EP2499428A2 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP2499428A2
EP2499428A2 EP11701367A EP11701367A EP2499428A2 EP 2499428 A2 EP2499428 A2 EP 2499428A2 EP 11701367 A EP11701367 A EP 11701367A EP 11701367 A EP11701367 A EP 11701367A EP 2499428 A2 EP2499428 A2 EP 2499428A2
Authority
EP
European Patent Office
Prior art keywords
heat sink
cooling
lighting device
piston
sink structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11701367A
Other languages
German (de)
English (en)
Inventor
Nicole Breidenassel
Guenter Hoetzl
Fabian Reingruber
Simon Schwalenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2499428A2 publication Critical patent/EP2499428A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device, in particular LED lighting device, in particular LED retrofit lamp.
  • LEDs have lower brightness and lower lifetimes at higher temperatures.
  • An LED lamp typically has a base, a heat sink, an LED module and a semi / transparent lamp envelope or a semi / transparent cover.
  • a heat sink is typically used for heat dissipation.
  • the available space for the heat sink is limited, in particular for normbe ⁇ bordered lamps, including a space requirement for a piston and a driver electronics. As a result, the size of the effectively usable for cooling volume and thus the cooling capacity are limited.
  • Preferred embodiments are insbesonde ⁇ re the dependent claims.
  • the object is achieved by a lighting device aufwei ⁇ send at least one at least partially translucent cover which at least one light source, in particular light emitting diode, covers, so that between the at least one light source and the cover, a cavity is present, and having at least one heat sink structure, the partly is to ⁇ least in the cavity and / or is at least partially embedded in the cover.
  • the heat sink can be additionally cooled in the region of the cover via this heat sink structure (s) and thus cool better without having to change the size and appearance of the lighting device.
  • larger heat losses can be dissipated.
  • the heat sink structure can in particular at least partially, and thus complete, be arranged in front of the at least one light source ⁇ .
  • the determination 'before' / 'front' or 'behind' / 'backward' refers to the Hauptabstrahl ⁇ direction or optical axis of the light source.
  • front of a light source thus means positioned in that half-space in front of the at least one light source ('front half ⁇ space'), which is centered by the main emission direction.
  • a light-emitting diode can emit as a Lambertian radiator in the front half-space, without further action but not in the complementary 'rear half-space'.
  • the lighting device may further comprise a heat sink base with a top surface for the at least one light source and with respect to the at least one light source rearwardly arranged and / or laterally outwardly directed conventional heat sink structures.
  • This heat sink base may be similar to a conventional heat sink.
  • the light source may be integrally ⁇ placed directly on the heat sink base or secured, for example, be attached ⁇ introduced by means of an adhesion paste or an adhesive film, or indirectly in the heatsink base, for example via a carrier substrate such as a submount, and / or a circuit board.
  • the at least one heat sink structure is connected to the heat sink base.
  • a particularly effective heat conduction into the at least one heat sink structure can be achieved.
  • the at least one heat sink structure is connected to the attachment surface of the heat sink base for the at least one light source.
  • the at least one heat sink structure can be embodied in one piece or in several parts with the heat sink base, which together form the (total) heat sink.
  • the at least ei ⁇ ne heat sink structure may be, for example, a separately Herge ⁇ notified heat sink part, which is connected to the heat sink base, in particular with the bearing surface, bonded or attached thereto.
  • the at least one heat sink ⁇ structure with the heat sink base can be made in one piece, for example made of a cast.
  • the nature of the at least one light source is basically not limited.
  • the at least one light source may comprise in particular ⁇ sondere a semiconductor light source such as a laser diode and / or a light emitting diode.
  • the translucent material of the cover may have a transparent or translucent (eg milky white) material.
  • the cover can with, in particular, be made art ⁇ cloth, glass or ceramic.
  • the plastic may in particular be a thermally conductive and sufficiently temperature-stable translucent plastic such as polycarbonate. It is a design optimized for better thermal conductivity, the translucent material has a plastic filled with higher heat-conductive particles.
  • the cover may comprise glass, in particular a thermally conductive glass having a thermal conductivity of more than 1.1 W / (mK), eg borofloate with 1.2 W / (mK).
  • transparent ceramic may be USAGE ⁇ det, which may have far higher thermal conductivity (for example, a transparent Alumi ⁇ niumoxid-ceramics) as the light transmissive material. The increased thermal conductivity of the Abde- ckung heat may well be passed released into the ambient air ⁇ through this.
  • the heat sink structure consists of a thermally well-conducting material (heat conductivity> 15 W / (mK)), in particular of a metal or egg ⁇ ner metal alloy, in particular comprising copper and / or aluminum.
  • heat conductivity > 15 W / (mK)
  • metal or egg ⁇ ner metal alloy in particular comprising copper and / or aluminum.
  • the cover is a piston and the cavity is a piston (inside) cavities.
  • the piston may in particular have a spherical cap shape.
  • the piston can then be fastened in particular with its edge on the attachment surface of the cooling ⁇ body base.
  • the cover may be a disc-shaped cover for a funnel-shaped cavity.
  • the at least one light source may be arranged at the bottom of the funnel.
  • Such a cover is particularly advantageous for a realization of a LED Halogenreflektorlampenretrofitlampe.
  • the cover may generally have an optical function in addition to its protective function.
  • the cover can be added to at least partially one or more optical areas, such as lens-like areas, etc., be integrated.
  • the Cover B ⁇ ckung can be used in other words, for a targeted beam guidance in terms of appearance.
  • the heat sink structure is at least partially disposed within the cavity, which supports a heat coupling with the cavity.
  • the heat sink structure can in particular be arranged completely inside the cavity, which facilitates production of the cover.
  • the heat sink is at least partially spaced from the cover.
  • the heat sink structure or the cooling-relevant, cover-side surfaces of the heat sink structure are preferably located near the (inner) wall of the cover, in particular at a distance to the cover of not more than 10 mm, in particular not more than 3 mm , in particular less than 1 mm.
  • the location of the heat sink structure (s) near the wall better dissipates heat from the heat sink structure to the corresponding coverage areas and dissipates them to the environment.
  • the heat sink structure may rest against the cover.
  • the heat sink structure is at least partially surrounded by a transparent material of the cover, in particular so shed is.
  • the use of plastic has, inter alia, the advantage that the heat sink can be cast in a particularly simple manner with the cover, in particular cast into it.
  • the heat sink may protrude at least partially into the cavity and / or be at least partially surrounded by the licht pressläs ⁇ sigen material of the cover. This results in a very good thermal connection and mechanical stability.
  • the heat sink structure may in particular be completely surrounded by the light-transmitting material, in particular it may be cast. This can simplify manufacture.
  • the heat sink structure may comprise at least one wire and / or thread. In this case, multiple wires and / or threads can be used for effective heat dissipation. These have, inter alia, the advantage of easy and inexpensive processability.
  • the cooling body structure extends at least up to a middle or average height of the cavity, in particular at least up to a obe ⁇ ren quarter of the cavity, in particular to an upper tip of the cavity.
  • the heat sink structure may protrude so far forward or upward that, with respect to a maximum height hmax of the cavity from the at least one light source, it has at least a height of hmax / 2, in particular of at least hmax-3/4, in particular of hmax. That thedekör ⁇ per Scheme to an upper tip of the cavity is sufficient, meaning that it extends at least over the entire height of the cavity. If the heat sink structure also extends through the cover or is part of it, then in particular it also extends at least over the entire height of the cover, ie, up to its outer tip.
  • the heat sink structure (s) By pouring the heat sink structure (s) into the front area of the cavity, they are surrounded with cooler air because the cavity in its front area is cooler is as in the lower or rear area near the heat sink top surface and the light source (s). Consequently, the cooling ⁇ body structure is cooled the better the further it reaches forward and the more their surface is located in the front part of the cover and / or the cavity.
  • a larger cooling ⁇ surface in the front region of the cover and / or the cavity is also optically eg for LED retrofit lamps advantageous because light-emitting diodes have a stronger forward radiation than incandescent lamps, so that a smaller lateral and a larger front shadowing the emission characteristic of the LED Lamp of the radiation characteristic of the incandescent lamp can further approximate.
  • the heat conduction in the heat sink structure in the front region of the cover and / or the cavity occurs substantially along an inner side of the cover.
  • the cooling body structure replaces a part of the cover (that is, the light-transmitting material), in particular a front part of the Ab ⁇ cover and / or the cavity.
  • the heat sink structure can thus be present at least in some areas instead of the light-permeable material of the cover.
  • a part of the heat sink structure may have an externally exposed surface.
  • the He set ⁇ for example the front part of the cover by the exposed to the outside part of the cooling body structure made possible by the direct contact of the heat sink surface to the ambient air, a particularly effective cooling.
  • the heat sink structure rotationally symmetrically arrangeddeitatistruktu ⁇ ren, in particular cooling struts, having.
  • the heat emitted by the LEDs can be dissipated over a large area. share, which increases a cooling capacity.
  • the cooling struts may in particular be free-standing.
  • the heat sink structures may be arranged in the area of the cavity from a thermal viewpoint that they are far apart as possible and so distribute the heatfelflä ⁇ chig.
  • Rotationally symmetric arranged, in particular internal, elements of the heat sink structure, such as fins or struts, are far apart, whereby their mutual thermal influence is minimized and they are in a relatively cool environment and thus can cool better.
  • any cooling structures can be arranged rotationally symmetrical about the LEDs mounted on the heat sink base. Since the cooling capacity also depends on the size of the cooling strut surface facing the cover, a smaller number of thicker cooling struts and a larger number of thinner cooling struts can lead to approximately the same cooling capacity in a rotationally symmetrical arrangement. Thinner cooling struts can be designed inter alia as wires or threads. It is a further development that the cooling at least struts from ⁇ cut, a comprise to the cover, in particular Col. ⁇ ben, towards widened cross-sectional shape. Thereby can be kept large directed toward the cap area for a large heat transfer to the cover, while at the same low ⁇ can be supported th optical shading.
  • the cooling body structure in particular cooling strut at least in sections a comprise to the cover, in particular piston toward Spread ⁇ ternde cross-sectional shape.
  • the cooling body structure in particular cooling strut at least in sections a comprise to the cover, in particular piston toward Spread ⁇ ternde cross-sectional shape.
  • an inwardly narrowed and wider to the outside cross section of the cooling struts On the one hand, it can be sufficiently large to allow a good flow of heat into the front region of the cover and / or the cavity, and on the other hand to allow the largest possible surface area of the individual cooling struts (or another heat sink structure) to adjoin the cover. which increases the cooling capacity.
  • a broadening of the heat sink, in particular cooling struts, in the front part of the cover and / or the cavity thus creates a particularly effective cooling surface.
  • a cross-sectional shape of the heat sink structure is generally a thermal-optical compromise.
  • the cross-sectional shape should be selected from a thermal viewpoint so that the cooling ⁇ body is on the one hand large enough to conduct the heat efficiently into the cavity or region of the cover, and on the other hand results in a as large as possible adjacent to the cover surface. This can for example apply to single or all cooling struts.
  • Another suitable cross-section for a compact variant, sitting in the center LED light source may, for example, a conical, pointed toward a center of the cross section zuarchitecte- be with a round, adapted to the course of the Abde ⁇ ckung outer edge.
  • a majority of the surface area (> 50%) of the heat sink structure is located on a front half of the cover and / or the cavity. This further increases the heat dissipation. Under the front half of the one half is understood, which is ent ⁇ removed calculated from the at least one light source the furthest forward.
  • the heat sink structure has the largest possible surface in or on the front area of the cover and / or the cavity, in particular more than 5%, in particular more than 20%, in particular ⁇ more than 50% of the heat sink surface may be located in the front half of the cavity, in particular one to the cover showing Lucasworksoberflä ⁇ che located in the cavity heat sink structure.
  • a particularly cooling-relevant contact with the cover generally takes place in the front region of the cover and / or the cavity.
  • the heat sink structure converges in a front region of the cover and / or the cavity, in particular at its tip.
  • This embodiment can be used in particular with a mirrored or diffusely scattering cover.
  • a convergence of the heat sink structure, in particular cooling struts, in the front part of the cover provides an even more effective cooling surface.
  • the heat sink structure has an optically active, in particular specular (specular) or diffusely reflecting (scattering), surface.
  • an optically active surface may comprise, for example, a roughening, a coating and / or a coating.
  • the heat sink structure has a position and / or shape adapted to a beam guidance.
  • heat sink struts located further outwards can lead to lower light losses lead, while further inward heat sink struts lead to a better homogeneity of the light emission.
  • the cooling body structure having a (centered) center column that on ⁇ record area forward protrudes from the up to the cover.
  • the heat can be conducted over a large area of the Lucas Energyba ⁇ sis, especially top surface, in the center column and through the center column in the front of the cover, which supports a particularly effective cooling under ⁇ .
  • the center pillar extends at least partially laterally in a front region than a group of at least two light sources surrounding the center pillar.
  • the light sources may, for example, be arranged annularly around the center pillar, eg with a central recess for the center pillar.
  • center pillar may be used as a reflector and / or a diffuser to enhance lateral light emission.
  • the lighting device is a retrofit lamp, in particular incandescent retrofit lamp.
  • the invention can be used particularly advantageous as retrofit lamps are normbe ⁇ bordered lamps.
  • the lighting device may generally be a lamp, a light, a lighting system and / or a part thereof.
  • the invention will be described schematically with reference to exemplary embodiments. Identical or identically acting Ele ⁇ elements may be provided with the same reference numerals for clarity.
  • FIG. 1 shows a side view of an LED according to the invention.
  • LED retrofit lamp according to the first embodiment 3 shows in side view a first part of a two part heat sink, the LED retrofit lamp ge ⁇ Yamass the first embodiment;
  • FIG. 4 shows a side view of the entire heat sink of FIG.
  • LED retrofit lamp according to the first embodiment shows a top view obliquely above a erfindungsge ⁇ Permitted LED retrofit lamp according to a second Ausry ⁇ tion form;
  • FIG. 6 shows a side view of the LED retrofit lamp according to the second embodiment
  • FIG. 7 shows an enlarged detail from FIG.
  • Fig. 8 is a plan view showing the LED retrofit lamp according to the second embodiment
  • FIG. 9 shows a side view of an LED retrofit lamp according to a third embodiment
  • Fig. 10 is a plan view of the LED retrofit lamp according to the third embodiment.
  • FIG. 11 shows a side view of an LED retrofit lamp according to a fourth embodiment
  • FIG. 12 shows a side view of an LED retrofit lamp according to a fifth embodiment
  • Fig. 13 is a plan view showing the LED retrofit lamps according to the fourth and fifth embodiments.
  • FIG. 14 shows in plan view a schematic of a Thomasdar ⁇ position by a piston chamber of an LED retrofit lamp according to a sixth embodiment
  • 15 shows a sectional side view of a sketch of a LED retrofit lamp according to a seventh embodiment
  • Fig.17 shows a sectional view in side view of a
  • Fig.18 shows a sectional view in plan view of a
  • 21 shows a perspective view of a sketch of a LED retrofit lamp according to a tenth exporting ⁇ approximate shape
  • Fig.22 shows a sectional view in plan view of a
  • Fig.23 shows a sectional view in side view of a
  • 26 shows a sectional side view of a
  • FIG. 27 shows a sectional side view of a LED retrofit lamp according to a three ⁇ tenth embodiment
  • Fig.28 shows a sectional view in side view of a
  • FIGS. 1 to 28 show an example of an LED retrofit incandescent lamp
  • FIG. 29 shows an LED retrofit halogen lamp.
  • the features shown with regard to the LED retrofit incandescent lamp are analogously also usable for the LED retrofit halogen lamp, and vice versa.
  • Fig.l shows a side view and Figure 2 shows a Thomasdar ⁇ position in side view of an LED retrofit lamp 1 according to ei ⁇ ner first embodiment.
  • the LED retrofit lamp 1 has a base 2, a heat sink 3, an LED module 5 with Minim ⁇ least on a light emitting diode (not shown.) And a licht fashionlvesssi ⁇ gene (transparent or opaque) piston 4.
  • the base 2 which may be configured, for example, as an Edison socket or a bayonet ⁇ socket, the LED retrofit lamp 1 can be supplied with power.
  • the current is supplied via a driver circuit (not shown) to the at least one light-emitting diode of the LED module 5.
  • the driver circuit is accommodated in a driver cavity 6, which is formed in the heat sink 3.
  • the heat generated by the driver circuit can be dissipated via the heat sink 3.
  • the heat sink 3 is constructed in two parts, with a heat sink base 3a, which has a contact surface, support surface or top surface 7 for the LED module 5.
  • a heat sink base 3a which has a contact surface, support surface or top surface 7 for the LED module 5.
  • On the top surface 7 of the LED substrate is flat and good thermal conductivity (eg, using a thermally conductive Haftmit ⁇ means of such a thermally conductive paste or a TIM-adhesive tape)
  • a carrier substrate eg, a circuit board and / or a submount
  • a front side is equipped with the at least one light emitting diode.
  • 'before' refers to an orientation in the z-direction (which also corresponds to the main emission direction of the at least one LED) and '(da) behind' or 'rearward' to an orientation opposite to the z-direction.
  • the heat sink base 3a corresponds in shape to a forth ⁇ conventional heat sink, the cooling fins 8, are rotationally symmetrical about the z-axis, which also corresponds to a longitudinal axis of the lighting device. 1
  • the cooling fins 8 are arranged behind the LED module 5 or the at least one light source.
  • the spherical cap-shaped piston 4 vaulted over the LED module 5 and thus the at least one light emitting diode, so that between the piston 4 and the LED module 5 and the at least one light emitting diode, a hollow piston chamber 9 is formed.
  • the piston 4 also vaulted laterally at least a portion of the cooling fins 8, these cooling fins 8 are exposed to better cooling effect partially directly to the environment.
  • the second part of the heat sink 3 consists of adekör ⁇ per Camill 3b, which here consists of a ring rotationally symmetrical ⁇ arranged cooling fins 10, which connect to the front of the cooling fins 8 of the heat sink base 3a.
  • the cooling fins 10 adjoin the piston chamber 9 by being accommodated within the piston chamber 9, with a small distance of less than 1 mm from the piston 4.
  • the cooling fins 10 have a circular-segment-shaped contour directed toward the piston 4 which follows the shape of the piston 4 while being perpendicularly up and forward on the inner side directed toward the light emitting diodes.
  • the cooling fins 10 have a height along the z-extension, which is approximately ⁇ of the maximum height hmax of the piston chamber 9 between the light module 5 or the at least one light emitting diode and an apsis or tip 11 of the piston chamber 9 corresponds.
  • the heat sink base 3a and the heat sink structure 3b may, for example, be glued together.
  • FIG. 3 shows a side view of the heat sink base 3a.
  • An upper top surface of a cylindrical central portion 3c serves as the top surface 7, while in the middle portion 3c, the driver cavity 6 is housed.
  • the heat sink base 3a is of a conventional construction.
  • FIG 4 shows a side view of the entire heat sink 3 of the LED retrofit lamp 1 with the heat sink base 3a and the cooling body structure 3b.
  • the additional cooling ribs 10 sit on the cooling ribs 8 and protrude from these forward (in the z direction), first side of the top surface 7 and then before the top surface 7.
  • the thickness of the cooling fins 8 and 10 is constant and equal.
  • the LED retrofit ampe 21 is basically similar to the LED retrofit lamp 1 of the first embodiment constructed as a LED incandescent retrofit lamp and has like this a base 22, a heat sink 23, an LED module 25 and a translucent piston 24.
  • the piston 24 may be made of plastic, which allows a particularly inexpensive production and lightweight construction, or of glass, such as borofloat glass, which gives a good aging resistance and scratch resistance ⁇ .
  • the LED module 25 has a circular circuit board 32 on which rotationally symmetrical about a longitudinal axis L of the LED Retrofitlampe 21 six forward (in the z direction) emitting white LEDs 33 are mounted.
  • the circuit board 32 is equipped with a plurality of light-emitting diodes 33 in an annular arrangement. Only for ease of illustration, line feedthroughs and lines etc. to the driver located in a driver cavity of the heat sink 23 are not shown.
  • the heat sink 23 may be made in one piece, although it may be notionally divided into two parts, namely a heat sink base 23a and substantially in front of the light emitting diodes 33 arranged ⁇ cooling body structure 23b.
  • the heat sink base 23a has an attachment surface 27 for attaching or fixing the LED module 25 to and below or behind and radially arranged with respect to the longitudinal axis L, outwardly directed cooling ribs 28th
  • the heat sink structure 23b is likewise connected to the heat sink base 23a on the top surface 27, namely in the radial direction (r direction) outside the board 32 of the LED module 25.
  • the heat sink structure 23b has six perpendicular to the top surface 27 upwardly extending cooling struts 30, which curve with increasing height inward in the direction of the tip 31 of the piston chamber 29 and thereby slim.
  • the cooling struts 30 thus extend substantially over the entire height of the piston chamber 29.
  • the free ends or tips of the cooling struts 30 do not touch.
  • the cooling struts 30 are rotationally symmetrical with respect to the longitudinal axis L for effective cooling.
  • the cooling struts 30 further include a flattened surface 34 in the direction of the piston 24, which does not contact the piston 24 but is spaced a small distance of about 1 mm or less therefrom.
  • the shape of the cooling struts 30 and the somewhat more than hemispherical ⁇ shaped designed shape of the piston 24 are adapted to put the piston 24 on the heat sink 23, namely here on an outermost edge of the top surface 27 of the heat sink base 23 a, as shown in an enlarged section in Figure 7. 8 shows the LED retrofit lamp 21 in plan view.
  • the cooling ⁇ struts 30 are arranged at a maximum peripheral distance to the light-emitting diodes 33, so that only a small proportion of the light emitted by the LEDs 33 light is blocked by the cooling struts 30. In other words, the cooling struts 30 are not arranged above the light emitting diodes 33, but laterally thereof.
  • the LEDs 33 heat up due to their power loss. This heat is largely varnish ⁇ ben on the board 32 to the top surface 7 and 27 of the heat sink 3 and 23 and heated to a small extent the piston chamber 9 and 29 by a heat spreading in the heat sink 3, 23 is a portion of the heat to the cooling fins 8, 28 passed and radiated from there to the environment.
  • the Oberflä ⁇ surface of the cooling fins 8, 28 due to a limited provided for suitability as an LED retrofit lamp form factor.
  • the LED retrofit lamp 41 is similar to the LED retro- 1, according to the second embodiment, except that the heat sink structure 43 b of the heat sink 43 is designed differently.
  • the heat sink part 43b is now configured such that six rota ⁇ tion arranged symmetrically to the longitudinal axis of the cooling struts 43c similar to the cooling members 30 initially perpendicularly from the top surface of the cooling body 43 to the front or top harnessra ⁇ gene.
  • the cooling struts 43c in a front or upper half of the piston 24 gradually dome-shaped together, thus forming a closed dome-shaped heat sink structure 43d. Characterized there is a predominant part of the surface of the cooling body structure 43b in a front portion or a front half of the piston chamber 29.
  • the dome-shaped heat sink structural ⁇ tur 43d does not cover the light-emitting diodes 33, is blocked or, however, reflected (diffusely or specularly) a greater portion of light as the retrofit lamp 21 according to the second embodiment.
  • a light distribution which is directed by the use of light-emitting diodes 33 more forward (in the direction of the z-axis) than in a herkömmli ⁇ Chen incandescent, closer to the light distribution of a conventional incandescent lamp.
  • a front portion of the piston chamber 29 and the piston 24 is heated more than in the second embodiment, so that heat can be dissipated more effectively.
  • the heat sink structure 43b is mechanically more stable.
  • FIG. 11 shows a side view of an LED retrofit lamp according to a fourth embodiment.
  • the LED retrofit lamp 51 is similar to the LED retrofit lamp 41 according to the third embodiment except that the heat sink structure 53b of the heat sink 53 located substantially in front of the light emitting diodes 33 is different.
  • the cooling struts 53c do not merge here gradually or continuously into each other, but go directly into a kugelkalottenförmige or cup-shaped cap 53d, which in a front Region of the piston chamber 29 is arranged.
  • the front portion of the piston chamber 29 and the piston 24 is heated more than in the second embodiment, so that heat can be dissipated more effectively.
  • the heat sink structure 53b is mechanically more stable.
  • the heat sink structure 53 b may be spaced from the piston 24 or at least partially directly adjacent to the piston 24 or contact this. Direct contact improves saulei ⁇ processing of the heat sink structure 53b in the piston 24th
  • FIG. 12 is a side view of a retrofit LED lamp 61 according to a fifth embodiment similar to the retrofit LED lamp 51 according to the fourth embodiment.
  • the cup-shaped cap 63 d of the located in front of the light emitting diode 33 heatsink portion 63 b of the heat sink 63 now a part of the translucent material of ⁇ permeable piston 64 and thus constitutes a part of the piston inevitablesei ⁇ te exposed to the environment, which enhances a heat transfer to the environment.
  • the cap 63d adjoins the piston chamber 29 and can thus dissipate the heat from the piston chamber 29 directly and over a large area, in addition to the heat brought about by the cooling struts 63c.
  • FIG. 13 is a plan view showing an embodiment of the LED retrofit lamps 51, 61 according to the fourth and fifth embodiments. Again, the LEDs 33 are not covered directly by the heat sink member 53b and 63b, in particular the cap 53d and 63d, respectively.
  • FIG. 14 shows a top view of a sketch of a sectional illustration through a piston chamber 9 of an LED retrofit lamp 71 according to a sixth embodiment.
  • the cooling struts 73 laterally surround a single, centrally mounted light-emitting diode 33.
  • the cross-sectional shape of the cooling struts 73 is triangular, wherein a pointed edge 74 of the respective cooling brace 73 is directed to the centrally mounted light-emitting diode 33 and one of the edge 74 opposite flat surface 75 of the piston 4 is opposite ⁇ .
  • the cooling struts 73 are spaced apart from the piston 4. The wide surface 75 results in an effective heat transfer from the respective cooling strut 73 to the piston 4.
  • a surface of the cooling struts 73 is configured (diffuse or mirror-gelnd) reflective, so that this will be the laterally emitted from the light emitting diode 33 light homogenization ⁇ Siert further by pass some light beams LI just between the cooling struts 73 and other light beams L2 from the cooling struts 73 are distracted.
  • FIG. 15 shows a sectional side view
  • Figure 16 shows a sectional representation in plan view of each egg ⁇ ne sketch of an LED retrofit lamp 81 according to a seventh From ⁇ guide die.
  • the heat sink 83 now has a heat sink structure which projects up from the top surface 27 in the form of a centrally located center pillar 83b.
  • the lower contact surface or the lower region of the center pillar 83b is laterally surrounded by an annularly arranged group of light-emitting diodes 33.
  • the center pillar 83b Towards the front, ie, with increasing height, the center pillar 83b initially slants, in order then to expand in a star shape in a front region.
  • the front portion of the center pillar 83b extends to the top of the piston space 29, and thus the center pillar 83b occupies the full height of the piston space 29.
  • the central column 83b does not cover the light-emitting diodes 33, but projections 84 which are spaced apart in the circumferential direction or 'rays' of the star-shaped widening laterally extend beyond the light-emitting diodes 33.
  • the use of the center column 83b has the advantage that it may have a large proportion of the On ⁇ flow area 27 (using a ring-shaped LED board) and the board contact, thereby achieving a very good heat dissipation from the heat sink base 23a.
  • the center pillar 83b is made of a solid material, eg a metal, for effective heat conduction. Due to the large upper ⁇ surface in the front part of the piston chamber 29 and possibly a contact of the piston 4 also a good réelleablei ⁇ processing is achieved to the outside.
  • the waisted shape of the center pillar 83b supports a (diffuse or specular) light reflection for homogenizing the light emission in a height direction.
  • FIG. 17 shows a sectional side view
  • Figure 18 shows a sectional representation in plan view of each egg ⁇ ne sketch of an LED retrofit lamp 91 according to an eighth From ⁇ guide die.
  • the LED retrofit lamp 91 is now equipped with a heat sink structure arranged in front of a plurality of light-emitting diodes 33, which has vertically upstanding, plate-shaped cooling ribs 93b between the light emitting diodes 33 in the piston cavity 29, which extend over the entire height of the piston space 29.
  • the cooling fins 93b are aligned in a plan view of a center of the piston chamber 29 out and thus delimit adjacent ⁇ light emitting diodes 33 against each other.
  • the cooling fins 93b can be widely distributed.
  • the cooling fins 93b can be widelybil ⁇ det completely or partially specularly reflecting or diffusely reflecting (scattering).
  • the cooling ribs 93b also have a large contact surface with the attachment surface 27 or the circuit board. Since ⁇ by that widen the cooling fins 93b to the front (in the z direction) through a heat conduction into the front portion of the piston 4 is supported.
  • 19 shows a sectional side view
  • Figure 20 shows a sectional representation in plan view of each egg ⁇ ne sketch of an LED retrofit lamp 101 according to a ninth Embodiment similar to the seventh embodiment.
  • the center pillar 103b now covers the main emission direction of the light-emitting diodes 33, which are arranged on an annular circuit board 106 around the center pillar 103b.
  • the center pillar 103b now covers the light-emitting diodes 33, as a result of which the front emission direction is further suppressed and the light emitted by the light-emitting diodes 33 is emitted more strongly laterally.
  • This may be preferred, for example, in the case of a page-emitting application, for example for ceiling lamps, corridor lamps or for a bathroom mirror lamp.
  • 103b can bordering on the piston space 29 ⁇ surface of the center pillar to particular specular or specular or diffuse be reflec ⁇ rend configured.
  • the reflection can be effected, as in the other embodiments, for example by means of a corresponding coating.
  • strips 113d do not cover the LEDs 33.
  • a proportion of the light falling forwardly through the strips 113d can be adjusted in a simple manner, for example by a width and / or length of the strips 113d.
  • the strips 113d can at least be reflective towards the bottom or adjacent to the piston chamber 29 to increase a light output and a side and downward light component.
  • FIG. 24 shows a sectional side view 123d a sketch of an LED retrofit lamp 121 according to an eleventh exporting ⁇ approximate shape, which is a variant of the tenth embodiment in that now from the top of the stem 123c instead of the single strip has a curved grid-like or umbrella-rib-like cooling structure going on. This increases the shading forward and a mechanical stability. Here, too, a good heat conduction is achieved tung from this front area into and through the mainly in a front portion of the piston chamber 29 and also the piston 4 EXISTING ⁇ dene surface of the cooling body structure 123b.
  • 25 shows a side view of a sketch of parts of an LED retrofit lamp 131 according to a twelfth embodiment.
  • the tenth embodiment is now from the top of the stem 133c of the heat sink structure 133b a ge ⁇ domed, hood-like cap 133d from.
  • This 'anchor-shaped' From ⁇ design increases the shadowing forward and a mecha ⁇ African stability.
  • 26 shows a sectional side view of a sketch of a LED retrofit lamp 141 according to a thirteenth embodiment. In this case, cooling struts 143b seated on the attachment surface 27 run upward in the manner of a ring segment and join at the tip 145 of the piston 144.
  • the cooling struts 143b of the heat sink structure alternate with transparent regions 149.
  • the material of the light-permeable regions 149 has been introduced into the intermediate spaces between the cooling struts 143b, for example injection-molded in the case of a translucent plastic.
  • This embodiment gives due to the direct exposure of the cooling struts 143b, especially with the environment a particularly good heat output.
  • the Cooling struts 143b may be made of, for example, a metal or an alloy, a carbon material such as graphite, etc.
  • cooling struts 143b may also be wholly or partially surrounded by the translucent material, e.g. be splashed. Such an embodiment may be simpler in terms of manufacturing technology and result in a more pleasing appearance.
  • FIG. 27 shows a sectional side view of a sketch of a LED retrofit lamp 151 according to a fourteenth embodiment.
  • thin cooling wires or cooling threads 153b are now used as the heat sink structure.
  • the cooling threads 153b extend from an attachment surface of the heat sink base to the tip of the piston 154.
  • the cooling threads 153b may be cast in particular in the light-permeable material of the piston 154.
  • the cooling filaments 153b for example, silver filaments, graphite filaments, copper wires or filaments, etc. may be used.
  • a single cooling filament 153b allows less heat conduction than a single cooling strut, the cooling filaments 153b can be used in greater numbers.
  • Fig. 28 is a sectional side view showing a sketch of a retrofit LED lamp 161 according to a fifteenth embodiment similar to the fifteenth embodiment using cooling filaments 163b as the heat sink structure of the heat sink.
  • cooling threads 163b circumferential cooling threads 163c are provided in the circumferential direction, which further improve heat dissipation.
  • the cooling threads 163c are in thermal contact with the cooling threads 163b and may, for example, be manufactured integrally therewith as a net-like structure, which in particular in FIG translucent material of the piston 164 may be potted.
  • FIG 29 shows a sectional side view of a sketch of a LED retrofit lamp 171 according to a sixteenth embodiment.
  • the LED retrofit lamp 171 is designed as a retrofit lamp for a halogen lamp.
  • the LED retrofit lamp 171 includes a heat sink base 173a, which is substantially funnel-shaped and rearwardly into a socket 172, for example a Bajonettso ⁇ ckel, passes.
  • An upper opening of the funnel is covered ⁇ by a disk-shaped light transmitting cover 174 beaut, so that the heat sink base 173a and the cover 174 form a cavity 179th
  • the cavity 179 is thus substantially also formed between the at least one light-emitting diode and the cover 174.
  • the heat sink base 173a on its outer side 178 has cooling fins for discharging a waste heat generated by the at least one light emitting diode 33
  • the inner side 177 of the funnel is usually smooth and therefore has no heat sink structures.
  • a heat sink structure in the form of upright cooling struts 173b is introduced in the cavity 179.
  • the cooling struts 173b stand on the bottom of the funnel or the base 172 and extend over the entire height of the cavity 179 until they contact the cover 174.
  • Characterized a further 'heat channel' of the base 172 is formed to the cover 174, which supports a planteablei ⁇ processing of the light-emitting diode mindestes a 33rd Depending ⁇ but other heat sink structures used advertising the, for example, analogous to the embodiments shown in Fig.l to Fig.28.
  • all the heat sink structures shown and further located in front of the at least one light source can be spaced from the piston, partially replace it and / or be surrounded by the light-transmitting material.
  • Fig.l to 28 shows incandescent retrofit lamp for the position shown in Figure 29 halogen spotlights retrofit ver ⁇ turns may be, or for other lamp types such as line lamps, fluorescent tubes, etc.

Abstract

Dispositif d'éclairage comprenant au moins un élément couvrant qui est au moins partiellement transparent et qui couvre au moins une source lumineuse, notamment une diode électroluminescente, de sorte qu'un espace vide se trouve entre la ou les sources lumineuses et l'élément couvrant, le dispositif d'éclairage comportant également au moins une structure de corps de refroidissement qui se trouve au moins partiellement dans l'espace vide et/ou est enchâssée au moins partiellement dans l'élément couvrant.
EP11701367A 2010-01-20 2011-01-14 Dispositif d'éclairage Withdrawn EP2499428A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010001046A DE102010001046A1 (de) 2010-01-20 2010-01-20 Leuchtvorrichtung
PCT/EP2011/050444 WO2011089069A2 (fr) 2010-01-20 2011-01-14 Dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP2499428A2 true EP2499428A2 (fr) 2012-09-19

Family

ID=43989776

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11701367A Withdrawn EP2499428A2 (fr) 2010-01-20 2011-01-14 Dispositif d'éclairage

Country Status (6)

Country Link
US (1) US20120287652A1 (fr)
EP (1) EP2499428A2 (fr)
JP (1) JP2013517608A (fr)
CN (1) CN102713429A (fr)
DE (1) DE102010001046A1 (fr)
WO (1) WO2011089069A2 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
JP2012064362A (ja) * 2010-09-14 2012-03-29 Sharp Corp 照明装置
JP5671356B2 (ja) * 2011-01-26 2015-02-18 ローム株式会社 Ｌｅｄ電球
JP5475732B2 (ja) * 2011-02-21 2014-04-16 株式会社東芝 照明装置
JP5870258B2 (ja) * 2011-05-20 2016-02-24 パナソニックＩｐマネジメント株式会社 電球形ランプ及び照明装置
JP5704005B2 (ja) 2011-07-26 2015-04-22 東芝ライテック株式会社 電球形ｌｅｄランプ
DE102011081672A1 (de) * 2011-08-26 2013-02-28 Osram Ag Lichtquellenvorrichtung
KR20130023638A (ko) * 2011-08-29 2013-03-08 삼성전자주식회사 전구형 반도체 발광 소자 램프
JP5809493B2 (ja) 2011-09-09 2015-11-11 東芝ライテック株式会社 照明装置
JP5809494B2 (ja) * 2011-09-09 2015-11-11 東芝ライテック株式会社 照明装置およびその製造方法
JP5802497B2 (ja) * 2011-09-21 2015-10-28 日立アプライアンス株式会社 電球型照明装置
CN103797641B (zh) 2011-09-22 2017-01-18 皇家飞利浦有限公司 具有射频天线的照明设备
WO2013089521A1 (fr) * 2011-12-16 2013-06-20 삼성전자주식회사 Structure de dissipation de chaleur pour appareil d'éclairage et appareil d'éclairage
CN103206692B (zh) * 2012-01-11 2017-05-10 欧司朗股份有限公司 散热装置和具有该散热装置的全向照明装置
US20130201680A1 (en) * 2012-02-06 2013-08-08 Gary Robert Allen Led lamp with diffuser having spheroid geometry
CN102620172B (zh) * 2012-03-27 2014-12-24 深圳市天祥太阳能技术发展有限公司 Led灯泡
CN102853290A (zh) * 2012-03-30 2013-01-02 明基电通有限公司 发光装置
CN103375693A (zh) * 2012-04-13 2013-10-30 欧司朗股份有限公司 照明装置、包括该照明装置的全向照明灯具和改型灯
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN102720961A (zh) * 2012-05-30 2012-10-10 上舜照明（中国）有限公司 一种全空间发光的led蜡烛灯
US9255674B2 (en) 2012-10-04 2016-02-09 Once Innovations, Inc. Method of manufacturing a light emitting diode lighting assembly
CN103994343A (zh) * 2013-02-19 2014-08-20 欧司朗有限公司 全向照明装置
TWI510741B (zh) 2013-05-27 2015-12-01 Genesis Photonics Inc 發光裝置
CN104218136A (zh) * 2013-06-05 2014-12-17 新世纪光电股份有限公司 发光装置
TWM474106U (zh) * 2013-12-03 2014-03-11 yu-xuan Chen 發光二極體燈具
CN103791439B (zh) * 2014-01-27 2015-05-06 上海三思电子工程有限公司 新型led照明装置
WO2015109674A1 (fr) * 2014-01-27 2015-07-30 上海三思电子工程有限公司 Appareil d'éclairage à del
EP3102011A4 (fr) * 2014-01-27 2017-03-08 Shanghai Sansi Electronics Engineering Co., Ltd. Appareil d'éclairage à led, abat-jour, et procédé de fabrication de circuit pour l'appareil
CN104197249A (zh) * 2014-09-22 2014-12-10 苏州承源光电科技有限公司 Led路灯
US9541262B2 (en) * 2014-12-30 2017-01-10 LIGHTING and SUPPLIES, INC Shabbat bulb
CN105864659B (zh) * 2015-02-04 2020-03-13 嘉兴山蒲照明电器有限公司 一种led球泡灯
JP6137231B2 (ja) * 2015-04-08 2017-05-31 三菱電機株式会社 ランプ
JP2015216130A (ja) * 2015-08-31 2015-12-03 日立アプライアンス株式会社 電球型照明装置
WO2017089170A1 (fr) * 2015-11-26 2017-06-01 Philips Lighting Holding B.V. Dispositif d'éclairage
IL255517B (en) * 2016-11-23 2021-06-30 Lighting And Supplies Inc Shabbat light with gear control for power outages
WO2020127163A1 (fr) 2018-12-21 2020-06-25 Signify Holding B.V. Lampe à filament

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070159828A1 (en) * 2006-01-09 2007-07-12 Ceramate Technical Co., Ltd. Vertical LED lamp with a 360-degree radiation and a high cooling efficiency
CN100570211C (zh) * 2006-02-16 2009-12-16 液光固态照明股份有限公司 高功率发光二极管电灯
US20110128742A9 (en) * 2007-01-07 2011-06-02 Pui Hang Yuen High efficiency low cost safety light emitting diode illumination device
DE202007008258U1 (de) * 2007-04-30 2007-10-31 Lumitech Produktion Und Entwicklung Gmbh LED-Leuchtmittel
CN201209792Y (zh) * 2008-06-19 2009-03-18 史杰 圆形led吸顶筒灯
CN201373273Y (zh) * 2009-03-12 2009-12-30 林峻毅 反射式led灯

Also Published As

Publication number Publication date
JP2013517608A (ja) 2013-05-16
DE102010001046A1 (de) 2011-07-21
WO2011089069A3 (fr) 2011-11-10
US20120287652A1 (en) 2012-11-15
CN102713429A (zh) 2012-10-03
WO2011089069A2 (fr) 2011-07-28

Similar Documents

Publication Publication Date Title
EP2499428A2 (fr) Dispositif d'éclairage
EP2499420B1 (fr) Dispositif d'éclairage
EP2459925B1 (fr) Lampe
DE102010043918B4 (de) Halbleiterlampe
RU2639980C2 (ru) Осветительное устройство с круговым распределением света
WO2011042357A1 (fr) Dispositif d'éclairage et procédé de montage d'un dispositif d'éclairage
DE102010030296B4 (de) Lampe mit konkavem Reflektor und einem Vorsprung für mindestens eine Lichtquelle
WO2002002989A1 (fr) Lampe, en particulier lampe de salon, de bureau ou de poche
EP2504616A1 (fr) Lampe pourvue d'un moyen réflecteur et élément réflecteur
DE102012018609A1 (de) Led lampe
DE102011007214B4 (de) Kolben für Halbleiter - Leuchtvorrichtung sowie Halbleiter - Leuchtvorrichtung
EP2564116B1 (fr) Lampe à del comme substitut d'ampoule à incandescence
EP2317211A2 (fr) Lampe extérieure et pièce de rechange pour lampes haute tension
DE112013006624T5 (de) Beleuchtungsvorrichtung
US20140097738A1 (en) Lighting device
AT14251U1 (de) LED-Lampe
DE102012211279A1 (de) Halbleiter-leuchtvorrichtung mit wärmerohr
DE112012005131T5 (de) Beleuchtungseinrichtung
WO2013064344A1 (fr) Lampe à semi-conducteur munie d'un piston
DE102012205472A1 (de) Halbleiterlampe mit kolben
DE202008013275U1 (de) LED-Beleuchtungslampe für Werkzeugmaschine
DE102019102056A1 (de) Reflektorlampe mit dreidimensionaler Lightengine
CH705463A1 (de) LED-Lampe.
DE102015209911A1 (de) Leuchtvorrichtung mit Halbleiterlichtquelle
DE102013208389A1 (de) Leuchtvorrichtung, insbesondere mit einem LED-Modul

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120613

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: HOETZL, GUENTER

Inventor name: SCHWALENBERG, SIMON

Inventor name: BREIDENASSEL, NICOLE

Inventor name: REINGRUBER, FABIAN

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140801