EP2577757A1 - Composant multicouche piézoélectrique et procédé pour former une électrode extérieure sur un composant multicouche piézoélectrique - Google Patents

Composant multicouche piézoélectrique et procédé pour former une électrode extérieure sur un composant multicouche piézoélectrique

Info

Publication number
EP2577757A1
EP2577757A1 EP11723469.0A EP11723469A EP2577757A1 EP 2577757 A1 EP2577757 A1 EP 2577757A1 EP 11723469 A EP11723469 A EP 11723469A EP 2577757 A1 EP2577757 A1 EP 2577757A1
Authority
EP
European Patent Office
Prior art keywords
region
outer electrode
stack
multilayer component
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11723469.0A
Other languages
German (de)
English (en)
Inventor
Peter Gerletz
Georg KÜGERL
Michael Stahl
Andreas Stani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2577757A1 publication Critical patent/EP2577757A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Definitions

  • For electrical contacting of the electrode layers can at the
  • Such multilayer components can be embodied, for example, as piezo actuators and are used, for example, for actuating an injection valve in a motor vehicle.
  • WO 0191199 A1 discloses a piezoelectric multilayer component with a stack attached to the stack
  • the multilayer component has at least one outer electrode.
  • the device has at least a second one
  • the outer electrodes can be arranged, for example, on different side surfaces of the building element.
  • the electrode layers may be, for example, in
  • Stacking direction alternately up to one of the outer be guided and electrically connected to this electrode and be set back relative to the second outer electrode in the stack electrodes. In this way, the electrode ⁇ layers along the stacking direction can be alternately contacted by means of one of the outer electrodes electrically.
  • the outer electrode has a first and a second
  • the second area constitutes an extension of the first one
  • the first and the second region are integrally formed, wherein, for example, the first region and the second region comprise the same material.
  • a Grundmetallisie ⁇ tion can be applied, which has, for example, materials such as silver-palladium or copper, and in which the
  • the first portion of the outer electrode is at the stack, preferably ⁇ example at the base metallization, for example by means of a solder material or a conductive adhesive secured.
  • the outer electrode is at least partially press-deformed in the second region. Press-deformation of the second region of the outer electrode may be by crimping, but possibly also by another
  • plastic forming process can be generated.
  • a dimensionally stable deformation of the outer electrode can be achieved.
  • the compression molding can at a
  • outside electrode are performed, which is already attached to the stack. This allows a particularly simple Formation of an outer electrode.
  • the step of press forming may also be done prior to attaching the
  • a further contact can be attached to the second region of the outer electrode.
  • the further contacting can be achieved, for example, by soldering or welding a connection element, for B. a lead wire to the second region of the outer electrode. Because the second area of the outer electrode is above the stack
  • piezoelectric layers and electrode layers which can lead to damage of the layers can be avoided.
  • the second region of the outer electrode projecting beyond the stack can be adapted to the specific geometrical and mechanical requirements of further contacting by the press deformation.
  • Attack area of a pressing tool to be suitably selected.
  • the width and the thickness of the outer electrode can be adapted to the installation space by a single process step. Often, for example, due to
  • the first and the second region are the same
  • the conductive element is formed flat.
  • the element in its initial shape in the first and in the second region, the same outer shape and is press-formed in a later step in the second area.
  • Soldering must be connected to the first area.
  • the outer electrode is at least partially flat.
  • the outer electrode is formed flat throughout the first area.
  • the thickness of the outer electrode is preferably substantially smaller than the width of the outer electrode.
  • the outer electrode preferably extends in its flat area substantially within a
  • Two-dimensional surface which is called the main surface of the outer electrode in the following.
  • the outer electrode extends in the first region within the main surface.
  • the outer electrode is arranged in the first region with the main surface on the stack.
  • the outer electrode is in the first area with the main surface on the stack.
  • the first region of the outer ⁇ electrode can for example be fastened by means of a solder material over the entire surface on the stack, that is, all portions of the outer electrode in the first region are located on the stack, for example, attached to a base metallization layer of the stack.
  • the outer electrode extends in the first region over a majority of a side surface of the stack.
  • the width of the outer electrode in the first area can for example, close to the width of the side surface.
  • the outer electrode in the first region is at least half as wide as the side surface of the stack.
  • At least one partial surface of the outer electrode is inclined relative to the main surface. This inclination is preferably due to the fact that the outer electrode rests on the one hand in the first region with the main surface of the stack, and on the other hand in the second region by a
  • two or more partial areas of the outer electrode abut each other.
  • the outer electrode can be deformed in the second region so that two or more faces after the Press deformation in the second area are in contact.
  • the two or more adjoining partial surfaces of the outer electrode may rest against one another in such a way that two electrically conductive regions of the partial surfaces abutting one another are in direct electrical contact with one another.
  • the adjoining faces are free of an insulating coating. This can be achieved with advantage that a reliable electrical contact is provided, in particular in a
  • Damage to a subarea for example due to a tearing of the outer electrode in this area, can be ensured.
  • the outer electrode may be at least partially folded in the second region.
  • the outer electrode is bent by the press-forming, for example, in the middle of the second region, wherein two partial surfaces are pressed against each other, so that a stable connection of the
  • Outer electrode in the second region for example by means of a crimping tool, can thus result in at least partial folding of the outer electrode in the second region.
  • the outer electrode is formed as a network.
  • the mesh may have wires that are interwoven with each other.
  • the wires may include materials such as ⁇ example, steel, copper or an iron-nickel alloy
  • the wires can be different
  • the network can, for example, at least pointwise at the
  • Base metallization be attached, which on one
  • At least one wire leads from the first region into the second region.
  • the wire has, for example, a first and a second section, wherein the first portion rests against the stack and the second portion projects beyond the stack.
  • At least one wire in the second region at least one wire has at least two wire sections, wherein the
  • Wire in the first wire section has a different thickness than in the second wire section.
  • one or more wire sections of a first wire section has a different thickness than in the second wire section.
  • Wire or more wires are deformed so that after the compression deformation, the thickness of individual wire sections is different.
  • the thickness of the press-formed wire can by a suitable choice of the pressing pressure on a
  • the outer electrode may also be formed as a sheet metal.
  • the sheet is provided with holes and thereby has an increased extensibility. As a result, for example, cracking of the outer electrode can be prevented.
  • the outer electrode in the second region has at least one partial region in which the width of the outer electrode is smaller than the width of the outer electrode in the first region.
  • width is preferably the extension of the outer electrode in a direction transverse to the stacking direction, wherein the
  • the smaller width of the outer electrode in the second region compared to the first region can preferably be achieved by a compression deformation of the outer electrode in the second region, for example by crimping.
  • This can For example, a slim shape of the second, over the stack projecting portion of the outer electrode can be achieved, which is advantageous in space limitations.
  • the outer electrode in the second region can be press-deformed so that the width of the outer electrode in the second region is less than in the first region and at the same time the thickness of the outer electrode
  • “folding over” may mean that the outer electrode in the second region is folded in the middle along a fold line which runs in the stacking direction.
  • projecting beyond the stack area further contact to the power supply, for example by means of soldering or welding, are attached.
  • soldering and welding in the vicinity of the stack surface which could damage the piezoelectric multilayer component, can be avoided.
  • a method for forming an outer electrode in a piezoelectric multilayer component is specified.
  • first a stack of piezoelectric layers and electrode layers arranged therebetween is provided.
  • On a side surface of the stack can be a
  • Base metallization can be applied, for example, by applying a silver-palladium paste or a copper-containing paste on the side surface and then baked.
  • a conductive element which has a first and a second area.
  • the first portion of the element is placed on the stack, for example on a side surface on which a
  • the first region of the element is attached to the stack, preferably to the base metallization, for example by means of a solder material.
  • the second area of the element is press-deformed.
  • Crimping pliers for example, a crimping tool, in the second region of the conductive element, for example, to two
  • an external electrode of the component is formed from the conductive element. Due to the press-forming, the outer electrode formed on the component differs in its outer shape from the starting shape of the conductive element.
  • the thickness and width of the outer electrode in the second region may be different from the thickness and width in the first region.
  • the geometry of the outer electrode in the second region can arbitrarily
  • Requirements of the multilayer component are adapted to facilitate, for example, the attachment of a further contact to the outer electrode.
  • the following are the specified piezoelectric
  • Multi-layer component and its advantageous embodiments explained with reference to schematic figures. Show it:
  • Figure 1 is a perspective view of a
  • Figure 2 is a cross section of a piezoelectric
  • Multilayer component with an outer electrode Multilayer component with an outer electrode
  • Figure 3 is a side plan view of a piezoelectric
  • Multilayer component with an outer electrode Multilayer component with an outer electrode
  • FIGS. 4A, 4B, 4C process steps of a method for
  • FIG. 1 shows a piezoelectric multilayer component 1 with an outer electrode 6, which is at least partially press-deformed in a second region 8.
  • the piezoelectric multilayer component 1 comprises a stack 2 of piezoelectric layers 3 and intervening electrode layers 4, which along a
  • Stacking direction 14 are arranged one above the other.
  • Stacking direction 14 corresponds to the longitudinal axis of the stack 2.
  • the piezoelectric layers 3 and the electrode layers 4 are sintered together and form a monolithic sintered body.
  • the electrode layers 4 extend along the stacking direction 14 alternately to an outer side of the stack 2 and are spaced from the opposite outer side.
  • an outer electrode 6 is fixed in a first region 7 of the outer electrode 6 on the outside of the stack 2.
  • the Jardinelek ⁇ trode 6 is formed flat in the first region 7, ie, the outer electrode 6 is formed flat and extends in the first region 7 over a large two-dimensional area. This two-dimensional region can also be referred to as the main surface 15 of the outer electrode.
  • the first region 7 covers a large part of a side surface of the stack 2.
  • the outer electrode 6 lies with the main surface 15 on the stack 2 and is connected over its entire surface to the stack 2.
  • the outer electrode 6 is designed as a wire mesh.
  • the wire mesh has wires 20 which are woven together and which, for example
  • a second region 8 of the outer electrode 6 projects beyond the stack 2 in the direction of the stacking direction 14.
  • the outer electrode 6 has in the second region 8 partial surfaces 9a and 9b, which are inclined relative to the main surface 15.
  • the two partial surfaces 9a, 9b abut each other in the second region 8.
  • Area 8 also has another press-deformed geometry
  • a further external electrode is mounted on the side opposite to ⁇ outside and press-molded (not shown here).
  • FIG. 2 shows a cross section of the piezoelectric multilayer component 1 according to FIG. 1, in which a plan view of a piezoelectric layer 3 can be seen.
  • the stack 2 of piezoelectric layers 3 and electrode layers 4 has two opposite inactive zones 5a, 5b.
  • a base metallization 10 is applied.
  • the base metallization 10 is preferably baked in the form of a silver-palladium paste or a copper-containing paste on a portion of the outside of the stack 2 personallytra ⁇ gene and on sintering of the stack.
  • the outer ⁇ electrodes 6a, 6b are fixed to the base metallization 10 by a solder layer. 11
  • the outer electrode 6 is different according to the Pressver ⁇ deformation in its thickness 18 in the first region 7 of thickness 19 in the second region 8.
  • FIG. 3 shows a lateral top view of the piezoelectric multilayer component 1 according to FIG. 1, the component 1 being rotated by 180 degrees relative to the stacking direction 14 in comparison to the component 1 in FIG.
  • Outer electrode 6 is flat in the first region 7 and has a main surface 15, to which it is attached, for example by means of a soft solder on the stack 2. Due to the press deformation, the outer electrode 6 differs in its width 17 in the second region 8 from its width 16 in the first region 7. By a slimmer shape of the outer electrode 6 in the second region 8, for example, the attachment of a washererutton ist 12 facilitates or the outer electrode 6 their installation space be adjusted.
  • Suchmannerching ist serves the power supply and is for example by a soldering or a
  • FIGS. 4A, 4B and 4C show method steps of a method for forming an outer electrode in a piezoelectric multilayer component.
  • FIG. 4A shows a stack 2 of piezoelectric layers 3 and electrode layers (not shown here) arranged therebetween, on which a conductive element 9 having a first region 7 and a second region 8 is arranged and fastened.
  • the second region 8 represents an extension of the first region 7.
  • the element 9 has a planar shape, ie it is flat and extends over a large, two-dimensional region.
  • the areal shaped area in the first area 7 is referred to as the main area 15 of the element 9.
  • the conductive element 9 is arranged on the stack 2 in such a way that, with its main surface 15, it rests completely against the stack 2 in the first region 7 and projects beyond the stack 2 in the second region 8 in the stacking direction 14. Subsequently, the element 9, for example by means of soldering, in the first region 7 with its main surface 15 attached to the stack 2.
  • FIG. 4B shows the stack 2 and the conductive element 9 after fixing the element 9 to the stack 2 and constitutes the press-forming of a part of the second region 8 of FIG
  • a pressing tool 13 is arranged with pressing tongs in the second region 8 on two different sides of the element 9 and then pressed together.
  • a pressing tool 13 can for
  • Example a crimping tool can be used.
  • FIG. 4C shows the conductive element 9 after the press-forming step.
  • the invention is not limited to this by the description with reference to the embodiments, but includes each new feature and any combination of features. This includes in particular any combination of features in the claims, even if this feature or these

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Fuel-Injection Apparatus (AREA)

Abstract

L'invention concerne un composant multicouche piézoélectrique (1) sur lequel au moins une électrode extérieure (6, 6a, 6b) est fixée à un empilement (2) constitué de couches piézoélectriques (3) et de couches d'électrodes intercalées (4) entre ces dernières, au moins une zone (8) de l'électrode extérieure (6, 6a, 6b) faisant saillie au-delà de l'empilement (2) et l'électrode extérieure (6, 6a, 6b) étant au moins partiellement façonnée par compression dans cette zone (8). L'invention concerne en outre un procédé pour former une électrode extérieure (6, 6a, 6b) sur un composant multicouche piézoélectrique (1).
EP11723469.0A 2010-06-07 2011-06-06 Composant multicouche piézoélectrique et procédé pour former une électrode extérieure sur un composant multicouche piézoélectrique Withdrawn EP2577757A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010022925.3A DE102010022925B4 (de) 2010-06-07 2010-06-07 Piezoelektrisches Vielschichtbauelement und Verfahren zur Ausbildung einer Außenelektrode bei einem piezoelektrischen Vielschichtbauelement
PCT/EP2011/059271 WO2011154348A1 (fr) 2010-06-07 2011-06-06 Composant multicouche piézoélectrique et procédé pour former une électrode extérieure sur un composant multicouche piézoélectrique

Publications (1)

Publication Number Publication Date
EP2577757A1 true EP2577757A1 (fr) 2013-04-10

Family

ID=44513438

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11723469.0A Withdrawn EP2577757A1 (fr) 2010-06-07 2011-06-06 Composant multicouche piézoélectrique et procédé pour former une électrode extérieure sur un composant multicouche piézoélectrique

Country Status (6)

Country Link
US (1) US9214621B2 (fr)
EP (1) EP2577757A1 (fr)
JP (1) JP2013533616A (fr)
CN (1) CN102918671A (fr)
DE (1) DE102010022925B4 (fr)
WO (1) WO2011154348A1 (fr)

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DE102013108753A1 (de) * 2013-08-13 2015-02-19 Epcos Ag Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung
DE102013216628A1 (de) * 2013-08-22 2015-02-26 Robert Bosch Gmbh Brennstoffeinspritzventil und piezokeramisches Vielschichtbauteil mit einer Außenelektrode
DE102014214018A1 (de) * 2014-07-18 2016-01-21 Continental Automotive Gmbh Piezobauelement, Kontaktierungsbauelement zum elektrischen Kontaktieren eines Piezostapels und Verfahren zum Herstellen eines solchen Piezobauelements
DE102015117262B4 (de) * 2015-10-09 2022-09-22 Tdk Electronics Ag Bauelement zur Erzeugung eines aktiven haptischen Feedbacks
CN107068851B (zh) * 2017-03-30 2019-01-25 武汉纺织大学 一种压力发电金属丝及其制备方法

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Also Published As

Publication number Publication date
DE102010022925B4 (de) 2019-03-07
JP2013533616A (ja) 2013-08-22
US9214621B2 (en) 2015-12-15
WO2011154348A1 (fr) 2011-12-15
DE102010022925A1 (de) 2011-12-08
CN102918671A (zh) 2013-02-06
US20130140960A1 (en) 2013-06-06

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