EP2499428A2 - Lighting device - Google Patents

Lighting device

Info

Publication number
EP2499428A2
EP2499428A2 EP11701367A EP11701367A EP2499428A2 EP 2499428 A2 EP2499428 A2 EP 2499428A2 EP 11701367 A EP11701367 A EP 11701367A EP 11701367 A EP11701367 A EP 11701367A EP 2499428 A2 EP2499428 A2 EP 2499428A2
Authority
EP
European Patent Office
Prior art keywords
heat sink
cooling
light
cover
particular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11701367A
Other languages
German (de)
French (fr)
Inventor
Nicole Breidenassel
Guenter Hoetzl
Fabian Reingruber
Simon Schwalenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102010001046A priority Critical patent/DE102010001046A1/en
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to PCT/EP2011/050444 priority patent/WO2011089069A2/en
Publication of EP2499428A2 publication Critical patent/EP2499428A2/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66Details of globes or covers forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The invention relates to a lighting device having at least one at least partially transparent cover which covers at least one light source, in particular a light emitting diode, so that there is a hollow chamber between the at least one light source and the cover, and further has at least one cooling body structure, which is at least partially located in the hollow chamber and/or at least partially recessed in the cover.

Description

description

Light orrichtung The invention relates to a lighting device, in particular LED lighting device, in particular LED retrofit lamp.

Generally have LEDs at higher temperatures to lower brightness and lower lifetimes. An LED lamp typically includes a base, a heat sink, an LED module and a semi- / transparent lamp bulb or a semi- / transparent cover plate. With LED retrofit a heat sink is used for heat dissipation typically. The standing of the heat sink available space is limited, however, particularly for normbe ¬ bordered lamps, including through a space required for a piston and a driver electronics. Characterized the magnitude of the effectively usable volume for cooling and consequently the cooling capacity is limited.

It is the object of the present invention to avoid the aforementioned disadvantages at least partially and in particular a way to provide improved cooling for norm ¬ limited light emitting devices.

This object is achieved according to the features of the independent claims. Preferred embodiments are insbesonde ¬ re the dependent claims. The object is achieved by a lighting device, aufwei ¬ send at least one at least partially light-permeable cover which covers at least one light source, in particular light emitting diode, so that a cavity is present between the at least one light source and the cover, and having at least one heat sink structure partly is to ¬ least in the cavity and / or is at least partially embedded in the cover. The heat sink can this heat sink structure (s) are additionally entwärmt in the area of ​​the cover in and thus better cool without changing size and appearance of the lighting device needs to change. Sun can be removed for improved cooling inside the lamp standards greater heat loss ¬ lines.

The heat sink structure can in particular at least partially, and thus complete, be arranged in front of the at least one light source ¬. The determination 'before' / 'front' and 'rear' / 'rear' refers to the Hauptabstrahl ¬ direction or optical axis of the light source. In front of a light source means therefore positioned in the one half cavities before the at least one light source ( 'front half space ¬') which is centered by the main emission direction. For example, a light-emitting diode as a radiation-Lambertian radiator in the front half space, without further measures, but not 'cavities rear half' in the complementary thereto.

The lighting device may further comprise a heat sink base having a support surface for the at least one light source and with respect to the at least one light source rearwardly Toggle parent and / or laterally outward conventional heat sink structures. This heatsink base can correspond approximately to a conventional heat sink. The light source may be integrally ¬ placed directly on the heat sink base or secured, for example, be attached ¬ introduced by means of an adhesion paste or an adhesive film, or indirectly in the heatsink base, for example via a carrier substrate such as a submount, and / or a circuit board.

It is an embodiment that the at least one heat sink is perstruktur connected to the heat sink base. This can achieve a particularly effective heat conduction in at least one heat sink structure. It is a further embodiment that the at least one cooling body structure with the top surface of the heat sink base for the at least one light source is connected. The so resulting good thermal connection to the heat sink structure to the comparatively warm setting surface on which the min ¬ least sits a light source directly or indirectly, made ¬ light a strong heat flow in the cooling body structure (such as "internal" heat sink fins or heat sink struts), WO by results in improved cooling. Furthermore, a compact design is supported.

The at least one heat sink structure with the heat sink base, which together form the (total) heat sink, be made in one piece or in several parts. The at least ei ¬ ne heat sink structure may be, for example, a separately Herge ¬ notified heat sink part, which is connected to the heat sink base, in particular with the bearing surface, bonded or attached thereto. For an optimized thermal connection and mechanical stability, at least one heat sink structure ¬ be carried out with the heat sink base in one piece which is made for example of a piece.

The nature of the at least one light source is not limited. The at least one light source may comprise in particular ¬ sondere a semiconductor light source such as a laser diode and / or a light emitting diode.

The light-transmissive material of the cover may have a trans material parentes or translucent (milky white for example). The cover can with, in particular, be made art ¬ cloth, glass or ceramic.

The plastic can be in particular a thermally conductive and sufficiently temperature stable translucent plastic such as polycarbonate. It is optimized for better thermal conductivity configuration is that the light transmissive material has a higher backfilled with heat conductive particles plastic. Alternatively, the cover may comprise glass, in particular a thermally conductive glass having a thermal conductivity greater than 1.1 W / (mK), for example, Borofloat with 1.2 W / (mK). Alternatively, transparent ceramic may be USAGE ¬ det, which may have far higher thermal conductivity (for example, a transparent Alumi ¬ niumoxid-ceramics) as the light transmissive material. The increased thermal conductivity of the Abde- ckung heat may well be passed released into the ambient air ¬ through this.

For effective heat conduction, the heat sink structure consists of a thermally well-conducting material (heat conductivity> 15 W / (mK)), in particular of a metal or egg ¬ ner metal alloy, in particular comprising copper and / or aluminum. Characterized the material of the heat sink structure can effectively animals, the waste heat of the light source (s) in the front, cooler area of ​​the cover and / or of the cavity transported, resulting in better cooling.

It is an aspect that the cover is a plunger and the cavity, a piston (s) is flush. This embodiment is particularly suitable for an implementation of an LED-incandescent retrofit lamp advantageous. The piston may in particular have a spherical cap shape. The piston may then be mounted in particular with its edge on the top surface of the cooling body ¬ basis. Alternatively, the cover may be a disk-shaped cover for a funnel-shaped cavity. The at least one light source may be disposed at the bottom of the funnel. Such a cover is particularly advantageous for the realization of an LED Halogenreflektorlampenretrofitlampe.

The cover may in addition to its protective function generally have an optical function. can do this to-least regionally, etc., integrating one or more optical areas such as lens-like areas in the cover. The Cover B ¬ ckung can be used in other words, for a targeted beam guidance in terms of appearance.

It is an aspect that the cooling body structure, is at least partially disposed within the cavity which supports a thermal coupling with the cavity. The heat sink structure may be arranged completely inside the hollow space in particular, which facilitates manufacture of the cover.

It is an aspect that the cooling body is spaced from the cover at least partially. In such an embodiment is the cooling body structure and contains the cooling relevant cover side surfaces of the heat sink structure is preferably close to the (inner) wall of the cover, in particular at a distance from the cover of not more than 10 mm, in particular of not more than 3 mm , in particular of less than 1 mm. The position of the heat sink structure (s) near the wall is better given the heat from the heat sink structure to the respective coverage areas and submitted by them to the environment.

Alternatively or additionally, the heat sink structure may rest on the cover.

It is yet an embodiment that the cooling body structure at least partially surrounded by a light-transmissive material of the cover, in particular cast with it is. The use of plastic has, inter alia the advantage that the heat sink molded in a particularly simple manner with the cover, especially in those eingegos- sen, can be. The cooling body can at least partly project into the cavity and / or be at least partially surrounded by the lichtdurchläs ¬ sigen material of the cover. This gives a very good thermal and mechanical stability.

The heat sink structure can in particular completely surrounded by the light-transmitting material, in particular molded therein, his. This can simplify manufacturing. The heat sink structure may comprise at least one wire and / or thread. Here can be used for effective heat dissipation more wires and / or filaments. These have, among others, the advantage of easy and inexpensive encryption working properties on.

It is also an embodiment that the cooling body structure extends at least up to a center or mid-height of the cavity, in particular at least up to a obe ¬ ren quarter of the cavity, in particular to an upper tip of the cavity.

In other words, the heat sink structure may project so far to the front or above in that it has at least a height of hmax / 2, in particular of at least hmax-3/4, in particular of hmax with respect to a maximum height hmax of the cavity from the at least one light source. That the Kühlkör ¬ perstruktur to an upper tip of the cavity is sufficient, meaning that it extends at least over the entire height of the cavity. Extending the heat sink structure also through the cover or part of it, then extends in particular also at least over the entire height of the cover, ie, up to its outer tip. By extend the cooling body structure (s) into the front portion of the cavity, these are surrounded with cooler air, because the cavity in its front region is cooler than in the lower and rear region near the heat sink attachment surface and the light source (s). Consequently, the cooling ¬ body structure is so much the better cooled, the further it extends forward, the more its surface is located in the front part of the cover and / or the cavity. A greater cooling ¬ surface in the front portion of the cover and / or the cavity is also optically, for example, for LED retrofit advantageous because LEDs have a stronger forward radiation than incandescent lamps, so that a lower side and a larger Frontabschattung the radiation characteristic of the LED lamp of the emission of the light bulb can approach further.

It is a further embodiment that the heat conduction in the heat sink structure in the front region of the cover and / or of the cavity occurs substantially along an inner side of the cover. This heat dissipation through the cover out into the environment will take place on the way towards the front of the cover.

It is a further embodiment that the cooling body structure replaces a part of the cover (that is, the light-transmitting material), in particular a front part of the Ab ¬ cover and / or the cavity. In this embodiment, the heatsink structure can therefore be at least partially present instead of the light transmissive material of the cover. Thereby, in particular having an exposed surface to the outside part of the cooling body structure. The He set ¬ for example the front part of the cover by the exposed to the outside part of the cooling body structure made possible by the direct contact of the heat sink surface to the ambient air, a particularly effective cooling.

It is yet a further embodiment, the heat sink structure rotationally symmetrically arranged Kühlkörperstruktu ¬ ren, in particular cooling struts have. This makes it possible to share a large area comparable emitted by the LEDs heat, which increases the cooling capacity. The cooling struts may be particularly free-standing.

In general, the heat sink structures may be arranged in the area of the cavity from a thermal viewpoint that they are far apart as possible and so distribute the heat großflä ¬ chig. Rotationally symmetrically arranged, in particular internal elements of the heat sink structure, for example fins or struts, are far apart, whereby their mutual thermal interference is minimized and they are located in a relatively cool environment, and thus better cool.

In a thermally optimized variant beispielswei- se any cooling structures (cooling struts / ribs / Areas, etc.) to be rotationally symmetrical about the mounted on the heat sink base LEDs. Since the cooling capacity also depends on the size of the pointing to the cover struts cooling surface, wherein a rotationally symmetrical arrangement, a reduced number of thicker cooling struts and a larger number of thinner cooling struts can lead to approximately the same cooling capacity. Thinner cooling struts can be designed, among other things as wires or threads. It is a further development that the cooling at least struts from ¬ cut, a comprise to the cover, in particular Col. ¬ ben, towards widened cross-sectional shape. Thereby can be kept large directed toward the cap area for a large heat transfer to the cover, while at the same low ¬ can be supported th optical shading.

It is a further embodiment that the cooling body structure, in particular cooling strut at least in sections a comprise to the cover, in particular piston toward Spread ¬ ternde cross-sectional shape. An example inwardly constricted and wider outward cross-section of the cooling struts on the one hand be sufficiently large to allow a good flow of the heat in the front area of ​​the cover and / or of the cavity, and on the other hand, a largest possible surface of the individual cooling struts (or a to let the cover adjacent to Ren on the other heat sink structure), which increases the cooling power. A broadening of the heat sink, in particular by cooling struts in the front part of the cover and / or of the cavity thus provides a particularly effective cooling surface. From optical point of view such a constricted inwardly and outwardly broader cross-section of the cooling bars is also favorable since the shading of the emitted light from the LEDs by the internal heat sink structure may be reduced with this. A cross-sectional shape of the heat sink structure is generally a thermal-optical compromise. The cross-sectional shape should be selected from a thermal viewpoint so that the cooling ¬ body is on the one hand large enough to conduct the heat efficiently into the cavity or region of the cover, and on the other hand results in a as large as possible adjacent to the cover surface. This can apply to any or all of the cooling struts. Another suitable cross-section for a compact variant, sitting in the center LED light source may, for example, a conical, pointed toward a center of the cross section zulaufen- be with a round, adapted to the course of the Abde ¬ ckung outer edge.

It is yet a further embodiment, that a major part of the surface (> 50%) is the heat sink structure to a front half of the cover and / or the cavity. This increases the heat dissipation on. Under the front half of the one half is understood, which is ent ¬ removed calculated from the at least one light source the furthest forward.

In a thermally enhanced embodiment, the cooling body structure as large a surface in or on the front portion of the cover and / or of the cavity, and in particular may be in the front half of the cavity preferably more than 5%, in particular more than 20%, in particular ¬ sondere more than 50% of the heat sink surface are, in particular of a pointing to the cover Kühlkörperoberflä ¬ surface of a cooling body structure, located in the cavity. When located in the cavity of the cooling body structure generally a particularly relevant cooling contact with the cover preferably takes place in the front portion of the cover and / or the cavity.

It is yet an embodiment that the cooling body structure, converges in a front region of the cover and / or of the cavity, in particular on its top. This embodiment can be used, in particular, having a mirror or diffusely scattering cover. A convergence of the cooling body structure, in particular by cooling struts in the front part of the cover creates an even more effective cooling surface. In addition, there is a stability and manufacturing technology advantageous embodiment.

It is also an embodiment that at least some of the cooling body structure has an optically active, in particular specular (specular) reflective or diffuse (scattering), surface che. This allows a beam guide and Lichtab ¬ radiation characteristics are specifically influenced. The optically active surface can include, for example roughening, a coating and / or painting. This can be realized in a simple manner beam guidance and / or spatial homogenization of the light emitted from the light emitting device light.

It is yet an embodiment that the cooling body structure having a shape adapted to a beam guide position and / or shape. In an optically matched variant external cooling body struts may further lead to lower light loss, while more internal heat sink struts lead to improved homogeneity of the light radiation.

It is also an embodiment that the cooling body structure having a (centered) center column that on ¬ record area forward protrudes from the up to the cover. Through the central column, the heat can be a large area, further guided by the Kühlkörperba ¬ sis, particularly bearing surface in the center column and the central column in the front region of the cover, which supports a particularly effective cooling under ¬.

It is a further development that the central column is stretched in a front region at least partially laterally further ER as a group of at least two the center pillar surrounding light sources. The light sources may be arranged annularly around the central column, for example around, eg with a central recess for the center column. This results in the advantages that no or no substantial optical frontal shading occurs due to the center column and easier manufacturability and / or assembly of the heat sink structural ¬ structure results with the heat sink base.

In addition, the center pillar as a reflector and / or a diffuser can be used to amplify a lateral light emission.

It is still a further development that the lighting device is a Retrof it lamp, in particular incandescent retrofit lamp. In such an embodiment, the invention can be used particularly advantageous as retrofit lamps are normbe ¬ bordered lamps.

The lighting device can generally te a lamp, a luminaire, a lighting system and / or a part of it. In the following figures the invention is described schematically in more detail with reference to embodiments. Identical or identically acting Ele ¬ elements may be provided with the same reference numerals for clarity.

Fig.l shows a side view of an LED according to the invention

Retrofit lamp according to a first embodiment;

2 shows a sectional side view of the

LED retrofit lamp according to the first embodiment; 3 shows in side view a first part of a two part heat sink, the LED retrofit lamp ge ¬ Mäss the first embodiment;

4 shows a side view of the whole body of the cooling

LED retrofit lamp according to the first embodiment; 5 shows in a view obliquely from above erfindungsge ¬ Permitted LED retrofit lamp according to a second exporting ¬ approximate shape;

6 shows in side view, the LED retrofit lamp according to the second embodiment;

7 shows an enlarged detail of Figure 6;

8 shows in plan view, the LED retrofit lamp according to the second embodiment;

9 shows a side view of an LED retrofit lamp according to a third embodiment;

10 shows in plan view, the LED retrofit lamp according to the third embodiment;

11 shows a side view of an LED retrofit lamp according to a fourth embodiment;

12 shows a side view of an LED retrofit lamp according to a fifth embodiment;

13 shows in plan view, the LED retrofit lamps according to the fourth and fifth embodiments;

14 shows in plan view a schematic of a Schnittdar ¬ position by a piston chamber of an LED retrofit lamp according to a sixth embodiment; 15 shows a sectional side view of a sketch of a LED retrofit lamp according to a seventh embodiment;

16 shows a sectional view in a plan view

Sketch of the LED retrofit lamp according to the seventh from ¬ guide die;

17 shows a sectional side view of an

Sketch of an LED retrofit lamp according to an eighth embodiment;

18 shows a sectional view in a plan view

Sketch of LED retrofit lamp according to the eighth off ¬ management form;

19 shows a sectional side view of an

Sketch of an LED retrofit lamp according to a ninth embodiment;

Figure 20 shows a sectional plan view illustration of a

Sketch of the LED retrofit lamp according to the ninth From ¬ guide die;

21 shows a perspective view of a sketch of a LED retrofit lamp according to a tenth exporting ¬ approximate shape;

Figure 22 shows a sectional view in a plan view

Sketch of the LED retrofit lamp according to the tenth From ¬ guide die;

23 shows a sectional side view of an

Sketch of the LED retrofit lamp according to the tenth From ¬ guide die;

24 shows in side view a drawing of parts of a

LED retrofit lamp according to an eleventh exemplary form;

Fig.25 shows, as a sectional side view of an

Sketch of an LED retrofit lamp according to a twelfth embodiment;

Fig.26 shows, as a sectional side view of an

Sketch of an LED retrofit lamp according to a three ¬ tenth embodiment; 27 shows a sectional side view of an

Sketch of an LED retrofit lamp according to a four ¬ tenth embodiment; and

Fig.28 shows, as a sectional side view of an

Sketch of an LED retrofit lamp according to a five ¬ tenth embodiment;

Fig.29 shows, as a sectional side view of an

Sketch of an LED retrofit lamp according to a sixteenth ¬ tenth embodiment.

The Fig.l to Figure 28 show this example of an LED Retrofitglühlampe while Figure 29 shows an LED lamp Retrofithalogen-. However, the characteristics with respect to the LED Retrofitglühlampe shown are analogously also to the LED Retrofithalogenlampe used, and vice versa.

Fig.l shows in side view and Figure 2 shows as Schnittdar ¬ position in side view an LED retrofit lamp 1 according ei ¬ ner first embodiment. The LED retrofit lamp 1 has a base 2, a heat sink 3, an LED module 5 with Minim ¬ least on a light emitting diode (not shown.) And a lichtdurchlässi ¬ gene (transparent or opaque) piston 4. On the base 2, which may be designed for example as an Edison base or a bayonet base ¬, the LED retrofit lamp can be supplied with power. 1 The current is via a driver circuit (not shown.) Supplied to the at least one light emitting diode of the LED module 5. The drive circuit is accommodated in a Treiberkavität 6, which is formed in the heat sink. 3 Thus, the heat generated by the driver circuit can be dissipated via the heat sink. 3

The heat sink 3 is constructed in two parts, with a heat sink base 3a, which has a contact surface, contact surface or support surface 7 for the LED module. 5 On the top surface 7 of the LED substrate is flat and made of good thermal conductive (for example, using a thermally conductive Haftmit ¬ means of such as a thermal grease or a TIM-adhesive tape) Toggle, more specifically, a carrier substrate (eg, a printed circuit board and / or a submount ) mounted on the top surface 7 of the heat sink base 3a with its back surface, while a front side is fitted with the at least one light emitting diode. In this case refers 'before' to an orientation in the z-direction (which is also the main emission direction of the at least one LED corresponds) and '(da) behind "or" backward' to an orientation opposite to the z-direction. The heat sink base 3a corresponds in shape to a forth ¬ conventional heat sink, the cooling fins 8, are rotationally symmetrical about the z-axis, which also corresponds to a longitudinal axis of the lighting device. 1 The cooling fins 8 are respectively arranged behind the LED module 5 of the at least one light source.

The spherical segment-shaped piston 4 arched over the LED module 5, and thus the at least one light emitting diode, so that one light emitting diode or a hollow piston chamber 9 is formed between the piston 4 and the LED module 5 at least. The piston 4 also arched laterally at least a portion of the cooling fins 8, wherein said fins 8 are exposed for better cooling effect partly directly to the environment. The second part of the cooling element 3 consists of a Kühlkör ¬ perstruktur 3b which is here rotationssymmet ¬ driven arranged in a ring cooling fins 10 which connect to the front of the fins 8 of the heat sink base 3a. The cooling fins 10 are adjacent to the piston chamber 9 by domestic nerhalb of the piston chamber 9 are housed, with a small distance of less than 1 mm to the piston 4. The cooling fins 10 in this case have a directed on the piston 4 circular segment-shaped contour on, which follows the shape of the piston 4, while on the inner side which is directed towards the light-emitting diodes out is perpendicular to the top and front. The cooling fins 10 have a height along the z-dimension which is approximately the maximum height hmax Ή of the piston chamber 9 between the light emitting module 5 and the at least one light emitting diode and an apse or peak 11 corresponds to the piston chamber. 9 The heat sink base 3a and the heat sink structure 3b can for example be glued together.

3 shows 3a, the heat sink base in side view. An upper deck surface of a cylindrical central part 3c serves as the support surface 7, while in the central part 3c, the Treiberkavität is housed. 6 The heat sink base 3a is of a conventional construction.

4 shows in side view the entire heat sink 3, the LED retrofit lamp 1 with the heat sink base 3a and the cooling body structure 3b. The additional cooling fins 10 sit on the fins 8 and protrude from these from the front (in the z direction), first side of the top surface 7 and 7 prior to the attachment surface, the thickness of the fins 8 and 10 is constant and equal.

5 shows in a view obliquely from above and Figure 6 shows in side view an inventive LED retrofit lamp 21 ge ¬ Mäss a second embodiment. The LED Retrofitl ampe 21 is basically constructed similarly to the LED retrofit lamp 1 of the first embodiment as an LED incandescent retrofit lamp and includes like this a base 22, a heat sink 23, an LED module 25, and a light-transmissive envelope 24.

The piston 24 can be made of plastic, which enables a particularly low-cost manufacturing and lightweight design, or glass, for example borofloat what a good old ¬ weathering resistance and scratch resistance results.

The LED module 25 includes a circular circuit board 32 on which a rotationally symmetrical about a longitudinal axis L of the LED retrofit lamp 21 six forward radiating (in z-direction) of white light emitting diodes are mounted 33rd The circuit board 32 is fitted in other words with a plurality of light-emitting diodes 33 in an annular arrangement. Merely for ease of representation position line ducts and pipes, etc., are not shown to the situated in an Treiberkavität of the heat sink 23 drivers.

The heat sink 23 may be made in one piece, although it may be notionally divided into two parts, namely a heat sink base 23a and substantially in front of the light emitting diodes 33 arranged ¬ cooling body structure 23b. The heat sink base 23a has a support surface 27 for attachment or mounting the LED module 25 as well as including or Behind all radially and with respect to the longitudinal axis L arranged, outwardly directed cooling fins 28th

The cooling body structure 23b is also connected to the Aufsatzflä ¬ surface 27 with the heat sink base 23a, in rapid dialer direction (r direction) outside of the circuit board 32 of the LED module 25. The heat sink structure 23b has six perpendicularly from the top surface 27 upwardly extending cooling strut 30 which is 29 curva- men and streamline progresses height inwardly towards the tip 31 of the piston chamber thereby. The cooling members 30 thus extend substantially over the entire height of the piston chamber 29. The free ends or tips of the cooling struts 30 do not touch. The cooling struts 30 are constructed driven for effective cooling with respect to the longitudinal axis L rotationssymmet-. The cooling struts 30 further comprise a flattened in the direction of the piston 24 surface 34 which contacts the piston 24 does not, but is spaced a small distance of about 1 mm or less to do so. The shape of the cooling members 30 and the slightly more than a hemispherical ¬ shaped designed shape of the piston 24 are adapted to seat the piston 24 to the heat sink 23, namely here at an outermost edge of the top surface 27 of the heat sink base 23a, as shown in an enlarged section shown in Figure 7. 8 shows the LED retrofit lamp 21 in plan view. The cooling ¬ struts 30 are arranged at a maximum distance from the peripheral light-emitting diodes 33 so that only a small fraction of the emitted light from the LEDs 33 is blocked by the cooling struts 30th The cooling struts 30 are not located in their arrival words, above the light-emitting diodes 33, but laterally thereof.

During operation of the LED retrofit lamps 1 and 21, the light-emitting diodes 33 to warm due to their power dissipation. This heat is 9 or 29, becomes a greater part on the circuit board 32 to the top surface 7 and 27 of the heat sink 3 and 23 abgege ¬ ben and heated to a small part of the piston chamber by a heat spreading in the heat sink 3, 23 some of the heat to the cooling fins 8, passed 28 and emitted from there to the surroundings. However, the Oberflä ¬ surface of the cooling fins 8, 28 due to a limited provided for suitability as an LED retrofit lamp form factor.

For more effective cooling or heat dissipation, the heat is also semi-DES in the cooling body structure 23b (cooling fins 10, cooling members 30) is derived and heats it. Thus, heat in the piston chamber 9, 29 and above the piston 4, 24 is passed amplified. By the extension of the cooling structure 10, 30 over more than half the height of the piston chamber 9, 29, a front region is heated in particular, which is otherwise comparatively cool. Thereby, the piston 4, 24, in particular ¬ sondere in its front area is heated more strongly and emits more heat than accordingly without the cooling structure 10, 30. Figure 9 shows in side view and Figure 10 shows in plan view an LED retrofit 41 according to a third execution ¬ form. the LED retrofit lamp 41 is similar to the LED retrofit lamp 21 according to the second embodiment except that the heat sink structure is shaped differently 43b of the cooling body 43. The heat sink part 43b is now configured such that six rota ¬ tion arranged symmetrically to the longitudinal axis of the cooling struts 43c similar to the cooling members 30 initially perpendicularly from the top surface of the cooling body 43 to the front or top hochra ¬ gene. In contrast to the second embodiment through the cooling struts 43c in a front or upper half of the piston 24 gradually domed together, thus form a closed 43d dome-shaped heat sink structure. Characterized there is a predominant part of the surface of the cooling body structure 43b in a front portion or a front half of the piston chamber 29. The dome-shaped heat sink structural ¬ tur 43d does not cover the light-emitting diodes 33, is blocked or, however, reflected (diffusely or specularly) a greater portion of light as the retrofit lamp 21 according to the second embodiment. Thus, a light distribution, which is directed more to the front through the use of the light-emitting diodes 33 (in the direction of the z-axis) than in a herkömmli ¬ chen bulb can be approximated closer to the light distribution of a conventional light bulb. In addition, a front portion of the piston chamber 29 and the piston 24 is heated more than in the second embodiment, so that heat can be dissipated more effectively. Furthermore, the cooling body structure 43b is mechanically stable.

11 shows a side view of an LED retrofit lamp according to a fourth embodiment. The LED retrofit lamp 51 is similar to the LED retrofit lamp 41 according to the third embodiment except that the heat sink structure is located substantially in front of the LEDs 33 is designed differently 53b of the heat sink 53rd The cooling struts 53c go here not gradually or continuously into one another, but rather go directly into a spherical cap-shaped or cup-shaped cap 53d on which is disposed in a front portion of the piston chamber 29th Here too, the front portion of the piston chamber 29 and the piston 24 is heated more than in the second embodiment, so that heat can be dissipated more effectively. Furthermore, the heat sink structure 53b is mechanically stable. The heat sink structure 53b may be spaced from the piston 24, or at least in part, directly adjacent to the piston 24 and contact this. Direct contact improves Wärmelei ¬ processing of the heat sink structure 53b in the piston 24th

12 shows a side view of an LED retrofit lamp 61 according to a fifth embodiment is similar to the LED retrofit lamp 51 according to the fourth embodiment. In contrast to the fourth embodiment is now the cup-shaped cap replaced 63d of the situated in front of the light emitting diodes 33 heat sink part 63b of the heat sink 63 a part of the light ¬ permeable material of the piston 64 and thus provides a part of the piston. This means there is the cap 63d at its geek ¬ te against exposed to the environment, which increases heat loss to the environment. In your inside the cap 63d is adjacent to the piston chamber 29 and can thus dissipate except brought up through the cooling struts 63c heat directly and extensively heat from the piston chamber 29th 13 shows in plan view an embodiment of the LED retrofit lamps 51, 61 according to the fourth and the fifth embodiment. Again, the light-emitting diodes 33 are not covered directly by the cooling body part 53b and 63b, respectively, in particular the cap 53d and 63d.

14 shows in plan view a schematic of a Schnittdarstel ¬ lung by a piston chamber 9 of an LED retrofit lamp 71 according to a sixth embodiment. In the piston 4 cooling struts 73 are rotationally symmetrically mounted, of which are shown here only three. The cooling struts 73 laterally surround a single, centrally mounted light-emitting diode 33. The cross-sectional shape of the cooling bars 73 is triangular with a pointed edge 74 of the respective cooling strut is directed to the centrally mounted light emitting diode 33 73 and the edge 74 opposite flat surface 75 of the piston 4 on opposite ¬. The cooling struts 73 are attached beabstan- det of the piston. 4 Due to the broad face 75, a more effective heat transfer from the respective cooling strut 73 results on the piston. 4

A surface of the cooling struts 73 is configured (diffuse or mirror-gelnd) reflective, so that this will be the laterally emitted from the light emitting diode 33 light homogenization ¬ Siert further by pass some light beams LI just between the cooling struts 73 and other light beams L2 from the cooling struts 73 are deflected.

Of course, other, possibly above the height varying cross-sectional shapes (oval, round, rectangular or polygonal, etc.) and cross-sectional sizes usable. 15 shows a sectional side view, and Figure 16 shows a sectional representation in plan view of each egg ¬ ne sketch of an LED retrofit lamp 81 according to a seventh From ¬ guide die. The cooling body 83 now has a heat sink structure which telsäule in the form of a centrally located joint 83b upstanding from the top surface 27th The lower contact surface or the lower portion of the center pillar 83b is surrounded by an annularly arranged set of the LEDs 33 sideways. Forward, that is, with increasing height, the central column 83b streamlined first, to then expand again in a star shape in a front region. The front portion of the center pillar 83b extends to the top of the piston chamber 29, and thus assumes the central column 83b the full height of the piston chamber 29 a. The center pillar 83b does not cover the light-emitting diodes 33, but spaced projections 84 or 'radiation' of the star-shaped widening range in the circumferential direction laterally across the light-emitting diodes 33 also. The use of the central column 83b has the advantage that they can have a major proportion of at ¬ flow area 27 (using a ring-shaped LED board) and the board contact, thereby achieving a very good heat dissipation from the heat sink base 23a. The central column 83b is the effective thermal conductivity of a solid material such as a metal. Due to the large upper ¬ surface in the front part of the piston chamber 29 and possibly a contact of the piston 4 also a good Wärmeablei ¬ processing is achieved to the outside. The curved shape of the center column 83b supports a (diffuse or specular) reflection of light to homogenize the light output in a height direction.

17 shows a sectional side view, and Figure 18 shows a sectional representation in plan view of each egg ¬ ne sketch of an LED retrofit lamp 91 according to an eighth From ¬ guide die. The LED retrofit lamp 91 is now equipped with a arranged in front of a plurality of light-emitting diodes 33 heat sink structure which, in the piston cavities between the light emitting diodes 33 29 perpendicularly upstanding plate-shaped fins 93b has, which extend over the entire height of the piston chamber 29th The cooling fins 93b are aligned in plan view to a center of the piston chamber 29 toward and thus limits Benach ¬ disclosed LEDs 33 against each other. Homogenization of the light emitted by the light emitting diode 33 light is achieved by a reflective surface of the cooling fins 93b. Also, the cooling fins 93b can be ausgebil ¬ det completely or partially specularly reflecting or diffusely reflecting (scattering). The cooling fins 93b also have a large contact area with the top surface 27 or on the board. Since ¬ by that widen the cooling fins 93b to the front (in the z direction) through a heat conduction into the front portion of the piston 4 is supported. 19 shows a sectional side view, and Figure 20 shows a sectional representation in plan view of each egg ¬ ne sketch of an LED retrofit lamp 101 according to a ninth embodiment is similar to the seventh embodiment. In contrast to the seventh embodiment, the center column 103b now covers the main emission direction of the LEDs 33, which are arranged on an annular circuit board 106 to the center column 103b around. In other words, the center column 103b now covers the light emitting diodes 33, whereby the front emission direction is further suppressed and the light emitted from the light emitting diode 33 light is more strongly emitted laterally. This may be preferred in a seitenemittieren- the application, for example, such as ceiling lamps, corridor lamps or for a bathroom mirror lamp. 103b can bordering on the piston space 29 ¬ surface of the center pillar to particular specular or specular or diffuse be reflec ¬ rend configured. The reflection can be effected as in the other embodiments, for example, by an appropriate coating.

21 shows in a perspective view, Figure 22 shows a sectional representation in plan view, and Figure 23 shows, as a sectional side view, respectively, a diagram of a LED retrofit lamp 111 according to a tenth embodiment. The heat sink also has a heat sink structure that tall in the form of a centrally located center column 113b of the attachment surface 27th The center column 113b includes an up to an upper tip of the piston chamber 29 leading waisted 'master' 113c for good heat dissipation from the top surface 27th The stem 113c is surrounded by a front side fitted with the light emitting diodes 33 annular board. At its front end laterally rotationally symmetrically arranged strips extend from the root 113c from 113d. These strips 113d do not overlap the light emitting diodes 33rd The illustrated 'palm-shaped' center column 113b, a component can be of the forward set by the strips 113d light incident in a simple manner, for example by a width and / or length of the strips 113d. As a result, the emitted light intensity to the front with simp ¬ chen means can be adjusted. The strips 113d may be reflective, at least in the downward direction or adjacent the piston chamber 29 to increase a light output and a laterally directed and downwardly light component. 24 shows a sectional side view 123d a sketch of an LED retrofit lamp 121 according to an eleventh exporting ¬ approximate shape, which is a variant of the tenth embodiment in that now from the top of the stem 123c instead of the single strip has a curved grid-like or umbrella-rib-like cooling structure going on. This increases the shading forward and a mechanical stability. Here, too, a good heat conduction is achieved tung from this front area into and through the mainly in a front portion of the piston chamber 29 and also the piston 4 EXISTING ¬ dene surface of the cooling body structure 123b.

Fig.25 shows in side view a drawing of parts of a LED retrofit lamp 131 according to a twelfth embodiment. Unlike the tenth embodiment, a ge ¬ arched, dome-like cap is now 133d on the tip of the stem 133c of the heat sink structure 133b. This 'anchor-shaped' From ¬ design increases the shadowing forward and a mecha ¬ African stability. Fig.26 shows, as a sectional side view of a sketch of a LED retrofit lamp 141 according to a thirteenth embodiment. Here 27 seated cooling struts 143b run on the top surface of a ring segment up and come together at the top 145 of the piston 144. The cooling struts 143 b of the heat sink structure alternate with transparent regions 149th For this purpose, the material of the light transmitting regions has been introduced into the interspaces between the cooling ¬ strive 143b 149, for example, sprayed in a light-transmissive plastic. This configuration results due to the direct exposure of the cooling struts 143 b in particular around a particularly good heat dissipation. The cooling struts 143b, for example, may consist of a carbon material such as graphite, etc. of a metal or an alloy.

Alternatively, the cooling struts can also 143b whole or in part from the translucent material surrounded, for example, molded, be. Such a configuration can be produced more easily and give a more pleasing appearance.

27 shows a sectional side view of a sketch of a LED retrofit lamp 151 according to a fourteenth embodiment. Instead of with respect to their cross-section thicker cooling struts thin wires cooling or cooling filaments 153b will now be used as the cooling body structure. The cooling filaments 153b extend from a top surface of the heat sink base to the tip of the plunger 154. The cooling yarns 153b may be cast 154 in particular in the light transmitting material of the bulb. As the cooling threads 153 b as silver threads, graphite fibers, copper wires or threads etc. can be used. Although a single cooling thread 153b allows a lower thermal conductivity than a single cooling strut, but the cooling threads can be used in greater numbers 153b. The cooling threads can cause a more uniform shading. Fig.28 shows, as a sectional side view of a sketch of a LED retrofit lamp 161 according to a fifteenth embodiment is similar to the fifteenth embodiment using cooling threads 163b as the heat sink structure of the heat sink. In addition to the surface of a Aufsatzflä- of the heat sink or by a (massive) Kühlkörperba ¬ sisteil to the tip of the piston 164 running cooling threads 163b circumferential cooling threads 163c are provided in the circumferential direction, which further improve heat dissipation. The cooling threads 163c stand by in thermal contact with the cooling threads 163b and can for example be made using this integrally formed as a net-like structure, which may be potted in particular in the light transmitting material of the bulb 164th

Fig.29 shows, as a sectional side view of a sketch of a LED retrofit lamp 171 according to a sixteenth embodiment. The LED retrofit lamp 171 is formed as a retrofit lamp for a halogen lamps.

The LED retrofit lamp 171 includes a heat sink base 173a, which is substantially funnel-shaped and rearwardly into a socket 172, for example a Bajonettso ¬ ckel, passes. An upper opening of the funnel is covered ¬ by a disk-shaped light transmitting cover 174 abge, so that the heat sink base 173a and the cover 174 form a cavity 179th On the bottom of the funnel serving as the heat sink base 173a socket 172 at least one light-emitting diode 33 is mounted, which has a vertically upwardly through the cover 174 main emission. The cavity 179 is thus formed substantially between the at least one light emitting diode and the cover 174th

While conventionally the heat sink base 173a has on its outside cooling fins 178 for dissipating waste heat least one light emitting diode 33 generated by the Any artwork, the inside of the funnel 177 is generally smooth and thus has kei ¬ ne heat sink structures.

In the embodiment shown in the cavity 179 a heat sink structure in the form of upstanding cooling struts 173b is introduced. The cooling struts 173b are provided on the bottom of the hopper and the base 172 and extend over the entire height of the cavity 179 until they contact the cover 174th Characterized a further 'heat channel' of the base 172 is formed to the cover 174, which supports a Wärmeablei ¬ processing of the light-emitting diode mindestes a 33rd Depending ¬ but other heat sink structures can be used to advertising, for example, analogously to those shown in Fig.l to 28 shows embodiments.

Naturally, the present invention is not limited to the embodiments shown.

Thus, all shown and further to be spaced in front of the at least one light source located heat sink structures of the piston, to replace this part and / or be surrounded by the light-transmitting material.

In general, combines features of the embodiments and / or replaced with each other. So elements shown in Fig.l to 28 shows incandescent retrofit lamp for the position shown in Figure 29 halogen spotlights retrofit ver ¬ turns may be, or for other lamp types such as line lamps, fluorescent tubes, etc.

LIST OF REFERENCE NUMBERS

1 LED retrofit

2 socket

3 heatsink

3a heatsink base

3b heatsink structure

3c midsection

4 piston

5 LED module

6 Treiberkavitat

7 bearing surface

8 fin

9 piston chamber

10 fin

11 tip of the piston chamber

21 LED retrofit

22 socket

23 Heatsink

23a heatsink base

23b heatsink structure

24 piston

25 LED module

27 bearing surface

28 fin

29 piston chamber

30 cooling strut

31 tip of the piston chamber

32 board

33 light-emitting diode

34 surface of the cooling strut

41 LED retrofit

43 Heatsink

43b heatsink structure

43c cooling strut

43d dome-shaped heat sink structure

51 LED retrofit lamp 53 heatsink

53b heatsink structure

53c cooling strut

53d bowl-shaped cap

61 LED retrofit

63 Heatsink

63b heatsink member

63c cooling strut

63d bowl-shaped cap

64 piston

71 LED retrofit

73 cooling strut

Pointed edge 74 of the cooling strut

75 planar surface of the cooling strut

81 LED retrofit

83 Heatsink

83b center column

84 tip

91 LED retrofit

93b fin

101 LED retrofit

103b center column

106 annular board

111 LED retrofit

113b center column

113c tribe

113d strips

121 LED retrofit

123b heatsink structure

123c tribe

123d umbrella rib-like cooling structure

131 LED retrofit

133b heatsink structure

133c tribe

133d cap

141 LED retrofit

143b cooling strut 144 piston

145 top of the piston

149 light-transmitting area of ​​the piston

151 LED retrofit

153b cooling thread

154 piston

161 LED retrofit

163b cooling thread

163c cooling thread

164 piston

171 LED retrofit

172 socket

173a heatsink base

173b cooling strut

174 cover

177 inside of the funnel

178 outside

179 cavity

hmax maximum height of the cavity

L longitudinal axis

LI light beam

L2 light beam

z z-axis

Claims

claims
1. lighting device (1; 21; 41; 51; 61; 71; 81; 91; 101;
111; 121; 131; 141; 151; 161; 171), comprising
(4; 24; 64; 144; 154; 164) - at least one at least partially light-permeable cover which covers at least one light source (33), in particular light-emitting diode, so that between the at least one light source (33) and the cover a cavity ( 9; 29) is present, and
- at least one cooling body structure (3b; 23b; 43b-43d;
53b-53d; 63b-63d; 73; 83b; 93b; 103b; 113b-113d; 123b-123d; 133b-133d; 143b; 153b; 163b, 163c; 173b) which at least partially (in the cavity 9; 29), and / or is at least partially embedded in the Cover B ¬ packaging.
2. A lighting apparatus according to claim 1, wherein the cover (4; 24; 64; 144; 154; 164) is a piston and the cavity, a piston chamber (9; 29).
3. Illuminating device according to one of the preceding claims, wherein the heat sink structure having a heat sink base (3a; 23a), in particular an attachment surface of the heat sink base (3a; 23a) for the at least one light source ¬ is connected.
4. lighting device (1; 21; 41; 51; 61; 71; 81; 91; 101;
111; 121; 131; 171) according to any one of the preceding claims, wherein the cooling body structure (3b; 23b; 43b-43d; 53b-53d; 63b-63d; 73; 83b; 93b; 103b; 113b-113d; 123b- 123d; 133b-133d; 173b) is at least partially, in particular completely, disposed within the cavity. 5. lighting device (141; 151; 161) according to any one of claims 1 or 2, wherein the cooling body structure (143b; 153b; 163b, 163c) at least partially surrounded by a light-transmitting sigen material of the cover, in particular cast is.
Light emitting device (151; 161) according to claim 5, wherein the heat sink structure at least one wire and / or thread (153b; 163b, 163c) has.
Illuminating device according to one of the preceding claims, wherein the heat sink structure at least up to ei ¬ ner center of the cavity towering, especially Minim ¬ least to an upper quarter of the cavity, in particular ¬ sondere to an upper tip of the cavity.
Illuminating device according to one of the preceding claims, wherein the heat sink structure replaces a portion of the piston, in particular a front part of the piston.
Light-emitting device (71; 91) according to any one of the preceding claims, wherein the cooling body structure rotationssymmet ¬ centrally arranged cooling body structures (73; 93b), in particular ¬ sondere cooling struts (73).
Light-emitting device (71) according to claim 9, wherein the cooling members (73) comprise a piece-wise to the cover, in particular piston towards widening cross-sectional shape at least ¬.
Illuminating device according to one of the preceding claims, wherein a major part of the surface of the heat sink structure is located at a front half of the piston.
Illuminating device according to one of the preceding claims, wherein at least a part of the cooling body structure comprises egg ¬ ne optically active, in particular reflective, Oberflä ¬ surface.
13 light emitting device (81; 101; 111; 121; 131) according to any one of the preceding claims, wherein the heat sink structure is a center pillar (83b; 103b; 113c; 123c; 133c) has ¬ that of the top section forward to the piston protrudes.
14 light emitting device (81; 101) of claim 13, wherein the center column (83b; 103b) at least partially further extending in a front region laterally as a group of at least two light sources surrounding the central column (33).
15, the lighting device, said lighting device is a retrofit, especially Glühl Ampen retrofit.
EP11701367A 2010-01-20 2011-01-14 Lighting device Withdrawn EP2499428A2 (en)

Priority Applications (2)

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DE102010001046A DE102010001046A1 (en) 2010-01-20 2010-01-20 lighting device
PCT/EP2011/050444 WO2011089069A2 (en) 2010-01-20 2011-01-14 Lighting device

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CN (1) CN102713429A (en)
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WO (1) WO2011089069A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
JP2012064362A (en) * 2010-09-14 2012-03-29 Sharp Corp Lighting system
JP5671356B2 (en) * 2011-01-26 2015-02-18 ローム株式会社 LED bulb
JP5475732B2 (en) * 2011-02-21 2014-04-16 株式会社東芝 Lighting device
JP5870258B2 (en) * 2011-05-20 2016-02-24 パナソニックIpマネジメント株式会社 Light bulb shaped lamp and lighting device
JP5704005B2 (en) * 2011-07-26 2015-04-22 東芝ライテック株式会社 Light bulb shaped LED lamp
DE102011081672A1 (en) * 2011-08-26 2013-02-28 Osram Ag Light source device
KR20130023638A (en) * 2011-08-29 2013-03-08 삼성전자주식회사 Bulb type semiconductor light emitting device lamp
JP5809493B2 (en) * 2011-09-09 2015-11-11 東芝ライテック株式会社 Lighting device
JP5809494B2 (en) * 2011-09-09 2015-11-11 東芝ライテック株式会社 Lighting device and manufacturing method thereof
JP5802497B2 (en) * 2011-09-21 2015-10-28 日立アプライアンス株式会社 Light bulb type lighting device
ES2671250T3 (en) 2011-09-22 2018-06-05 Philips Lighting Holding B.V. Lighting device with RF antenna
US9239159B2 (en) * 2011-12-16 2016-01-19 Samsung Electronics Co., Ltd. Heat-dissipating structure for lighting apparatus and lighting apparatus
CN103206692B (en) * 2012-01-11 2017-05-10 欧司朗股份有限公司 Heat dissipation device and omnidirectional lighting device with same
US20130201680A1 (en) * 2012-02-06 2013-08-08 Gary Robert Allen Led lamp with diffuser having spheroid geometry
CN102620172B (en) * 2012-03-27 2014-12-24 深圳市天祥太阳能技术发展有限公司 LED bulb
CN102853290A (en) * 2012-03-30 2013-01-02 明基电通有限公司 Light-emitting device
CN103375693A (en) * 2012-04-13 2013-10-30 欧司朗股份有限公司 Lighting device, omnidirectional lighting lamp and reshaped lamp both with same
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN102720961A (en) * 2012-05-30 2012-10-10 上舜照明(中国)有限公司 LED (light emitted diode) candle lamp capable of lightening in entire space
US9255674B2 (en) 2012-10-04 2016-02-09 Once Innovations, Inc. Method of manufacturing a light emitting diode lighting assembly
CN103994343A (en) * 2013-02-19 2014-08-20 欧司朗有限公司 Omni-directional lighting device
TWI510741B (en) * 2013-05-27 2015-12-01 Genesis Photonics Inc Light emitting device
CN104218136A (en) * 2013-06-05 2014-12-17 新世纪光电股份有限公司 Light-emitting device
TWM474106U (en) * 2013-12-03 2014-03-11 yu-xuan Chen Light emitting diode lamp
EP3102011A4 (en) * 2014-01-27 2017-03-08 Shanghai Sansi Electronics Engineering Co., Ltd. Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus
CN103791439B (en) * 2014-01-27 2015-05-06 上海三思电子工程有限公司 Novel LED lighting device
JP6495307B2 (en) * 2014-01-27 2019-04-03 上海三思▲電▼子工程有限公司Shanghai Sansi Electronic Engineering Co.,Ltd. LED lighting device
CN104197249A (en) * 2014-09-22 2014-12-10 苏州承源光电科技有限公司 LED streetlamp
US9541262B2 (en) * 2014-12-30 2017-01-10 LIGHTING and SUPPLIES, INC Shabbat bulb
CN105864659A (en) * 2015-02-04 2016-08-17 嘉兴山蒲照明电器有限公司 LED bulb lamp
JP6137231B2 (en) * 2015-04-08 2017-05-31 三菱電機株式会社 lamp
JP2015216130A (en) * 2015-08-31 2015-12-03 日立アプライアンス株式会社 Bulb type lighting device
CN108291693A (en) * 2015-11-26 2018-07-17 飞利浦照明控股有限公司 Lighting apparatus
IL255517D0 (en) * 2016-11-23 2017-12-31 Lighting And Supplies Inc Shabbat bulb with gear controlled blackout

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070159828A1 (en) * 2006-01-09 2007-07-12 Ceramate Technical Co., Ltd. Vertical LED lamp with a 360-degree radiation and a high cooling efficiency
CN100570211C (en) * 2006-02-16 2009-12-16 液光固态照明股份有限公司 High-power light-emitting diode lamp
US20110128742A9 (en) * 2007-01-07 2011-06-02 Pui Hang Yuen High efficiency low cost safety light emitting diode illumination device
DE202007008258U1 (en) * 2007-04-30 2007-10-31 Lumitech Produktion Und Entwicklung Gmbh LED bulbs
CN201209792Y (en) * 2008-06-19 2009-03-18 杰 史 Circular LED ceiling lamp
CN201373273Y (en) * 2009-03-12 2009-12-30 林峻毅 Reflective LED lamp

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US20120287652A1 (en) 2012-11-15
DE102010001046A1 (en) 2011-07-21
CN102713429A (en) 2012-10-03
WO2011089069A3 (en) 2011-11-10
WO2011089069A2 (en) 2011-07-28

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