EP2508049A1 - Carte de circuits souple et dispositif électrique - Google Patents

Carte de circuits souple et dispositif électrique

Info

Publication number
EP2508049A1
EP2508049A1 EP10768903A EP10768903A EP2508049A1 EP 2508049 A1 EP2508049 A1 EP 2508049A1 EP 10768903 A EP10768903 A EP 10768903A EP 10768903 A EP10768903 A EP 10768903A EP 2508049 A1 EP2508049 A1 EP 2508049A1
Authority
EP
European Patent Office
Prior art keywords
cover
circuit board
printed circuit
flexible printed
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10768903A
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2508049A1 publication Critical patent/EP2508049A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Definitions

  • the invention relates to a flexible printed circuit board, with at least one conductor track and an at least partially enclosing the conductor track, wherein between the conductor track and the sheath at least one adhesive layer is provided for fastening the sheath.
  • the invention further relates to an electrical device.
  • a flexible printed circuit board which is referred to in the cited document as a flexible conductor foil, is provided for the electrical connection of a circuit part arranged in an interior of a housing of a control unit with electrical components arranged outside the housing interior.
  • the flexible circuit board has the at least one conductor track, which is enclosed by the sheath at least partially. Between the track and the sheath, the adhesive layer is provided to secure the trace relative to the sheath.
  • the flexible circuit board with the features of claim 1 has the advantage that it has a surface which makes it possible to lead out of the electrical device and this seal without high effort.
  • the at least one conductor track on the shell so that there is a relief-like profile in the cross section of the flexible circuit board.
  • the additional cover is provided, which encloses the shell at least partially. Between the shell and the cover, the filling layer is arranged.
  • the filling layer ensures that the relief-like course of the shell is compensated, so that the cover, which comprises the filling layer, is at least almost flat.
  • the shell and the cover may be made of different materials.
  • the polyimide (PI) sheath and the cover will be made of a thermoplastic or rubbery material.
  • the cover surrounds the shell only partially, so as not to impair the flexibility of the circuit board.
  • the cover is provided, for example, only in the region of a recess of the electrical device, through which the circuit board from the electrical device or a housing thereof is led out.
  • a development of the invention provides that the filling layer produces an adhesive bond between the shell and the cover.
  • the filling layer can also be an adhesive layer or at least have adhesive.
  • the filling layer can be achieved both that the unevenness of the shell are compensated and at the same time the cover is attached to the shell.
  • This allows a cost-effective production of the flexible printed circuit board.
  • a development of the invention provides that in the filling layer at least one plastic and / or metal exhibiting or consisting of plastic and / or metal compensation element is arranged.
  • the compensation element may be arranged in the filling layer.
  • a plurality of strip-shaped compensating elements may be arranged such that they-as seen in cross-section-each lie next to the conductor track.
  • the compensating element consists for example of plastic or metal or at least has these materials. If metal is provided at least in some areas, the compensating element can at the same time serve as an electrical shield against interference. For this purpose, the compensation element is preferably connected to an electrical ground. By means of the compensating element can also be a
  • Shaping or preforming of the flexible circuit board be achieved. This is achieved in particular by the use of metal.
  • the plastic in particular a thermoplastic, could be used to achieve the preforming of the printed circuit board.
  • a sealing element in particular a sealing lip, is provided on the cover.
  • the sealing element may be attached to the cover or formed integrally therewith. The latter can be provided in particular with advantage if the cover consists of a thermoplastic or rubber-elastic material.
  • the sealing element is designed such that a recess in which the flexible printed circuit board is arranged, is sealed.
  • the sealing element may be formed as a sealing lip.
  • the cover is formed by a circumferential band and / or a one-piece or multi-piece cover.
  • the cover can be applied to the cover in various ways. For example, it may be provided to carry out the cover as a circumferential band and the latter in the manufacture of the flexible
  • the envelope is, for example, arranged in a U-shape and inserted into the band. After the introduction of the filling layer, the envelope is brought together with the band or the cover in the desired, for example, flat, shape.
  • the banderole represents an embodiment of the one-piece cover element.
  • a one-piece, not designed as a banderole cover This is wrapped around the shell or the filling layer and the two ends are connected to one another in the region of a composite point, so that the cover is substantially closed.
  • the multi-piece cover member wherein, for example, two films, which together form the cover, are wrapped around the shell or the filling layer.
  • the one-piece or multi-piece cover element has at least one composite point at which a first area of the cover element is in abutment with a second area of the cover element or forms a seam or an overlap.
  • the first region and the second region of the cover element are connected to one another or at least arranged such that the filling layer is protected against external influences and at the same time the planar surface of the cover is present.
  • the areas may be in abutment, that is, they may be arranged planar to one another.
  • the invention further relates to an electrical device, in particular a control device for a vehicle, with at least one flexible printed circuit board, in particular according to the preceding embodiments, wherein the printed circuit board at least one conductor track and the conductor at least partially enclosing envelope, and wherein between the conductor track and the shell provided at least one adhesive layer for fixing the shell and the conductor track is led out through a recess of a housing of the device.
  • a cover covering the envelope at least partially is provided, at least one filling layer being provided between the envelope and the cover. Due to the cover and the filling layer, a substantially planar surface of the flexible conductor track is achieved.
  • the housing consists for example of two shells, which are connected to each other in the manufacture of the electrical device.
  • the electrical conductor track between the two shells is arranged and held for example by clamping.
  • at least one of the shells has the recess.
  • the housing may also have sealing means, which after the assembly of the housing or the electrical device with the flexible printed circuit board comes into touching contact, thus ensuring an additional sealing of the housing.
  • the cover may have a sealing element and in particular a sealing lip.
  • the sealing element is arranged for further sealing of the housing.
  • a development of the invention provides that the housing is at least partially filled with a filling compound.
  • the filling compound is, for example, a molding compound, with which the housing of the device is at least partially filled in order to better protect components arranged in the housing from external influences.
  • the filling compound may be a thermoset, thermoplastic or other plastic.
  • a development of the invention provides that the cover is provided at least in the region of the recess. In this way, the flexibility of the flexible printed circuit board is obtained because it is additionally stiffened only in the region of the recess through the cover.
  • the cover serves only to ensure the tightness of the housing by providing a flat surface of the flexible printed circuit board available.
  • the cover consists of a material, in particular plastic and / or metal, which forms a connection with the filling compound.
  • the flexible printed circuit board or the cover is guided at least partially into the housing of the electrical device.
  • the cover connects to the filling compound, so that the flexible printed circuit board is held on or in the housing via an adhesive connection.
  • FIG. 2 shows a flexible printed circuit board with a cover and a filling layer in a first embodiment, a region of the flexible printed circuit board in a second embodiment
  • FIG. 4 shows a region of the flexible printed circuit board in a third embodiment
  • FIG. 5 shows a region of the flexible printed circuit board in a fourth embodiment
  • FIG. 6 shows an electrical device with a flexible printed circuit in a sectional view
  • FIG. 7 shows the device in a view from above
  • FIG. 8 shows a region of the electrical device with two flexible printed circuit boards in a first production step
  • FIG. 9 shows the arrangement known from FIG. 8 in a second production step
  • Figure 1 1, a further embodiment of the electrical device.
  • FIG. 2 shows an embodiment of the flexible printed circuit board 1 according to the invention.
  • the printed circuit board 1 shown here has printed conductors 2 which are surrounded by an adhesive layer 4 and a sleeve 3.
  • the shell 3 On the surface 5 of the shell 4 or the circuit board 1 is thus again in front of the relief-like course.
  • the shell 3 at least partially from a cover 8 is included.
  • a filling layer 9 is provided between the shell 3 and the cover 8. The filling layer 9 establishes an adhesive bond between the casing 3 and the cover 8, thus holding the cover 8 on the casing 3.
  • the filling layer 9 it is intended that surfaces 10 of the cover 8 or the flexible printed circuit board 1 are substantially planar, So no longer have the relief-like course of the surface 5 of the shell 3.
  • compensating elements 11 can be arranged to achieve this goal.
  • the compensation elements 1 1 are each arranged in the recesses 7, and fill them at least partially. If, in addition, the filling layer 9 and the cover 8 are provided, then it runs
  • the cover 8 is formed by a one-piece cover member 12.
  • the covering element 12 extends around the filling layer 9, with a first region 14 and a second region 15 of the covering element 12 being arranged in abutment with one another in the region of a composite site 13. It can be provided that a gap 16 between the areas 14 and 15 - if present - is filled by the filling layer 9.
  • the compound point 13 is present on the upper side of the flexible printed circuit board 1.
  • FIG. 3 shows a region of the flexible printed circuit board 1 in a second embodiment. This differs from that shown in the figure 2 in the embodiment of the cover 12 and the compound point 13.
  • the cover 12 may also be formed in one piece or in several pieces in this embodiment. In the latter case, on the side of the printed circuit board 1 not shown here, there is also the composite point 13, which in this case is likewise designed like the composite point 13 shown here.
  • the cover element 12 is in one piece, then only the composite point 13 shown here is present.
  • the first region 14 and the second region 15 form a seam 17. This is filled with the filling layer 9, so that the areas 14 and 15 are adhesively held together.
  • the cover 8 tapers in the region of the composite site 13 so that the regions 14 and 15 converge to form the seam 17.
  • FIG. 4 likewise shows a region of the printed circuit board 1, this being present in a third embodiment.
  • the areas 14 and 15 of the Covering 12 arranged overlapping in the region of the compound site 13, so that an overlap 18 is present.
  • FIG. 5 shows a region of a fourth embodiment of the printed circuit board 1.
  • the regions 14 and 15 are spaced apart from each other so that there is no composite point 13, as in the embodiments of FIGS. 2 to 4. Rather, the areas 14 and 15 are substantially parallel to each other, while an end portion 19 of the circuit board 1 is formed by the filling layer 9.
  • FIG. 6 shows a cross-section of an electrical device 20.
  • This has a housing 21 consisting of a first housing shell 22 and a second housing shell 23.
  • an electrical assembly 24 is arranged and fixed.
  • the flexible circuit board 1 is guided in the housing 21 of the electrical device 20. It can be seen that the flexible printed circuit board 1 only in the region of the recess 25, the cover 8 and the filling layer 9 has. It can further be seen that on the upper side of the printed circuit board 1 the cover 8, the filling layer 9, the shell 3 and the adhesive layer 4 are pulled back in such a way that the printed conductor 2 is at least partially exposed.
  • a bonding connection 26 is provided, which connects the conductor track 2 to the assembly 24 or to a connection of the assembly 24.
  • the recess 25 is executed in this embodiment by a spacing of the housing shells 22 and 23.
  • each sealing elements 27 are arranged to protect the assembly 24 from external influences.
  • the sealing elements 27 are present here as separate components, which hedge in pockets 28 of the housing shells 22 and 23. Alternatively, however, the sealing elements 27 can also be connected to the cover 8 or be formed by it.
  • a further flexible circuit board 1 is provided, but this is not shown in detail. Since it is the same as the printed circuit board 1 already described, will not be discussed in more detail here at this point.
  • FIG. 7 shows the electrical device 20 in a top view. It can be clearly seen that the assembly 24, which is in the housing 21 ange- is arranged is connected by means of a plurality of bonding connections 26 to six circuit boards 1, which are each led out through recesses 25 of the housing 21 from this. It is also clear that the flexible printed circuit boards 1 are each present as an independent component and are not applied to a common carrier.
  • FIG. 8 shows a region of the device 20 in a view from above, wherein only the first housing shell 22 of the housing 21 is shown. It is clear that the flexible circuit boards 1 in recesses 25 of the housing shell 22 or a filling element 29, which rests on the housing shell 22 are guided.
  • the housing 21 shown in FIG. 8 is present in a first production step of the electrical device 20.
  • FIG. 9 shows a second production step of the electrical device 20 known from FIG.
  • a further filling element 29 is applied to the first housing shell 22 or the filling element 29 and the flexible printed circuit boards 1.
  • This filling elements 29 provide a leveling between the circuit boards 1 and the surrounding areas, so that by fixing the second housing shell 23 to the first housing shell 22, a sealing of the device 20 is possible.
  • sealing strip 29 may be formed as a sealing strip. It is therefore intended that both below and above the circuit boards 1 each such a sealing strip is arranged. As a result of the planar surface 10 of the cover 8 or of the printed circuit board 1, a very good sealing of the housing 21 or of the device 20 can be achieved in this way.
  • FIG. 10 shows a detail of the device 20 known from FIG. 6.
  • the bond connection 26 can be recognized, by means of which the conductor track 2 is connected to the assembly 24, which is not shown here.
  • the conductor 2 is embedded by the adhesive layer 4, the envelope
  • the housing 21 is completely filled with a filling compound 30.
  • the cover 8 is made of a material which enters into a connection with this filling compound 30.
  • the flexible circuit board 1 is thus held in the housing 21.
  • Such a device 20 can be manufactured, for example, by fixing the flexible printed circuit boards 1 and the assembly 24 on an intermediate carrier, for example by gluing, in order to achieve a precise positioning.
  • the printed conductors 2 of the printed circuit board 1 are then connected to the module 24 by bonding or producing the bonding connections 26.
  • the resulting assembly is tested.
  • the assembly 24 is overmolded with the filling compound 30, for example in a Moldform.
  • a thermoplastic can be used as the filling compound 30.
  • the filling compound 30 forms the housing 21 at least in regions.
  • 1 1 shows an alternative embodiment of the electrical device 20. Shown is the housing 21, from which a plurality of flexible circuit boards 1 are led out. These may be provided, for example, for connection of a pressure regulator 31, a sensor 32, a plug 33 or the like. It is indicated in FIG. 11 that the flexible circuit boards 1 have the cover 8 only in the region in which they are led out of the housing 21. In the further course of the printed circuit board 1 is a flexible circuit board 1 as known from the prior art (ie without filling layer 9 and cover 8), so as not to affect the flexibility.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne une carte de circuits (1) souple comportant au moins un tracé conducteur (2) et une enveloppe (3) entourant au moins par endroits le tracé conducteur (2), au moins une couche de matière adhésive (4) étant prévue entre le tracé conducteur (2) et l'enveloppe (3) pour fixer l'enveloppe (3). La présente invention concerne également dans ce contexte un dispositif de recouvrement (8) comportant l'enveloppe (3), au moins par endroits, au moins une couche de remplissage (9) se situant entre l'enveloppe (3) et le dispositif de recouvrement (8). Cette invention concerne en outre un dispositif électrique (20).
EP10768903A 2009-12-01 2010-10-07 Carte de circuits souple et dispositif électrique Withdrawn EP2508049A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009047329A DE102009047329A1 (de) 2009-12-01 2009-12-01 Flexible Leiterplatte sowie elektrische Vorrichtung
PCT/EP2010/064990 WO2011067019A1 (fr) 2009-12-01 2010-10-07 Carte de circuits souple et dispositif électrique

Publications (1)

Publication Number Publication Date
EP2508049A1 true EP2508049A1 (fr) 2012-10-10

Family

ID=43132771

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10768903A Withdrawn EP2508049A1 (fr) 2009-12-01 2010-10-07 Carte de circuits souple et dispositif électrique

Country Status (6)

Country Link
US (1) US20120307461A1 (fr)
EP (1) EP2508049A1 (fr)
KR (1) KR20120092648A (fr)
CN (1) CN102640579A (fr)
DE (1) DE102009047329A1 (fr)
WO (1) WO2011067019A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP5753501B2 (ja) * 2012-02-10 2015-07-22 ホシデン株式会社 部品モジュール
JP5868721B2 (ja) * 2012-02-10 2016-02-24 ホシデン株式会社 入力装置
DE102012204630A1 (de) 2012-03-22 2013-09-26 Robert Bosch Gmbh Verfahren zur thermoplastischen Umspritzung und thermoplastische Umspritzung
EP2992535B1 (fr) * 2013-05-01 2017-01-11 3M Innovative Properties Company Câble électrique avec structure d'isolation de bords
DE102014211720A1 (de) * 2014-06-18 2015-12-24 Robert Bosch Gmbh Optikträger, Verfahren zur Herstellung eines Optikträgers, Vorrichtung zur Herstellung eines Optikträgers und Kamerasystem
TWI607677B (zh) * 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構
KR102444299B1 (ko) * 2020-10-23 2022-09-15 삼성전기주식회사 전자 소자 모듈 및 이의 제조 방법

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US20030002241A1 (en) * 2001-05-04 2003-01-02 Sick Ag Sensor
US20060169481A1 (en) * 2005-01-28 2006-08-03 Stotz Darin D Flexible flat cable with insulating layer having distinct adhesives on opposing faces
US20070206365A1 (en) * 2006-03-03 2007-09-06 Kingston Technology Company, Inc. Waterproof USB drives and method of making
US7612290B1 (en) * 2008-06-04 2009-11-03 Wiliams - Pyro, Inc. Flexible high speed micro-cable

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US4287385A (en) * 1979-09-12 1981-09-01 Carlisle Corporation Shielded flat cable
US5360944A (en) * 1992-12-08 1994-11-01 Minnesota Mining And Manufacturing Company High impedance, strippable electrical cable
DE10103761A1 (de) * 2001-01-27 2002-09-05 Kostal Leopold Gmbh & Co Kg Flexibles Flachbandkabel
JP4292729B2 (ja) * 2001-03-30 2009-07-08 日立電線株式会社 耐熱・耐屈曲フレキシブルフラットケーブル
JP4876335B2 (ja) * 2001-06-08 2012-02-15 大日本印刷株式会社 フラットケーブル用被覆材およびそれを用いたフラットケーブル
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JP3610400B2 (ja) * 2003-03-31 2005-01-12 日本航空電子工業株式会社 電気接続部品
JP4526115B2 (ja) * 2004-05-24 2010-08-18 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブルフラットケーブル
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JPWO2007023517A1 (ja) * 2005-08-22 2009-02-26 日立プラズマディスプレイ株式会社 フラットケーブルおよびプラズマディスプレイ装置
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US20030002241A1 (en) * 2001-05-04 2003-01-02 Sick Ag Sensor
US20060169481A1 (en) * 2005-01-28 2006-08-03 Stotz Darin D Flexible flat cable with insulating layer having distinct adhesives on opposing faces
US20070206365A1 (en) * 2006-03-03 2007-09-06 Kingston Technology Company, Inc. Waterproof USB drives and method of making
US7612290B1 (en) * 2008-06-04 2009-11-03 Wiliams - Pyro, Inc. Flexible high speed micro-cable

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Title
See also references of WO2011067019A1 *

Also Published As

Publication number Publication date
US20120307461A1 (en) 2012-12-06
KR20120092648A (ko) 2012-08-21
WO2011067019A1 (fr) 2011-06-09
CN102640579A (zh) 2012-08-15
DE102009047329A1 (de) 2011-06-09

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