EP2558606A1 - Nouvel alliage de laiton exempt de plomb - Google Patents
Nouvel alliage de laiton exempt de plombInfo
- Publication number
- EP2558606A1 EP2558606A1 EP11769504A EP11769504A EP2558606A1 EP 2558606 A1 EP2558606 A1 EP 2558606A1 EP 11769504 A EP11769504 A EP 11769504A EP 11769504 A EP11769504 A EP 11769504A EP 2558606 A1 EP2558606 A1 EP 2558606A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- lead
- sulfur
- tellurium
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Definitions
- the present invention relates to brass compositions with extremely low to no lead content.
- the compositions exhibit good machinability and strength similar to that of conventional leaded brass alloy free machining brass.
- the alloys of the invention use sulfur or blends of sulfur and tellurium in lieu of added lead to improve the machinability of the brass alloys.
- the lead phase in copper lead alloys can be affected by corrosive attacks with hot organic or mineral oil.
- the oil can break down to form peroxides and organic gases which effect a degree of leaching on the lead phase within the alloy. If this leaching progresses to any appreciable extent, the component, if it is a bearing or structural component, may eventually malfunction or fail.
- the present invention comprises a brass alloy containing from about 0.20% to 1.5% tellurium, sulfur or sulfur tellurium blends as a substitute for lead, typically added to the brass composition.
- the tellurium, sulfur or tellurium/sulfur blend ranges from about 0.4% to about 1.0%.
- the resulting alloy typically has a lead content of from less than about 0.025% to less than about 0.001 % which is considered "lead-free.”
- the alloys are also essentially silicon free in that no silicon is added to the alloys. The only silicon present is a trace amount typically found in association with the other metals used in the alloy.
- the silicon present is less than 1,000 parts per million (ppm), 100 ppm, 10 ppm, 1 ppm, 0.1 ppm, 0.01 ppm, 0.001 ppm, 0.0001 ppm, or 0.00001 ppm of the metals used in the alloy, and in some cases the metals used in the alloy are completely silicon free.
- Brass alloys of the invention typically have a copper content of from about 98% to about 57%, a zinc content of from about 43% to about 2%, a tellurium content of from about 1.0% to about 0.02%, a lead content of from about 0.025% to about 0.001%, and a maximum phosphorous content of about 0.05%.
- the sulfur content will range from about 1.5% to about 0.02 % of the brass alloy. In some cases, the sulfur content will range between 1.5% and 0.5% of the brass alloy, 1.4% and 0.5% of the brass alloy, .1.2% and 0.5% of the brass alloy, 1.0% and 0.5% of the brass alloy, 0.9% and 0.5% of the brass alloy, 0.7% and 0.5% of the brass alloy, 1.5% and 0.75% of the brass alloy, 1.5% and 0.80% of the brass alloy, 1.5% and 1.0% of the brass alloy, 1.5% and 1.2% of the brass alloy, 1.5% and 1.4% of the brass alloy, 1.25% and 0.5% of the brass alloy, or 0.75% and 0.5% of the brass alloy.
- tellurium and sulfur are used, they will again range from about 1.5 to about 0.02% of the brass alloy, 1.5% and 0.5% of the brass alloy, 1.4% and 0.5% of the brass alloy, 1.2% and 0.5% of the brass alloy, 1.0% and 0.5% of the brass alloy, 0.9% and 0.5% of the brass alloy, 0.7% and 0.5% of the brass alloy, 1.5% and 0.75% of the brass alloy, 1.5% and 0.80% of the brass alloy, 1.5% and 1.0% of the brass alloy, 1.5% and 1.2% of the brass alloy, 1.5% and 1.4% of the brass alloy, 1.25% and 0.5% of the brass alloy, or 0.75% and 0.5% of the brass alloy.
- the ratio of tellurium and sulfur may be in a fixed ratio with the ratio of tellurium to sulfur ranging from 1000: 1 to 1 : 1000, 100: 1 to 1 : 100, 10: 1 to 1 : 10, 1000: 1 to 1 : 1 , 1 : 1 to 1 : 1000.
- the amount of tellurium and sulfur may be expressed as a percentage with sulfur being a percentage of the total amount of the sulfur/tellurium blend.
- the percentage of sulfur in the sulfur/tellurium blend may be 99%, 95%, 90%, 85%, 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, 30%, 25%, 20%, 15%, 10%) or 5% of the sulfur/tellurium blend or range from 1% to 99% or any range in between of the tellurium/sulfur blend.
- blends of tellurium and sulfur can be used. These blends comprise from between about 1 % to about 99% tellurium with the balance sulfur.
- the resulting alloys exhibit excellent machinability and conductivity.
- the tensile strength will vary between 240 MPa and 530 MPa and yield strength will vary from about 200 to about 450 MPa.
- Conductivity will range from about 28% to about 49% IACS.
- the machinability of the novel alloys of the invention is similar to that for lead containing compositions. This eliminates or reduces the amount of retooling needed to use the novel alloys to produce finished products such as plumbing fixtures.
- composition of the novel alloys also allows the end product manufacturers to recycle the scrap from the manufacturing process itself. This eliminates the need to return the scrap to the alloy manufacturer for recycling.
- alloys containing less than about 15% or from about 0.0001% to less than 15% zinc exhibit excellent dezincification resistance.
- Figure 1 is a photomicrograph of the alloy used in Sample C I after draw.
- Figure 2 is a photomicrograph of the alloy used in Sample C2 after draw.
- Figure 3 is a photomicrograph of the alloy used in Sample C3 after draw.
- Figure 4 is a photomicrograph of the alloy used in Sample El after draw at lOOOx magnification.
- Figure 5 is a photomicrograph of that alloy used in Sample El after draw and etching at lOOx magnification.
- Figure 6 is a photomicrograph of the alloy used in Sample E4 after draw at l OOOx magnification.
- Figure 7 is a photomicrograph of the alloy used in Sample E4 after draw and etching at lOOx magnification.
- Figure 8 is a photomicrograph of the alloy used in Sample E7 after draw.
- Figure 9 is a photomicrograph of the alloy used for Sample E7 after draw and etching at lOOx magnification.
- the brass alloys of the present invention are prepared by first melting copper at a temperature of about 1050°C. Zinc and tellurium are then added to the molten copper. Brass alloy is then cast into billets utilizing horizontal or vertical casting methods. Where sulfur or tellurium/sulfur blends are used, they are also added with the zinc.
- the copper used to make the alloys is typically copper cathode or high grade uncontaminated and pure copper scrap comprising at least 99.95% copper and to 0.05% impurities.
- Lead is a typical impurity, comprising less than 0.025% of the copper used.
- copper comprises from about 57.00 to about 98.00% of the alloy.
- Zinc is the next major component comprising from about 2.00% to about 43.00% of the alloy.
- Tellurium, sulfur and tellurium/sulfur blends are used as a replacement for lead. Like lead, tellurium, sulfur or tellurium/sulfur blends are added to improve machinability of the alloy without the negative contribution of lead. Tellurium, sulfur or tellurium/sulfur blends are added in an amount ranging from about 0.20% to about 1.5% of the alloy. In one series of embodiments, the tellurium, sulfur or tellurium/sulfur blends range from about 0.4 to about 1.0%. In one embodiment, tellurium comprises about 0.5% of the alloy.
- tellurium, sulfur or tellurium/sulfur blends used will depend, in part, on the amount of copper used in the alloy, as copper levels increase the amount of tellurium used with decrease.
- tellurium, sulfur or tellurium/sulfur blends to the alloy creates discontinuities in the copper and zinc phases of the alloy like those shown in Figures 1 -6. The good dispersion of these discontinuities leads to the improved machinability of the alloys.
- One advantage of the present invention is that the alloys exhibit machinability similar to that of lead containing alloys while using significantly lower amounts of tellurium, sulfur or tellurium/sulfur blends.
- brass alloys include arsenic, nickel, manganese, and phosphorous. When phosphorous is used, the amount present will typically be less than 0.05% of the alloy. Silicon is generally not added to the alloys resulting in an alloy that is silicon-free as well as lead-free.
- the resulting alloys will generally exhibit excellent machinability and conductivity as indicated by Ultimate Tensile Strength (UTS) ranging from about 240 to about 530 Pa and a yield strength of from about 200 MPa to about 450 MPa as determined using ASTM method B140.
- UTS Ultimate Tensile Strength
- the actual Tensile strength and Yield strength will depend, in part, on the actual composition of the alloy.
- Conductivity of the alloys will range from about 28 to about 45% IACS.
- the billets were then changed into an extrusion press at a temperature ranging from about 780°C to about 860°C.
- the billets were then hot extruded through a variety of dies and at different pressures to produce numerous sizes. Each shot was lubricated prior to extrusion and the extrusion dies were preheated. The results are shown in Table 2.
- the sulfur containing alloys have mechanical properties similar to those of the tellurium containing alloys.
- FIGS. 5, 7 and 9 are photomicrographs of the same samples after draw and etching at lOOx magnification.
- the microstructure in the alloys were uniform indicating good dispersion of the sulfur throughout the alloy.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
L'invention concerne des alliages de laiton qui sont sensiblement exempts de plomb. Dans les alliages de l'invention, le plomb est remplacé par un sulfure de tellure ou des mélanges de tellure et de soufre, conduisant à des alliages qui présentent une excellente aptitude à l'usinage et une excellente conductivité.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/759,402 US20100303667A1 (en) | 2009-03-09 | 2010-04-13 | Novel lead-free brass alloy |
PCT/US2011/032253 WO2011130368A1 (fr) | 2010-04-13 | 2011-04-13 | Nouvel alliage de laiton exempt de plomb |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2558606A1 true EP2558606A1 (fr) | 2013-02-20 |
EP2558606A4 EP2558606A4 (fr) | 2016-07-27 |
Family
ID=44799006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11769504.9A Withdrawn EP2558606A4 (fr) | 2010-04-13 | 2011-04-13 | Nouvel alliage de laiton exempt de plomb |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100303667A1 (fr) |
EP (1) | EP2558606A4 (fr) |
JP (1) | JP2013524023A (fr) |
IL (1) | IL222418A0 (fr) |
SG (1) | SG184877A1 (fr) |
WO (1) | WO2011130368A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9829122B2 (en) * | 2011-11-07 | 2017-11-28 | Nibco Inc. | Leach-resistant leaded copper alloys |
US20130115128A1 (en) * | 2011-11-07 | 2013-05-09 | Nibco Inc. | Sulfur-rich corrosion-resistant copper-zinc alloy |
CN103805806B (zh) * | 2013-11-12 | 2016-03-09 | 龙岩市鸿航金属科技有限公司 | 抗脱锌挤压拉制黄铜管的配方及其生产方法 |
US20160145719A1 (en) * | 2014-01-03 | 2016-05-26 | Jiaxing Idc Plumbing & Heating Technology Ltd. | Low-lead bismuth-free silicon-free brass |
KR20150093100A (ko) * | 2014-01-03 | 2015-08-17 | 찌아싱 아이디시 플러밍 엔드 히팅 테크놀로지 엘티디 | 리드, 비스무트 및 규소를 함유하지 않는 황동 |
CZ306429B6 (cs) * | 2015-10-07 | 2017-01-18 | Comtes Fht A.S. | Obrobitelná mosaz se sníženým obsahem olova vhodná pro tváření válcováním za studena |
TR202018149A2 (tr) | 2020-11-13 | 2022-05-23 | T C Marmara Ueniversitesi | İşlenebi̇li̇rli̇ği̇ i̇yi̇leşti̇ri̇lmi̇ş kurşunsuz pi̇ri̇nç alaşimi üreti̇mi̇ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1680046A (en) * | 1924-01-30 | 1928-08-07 | Victor O Homerberg | Method of treating copper alloys and improved product |
US2038136A (en) * | 1933-09-02 | 1936-04-21 | American Brass Co | Copper-selenium alloys |
US2102388A (en) * | 1933-09-21 | 1937-12-14 | American Brass Co | Copper-sulphur alloy |
US2155408A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Copper base alloys |
US5167726A (en) * | 1990-05-15 | 1992-12-01 | At&T Bell Laboratories | Machinable lead-free wrought copper-containing alloys |
US5137685B1 (en) * | 1991-03-01 | 1995-09-26 | Olin Corp | Machinable copper alloys having reduced lead content |
US6413330B1 (en) * | 1998-10-12 | 2002-07-02 | Sambo Copper Alloy Co., Ltd. | Lead-free free-cutting copper alloys |
US6471792B1 (en) * | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
JP4729680B2 (ja) * | 2000-12-18 | 2011-07-20 | Dowaメタルテック株式会社 | プレス打ち抜き性に優れた銅基合金 |
WO2005087957A1 (fr) * | 2004-03-12 | 2005-09-22 | Sumitomo Metal Industries, Ltd. | Alliage de cuivre et méthode de production de celui-ci |
DK1777305T3 (da) * | 2004-08-10 | 2011-01-03 | Mitsubishi Shindo Kk | Støbning af kobberbaselegering med raffinerede krystalkorn |
DE502005009545D1 (de) * | 2004-10-11 | 2010-06-17 | Diehl Metall Stiftung & Co Kg | Kupfer-zink-silizium-legierung, deren verwendung und deren herstellung |
JP3957308B2 (ja) * | 2004-11-29 | 2007-08-15 | 滋賀バルブ協同組合 | 耐圧性に優れた鋳物用無鉛銅合金 |
JP4951623B2 (ja) * | 2005-09-22 | 2012-06-13 | 三菱伸銅株式会社 | 鉛を超低量含む快削銅合金 |
JP5116976B2 (ja) * | 2006-02-10 | 2013-01-09 | 三菱伸銅株式会社 | 半融合金鋳造用原料黄銅合金 |
JP2007297675A (ja) * | 2006-04-28 | 2007-11-15 | Shiga Valve Cooperative | 被削性に優れた鋳物用無鉛銅合金 |
CN101619404B (zh) * | 2009-08-11 | 2011-05-11 | 路达(厦门)工业有限公司 | 一种适于锻造用易切削无铅黄铜合金及其制备方法 |
-
2010
- 2010-04-13 US US12/759,402 patent/US20100303667A1/en not_active Abandoned
-
2011
- 2011-04-13 JP JP2013505083A patent/JP2013524023A/ja not_active Withdrawn
- 2011-04-13 SG SG2012076634A patent/SG184877A1/en unknown
- 2011-04-13 WO PCT/US2011/032253 patent/WO2011130368A1/fr active Application Filing
- 2011-04-13 EP EP11769504.9A patent/EP2558606A4/fr not_active Withdrawn
-
2012
- 2012-10-14 IL IL222418A patent/IL222418A0/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2011130368A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2011130368A1 (fr) | 2011-10-20 |
EP2558606A4 (fr) | 2016-07-27 |
US20100303667A1 (en) | 2010-12-02 |
SG184877A1 (en) | 2012-11-29 |
IL222418A0 (en) | 2012-12-31 |
JP2013524023A (ja) | 2013-06-17 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Effective date: 20121113 |
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RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20160628 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/04 20060101AFI20160622BHEP |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20170126 |