the energy transmitter can take place by means of a detachable connection, so that the organic-light-emitting component can be mounted on the energy transmitter
  • Energy transmitter can be added if necessary.
  • Fixing means one or more selected from the following group: adhesive layer, Velcro connection,
  • a double-sided adhesive tape can be used, which can also be used several times, so that the organic light emitting device at
  • Energy transmitter can be attached and / or more
  • the at least one organic light emitting diode can be replaced with each other. The same may apply to the other fasteners mentioned.
  • the at least one organic light emitting diode can be replaced with each other. The same may apply to the other fasteners mentioned.
  • the at least one organic light emitting diode can be replaced with each other. The same may apply to the other fasteners mentioned.
  • the at least one organic light emitting diode can be replaced with each other. The same may apply to the other fasteners mentioned.
  • Component be attached to the encapsulation side of the energy transmitter so that the substrate is facing away from the energy transmitter and thereby light can be radiated into the environment during operation of the organic light-emitting device, while the electronic structure is arranged as close to the energy transmitter.
  • the organic light-emitting component described here it is possible to provide electrical and electronic components of the thin-film and thick-film electronics as well as the
  • Encapsulate encapsulation especially in the form of so-called “embedded systems” or “embedded passive”. This includes components that are used in tantalum technology as well as in
  • a vertically integrated coil can be integrated directly into the encapsulation so that it lies as close as possible to the energy transmitter.
  • Thick-film electronics apply the electronic structure over a large area, in particular in the case of organic light-emitting components designed as surface light sources,
  • capacitors with a large capacity For example, capacitors with a large capacity.
  • Feedthroughs can be interconnected.
  • Electromagnetic alternating field can thus radiate arbitrarily designed, variable area light sources a defined defined homogeneous or inhomogeneous light and thereby static and / or dynamic as needed
  • the organic light-emitting component or the light-emitting device described here can be integrated into walls, ceilings, floors of objects and / or rooms.
  • the Conduction-free energy supply can provide optimal spatial placement of the at least one organic light
  • any forms of at least one organic light-emitting device can be an efficient wireless power transmission, especially compared to previously known wireless
  • an efficiency of up to 97% in the range up to a power of 10 kW can be achieved in the automotive industry.
  • Range an efficiency of 95% can be achieved in the automotive industry.
  • Component can be used in areas where no electrical wiring may be laid, for example underwater lights.
  • the discretization can be chosen so small that it is imperceptible to the human eye
  • Compilation may be a subsequent change of a
  • FIGS. 1A to IC are schematic representations of organic
  • Figure 2 is a schematic representation of an organic light-emitting device according to a
  • FIG. 3 shows a schematic representation of an organic light-emitting component according to a further exemplary embodiment
  • FIGS. 4A to 4C are schematic representations of
  • FIG. 5 to 7 are schematic representations of organic
  • Light emitting devices according to further embodiments, 8 shows a schematic illustration of a light-emitting device according to a further exemplary embodiment
  • FIGS. 9A to 9C are schematic representations of
  • identical, identical or identically acting elements can each be provided with the same reference numerals.
  • the illustrated elements and their proportions with each other are not to be regarded as true to scale, but individual elements, such as layers, components, components and areas, for better representation and / or better understanding may be exaggerated.
  • FIGS. 1A to 1C Examples of the basic structure of an organic light emitting device 100 are shown in FIGS. 1A to 1C.
  • the organic light-emitting components 100 described below are in particular as
  • OLED organic light emitting diodes
  • the organic light-emitting component 100 which may also be referred to below as OLED 100, has a substrate 1 on which
  • an organic functional layer stack 3 is arranged with at least one organic light-emitting layer. At least one of the electrodes 2, 4 is transparent, so that in
  • Layer stack 3 generated light can be irradiated through the at least one transparent electrode.
  • the substrate 1 In particular, in the example shown, the substrate 1
  • the substrate 1 transparent, such as in the form of a glass plate or glass layer.
  • the substrate 1 is transparent, such as in the form of a glass plate or glass layer.
  • Substrate 1 for example, a ceramic material or be it.
  • the substrate 1 may be one or more as further described below
  • Dünnfilmverkapselung 27 described encapsulation layers for encapsulation or sealing of the
  • the electrode 2 applied to the substrate 1 is likewise transparent and may, for example, be a
  • TCO Transparent conductive oxides
  • transparent, conductive materials typically metal oxides, such as zinc oxide, tin oxide, aluminum tin oxide, cadmium oxide, titanium oxide, indium oxide and indium tin oxide (ITO).
  • metal oxides such as zinc oxide, tin oxide, aluminum tin oxide, cadmium oxide, titanium oxide, indium oxide and indium tin oxide (ITO).
  • binary metal oxygen compounds such as ZnO, Sn02 or ⁇ 2 ⁇ 3
  • binary metal oxygen compounds such as ZnO, Sn02 or ⁇ 2 ⁇ 3
  • Metal oxygen compounds for example Zn 2 SnO 4, CdSnO 3, ZnSnO3, Mglri204, GalnO3, Zn2In20s or In4Sri30i2, or mixtures of different transparent conductive oxides to the group of TCOs.
  • the TCOs do not necessarily correspond to a stoichiometric composition and may also be p- or n-doped.
  • a transparent electrode for example, a transparent metal, metallic network structures or conductive
  • Networks for example with or made of silver, and / or
  • the further electrode 4 on the organic functional layer stack 3 may be reflective and comprise a metal, which may be selected from aluminum,
  • the electrode 4 may comprise Ag, Al, Cu or alloys or layer stacks with these,
  • the electrode 4 may also be an above-mentioned TCO material or a
  • Layer stack with at least one TCO and at least one metal with at least one TCO and at least one metal.
  • the OLED 100 is due to the transparent substrate 1 and the transparent lower electrode 2 designed as a so-called bottom emitter and can emit light during operation through the transparent electrode 2 and the transparent substrate 1, so that the organic functional
  • Layer stack 3 facing away from the surface of the substrate 1 forms a light output surface.
  • the lower electrode 2 may be formed as an anode, while the upper electrode 4 may be formed as a cathode. With appropriate choice of material but also in terms of polarity reversed construction is possible.
  • electrode connecting pieces 5 are provided, which in the examples of FIGS. 1A to 1C extend from the electrodes 2, 4 under the encapsulation 20 described below.
  • the electrode connection pieces 5 designed as electrical contact leads can be made transparent or non-transparent and, for example, have or consist of a TCO and / or a metal.
  • the electrode terminal pieces 5 may be formed by a metal layer or a metal layer stack, such as Mo / Al / Mo, Cr / Al / Cr, Ag / Mg or Al or Cu.
  • the organic functional layer stack 3 may comprise, in addition to the at least one organic light-emitting layer, further organic layers, for example one or more selected from a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, a
  • Electron transport layer, an electron injection layer and a charge generation layer (CGL), which are suitable holes or
  • Layer stack 3 may be organic polymers, organic
  • the organic functional layer stack 3 has a functional layer, which is designed as a hole transport layer, in order to allow an effective hole injection into the organic light-emitting layer.
  • a hole transport layer may be
  • tertiary amines, carbazole derivatives, conductive polyaniline or polyethylenedioxythiophene prove to be advantageous.
  • Suitable materials for the light-emitting layer are electroluminescent materials which have a radiation emission due to fluorescence or
  • Isolator 6 may be present, for example with or made of polyimide, for example, the electrodes 2, 4th
  • Embodiment of the individual layers of the OLED 100 also insulator layers 6 may not be necessary and may not be present, such as appropriate
  • an encapsulation 20 for protecting the organic functional layer stack 3 and the electrodes 2, 4
  • Electrodes 2, 4 arranged.
  • the encapsulation 20 has a thin-film encapsulation 27 in the case of the example shown in FIG. 1A.
  • the thin-film encapsulation 27 is designed so that it can be penetrated by atmospheric substances at most to very small proportions.
  • Substantially produced by one or more as thin layers executed barrier layers and / or passivation layers that are part of the Dünnfilmverkapselung 27.
  • Layers of the thin-film encapsulation 27 generally have a thickness of less than or equal to a few 100 nm.
  • the thin-film encapsulation 27 may comprise or consist of one or more thin layers which are responsible for the barrier effect of the encapsulation 20
  • the thin layers can be any material.
  • ALD atomic layer deposition
  • Suitable materials for the layers of the encapsulation arrangement may be
  • alumina for example, alumina, zinc oxide, zirconia,
  • the thin-film encapsulation 27 preferably has a
  • Layer sequence with a plurality of thin layers, each having a thickness between one atomic layer and several 100 nm.
  • the thin-film encapsulation 27 at least one or a plurality of further layers, ie in particular barrier layers and / or
  • PECVD PECVD
  • Materials for this may be the aforementioned materials as well as silicon nitride, silicon oxide, silicon oxynitride,
  • Alumina and mixtures and alloys of said materials are Alumina and mixtures and alloys of said materials.
  • the one or more others are others.
  • layers may each have a thickness between 1 nm and 5 ym, and preferably between 1 nm and 400 nm, with the limits included.
  • the encapsulation 20 can be seen from the substrate 1 on the thin-film encapsulation 27, as shown in FIG. 1A, glued to it by means of an adhesive layer 28
  • Cover element 29 have.
  • the cover element 29 can be any material
  • a metal for example, by a glass layer or glass plate or by a plastic, a metal, a ceramic such as a high-temperature cofired ceramic (HTCC: "high-temperature cofired ceramics”) or a low-temperature cofired ceramics (LTCC: "low-temperature cofired ceramics”) or a combination or a laminate of said HTCC: "high-temperature cofired ceramics" or a low-temperature cofired ceramics (LTCC: "low-temperature cofired ceramics”) or a combination or a laminate of said
  • HTCC high-temperature cofired ceramic
  • LTCC low-temperature cofired ceramics
  • a protective lacquer for example in the form of a spray paint, may also be provided on the thin-film encapsulation 27.
  • the electrodes 2, 4 are preferably large area and
  • Device 100 may be formed over a large area, so that the organic light emitting device 100 as
  • Surface light source may be formed, preferably having an area greater than or equal to a few square millimeters, preferably greater than or equal to one square centimeter and more preferably greater than or equal to one square decimeter.
  • at least one of the electrodes 2, 4 of the organic light-emitting component 100 is structured, whereby a spatially and / or temporally structured
  • FIG. 1B shows a further example of an organic light-emitting component 100 that, as an encapsulation 20 instead of a thin-film encapsulation, uses a component as compared to the component shown in FIG.
  • the cover element 22 may be formed like the cover element 29 described above and be formed for example by a glass layer or glass plate or another of the aforementioned materials.
  • the cover element 22 can For this purpose, for example, a depression over the electrodes 2, 4 and the organic functional
  • the connecting material 21 may be formed, for example, by an adhesive, with which the cover element 22 is fastened on the substrate 1. Furthermore, that can be
  • the connecting material 21 is in particular in one
  • contiguous circumferential area around the organic functional layer stack 3 may be arranged.
  • Encapsulation 20 is formed by a combination of the encapsulations shown in FIGS. 1A and 1B and thus has a thin-film encapsulation 27, above which a cover element 22 arranged by means of a connecting material 21
  • the cover element 22 may be spaced apart from the thin-film encapsulation 27, as shown in FIG. Furthermore, it may also be possible for the cover element 22 to rest on the thin-film encapsulation 27.
  • emissive devices for example with regard to the structure, the layer composition and the materials of the organic functional layer stack, the electrodes and the encapsulation is referred to the document WO
  • FIG. 1A to IC shown organic light emitting devices is hereby expressly incorporated by reference.
  • the exemplary embodiments shown below each have an organic light-emitting component 100 which, in principle, has the structure shown in FIGS.
  • FIG. 2 shows an exemplary embodiment of an organic light-emitting component 100 which has a transparent first electrode 2 on a transparent substrate 1, an organic functional layer stack 3 thereon, and a second electrode 4.
  • a transparent first electrode 2 on a transparent substrate 1
  • an organic functional layer stack 3 thereon
  • a second electrode 4 can be used as described in connection with FIGS. 1A to 1C
  • the organic light-emitting component 100 has an encapsulation 20, which over the electrodes 2, 4 and the organic
  • Encapsulation 20 an electronic structure 30 is integrated, for receiving electromagnetic energy and for
  • Electronic structure 30 is electrically conductive with the
  • Electrodes 2, 4 connected.
  • the encapsulation 20 has a means of a
  • Cover element 22 which may be formed as described in connection with the previous figures.
  • the cover element 22 may be formed as a layered plate and, for example, comprise or be a glass, such as a glass sheet, or a ceramic material.
  • the electronic structure 30 is arranged on the organic functional layer stack 3 facing side of the cover member 22, ie within the cavity formed by the substrate 1, the cover member 22 and the connecting material 21, the electronic structure 30 is arranged.
  • This has at least one conductive layer 31 which is formed at least partially in the form of a coil.
  • the electronic structure 30 has electrical passages ("vias") formed by the conductive layer 31, which extend as far as a side of the electronic structure 30 facing the substrate 1, so that the electronic structure differs from that of FIG.
  • Substrate side is electrically contacted.
  • the conductive layer 31 may, for example, comprise or consist of one or more of the following materials: AgPd, AgPt, Ag, Al, Au, Pt, Cr / Al / Cr.
  • the conductive layer 31 is embedded in a matrix material 32.
  • Matrix material 32 may be the same or different material compared to cover element 22.
  • the matrix material 32 comprise or be a ceramic material.
  • the conductive layer 31 may, for example, a printed and / or burned conductive paste
  • a matrix material 32 formed by glass and / or ceramic formed by glass and / or ceramic.
  • the encapsulation 20 can, as also described below in connection with Figures 4A to 4C, separately from the substrate 1 with the electrodes 2, 4 and arranged thereon
  • organic functional layer stack 3 are produced.
  • contact elements 51 which comprise a metal.
  • the contact elements 51 may comprise a metallic solder and be embodied, for example, as so-called “solder bumps.”
  • the contact elements 51 are applied in particular to the electrode connection pieces 5 and thus bridge the gap between those arranged on the substrate 1 Electrode terminals 5 and arranged on the cover element 22 electronic structure 30th
  • the electrode connection pieces 5 therefore do not have to protrude out of the encapsulation 20 and are
  • Encapsulation 20 and the substrate 1 formed cavity arranged.
  • organic light-emitting component 100 can thus be dispensed with a wired electrical contact, so that the device 100 free from outstanding from the encapsulation 20 electrical
  • the electronic structure 30 is integrated in the encapsulation 20 and, in particular, that the coil formed by the conductive layer 31 is placed directly adjacent to the cover layer 22, it can be replaced by the
  • Electronic structure 30 are arranged receiver very close to a transmitter, which emits an electromagnetic alternating field for energy transmission. This can be a high efficiency in terms of energy transfer can be achieved.
  • the conductive layer 31, and thus the part of the electronic structure 30 which is essential for the reception of the electromagnetic energy, can be separated from that passing through the organic functional layer stack 3
  • FIG. 3 shows a further exemplary embodiment of an organic light-emitting component 100 which, in comparison with the previous exemplary embodiment, has a
  • Electronic structure 30 includes, purely by way of example, an integrated rectifier circuit in the form of a single-ended blocking circuit.
  • the electronic structure 30 has a plurality of layers with the matrix material 32, in which conductive layers 31 for energy transmission in the form of conductor tracks, electrical feedthroughs and a coil are arranged. Compared to the previous one
  • a part of the conductive layer 31 and thus a part of the electronic structure 30 in the cover member 22 is arranged. Furthermore, the electronic structure 30, a rectifier diode 33, for example, by
  • Vaporizing can be made and which may be formed by a silicon diode with a reverse voltage of 0.7 volts.
  • a thin-film capacitor 34 is
  • diodes and capacitors may be integrated as singular components in the electronic structure 30 in a simple manner.
  • the entire electronics of the electronic structure 30 may be encapsulated in the encapsulation 20 and thereby protected by the encapsulation 20. Furthermore, in principle, the luminous area, that is corresponding to the organic functional
  • Electronic structure 30 formed receiving part is arranged above these layers. This can be done especially in the
  • FIGS. 4A to 4C show method steps for
  • the substrate 1 with the electrodes 2, 4, the organic functional layer stack 3 and the electrode terminals 5 can be manufactured separately from the electronic structure 30 and
  • a thin-film encapsulation 27 is additionally arranged above the electrodes 2, 4 and the organic functional layer stack, as a result of which the underlying layers can be protected in the further course of the production of the organic light-emitting component 100.
  • other manufacturing techniques such as high temperature processes are possible without compromising their compatibility with respect to the remaining layers of the organic light
  • the connecting material 21 may comprise, for example, a glass solder in the form of glass frits, an adhesive or a metal.
  • Electronic structure 30 can be arranged in a kind of flip-chip process, the electrical contacting of the
  • Electronics structure 30 to the electrodes 2, 4 take place.
  • the electronic structure 30 is thus encapsulated by an encapsulated
  • FIG. 5 shows a further exemplary embodiment of an organic light-emitting component 100, in which, compared to the previous exemplary embodiments, an electrical coupling of the electronic structure 30 takes place at least to the second electrode 4 without the use of a contact element 51. For this, the electronic structure 30 is located
  • the conductive layer 31 can even in the second
  • an electrical contact to the first electrode 2 can be produced at any point by a suitably electrically insulated contact element 51 or alternatively to the illustration shown by a correspondingly formed conductive layer 31. This allows the illuminated area practically until the
  • Connecting material 21 are sufficient, whereby a quasi edge-free light area can be achieved.
  • a quasi edge-free light area can be achieved.
  • Circuits of the electronic structure 30 may also each have a different layout.
  • FIG. 6 shows a further exemplary embodiment of an organic light-emitting component 100 that has an encapsulation 20 that contains a thin-film encapsulation 27 compared to the previous exemplary embodiments in which the electronic structure 30 partially
  • the conductive layer 31 further extends through the thin film encapsulant 27 to the
  • Electrode terminals 5 so that the electronic structure 30 directly with the electrode connection pieces. 5
  • Adhesive layer 28 applied cover member 29 may be formed as described in connection with Figure 1A and does not contribute to an encapsulation effect of the encapsulation 20, but may merely represent a mechanical protection.
  • the adhesive layer 28 and the cover element 29 may also be absent or replaced by a lacquer layer, for example.
  • the conductive layer 31 as well as the thin-film encapsulation 27 can be vapor-deposited, so that there are only slight changes in the process sequence compared to a pure thin-film encapsulation without an electronic structure 30.
  • FIG. 7 shows a further exemplary embodiment of an organic light-emitting component 100 which, in comparison with the exemplary embodiments of FIGS. 2 to 6, has a connecting material 21 for fastening the cover element
  • lateral sealing of the organic light-emitting Component 100 are at least partially formed by a metal of the contact elements 51, which also serves as a current conductor.
  • a metal of the contact elements 51 which also serves as a current conductor.
  • an electrically conductive adhesive such as an anisotropically electroconductive adhesive.
  • FIG. 8 shows an exemplary embodiment of a light
  • the emitting device 1000 shown purely by way of example, an organic light-emitting device 100 according to the embodiment of Figure 7.
  • the light-emitting device 1000 may include any of the other organic light-emitting devices 100 shown in FIGS. 2 to 6.
  • the light-emitting device 1000 further comprises an energy transmitter 200, which is provided and configured to use energy via an inductive coupling during operation.
  • the energy transmitter 200 has a coil, which are formed by conductor tracks 201.
  • This may be, for example, printed or baked conductive pastes on a support 202, which may comprise, for example, glass and / or a ceramic material.
  • the energy transmitter 200 In operation of the light emitting device 1000, the energy transmitter 200 generates an electromagnetic field by means of the coil formed by the tracks 201, which is received by the electronic structure 30 of the organic light emitting device 100 and converted into an electric current there. By doing that through the conductive layer 31 formed coil of the electronic structure 30 is integrated into the encapsulation 20 and thus in
  • the carrier 202 with the conductor tracks 201 can, as shown in FIG. 8, be arranged between two covers 203, for example fabric films. Furthermore, the
  • Covers 203 for example, be parts of a wall, a ceiling or a floor of an object or a room in which the energy transmitter 200 is integrated or part of which it is.
  • the organic light emitting device 100 is attached to the energy transmitter 200 with a fastener 300.
  • this can be a detachable
  • an adhesive layer is suitable as
  • the fastening means 300 may also have a mechanical support, which is formed for example by one or more screws or clamps for screwing or clamping, for example on a grid.
  • a fastener 300 also has a mechanical support, which is formed for example by one or more screws or clamps for screwing or clamping, for example on a grid.
  • the emitting device 100 and the energy transmitter 200 are achieved with a small distance between them.
  • a defined light image can be used regardless of the design and the
  • Homogeneity of the luminous surface can be achieved, in particular also independent of a contact.
  • a defined discretization of a luminous area in the form of a plurality of organic light-emitting components is possible, as shown in connection with FIGS. 10A to 11F.
  • fewer contact edges and narrower and smaller lighting surfaces are possible.
  • FIG. 9A shows an energy transmitter 200 which, like the energy transmitter 200 of the embodiment of FIG. 8, is formed by a cell 210, but which has a multilayer structure with a plurality of carriers 202 on which coil-forming conductor tracks 201 are applied.
  • the cover 203 for example, plastic sheets such as construction sheets can be used.
  • the individual layers of the energy transmitter 200 can be formed, for example, by copper on flex-printed conductors.
  • Embodiment of Figure 9A may also be more or fewer such layers may be present, for example, two layers or four or more layers.
  • the energy transmitter 200 in the exemplary embodiment of FIG. 9B has, in addition to a plurality of layers which are vertical
  • Each cell 210 has its own coils, by means of which a locally
  • Electromagnetic alternating field can be generated.
  • the energy transmitters 200 shown may, in addition to the already described embodiments, have flexible carriers 202, for example with or made of polyvinyl chloride (PVC),
  • PET Polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PI polyimide
  • glass sheet or be thereof.
  • films with different thicknesses can be used, for example as used in the construction sector, for example in the form of screed films,
  • the size of the carrier 202 can be up to several meters. For example
  • rigid carriers can also be used as carrier 202, for example with or made of glass,
  • Ceramics, composites, metals, plastics and / or printed circuit boards are possible.
  • multi-layer support with electrical feedthroughs as level connections are possible.
  • the carrier 202 with the conductor tracks 201 may be mechanically applied, for example, in ceiling systems or in drywall or in-wall construction.
  • the conductor tracks 201 can, for example, by means of
  • PVD Gas phase deposition
  • printing methods such as screen printing, flexographic printing, planographic printing or gravure printing are possible.
  • conductor strip films are also in multilayer systems or glass solders as well as materials such as organic
  • PEDOT PEDOT: poly-3, 4-ethylenedioxythiophene, PSS: polystyrene sulfonate
  • PEDOT poly-3, 4-ethylenedioxythiophene
  • PSS polystyrene sulfonate
  • polyaniline conceivable.
  • FIG. 9C shows a further exemplary embodiment of an energy transmitter 200 in a plan view, which has a plurality of cells 210.
  • the cells 210 may be formed as described in connection with FIG. 9B.
  • each cell 210 may be connected to a control electronics 205. In this case, each cell 210 can be controlled individually.
  • the cells 210 each occupy an area of 60 cm x 60 cm, so that the energy transmitter 200 shown can essentially have an area of 120 cm ⁇ 300 cm. If strip conductors with a width of 2 mm and a spacing of 0.1 mm are used for the lines 204, then a space of 4.2 mm is necessary for one outward and return line per cell 210. With these geometries 14 ⁇ 60 cm long webs are possible for a one-sided connection. In a one-sided
  • Connection is still possible in a single-layer power line, a about 8.4 m long track, with a two-sided connection corresponding to 16.8 m.
  • An increase can be achieved by multilayer insulated current paths or a
  • FIGS. 10A and 10B show further embodiments of light emitting devices 1000.
  • the light-emitting devices 1000 are each shown in a plan view, wherein the light-emitting Components 100 for better representability in addition to the
  • Energy transmitters 200 are arranged. However, as illustrated by the arrows, the organic light emitting devices 100 are above the energy transmitters 200 as in connection with the previous embodiments
  • FIGS. 10A and 10B show different configurations, in particular
  • Components 100 can also be individually switched so that the organic light-emitting components 100 can be individually switchable.
  • Such an individual circuit can, for example, via a controller with
  • the organic light-emitting components 100 each form discrete luminous surfaces, in particular in the form of pixels or subpixels. These can also be used in any defined subunits
  • organic light emitting devices 100 may be possible. Ideally, the cells 210 and the organic light emitting devices 100 are directly superimposed in cross-section 1: 1 with respect to the transmitter and receiver coils to provide minimum energy loss and maximum
  • each formed as a pixel device 100 can be individually controlled inductive. This can be an optimized
  • Energy transfer can be achieved by resizing transmitter and receiver units in the micrometer to meter range. Furthermore, an exact electromagnetic
  • individual light sources in the form of the organic light emitting devices 100 may be made so small that they are imperceptible to the human eye, for example in the range of several 10 micrometers.
  • an individual configuration of light sources may be possible.
  • the configurations shown result in the least alternating field losses with the best Spulenüberlapp and the shortest distance. Since the entire surface of the energy transmitter 200 does not have to be covered with organic light emitting components 100, investment costs can be kept low. Furthermore, an easy replacement of individual or even all organic light-emitting components 100 is possible, for example in the event of failure of one or more components 100.
  • FIGS. 11A to 11F show further exemplary embodiments of energy transmitter 200 and light-emitting devices 1000.
  • the energy transmitter 200 is assumed to be a ceiling grid with a cell size of 60 cm ⁇ 60 cm for the individual cells 210. Alternatively, these are However, cell sizes in the range of 50 microns to a few centimeters or larger possible.
  • the ceiling grid thus dictates the size of the inductive cells 210. Is, as shown in Figure IIA, no organic light
  • FIG. IIB shows a light-emitting device 1000 in which an organic light-emitting component 100 designed as a surface light source is partially mounted on the energy transmitter 200 and covers only a few cells 210. Energy dissipation occurs only through the cells 210 covered by the organic light emitting device 100 while the other cells 210 remain inactive.
  • Edge area are arranged. Again, only the cells 210 covered by the organic light emitting devices 100 are used to emit electromagnetic energy while the uncovered cells 210 remain inactive. This is when using a same one
  • Components 100 are arranged.
  • the organic light-emitting components 100 can be strung together, for example, borderless and it can be an adaptation of the lighting to the use of space, for example done in a changing seating.
  • the organic light emitting devices 100 are thus on the
  • Energy transmitter 200 freely displaceable without additional cables.
  • the energy transmitter 200 can be installed, for example, as part of a ceiling in foils and flush-mounted and so not be visible.
  • organic light-emitting devices 100 with
  • Magnitude range of several 10 microns to be built up in one meter range Magnitude range of several 10 microns to be built up in one meter range.
  • the organic light emitting devices 100 need not be in shape and size with the cells 210 of the
  • Embodiment of Figure 11 to be freely displaceable on the energy transmitter 200.
  • luminous surfaces can be achieved by a completely free design with or without discretization

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un composant électroluminescent organique (100) qui possède un substrat transparent (1), sur lequel sont disposés une première électrode transparente (2), au-dessus de celle-ci un empilement de couches fonctionnelles organiques (3) comprenant au moins une couche électroluminescente organique et, au-dessus, une deuxième électrode (4), et un encapsulage (20) au-dessus des électrodes (2, 4) et de l'empilement de couches fonctionnelles organiques (3), dans lequel est intégrée une structure électronique (30) destinée à la réception d'énergie électromagnétique. La structure électronique (30) est reliée électriquement aux électrodes (2, 4). L'invention concerne en outre un dispositif électroluminescent (1000) comprenant au moins un composant électroluminescent organique (100) et un émetteur d'énergie (200).
PCT/EP2016/052169 2015-02-03 2016-02-02 Composant électroluminescent organique et dispositif électroluminescent WO2016124587A1 (fr)

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DE102017113924A1 (de) * 2017-06-23 2018-12-27 Osram Oled Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement

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WO2012020342A2 (fr) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. Dispositif électroluminescent étanche aux gaz

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