EP2484970A1 - Luminaire, en particulier pour éclairage à DEL - Google Patents

Luminaire, en particulier pour éclairage à DEL Download PDF

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Publication number
EP2484970A1
EP2484970A1 EP20120154278 EP12154278A EP2484970A1 EP 2484970 A1 EP2484970 A1 EP 2484970A1 EP 20120154278 EP20120154278 EP 20120154278 EP 12154278 A EP12154278 A EP 12154278A EP 2484970 A1 EP2484970 A1 EP 2484970A1
Authority
EP
European Patent Office
Prior art keywords
luminaire
support
thermally conductive
heat sink
conductive mat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20120154278
Other languages
German (de)
English (en)
Other versions
EP2484970B1 (fr
Inventor
Erik Nicolaas Johannes Swennen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LED EXPERT PARTICIPATIE BV
Original Assignee
LED Expert Participatie BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LED Expert Participatie BV filed Critical LED Expert Participatie BV
Publication of EP2484970A1 publication Critical patent/EP2484970A1/fr
Application granted granted Critical
Publication of EP2484970B1 publication Critical patent/EP2484970B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a luminaire, in particular for LED lighting, comprising a support having a first side and a second side, a heat sink which is in heat-exchanging contact with the first side of the support, and at least one LED element placed on the support on the second side thereof.
  • Such a known luminaire is disclosed in WO 2010/051985 A2 .
  • Such a luminaire generally accommodates a group of LED elements, with the number of LED elements partially determining the light output of the luminaire.
  • LED elements exist in various sizes and embodiments; they can be soldered to the support via legs or connection contacts. In addition to that, the LED elements may also be mounted on the support by means of a Surface Mounted Device (SMD) technique.
  • SMD Surface Mounted Device
  • the construction of the LED elements is such that most LED elements comprise, in addition to the semiconductor LED, a reflector or a lens by means of which the aperture angle of the light from the LED can be determined.
  • LEDs have several advantages over conventional light sources, such as incandescent lamps and discharge lamps. LEDs have a longer life, for example, and they are more energy-efficient than such conventional light sources.
  • LED luminaires such as the LED luminaire disclosed in WO 2010/105985 A2 , for example, to that end comprise a heat sink, which is preferably provided with cooling fins.
  • thermally conductive glue has the drawback that hazardous substances are released in use due to the generation of heat. Said substances constitute a health hazard and have a negative effect on the LED elements, which are affected by said glue. Because of this, a long life and a high light output can no longer be guaranteed.
  • Another drawback of the use of glue is that it results in a stiff construction, because the glue is rigid after curing. Temperature changes due to the generation of heat by the LED elements causes the various parts of the luminaire to expand and shrink. This leads to a deteriorated contact surface between, for example, the heat sink and the support, resulting in a decreased dissipation of heat to the heat sink. This may lead to an unacceptable increase of the temperature of the LED elements, so that there is an increased risk of defects and the degradation process of the LED elements is accelerated.
  • a luminaire according to the present invention is characterised in that the luminaire further comprises a thermally conductive mat disposed between the first side of the support and the heat sink.
  • the use the thermally conductive mat obviates the need to glue the support provided with LED elements to the cooling fin block. Since practically no harmful substances are released, at least in use, if the thermally conductive mat is used, the use of said mat is safer than the use of glue.
  • the use of the thermal mat does not have an adverse effect on the heat dissipating capacity of the luminaire; the heat is dissipated in an efficient manner by the thermally conductive mat.
  • the heat sink may be provided with such a thermally conductive mat in advance, whereupon the support provided with the LED elements can be placed on the heat sink.
  • the thermally conductive mat extends over the entire area of the first side of the support.
  • a thermally conductive mat that extends over the entire area of the support has the advantage that in this way a larger contact area between the support and the mat is obtained. Said larger contact area leads to a reduced total thermal resistance of the mat, so that the mat can dissipate a larger amount of heat to the heat sink.
  • the housing of the luminaire comprises clamping means for clampingly accommodating the thermally conductive mat between the support and the heat sink.
  • the luminaire is provided with clamping means.
  • Said clamping means cause the support to be pressed against the heat sink with a certain pressure so as to prevent the occurrence of play between the two parts and retain an optimum heat transfer.
  • the effect of the clamping means is enhanced.
  • Said clamping means can press the support partially into the thermally conductive mat in that case, so that at least a large part of the play between the parts can be compensated.
  • a specific thickness of the compressible thermal mat can be selected. Major variations in the coefficients of expansion and a major generation of heat lead to a maximum amount of play between the parts.
  • a thick compressible thermal mat into which the support is pressed by the clamping means can compensate for said variation, because the support can be pressed into the mat to an extent greater than that to which play can occur as a result of the generation of heat.
  • the clamping means form part of the luminaire.
  • the advantage of a luminaire in which the clamping means form part of the luminaire is that it leads to a simpler construction of the luminaire.
  • the clamping means no longer need to be provided separately, but form part of the luminaire.
  • the luminaire clamps the support against the heat sink, so that the thermally conductive mat is clamped therebetween.
  • the LED element comprises an optical element for bundling the light from the LED element.
  • optical element has the advantage that it makes it possible to form a more efficient light beam.
  • the exit aperture and the angle at which the light exits the luminaire can be determined by the optical element.
  • the optical element can be configured so that it can be connected to the luminaire. As a result, the optical element presses against the support and the thermally conductive mat is clamped between the heat sink or on one side and the support provided with the optical element on the other side.
  • the optical element is in that case the part in the luminaire which provides the clamping engagement of the thermally conductive mat.
  • the optical element is configured as a reflector or as a lens, for example.
  • the optical element is a convergent, divergent or collimator lens for generating the desired light beam.
  • the luminaire further comprises an exit window arranged for clampingly accommodating the at least one optical element, the support and the thermally conductive mat between the exit window and the heat sink.
  • the function of the exit window is at least twofold.
  • the window functions to close the luminaire, with the light being able to exit the luminaire at the location of the window.
  • the window is to that end provided with a light-transmitting material, at least at the location of the LED elements / optical elements.
  • the advantage of the use of such a window is that the parts in the luminaire, such as the support and the LED elements, are screened from moisture and dirt.
  • the exit window forms part of the luminaire, such that this leads to a simpler construction of the luminaire.
  • the thermally conductive mat can be clamped between the support and the heat sink.
  • the exit window exerts a pressure on the optical elements, causing them to press against the support, as a result of which the support presses against the heat sink, resulting in the clamping engagement of the thermally conductive mat that is present therebetween. An adequate heat transfer from the support to the heat sink is thus ensured.
  • the exit window makes it possible to configure the luminaire as a module.
  • the heat sink can function as part of the housing in that case.
  • the thermally conductive mat is placed on the heat sink.
  • the support provided with LED elements is placed, with the optical elements being placed on top of that. The whole is closed with the exit window in such a manner that the parts are clamped down and the occurrence of play between the parts is prevented.
  • the thermally conductive mat comprises a material which is at least substantially electrically insulating.
  • Such a luminaire has the advantage that the addition of the electrically insulating, thermally conductive mat provides an additional insulation layer between the support and the heat sink. Because of the presence of said additional insulation layer, the electrical circuit is better insulated and a safer installation is obtained. As a result, the luminaire can be classified in a higher insulation class than in the situation in which such a thermally conductive, electrically insulating mat is not used.
  • a support will be configured as a printed circuit board, on the upper side of which the LED elements are mounted as SMD parts.
  • the use of an electrically insulating, thermally conductive mat has the additional advantage, however, that it is possible to use printed circuit boards which are provided with conductive tracks on the underside, being the side of the heat sink.
  • the conductive tracks are insulated from the metal heat sink by the electrical insulation of the thermally conductive mat, so that short-circuits and breakdowns are prevented.
  • the thermally conductive mat comprises a compressible material.
  • the thermally conductive mat comprises a compressible material
  • this has the advantage that the compressibility of the thermally conductive mat compensates for the differences in the expansion of the various parts in the luminaire.
  • the generation of heat may locally set up tension in the support or even cause the support to bend. As a result of said bending, the contact surface between the support and the heat sink is not even all over. Said unevennesses can be compensated by the compressible mat.
  • This in contrast to an adhesive bond as used in the prior art, where the differences in the expansion of the various parts may lead to a stress in the adhesive bond such that failure of the rigid adhesive bond results. A decreased heat transfer will occur at the location of the failure, resulting in a deteriorated heat management in the luminaire housing.
  • the thermally conductive mat may in particular comprise a polymer or a silicone material.
  • the thermally conductive mat that is used may also be built up of a multitude of layers, with the various layers performing different functions.
  • an electrically conductive intermediate layer may be used, such as a copper or aluminium layer, which is screened, with a high thermal conduction, by outer layers made of an electrically insulating material having a high breakdown voltage, such as silicone, Teflon, rubber or glass fibre, for example.
  • a unit comprising a heat sink, a thermally conductive mat and a support, wherein the support comprises at least one LED and wherein the unit is designed for use in a luminaire as described above.
  • FIG. 1 shows a schematic view of a first luminaire 10 according to the invention.
  • the luminaire 10 is made up of a wall portion 191 and a light exit portion 192, three LED elements 12, a support 14, a thermally conductive mat 16 and a heat sink 18.
  • the LED elements 12 are mounted on a first side of the support 14.
  • the support 14 will be configured as a printed circuit board.
  • Such a printed circuit board is known from the prior art.
  • the printed circuit board 14 is in thermal contact with the heat sink 18 for dissipating the heat being generated by the LED elements 12 from the luminaire 10.
  • the heat sink 18 can subsequently deliver the heat to the environment via a multitude of cooling fins 181.
  • a thermally conductive mat 16 is disposed between the heat sink 18 and the printed circuit board 14. This obviates the need for an adhesive bond and thus eliminates all the inherent drawbacks thereof.
  • the thermally conductive mat 16 being used is composed of a non-rigid, elastic material, which is compressible. As a result, the thermally conductive mat 16 is stretchable in its longitudinal direction along the printed circuit board 14, accommodating to the shape of the printed circuit board 14. It can continue to do so also in the case of deformation of the printed circuit board due to the generation of heat in the luminaire 10. As a result, a large contact area between the printed circuit board 14 and the heat sink 18 is retained and an adequate heat regulation is ensured.
  • the thermally conductive mat 16 is elastic, it is compressible, thereby making it possible to compensate for any tolerance in a warped or uneven printed circuit board 14. At locations where the contact surface of the printed circuit board 14 locally comes nearer the heat sink, the mat is compressed further than at the locations where the printed circuit board 14 is further removed from the heat sink 18. As a result, the thermal contact between the printed circuit board 14 and the heat sink 18 is the same at all locations and an adequate heat management is realised.
  • the heat sink 18 is configured as a cooling fin block. On said cooling fin block, the heat is delivered to the environment via a multitude of fins 181.
  • the whole is housed in a luminaire 10 consisting of a wall portion 191 and a light exit portion 192, through which the light from the LED elements can exit the housing.
  • a luminaire 10 consisting of a wall portion 191 and a light exit portion 192, through which the light from the LED elements can exit the housing.
  • the heat sink 18 is partially disposed outside the luminaire so as to realise an adequate heat transfer to the environment. It is also possible, however, to enclose the whole of heat sink 18 with the thermally conductive mat 16, the printed circuit board 14 and the LED elements 12 in the luminaire 10.
  • the heat sink 18, the thermally conductive mat 16, the printed circuit board 14 and the LED elements 12 jointly form a lighting module. In a practical embodiment, a multitude of such lighting modules are present within the luminaire 10.
  • the printed circuit board 14 consists of an epoxy board, on the first side of which the LED elements 12 are mounted as SMD elements.
  • Such printed circuit boards are known and are available in various embodiments thereof.
  • Figure 2 shows a schematic view of a luminaire 20, in which the electrically conductive mat 16 extends over the entire area of the printed circuit board 14.
  • the advantage of this is that a maximum contact area is obtained, so that a maximum amount of heat can be dissipated from the printed circuit board 14 to the heat sink 18.
  • the luminaire 30 is provided with clamping means, an exit window 34 and several optical elements 32.
  • the exit window 34 is at least partially provided, at the location of the optical elements 32, with a transparent material, such as glass, for example, or a hard transparent plastic material.
  • a transparent material such as glass, for example, or a hard transparent plastic material.
  • the light generated in the LED elements 12 can in that case exit the luminaire 30 through the exit window 34, possibly via the optical elements 32.
  • the exit window 34 has in addition to that another function. The fact is that the exit window may also be placed directly on the LED elements 12.
  • the exit window 34 must be made of a material that is resistant to heat (to a limited extent), however, for example a heat-resistant glass.
  • the exit window 34 may also be placed directly on or over the optical elements 32.
  • the exit window 34 can be pressed against the optical elements 32, as shown in figure 3 , by the clamping means 36.
  • the optical elements 32 thus press against the LED elements 12 and/or the printed circuit board 14, which are thus pressed into the thermally conductive mat 16, resulting in a good mechanical contact between the support and the heat sink 18.
  • the optical elements 32, the LED elements 12, the printed circuit board 14 and the thermally conductive mat 16 are all clamped between the exit window 34 and the heat sink 18.
  • the clamping means 36 may further be configured as a screw so as to make it possible to adjust the amount of pressure between the exit window 34 and the heat sink 18.
  • the heat sink 18, the clamping means 36, the side wall portion 191 and the exit window 34 jointly form the luminaire housing 30.
  • a separate housing is not directly necessary, therefore, since the whore of the parts is enclosed by the heat sink 18, the clamping means 36, the side wall portion 191 and the exit window 34.
  • the pressure means 42 are provided in the luminaire 40 in such a manner that they press the printed circuit board 14 directly against the heat sink 18. This obviates the need to use the optical elements 32 and the exit window 34 as such, at least for pressing the printed circuit board against the heat sink 18.
  • the optical elements also function to generate a light beam, however, and in the absence of said optical elements 32 the LED elements 12 will be provided with a lens so as to have the LED elements 12 generate a light beam.
  • the LED elements 12 thus have essentially built-in optical elements.
  • the pressure means 42 are configured so that they press the support against the heat sink 18. It is also possible, however, for the printed circuit board 14 to be provided with pre-drilled holes, so that a screw can be screwed into the heat sink 18.
  • FIG. 5 shows an embodiment of a luminaire 50 according to the invention in which the heat sink 18 forms the larger part of the luminaire.
  • the heat sink 18 is made of a block of metal; it is recessed on the opposite side of the cooling fins 181.
  • Said recessed portion accommodates several elements.
  • the whole is closed by the exit window 34 and the pressure means 52, which are provided in the heat sink 18 as a screw in this embodiment so as to thus realise a pressure of the exit window 34 on the optical elements 32, by which the support 14 with the LED elements 12 can be pressed into the thermally conductive layer.
  • the various parts of the luminaire 50 are essentially built up in layers, with the exit window 34 functioning to close the luminaire.
  • the thermally conductive mat 16 is larger than the area of the printed circuit board 14 in this embodiment. As a result, the entire contact area of the printed circuit board 14 will be in contact with the thermally conductive mat 16 at all times.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP12154278.1A 2011-02-08 2012-02-07 Luminaire, en particulier pour éclairage à DEL Not-in-force EP2484970B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2006167A NL2006167C2 (nl) 2011-02-08 2011-02-08 Verlichtingsarmatuur, in het bijzonder voor led-verlichting.

Publications (2)

Publication Number Publication Date
EP2484970A1 true EP2484970A1 (fr) 2012-08-08
EP2484970B1 EP2484970B1 (fr) 2017-11-08

Family

ID=45554586

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12154278.1A Not-in-force EP2484970B1 (fr) 2011-02-08 2012-02-07 Luminaire, en particulier pour éclairage à DEL

Country Status (3)

Country Link
EP (1) EP2484970B1 (fr)
DK (1) DK2484970T3 (fr)
NL (1) NL2006167C2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016020218A1 (fr) * 2014-08-08 2016-02-11 Koninklijke Philips N.V. Dispositif à del à interface thermique flexible
CN107883207A (zh) * 2017-11-11 2018-04-06 惠州市无龄康态健康科技有限公司 波纹片状贯通式led灯散热装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3620715A1 (fr) 2018-09-10 2020-03-11 Karl-Heinz Schneider Luminaire avec un dissipateur de chaleur

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008006325U1 (de) * 2007-11-28 2008-07-17 Cooler Master Co., Ltd., Chung-Ho City Wärmeabführanordnung und Lampe mit dieser
US20100008085A1 (en) * 2008-07-09 2010-01-14 Altair Engineering, Inc. Method of forming led-based light and resulting led-based light
WO2010051985A2 (fr) 2008-11-05 2010-05-14 Zumtobel Lighting Gmbh & Co.Kg. Lampe à led
US20100220476A1 (en) * 2009-02-27 2010-09-02 Ledtech Electronics Led light tube
WO2010105985A1 (fr) 2009-03-16 2010-09-23 Basf Se Procédé de production de composites de xérogel

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EP1182396B1 (fr) * 2000-08-22 2009-10-14 Koninklijke Philips Electronics N.V. Luminaire basé sur l'émission lumineuse de diodes électroluminescentes
US7182627B1 (en) * 2006-01-06 2007-02-27 Advanced Thermal Devices, Inc. High illumosity lighting assembly
DE102006048230B4 (de) * 2006-10-11 2012-11-08 Osram Ag Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung
JP4447644B2 (ja) * 2008-07-15 2010-04-07 シーシーエス株式会社 光照射装置
JP5007393B2 (ja) * 2009-09-18 2012-08-22 シーシーエス株式会社 検査用光照射装置
DE202010013958U1 (de) * 2010-10-05 2010-12-02 T.Y.C. Brother Industrial Co., Ltd. Leuchtenbaugruppe mit Leuchtdioden

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008006325U1 (de) * 2007-11-28 2008-07-17 Cooler Master Co., Ltd., Chung-Ho City Wärmeabführanordnung und Lampe mit dieser
US20100008085A1 (en) * 2008-07-09 2010-01-14 Altair Engineering, Inc. Method of forming led-based light and resulting led-based light
WO2010051985A2 (fr) 2008-11-05 2010-05-14 Zumtobel Lighting Gmbh & Co.Kg. Lampe à led
US20100220476A1 (en) * 2009-02-27 2010-09-02 Ledtech Electronics Led light tube
WO2010105985A1 (fr) 2009-03-16 2010-09-23 Basf Se Procédé de production de composites de xérogel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016020218A1 (fr) * 2014-08-08 2016-02-11 Koninklijke Philips N.V. Dispositif à del à interface thermique flexible
CN107883207A (zh) * 2017-11-11 2018-04-06 惠州市无龄康态健康科技有限公司 波纹片状贯通式led灯散热装置

Also Published As

Publication number Publication date
NL2006167C2 (nl) 2012-08-09
EP2484970B1 (fr) 2017-11-08
DK2484970T3 (en) 2018-02-05

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