EP2507186B1 - Oberflächenbehandlungen und beschichtungen - Google Patents

Oberflächenbehandlungen und beschichtungen Download PDF

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Publication number
EP2507186B1
EP2507186B1 EP10787432.3A EP10787432A EP2507186B1 EP 2507186 B1 EP2507186 B1 EP 2507186B1 EP 10787432 A EP10787432 A EP 10787432A EP 2507186 B1 EP2507186 B1 EP 2507186B1
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European Patent Office
Prior art keywords
phosphonic acid
acid
coating
ester
ceramic
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EP10787432.3A
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English (en)
French (fr)
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EP2507186A1 (de
Inventor
Owain Williams
Changqing Liu
Patrick Webb
Paul Firth
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Loughborough University
Lumentum Technology UK Ltd
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Loughborough University
Oclaro Technology Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
    • C09J2400/126—Ceramic in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/146—Glass in the pretreated surface to be joined
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Definitions

  • the present invention relates to the field of surface treatments and coatings, and in particular to surface treatments and coatings to reduce adhesive spread on a substrate.
  • Liquid adhesives are widely used in the manufacture of electronic and optoelectronic components. Epoxy adhesives are commonly used because they are strong and have long life-times in harsh or otherwise demanding environments. They are typically cured using UV light or thermally. As components have become smaller, adhesive management has become more important.
  • the control of the flow of adhesive can be achieved by control of parameters such as viscosity, temperature and cure time. The less adhesive spreads from the area of the joint between the materials to be joined, the less adhesive is used. This in turn leads to less interference between an affixed component and adjacent items in the electronic/optoelectronic product.
  • FIG. 1 A problem with using adhesives is that they "bleed" over the surface once applied. This is illustrated in Figure 1 .
  • the ceramic surface 1 has a drop of adhesive 2 placed upon it. Where the adhesive drop 2 has a diameter of, for example, 1.5 mm, the adhesive on a typical untreated ceramic will bleed and spread to give a bleed region 3 a further 1.5 mm from the outside of the adhesive drop 2.
  • the region of adhesive bleed is therefore far greater than the area of adhesive, and this is undesirable as it can have a detrimental effect on other nearby components.
  • the wetting properties of metallised ceramic substrates for use in optoelectronic assemblies are not specified or controlled by suppliers or optoelectronic module manufacturer customers, for the reasons mentioned above.
  • the wetting properties of aluminium oxide and aluminium nitride substrate materials in the as received state are known to vary widely. Variation has also been shown to depend on storage and handling procedures implemented by the suppliers and customers of the substrates. Variation in the composition of the surfaces leads to poor process control of material interactions in assembly processes, such as the adhesion of metal tracks and the flow behaviour of adhesives for interconnections. Ceramics and metals have intrinsic high surface energies which favour low equilibrium contact angles for epoxy adhesives used for component mounting and interconnection.
  • a self assembled monolayer is a single molecule thick chemical layer which forms spontaneously on a given surface.
  • the surface properties change from those of the bulk material to those of the SAM chemical following coating.
  • Molecules of an amphiphilic substance molecules having a hydrophilic head and a hydrophobic tail
  • the exposure of the hydrophobic tail groups as a new surface and the uniform coverage of the solid surface reduces the apparent surface energy of a hydrophilic solid surface.
  • the surface energy is an effect of the chemical and physical properties of the surface of the solid, the region where liquid/solid interactions take place. The reduction of this surface energy can increase the contact angle of liquids on the surface and thus reduce wetting.
  • a well-known SAM is made from silane, for example treatment of a surface with trimethylchlorosilane. The treatment is sometimes known a silanisation.
  • a surface to be prepared for bonding are frequently composed of more than one material.
  • a surface may be made up of a ceramic with an embedded copper track and epoxy bonding may be required to both the ceramic and the metal surfaces. It is therefore important that a surface treatment can be effectively applied to both the ceramic and the metal components.
  • US2009/075087 describes a spin on protective coating for a wet-etch processing of microelectric substrates.
  • the inventors have developed coatings and systems for coating substrates consisting of ceramics and/or metals to reduce the wetting of the surface of the substrate by an adhesive while still allowing the adhesive to bond sufficiently to the surface of the substrate.
  • a method of treating an electronic or optoelectronic component surface to be bonded with adhesive comprising applying a coating that causes a reduction in the surface energy of the surface.
  • the coating is applied by exposing the surface to a solution selected from any of an alkanoic acid, an alkyl phosphonic acid, an ester of an alkyl phosphonic acid, an aryl phosphonic acid, an ester of an aryl phosphonic acid, an alkenyl phosphonic acid and an ester of an alkenyl phosphonic acid.
  • the coating comprises a self-assembled monolayer.
  • a solution may be used that comprises a molecule having a linear carbon chain.
  • a solution may be used that comprises a molecule having a branched carbon chain.
  • an alkyl group of any of the alkanoic acid, the alkyl phosphonic acid or the ester of an alkyl phosphonic acid has the formula C n H (2n+1) -.
  • the alkanoic acid may comprise a fluoroalkanoic acid of the formula C n F (2n+ 1) COOH.
  • a chain length of an alkanoic acid may be between 8 and 21 carbon atoms.
  • the coating is applied so as to reduce the surface energy of the surface by at least 50 mN/m.
  • the surface further comprises at least one region of metal.
  • the method further comprises, prior to exposing the surface to a solution in order to apply a self-assembled monolayer, exposing the surface to a solution of comprising an alkanethiol.
  • the alkanethiol has a branched chain.
  • the alkanethiol may have the formula C n H (2n+1 ) SH, and furthermore may have a chain length of between 5 and 21 carbon atoms, or between 5 and 12 carbon atoms.
  • the coatings may be applied such that the surface of the metal and the surface of the ceramic have approximately equal surface energies.
  • an electronic or optoelectronic component having a substrate comprising a ceramic surface, the substrate comprising a surface coating that lowers the surface energy of the substrate.
  • the coating is selected from any of an alkanoic acid, an alkyl phosphonic acid, an ester of an alkyl phosphonic acid, an aryl phosphonic acid, an ester of an aryl phosphonic acid, an alkenyl phosphonic acid and an ester of an alkenyl phosphonic acid.
  • the coating preferably comprises a self-assembled monolayer.
  • the coating may comprise a linear carbon chain or a branched carbon chain.
  • An alkyl group of any of the alkanoic acid, the alkyl phosphonic acid or the ester of an alkyl phosphonic acid preferably has the formula C n H (2n+1) -.
  • the alkanoic acid preferably comprises a fluoroalkanoic acid of the formula C n F (2n+ 1) COOH.
  • the coated substrate has a surface energy 50 mN/m lower than an equivalent substrate without the surface coating.
  • the substrate may further comprise at least one surface region of metal, the surface of the substrate further comprising a coating on the metal surface having been applied using an alkanethiol.
  • the alkanethiol preferably has a branched chain.
  • the alkanethiol has the formula C n H (2n+1) SH.
  • the alkanethiol optionally has a chain length of between 5 and 21 carbon atoms, and preferably a chain length of between 5 and 12 carbon atoms.
  • the coatings are applied to the substrate such that the surface region of metal and the ceramic surface have approximately equal surface energies.
  • the coating comprises a monolayer of carboxylic acid that does not reduce adhesion between an adhesive and the surface.
  • a material made up of at least one ceramic material 4 has its surface treated with a solution of an alkanoic acid, a phosphonic acid or a silane. After washing and drying of the surface, a component or device is bonded to the surface using an adhesive, such as an epoxy adhesive 5.
  • an adhesive such as an epoxy adhesive 5.
  • the bleed region 6 of the adhesive is greatly reduced with no significant effect of the bond strength achieved between the component or device and the ceramic substrate, in the case of the alkanoic acid.
  • a drop of adhesive having a diameter of 1.5 mm will have a bleed region that only extends a further 0.1 mm from the outside of the adhesive drop.
  • silane and phosphonic acid monolayers can be used where bond strength is not imperative.
  • a surface is made up of at least one ceramic and at least one metal, having a surface with exposed ceramic and exposed metal, the surface is treated with an alkanethiol to modify the surface properties of the metal, followed by one of the ceramic treatments mentioned above to reduce the surface energy across the surface so that the spread of uncured and curing adhesive is reduced.
  • the reason that the alkanethiol is applied first is that it will form a coating on the metal but will not form a coating on the ceramic. This effectively 'masks' the metal when a ceramic coating is subsequently applied. When the coating for the ceramic is applied, it coats the ceramic but will not coat the metal coating with the alkanethiol. In this way, the substrate is coated such that different coatings are applied to the ceramic and metal surfaces of the substrate.
  • the alkanethiol is applied first to ensure that any oxidized metal is not adhered to by the coating meant to be applied to the ceramic portion of the substrate.
  • a further technique has been developed for coating a metal surface. It can also be used for coating a surface that includes metal and ceramic components
  • SAM substances suited to this type of treatment are those with the chemical formula HS-R or R-S-S-A where R and A are alkyl or aryl chains which could be partially or totally fluorinated or chlorinated.
  • the hydrocarbon chains will terminate in a methyl, ethyl, fluorinated methyl or chlorinated methyl tail group.
  • Step 1 Prepare a solution of phosphonic acid or silane to a concentration of 0.01 M.
  • suitable solvents include ethanol for phosphonic acid and cyclohexane for silanes.
  • Step 2 The ceramic (typically Al 2 O 3 AIN) is exposed to the solution.
  • the exposure is at approximately 20°C for up to approximately one hour but other conditions may be suitable depending upon the solid substrate and the SAM substance used.
  • Step 3 Remove the ceramic from the treatment solution and wash with thoroughly with the respective solvent.
  • SAM substances suited to this technique when silanes are used are those with a silane group and general formula R-SiA 3 where A can be hydrogen, chlorine or fluorine and R is a linear or branched alkyl or aryl chain of length 1-21 carbon atoms which could be partially or totally chlorinated of fluorinated.
  • SAM substances suited to this technique when phosphonic acid SAMs are used are those with a phosphonic acid group of the form R-PO(OH) 2 where R is an alkyl or aryl chain which could be partially or totally chlorinated of fluorinated or alternatively an ester thereof such as R-PO(OR')(OR") where R' and R" are the same or different and are typically short chain alkyl groups such as methyl or ethyl.
  • R-PO(OR')(OR" R' and R" are the same or different and are typically short chain alkyl groups such as methyl or ethyl.
  • the most effective phosphonic acids (halogenated or not) SAMs in this application have from 5 to 12 carbon atoms but from 1 to 21 will have some effect.
  • the performance of the treatments is assessed by measuring the distance the adhesive spreads away from the base of the item to be adhered to the test surface. For an untreated surface in ceramic the spread is typically 2mm. For an untreated metal it is typically 1 mm. After treatments described above the bleed is reduced to approximately 30 ⁇ m for ceramic or metal using the thiol and alkanoic acid treatments.
  • SAM treatments produce mono layers, and such monolayers are resistant to removal by solvent cleaning processes.
  • the presence of SAM monolayers on ceramics and metals treated as above has been confirmed with XPS both before and after solvent cleaning.
  • the protection of the metal from alkanoic acid by the alkanethiol mono layer has also been shown with XPS.
  • bleed distance as a function of a fluorinated carboxylic acid SAM chain length. Note that the bleed distance is shown on a logarithmic scale. It can be seen that the bleed distance reduces dramatically as the number of carbon atoms in the SAM increases.
  • the shear strength of epoxy bonds to the ceramics was not affected by the coatings, with joints failing cohesively for both coated and uncoated samples.
  • the SAMs were shown to be thermally stable, being unaffected by heat soaking at 150°C for 12 hours, augmenting their suitability as a solution to the problem of bleed.
  • the measured shear strengths of the commercial adhesives (on the ceramics) were 34.6N/mm 2 and 23.9N/mm 2 respectively, both before and after the ceramics were treated.
  • the adhesives always underwent cohesive failure, showing that there was no strength reduction at the interface. This has been done repeatedly with 4 lengths of fluorinated carboxylic acid, with all 3 epoxy adhesives described above.
  • a silane SAM which has a stronger bond
  • the shear strength is reduced to almost zero and the failure mode changes to adhesive failure.
  • the surface energy is, however, higher than the fluorinated carboxylic acid SAM coated surfaces.

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
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Claims (14)

  1. Verfahren zum Behandeln einer elektronischen oder optoelektronischen Komponentenoberfläche, die mit Klebstoff bondiert werden soll, wobei die Oberfläche mindestens ein Keramikmaterial umfasst, wobei das Verfahren durch Aufbringen einer Beschichtung gekennzeichnet ist, die eine Reduktion der Oberflächenenergie der Oberfläche verursacht, und des Weiteren Folgendes umfassend:
    das Aufbringen der Beschichtung durch Aussetzen der Oberfläche einer Lösung gegenüber, die unter irgendeinem von einer Alkansäure, einer Alkylphosphonsäure, einem Ester einer Alkylphosphonsäure, einer Arylphosphonsäure, einem Ester einer Arylphosphonsäure, einer Alkenylphosphonsäure und einem Ester einer Alkenylphosphonsäure ausgewählt wird.
  2. Verfahren nach Anspruch 1, wobei die Beschichtung eine selbstorganisierende Monoschicht umfasst.
  3. Verfahren nach Anspruch 1 oder 2, umfassend das Verwenden irgendeiner Lösung umfassend ein Molekül, das eine lineare Kohlenstoffkette aufweist, und einer Lösung umfassend ein Molekül umfasst, das eine verzweigte Kohlenstoffkette aufweist, und wobei bevorzugt eine Alkylgruppe irgendeiner von der Alkansäure, der Alkylphosphonsäure oder dem Ester einer Alkylphosphonsäure die Formel CnH(2n+1) aufweist und wobei bevorzugt in dem Fall, in dem eine Alkansäure verwendet wird, die Alkansäure eine Fluoralkansäure der Formel CnF(2n+1)COOH umfasst und wobei bevorzugt eine Kettenlänge der Alkansäure zwischen 8 und 21 Kohlenstoffatomen liegt.
  4. Verfahren nach einem der Ansprüche 1 bis 3, wobei die Beschichtung aufgebracht wird, um die Oberflächenenergie der Oberfläche um mindestens 50 mN/m zu reduzieren.
  5. Verfahren nach einem der Ansprüche 1 bis 4, wobei die Oberfläche des Weiteren mindestens eine Region aus Metall umfasst, wobei das Verfahren vor Aussetzen der Oberfläche einer Lösung gegenüber, um eine selbstorganisierende Monoschicht aufzubringen, das Aussetzen der Oberfläche einer Lösung, die Alkanthiol umfasst, gegenüber umfasst.
  6. Verfahren nach Anspruch 5, wobei das Alkanthiol irgendeines von einer verzweigten Kette, der Formel CnF(2n+1)SH, einer Kettenlänge zwischen 5 und 21 Kohlenstoffatomen und einer Kettenlänge zwischen 5 und 12 Kohlenstoffatomen aufweist.
  7. Verfahren nach Anspruch 5 oder 6, wobei die Oberfläche des Metalls und die Oberfläche des Keramikmaterials etwa gleiche Oberflächenenergien aufweisen.
  8. Elektronische oder optoelektronische Komponente, die ein Substrat aufweist, das eine Keramikoberfläche umfasst, wobei das Substrat durch eine Oberflächenbeschichtung gekennzeichnet ist, die die Oberflächenenergie des Substrats reduziert und wobei die Beschichtung unter irgendeinem ausgewählt ist von einer Alkansäure, einer Alkylphosphonsäure, einem Ester einer Alkylphosphonsäure, einer Arylphosphonsäure, einem Ester einer Arylphosphonsäure, einer Alkenylphosphonsäure und einem Ester einer Alkenylphosphonsäure.
  9. Elektronische oder optoelektronische Komponente nach Anspruch 8, wobei die Beschichtung eine selbstorganisierende Monoschicht umfasst.
  10. Elektronische oder optoelektronische Komponente nach Anspruch 8, wobei die Beschichtung eine von einer linearen Kohlenstoffkette und einer verzweigten Kohlenstoffkette umfasst.
  11. Elektronische oder optoelektronische Komponente nach Anspruch 8, wobei eine Alkylgruppe von irgendeinem von der Alkansäure, der Alkylphosphonsäure oder dem Ester einer Alkylphosphonsäure die Formel CnH(2n+1) aufweist und wobei in dem Fall, in dem eine Alkansäure verwendet wird, die Alkansäure bevorzugt eine Fluoralkansäure der Formel CnF(2n+1)COOH umfasst.
  12. Elektronische oder optoelektronische Komponente nach einem der Ansprüche 8 bis 11, die eine Oberflächenenergie aufweist, die 50 mN/m geringer ist als diejenige eines äquivalenten Substrats ohne die Oberflächenbeschichtung.
  13. Elektronische oder optoelektronische Komponente nach einem der Ansprüche 8 bis 11, wobei das Substrat des Weiteren mindestens eine Oberflächenregion aus Metall umfasst, wobei die Oberfläche des Substrats des Weiteren eine Beschichtung auf der Metalloberfläche aufweist, die unter Anwendung eine Alkanthiols aufgebracht worden ist, wobei das Alkanthiol eines von einer verzweigten Kette, der Formel CnF(2n+1)SH, einer Kettenlänge zwischen 5 und 21 Kohlenstoffatomen und einer Kettenlänge zwischen 5 und 12 Kohlenstoffatomen aufweist.
  14. Elektronische oder optoelektronische Komponente nach Anspruch 8, worin die Beschichtung eine Monoschicht aus Carbonsäure aufweist, die die Haftung zwischen einem Kleber und der Oberfläche nicht reduziert.
EP10787432.3A 2009-12-04 2010-12-03 Oberflächenbehandlungen und beschichtungen Active EP2507186B1 (de)

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US26661109P 2009-12-04 2009-12-04
PCT/EP2010/068858 WO2011067383A1 (en) 2009-12-04 2010-12-03 Surface treatments and coatings

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WO2011067383A1 (en) 2011-06-09
MY165210A (en) 2018-03-05
EP2507186A1 (de) 2012-10-10
US20120282473A1 (en) 2012-11-08

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