EP2053666A1 - Dispositif de dissipation thermique pour dels et procédé de production associé - Google Patents

Dispositif de dissipation thermique pour dels et procédé de production associé Download PDF

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Publication number
EP2053666A1
EP2053666A1 EP08167394A EP08167394A EP2053666A1 EP 2053666 A1 EP2053666 A1 EP 2053666A1 EP 08167394 A EP08167394 A EP 08167394A EP 08167394 A EP08167394 A EP 08167394A EP 2053666 A1 EP2053666 A1 EP 2053666A1
Authority
EP
European Patent Office
Prior art keywords
mounting board
led
heatsink
board
heatsink element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08167394A
Other languages
German (de)
English (en)
Inventor
Massimo Gattari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iguzzini Illuminazione SpA
Original Assignee
Iguzzini Illuminazione SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iguzzini Illuminazione SpA filed Critical Iguzzini Illuminazione SpA
Publication of EP2053666A1 publication Critical patent/EP2053666A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Modern lighting devices and apparatus make increasingly frequent use of light emitting diodes or LEDs due to their ease of use and superior characteristics, compared to conventional light sources composed of incandescent and fluorescent lamps, in terms of average useful life, flexibility of use and the possibility of integration into small spaces.
  • present LEDs only emit 20-30% of the absorbed power in the form of visible light radiation and dissipate the remaining 70-80% by conduction and convection. This naturally makes it necessary to provide LED devices employed for lighting with adequate dissipation means which guarantee elimination of the heat generated so as to ensure correct operation of this LED device and of the surrounding circuit.
  • the present invention relates to a lighting device based on LEDs (Light Emitting Diode) and comprising suitable heat dissipation means, associated with said LEDs, suitable to be managed in a flexible manner for use with LEDs of different sizes and rated powers without this requiring new design of the circuit layout.
  • LEDs Light Emitting Diode
  • the appended Fig. 1 shows a perspective view of a preferred embodiment of the present invention.
  • the lighting device based on LEDs shown in the aforesaid figure comprises a mounting board for electronic components 10, suitable to mount, on the one side, said electronic components including at least one light emitting diode or LED 11 and relative optics 12, and, on the other side, at least one heatsink element 13 associated with said at least one LED.
  • Said mounting board 10 is suitable to house LEDs 11 of different sizes while said at least one heatsink element 13 is composed of a bar of heat conductive material, preferably produced by extrusion, having a cross section of fixed and constant dimensions and suitable to be fastened by one of the base sides thereof to said mounting board 10 so as to extend in length in a direction essentially perpendicular thereto.
  • said at least one heatsink element 13 makes it possible to ensure a fixed and constant dimension on the mounting board 10 while the thermal resistance can be modulated as desired - to meet changing dissipation requirements of the electronic circuit - simply by modifying the length.
  • This allows the designer to dimension the layout of the mounting board 10 so that it can house LED devices of various sizes and rated powers using only one type of heatsink element, the thermal resistance of which is adapted time by time to the dissipation requirements of the circuit simply by changing the length of said heatsink element 13.
  • Said at least one heatsink element 13 is provided with appropriate means for fastening to said mounting board 10 suitable to provide the necessary mechanical stability, maintaining it in an appropriate position to eliminate the power dissipated by the LED device with which it is associated.
  • the LED devices present on said mounting board 10 are three in number 20, 21, 22, evenly spaced apart by approximately 120° and provided with relative optics 23, 24, 25, as shown in the appended Fig. 2 , which shows a plan view of the component side of said mounting board 10.
  • the LED devices present on said mounting board 10 are three in number 20, 21, 22, evenly spaced apart by approximately 120° and provided with relative optics 23, 24, 25, as shown in the appended Fig. 2 , which shows a plan view of the component side of said mounting board 10.
  • On the opposite side of said mounting board 10 shown in a plan view in the appended Fig.
  • an extruded heatsink 30 shaped appropriately so as to be associated with each of said three LED devices 20, 21, 22 and provided with means for fastening to said board 10 composed of a central pin 31 suitable to engage, at one end, with a specific hole on said mounting board 10, and, at the other end, with a cross member 32 suitable to exert the necessary pressure on said extruded heatsink shaped so as to minimize the thermal resistance of contact with said mounting board 10.
  • Said cross member 32 can also be suitable to operate as locking element for any power cables associated with said board 10.
  • said optics 23, 24, 25, can be produced through a single element comprising 3 conical lenses each associated with a LED device 20, 21, 22 mounted on said board 10 and connected by a surface 26 suitably machined so as to provide the total cone of light desired and provided with appropriate means for fastening to said board 10 which can be produced, for example, by appropriate pins 14, 15, suitable to engage with specific holes 27, 28, 29 made in said mounting board 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP08167394A 2007-10-23 2008-10-23 Dispositif de dissipation thermique pour dels et procédé de production associé Withdrawn EP2053666A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000235A ITFI20070235A1 (it) 2007-10-23 2007-10-23 Dispositivo di dissipazione per led e connesso metodo di produzione.

Publications (1)

Publication Number Publication Date
EP2053666A1 true EP2053666A1 (fr) 2009-04-29

Family

ID=40313693

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08167394A Withdrawn EP2053666A1 (fr) 2007-10-23 2008-10-23 Dispositif de dissipation thermique pour dels et procédé de production associé

Country Status (3)

Country Link
EP (1) EP2053666A1 (fr)
CN (1) CN101451701A (fr)
IT (1) ITFI20070235A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2484967A2 (fr) 2011-02-07 2012-08-08 Collingwood Lighting Limited Unité d'éclairage
DE102017119733A1 (de) 2016-08-30 2018-03-01 Varroc Lighting Systems, s.r.o. Kühler, insbesondere für Signal- oder Beleuchtungsanlagen für Kraftfahrzeuge, und sein Herstellungsverfahren
US9927112B2 (en) 2013-06-24 2018-03-27 Trinity, Llc Universal cornice light for product display

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940264A (en) * 1996-10-04 1999-08-17 Philips Electronics North America Corp Electrolytic capacitor with heat sink and method of heat dissipation
EP1081760A2 (fr) * 1999-08-30 2001-03-07 Molex Incorporated Assemblage de refroidissement
WO2002097884A1 (fr) * 2001-05-26 2002-12-05 Gelcore, Llc Module de del de grande puissance pour un eclairage
WO2003023853A2 (fr) * 2001-09-10 2003-03-20 Intel Corporation Ensembles electroniques comportant des dissipateurs thermiques haute capacite et procede de fabrication
US20050158687A1 (en) * 2002-07-25 2005-07-21 Dahm Jonathan S. Method and apparatus for using light emitting diodes for curing
US20050178527A1 (en) * 2004-02-12 2005-08-18 Yaxiong Wang Heat dissipation device for electronic device
DE102004004778A1 (de) * 2004-01-30 2005-09-08 Osram Opto Semiconductors Gmbh Leuchtdioden-Beleuchtungsmodul und strahlungsformende optische Einrichtung für ein Leuchtdioden-Beleuchtungsmodul
US20060126303A1 (en) * 2004-12-11 2006-06-15 Foxconn Technology Co., Ltd Heat dissipating device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940264A (en) * 1996-10-04 1999-08-17 Philips Electronics North America Corp Electrolytic capacitor with heat sink and method of heat dissipation
EP1081760A2 (fr) * 1999-08-30 2001-03-07 Molex Incorporated Assemblage de refroidissement
WO2002097884A1 (fr) * 2001-05-26 2002-12-05 Gelcore, Llc Module de del de grande puissance pour un eclairage
WO2003023853A2 (fr) * 2001-09-10 2003-03-20 Intel Corporation Ensembles electroniques comportant des dissipateurs thermiques haute capacite et procede de fabrication
US20050158687A1 (en) * 2002-07-25 2005-07-21 Dahm Jonathan S. Method and apparatus for using light emitting diodes for curing
DE102004004778A1 (de) * 2004-01-30 2005-09-08 Osram Opto Semiconductors Gmbh Leuchtdioden-Beleuchtungsmodul und strahlungsformende optische Einrichtung für ein Leuchtdioden-Beleuchtungsmodul
US20050178527A1 (en) * 2004-02-12 2005-08-18 Yaxiong Wang Heat dissipation device for electronic device
US20060126303A1 (en) * 2004-12-11 2006-06-15 Foxconn Technology Co., Ltd Heat dissipating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2484967A2 (fr) 2011-02-07 2012-08-08 Collingwood Lighting Limited Unité d'éclairage
US9927112B2 (en) 2013-06-24 2018-03-27 Trinity, Llc Universal cornice light for product display
DE102017119733A1 (de) 2016-08-30 2018-03-01 Varroc Lighting Systems, s.r.o. Kühler, insbesondere für Signal- oder Beleuchtungsanlagen für Kraftfahrzeuge, und sein Herstellungsverfahren

Also Published As

Publication number Publication date
CN101451701A (zh) 2009-06-10
ITFI20070235A1 (it) 2009-04-24

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