EP2478752A1 - Substrat pour circuits électroniques - Google Patents
Substrat pour circuits électroniquesInfo
- Publication number
- EP2478752A1 EP2478752A1 EP10754717A EP10754717A EP2478752A1 EP 2478752 A1 EP2478752 A1 EP 2478752A1 EP 10754717 A EP10754717 A EP 10754717A EP 10754717 A EP10754717 A EP 10754717A EP 2478752 A1 EP2478752 A1 EP 2478752A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- base material
- microporous layer
- printing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
- B41M5/52—Macromolecular coatings
- B41M5/5218—Macromolecular coatings characterised by inorganic additives, e.g. pigments, clays
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
- B41M5/502—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording characterised by structural details, e.g. multilayer materials
- B41M5/506—Intermediate layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
- B41M5/52—Macromolecular coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
- B41M5/52—Macromolecular coatings
- B41M5/5254—Macromolecular coatings characterised by the use of polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
- Y10T428/249979—Specified thickness of void-containing component [absolute or relative] or numerical cell dimension
Definitions
- the invention relates to a support material for the printing of electronic circuits by means of the Inkj et printing method with electrically conductive inks.
- An essential step in the production of electronic devices and circuits is the production of conductive connections between the components. These connections must follow a predetermined structure to effect the intended functionality of the assembly or device.
- conductive materials usually metals or carbon (graphite).
- Particularly suitable for cost-effective mass production are printing processes with which the circuits are produced by applying printing inks containing the conductive materials to sheet-like electrically insulating, preferably flexible carrier materials in one working step.
- the Inkj et printing technology can be used for the production of electronic circuits. It makes it possible to apply electrically conductive structures on insulating carrier materials or to conductively bond already applied components, whereby, in contrast to other printing techniques such as screen printing, no printing form has to be produced beforehand and thus easy and cost-effective small quantities or even individual pieces can be produced. Such applications are described, for example, in the article by John B. Blum, "Printed Circuit Design and Manufacture" of Oct. 1, 2007.
- Metal or carbon-containing preparations in which the electrically conductive material is present in the form of particles are usually used as printing inks.
- these particles must be very finely divided, usually less than 1 / im, in order to prevent clogging
- Prevent pressure nozzles and sedimentation of the conductive particles in the low-viscosity ink In order to stabilize the particles against agglomeration and sedimentation, additives must also be added to these inks, for example surface-active substances or protective colloids. Frequently preferred are inks containing finely divided silver metal. Inks of this type are available, for example, from the companies ANP (Advanced Nano Products) in Korea under the designations DGP and DGH, from the company Harima Chemcials Inc., Japan under the designation NPS and from Cabot Corporation, USA under the
- Designation CCI-300 available.
- the particle size of the silver particles in these inks is in the range of 5 nm to several 100 nm.
- Support materials such as glass or ceramic preferably flexible films of polymers, in particular of polyesters used.
- the solvent contained in the ink dries, and in the printed layer the non-volatile additives remain adjacent to the silver particles.
- the additives electrically insulate, the conductivity of the printed structures is so low. For this reason, as described in the data sheets of the ink manufacturers and in the article by John B.
- US Pat. No. 3,652,332 A describes the use of porous carrier materials, in particular of coated offset printing paper, for printing conductive structures.
- the high-pressure method is used for this purpose.
- the printing inks described for producing the conductive structures are carbon black or silver flake printing inks Particle sizes well above 1 ⁇ , which are unsuitable for the inkjet printing process.
- the teaching of this patent is that the printing medium must have a certain absorbency in order to be able to produce homogeneous printing surfaces with reproducible electrical conductivity.
- the support materials described in the patent preferably conventional alumina pigment-coated graphic papers, do not meet the specific requirements of ink-jet conductive ink-containing inks because of their coarse and irregular pore structure and low porosity. In addition, their high surface roughness prevents the pressure of fine high-resolution structures.
- US 2009/0087548 A1 describes a method in which a metal ink is applied to a carrier material with a porous layer.
- the porous layer prevents bleeding of the printed structures, allowing very fine
- the object of this invention is to provide a support material for the printing of electronic circuits using printing inks which contains electrically conductive particles having a mean particle size of less than 1 ⁇ m. It should have a high electrical conductivity of the printed
- This support material is intended to be suitable in particular for inkjet printing with raetall- or carbon (graphite) -containing inks and enable the high-resolution printing of fine structures.
- the invention further provides a method for producing an electrically conductive structure on the carrier material described above.
- the invention is finally a printed
- the microporous layer has an average pore size in the range of 5 nm to 50 nm.
- the surface of the microporous layer has an average roughness of less than 1 ⁇ , measured as a roughness in accordance with DIN 4768.
- the outer microporous layer may be present as a polymer foam, prepared for example by a sol-gel process.
- Such microporous layers are described, for example, in WO 2007/065841 Al.
- the outer microporous layer contains fine inorganic and / or organic pigment particles and a hydrophilic binder.
- suitable pigments of the image recording layer are aluminum oxide, aluminum hydroxide, aluminum oxide hydroxide, aluminum oxide hydrate, silicon dioxide, magnesium hydroxide, kaolin, titanium dioxide, zinc oxide, zinc hydroxide, calcium silicate, magnesium silicate, calcium carbonate, magnesium carbonate and barium sulfate.
- the amount of the pigment in the microporous layer may be 40 to 95% by weight, preferably 60 to 90% by weight, based on the weight of the dried layer.
- the particle size of the pigment of the microporous layer is preferably less than 1000 nm, but in particular 50 to 500 nm.
- the mean particle size of the primary component is preferably less than 100 nm, in particular less than 50 nm.
- the microporous layer contains a water-soluble and / or water-dispersible binder.
- Suitable binders are, for example, polyvinyl alcohol, fully or partially saponified, cationically modified polyvinyl alcohol. Silyl-containing polyvinyl alcohol, acetal-containing polyvinyl alcohol, gelatin, polyvinylpyrrolidone, starch, carboxymethylcellulose, polyethylene glycol, styrene /
- Butadiene latex and styrene / acrylate late Fully or partially saponified polyvinyl alcohols are particularly preferred.
- the amount of the binder may be 60 to 5 wt .-%, preferably 50 to 10 wt .-%, but in particular 35 to 8 wt .-%, based on the weight of the dried layer amount.
- the microporous layer may contain conventional additives and auxiliaries such as crosslinking agents, ionic and / or nonionic surfactants, particle fixing agents such as polyammonium compounds, UV absorbers, antioxidants and other light stability and gas resistance improving agents as well as other auxiliaries.
- auxiliaries such as crosslinking agents, ionic and / or nonionic surfactants, particle fixing agents such as polyammonium compounds, UV absorbers, antioxidants and other light stability and gas resistance improving agents as well as other auxiliaries.
- the application weight of the microporous layer may be 1 to 60 g / m 2 , preferably 5 to 40 g / m 2 , particularly preferably 10 to 30 g / m 2 .
- the microporous layer may be single-layered or multi-layered.
- the base material used for the substrate over which the microporous layer is disposed may be a rigid one plate-like material such as glass or a plastic. But preferred is a flexible base material such as a plastic film, fleece or paper. In a particularly preferred embodiment, the base material is a base paper.
- the term base paper is understood to mean an uncoated or surface-sized paper.
- sizing agents such as alkylene dimers, fatty acids and / or fatty acid salts, epoxidized fatty acid amides, alkenyl or alkyl succinic anhydride, wet strength agents such as polyamine-polyamide-epichlorohydrin, dry strength agents such as anionic, cationic or amphoteric polyamides, optical brighteners, pigments, dyes, Defoamers and other known in the paper industry tools may contain.
- the base paper can be surface-sized. Examples of suitable sizing agents are polyvinyl alcohol or oxidized starch.
- the base paper can be produced on a Fourdrinier or a Yankee paper machine (cylinder paper machine).
- the weight per unit area of the base paper may be 50 to 250 g / m 2 , in particular 50 to 150 g / m 2 .
- the raw paper can be used in uncompacted or compacted form (smoothed).
- Particularly suitable are base papers having a density of 0.8 to 1.05 g / cm 3 , in particular 0.95 to 1.02 g / cm 3 .
- fillers for example, kaolins, calcium carbonate in its natural form, such as limestone, marble or dolomite stone, precipitated calcium carbonate, calcium sulfate, barium sulfate, titanium dioxide, talc, silica, alumina and mixtures thereof can be used in the base paper.
- at least one further layer which contains a hydrophilic binder can be arranged between the base paper and the microporous layer.
- film-forming starches such as thermally modified starches, in particular
- Corn starches or hydroxypropylated starches are used, the Brookfield viscosities ranging from 50 to 600 mPas (25% solution 50 ° C./100 rpm), in particular 100 to 400 mPas, preferably 200 to 300 mPas, lie.
- the Brookfield viscosity is measured according to ISO 2555.
- the binder does not contain a synthetic latex. The absence of a synthetic binder makes it possible to recycle waste materials without prior treatment.
- At least one pigment is contained in the further layer containing a hydrophilic binder.
- the pigment may be selected from the group of metal oxides, silicates, carbonates, sulfides and sulfates. Particularly suitable are pigments such as kaolins, talc, calcium carbonate and / or barium sulfate.
- a pigment having a narrow particle size distribution in which at least 70% of the pigment particles have a size of less than ⁇ .
- the proportion of the pigment with the narrow particle size distribution of the total amount of pigment should be at least 5% by weight, in particular from 10 to 90% by weight. Particularly good results can be achieved with a proportion of 30 to 80 wt .-% of the total pigment.
- a pigment having a narrow particle size distribution also comprises pigments having a particle size distribution in which at least about 70% by weight of the pigment particles have a size of less than about 1 ⁇ m and at 40 to 80% by weight of these pigment particles the difference between the particle size
- Pigment with the largest grain size (diameter) and the pigment of the smallest grain size is less than about 0.4 ⁇ .
- a calcium carbonate with a d 50% of about 0.7 ⁇ proved to be particularly advantageous.
- a pigment mixture consisting of the abovementioned calcium carbonate and kaolin can be used.
- the quantitative ratio of calcium carbonate / kaolin is preferably 30:70 to 70:30.
- the amount ratio of binder / pigment in the layer may be 0.1 to 2.5, preferably 0.2 to 1.5, but especially about 0.9 to 1.3.
- the layer containing a hydrophilic binder may preferably contain other polymers such as polyamide copolymers and / or polyvinylamine copolymers.
- the polymer can be used in an amount of 0.4 to 5 wt .-%, based on the mass of the pigment. According to a preferred embodiment, the amount of this polymer is 0.5 to 1.5% by weight.
- the layer containing the hydrophilic binder can be arranged directly on the front side of the base paper or on the backside of the base paper. It can be applied as a single layer or as a multilayer to the base paper.
- the coating composition can be used with all in papermaking customary application units are applied inline or offline, wherein the amount is selected such that after drying the application weight per layer at most 20 g / m 2 , in particular 8 to 17 g / m 2 , or according to a particularly preferred embodiment 2 to 6 g / m 2 is.
- This further layer can be further smoothed by mechanical methods such as calendering or ferrotyping, but it can also be applied by the cast coating method.
- the base material is a base paper provided on the front side or the rear side with at least one polymer layer.
- the front side refers to the side of the base paper on which the conductive structure is printed.
- the front and rear polymer layers may contain the same polymer.
- the polymers used in the polymer layers of the front and the back are different.
- the polymer layer disposed on at least one side of the base paper preferably contains a polymer having a water vapor permeability of at most 150 g / m 2 ⁇ 24 h at a layer thickness of 30 ⁇ , measured at 40 ° C and 90% relative humidity.
- the polymer is preferably a thermoplastic polymer.
- Suitable thermoplastic polymers include, for example Polyolefins, in particular low density polyethylene
- LDPE low density polyethylene
- HDPE high density polyethylene
- (Meth) acrylic acid ester copolymers vinyl polymers such as polyvinyl butyral, polyamides, polyesters, polyacetals and / or polycarbonates can be used.
- vinyl polymers such as polyvinyl butyral, polyamides, polyesters, polyacetals and / or polycarbonates.
- the back side of the base paper is coated with a polyolefin, in particular polyethylene.
- a polyolefin in particular polyethylene.
- Particularly preferred is a polyethylene mixture of LDPE and HDPE, wherein the quantitative ratio LD / HD 9: 1 to 1: 9, in particular 3: 7 to 7: 3.
- the polymer layers may further contain white pigments, such as titanium dioxide, as well as other auxiliaries, such as optical brighteners, dyes and dispersing agents.
- white pigments such as titanium dioxide
- auxiliaries such as optical brighteners, dyes and dispersing agents.
- the coating weight of the polymer layers on the front and back may be 5 to 50 g / m 2 , preferably 20 to 50 g / m 2 or more preferably 30 to 50 g / m.
- further layers such as protective layers or gloss-improving layers can be applied to the outer microporous layer which is provided for printing with conductive particles by the inkjet printing method.
- the coating weight of such layers is preferably less than 1 g / m 2 .
- a eucalyptus pulp was used.
- the pulp was ground as an approximately 5% aqueous suspension (thick matter) with the aid of a refiner to a freeness of 36 ° SR.
- the mean fiber length was 0.64 mm.
- the concentration of pulp fibers in the thin material was 1% by weight, based on the mass of the pulp suspension.
- Additives such as a neutral sizing agent alkyl ketene dimer (AKD) in an amount of 0.48% by weight, wet strength agent polyamine-polyamide-epichlorohydrin resin (Kymene °) in an amount of 0.36% by weight and a natural CaC0 were added to the thin material 3 in an amount of 10 wt .-%.
- the quantities are based on the pulp mass.
- the thinness whose pH was adjusted to about 7.5, was brought from the headbox onto the wire of the paper machine, followed by sheet formation by dewatering the web in the wire section of the paper machine. In the press section further dewatering of the paper web took place on one
- the base paper is coated on the front side and the backside with a coating consisting of a styrene-acrylate binder and a pigment mixture of calcium carbonate and kaolin with a coating weight of 30 g / m 2 (front side) and 20 g / m 2
- the front of the base paper was coated with a synthetic resin mixture of 100% by weight of a low density polyethylene
- the coating was carried out in a laminator at an extrusion speed of 250 m / min.
- the front side of the carrier material was additionally treated with a corona discharge and coated with a solution of polyvinyl alcohol (Mowiol 04-98 from Kurarai) in water with a dry layer thickness of 100 mg / m 2 as an adhesive layer and dried.
- Example carrier AI (invention)
- the sample of carrier A was treated with a coating composition having a total solids content of 23%, consisting of 80 parts Boeh- pyro- self-owned alumina pigment having pigment (Disperal HP14 Sasol), 10 parts (Aeroxide ® Alu C from Evonik Degussa), 8 parts of polyvinyl alcohol (Mowiol ® 40-88 Kurarai company) and 2 parts of boric acid coated and dried.
- the dry layer application was 20 g / m 2 , the average pore size of the layer, measured by mercury porosimetry, 30 nm.
- Sample carrier B was coated and dried in the same way as sample support material AI with a microporous layer.
- the dry layer application was 30 g / m 2 , the mean pore size of the layer, measured with mercury porosimetry, 30 nm.
- a commercially available polyester film (Mylar ®) with a thickness of 125 was corona-treated ⁇ , then coated with a microporous layer, and then dried.
- the dry weight was 30 g / m 2 , the average pore size of the layer, measured by mercury porosimetry, 30 nm.
- the support materials A, B, Al, Bl, Cl and a commercially available polyester film were silver ink type "NPS" Harima Chemcials, Inc., Japan, with a inkjet printer DMP-2800 Fa. Fujifilm DIMATIX ® In the process, 25 mm long and 2 mm wide silver printed conductors were printed prepared at a distance of 25 mm and dried at room temperature for 1 hour.
- the materials according to the invention have a low electrical resistance of the printed conductor tracks exhibit a high insulation resistance between the tracks and allow good print quality.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
La présente invention concerne des supports destinés à l'impression par jet d'encre de structures électroconductrices, avec des encres qui contiennent des particules conductrices. Quand ces supports comportent en tant que couche extérieure une couche microporeuse dont le calibre moyen des pores est inférieur à 100 nm, ils permettent d'obtenir, sans traitement thermique ultérieur, des structures imprimées à faible résistance ohmique.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009041095 | 2009-09-14 | ||
US24288709P | 2009-09-16 | 2009-09-16 | |
PCT/EP2010/063222 WO2011029865A1 (fr) | 2009-09-14 | 2010-09-09 | Substrat pour circuits électroniques |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2478752A1 true EP2478752A1 (fr) | 2012-07-25 |
Family
ID=43217097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10754717A Withdrawn EP2478752A1 (fr) | 2009-09-14 | 2010-09-09 | Substrat pour circuits électroniques |
Country Status (7)
Country | Link |
---|---|
US (1) | US8815375B2 (fr) |
EP (1) | EP2478752A1 (fr) |
JP (1) | JP2013504864A (fr) |
KR (1) | KR20120083885A (fr) |
CN (1) | CN102668731A (fr) |
WO (1) | WO2011029865A1 (fr) |
ZA (1) | ZA201201845B (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102666096A (zh) * | 2009-12-14 | 2012-09-12 | 株式会社大赛璐 | 具有多孔层的层叠体以及使用其的功能性层叠体 |
DE202014003058U1 (de) * | 2014-04-10 | 2014-05-06 | Schoeller Technocell Gmbh & Co. Kg | Verbundkörper mit einer dekorativen Oberfläche, einer elektrisch leitfähigen Struktur und einer elektronischen Schaltung |
SG11201702785VA (en) | 2014-10-10 | 2017-05-30 | Formica Corp | Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor |
JP6373204B2 (ja) * | 2015-02-24 | 2018-08-15 | 北越コーポレーション株式会社 | 電子回路作成用シート |
EP3187322A1 (fr) | 2015-12-31 | 2017-07-05 | Arjo Wiggins Fine Papers Limited | Utilisation de dispositifs électroniques imprimés sur papier pour intégrer un circuit dans des objets moulés en plastique |
FR3071855B1 (fr) * | 2017-10-04 | 2021-02-19 | Inst Polytechnique Grenoble | Procede de fabrication d'un support flexible cellulosique fonctionnel, installation pour la mise en œuvre de ce procede |
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US3652332A (en) | 1970-07-06 | 1972-03-28 | American Can Co | Manufacture of printed circuits |
JPH0797696B2 (ja) * | 1986-07-05 | 1995-10-18 | 株式会社豊田自動織機製作所 | ハイブリツドic基板と回路パタ−ン形成方法 |
JPH06199034A (ja) * | 1992-12-28 | 1994-07-19 | Asahi Glass Co Ltd | 記録用シート |
JP3451757B2 (ja) * | 1994-11-18 | 2003-09-29 | 旭硝子株式会社 | インクジェット方式ラベルライター用テープ |
JP2001267725A (ja) * | 2000-03-16 | 2001-09-28 | Matsushita Electric Ind Co Ltd | セラミック厚膜印刷回路基板の製造方法 |
AU2001277973A1 (en) * | 2000-07-21 | 2002-02-05 | Chul Chai | Ink jet recording medium |
US6899930B2 (en) * | 2000-10-24 | 2005-05-31 | Mitsubishi Paper Mills Limited | Recording material for ink-jet |
JP4042497B2 (ja) * | 2002-04-15 | 2008-02-06 | セイコーエプソン株式会社 | 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体 |
US7910469B2 (en) * | 2002-09-25 | 2011-03-22 | Konica Minolta Holdings, Inc. | Electrical circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor |
US8263983B2 (en) * | 2003-10-28 | 2012-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Wiring substrate and semiconductor device |
JP4916653B2 (ja) | 2003-10-28 | 2012-04-18 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法及び半導体装置の作製方法 |
JP2006181954A (ja) * | 2004-12-28 | 2006-07-13 | Daio Paper Corp | インクジェット記録用紙 |
JP5030511B2 (ja) | 2005-09-20 | 2012-09-19 | 株式会社きもと | 基板用形成材料及び回路基板の製造方法 |
DE102005059321A1 (de) * | 2005-12-09 | 2007-06-28 | Basf Ag | Papiere für Ink-Jet |
JP2007290367A (ja) * | 2006-03-31 | 2007-11-08 | Canon Inc | インクジェット記録媒体及びその製造方法並びにインクジェット記録方法 |
JP5118824B2 (ja) * | 2006-06-22 | 2013-01-16 | 三菱製紙株式会社 | 導電性発現方法 |
JP2008149311A (ja) | 2006-11-21 | 2008-07-03 | Ricoh Co Ltd | 電子部品製造装置、パターン配線シート、電子デバイスシートおよびシート |
EP1926357A3 (fr) | 2006-11-21 | 2009-09-30 | Ricoh Company, Ltd. | Appareil de fabrication de dispositif fonctionnel et dispositif fonctionnel fabriqué avec celui-ci |
JP2008133336A (ja) * | 2006-11-28 | 2008-06-12 | Chisso Corp | インクジェット用インクおよび当該インクにより得られる硬化膜形成方法 |
JP4845214B2 (ja) | 2007-05-11 | 2011-12-28 | 宇部日東化成株式会社 | 導電回路形成用基板、その製造方法、導電回路基板およびその製造方法 |
JP5231884B2 (ja) | 2007-07-04 | 2013-07-10 | 宇部日東化成株式会社 | 多孔質膜、多孔質膜形成用塗工液、積層基板および配線材料 |
JP2009088460A (ja) | 2007-09-28 | 2009-04-23 | Samsung Electro-Mechanics Co Ltd | 回路パターン形成方法 |
-
2010
- 2010-09-09 US US13/395,659 patent/US8815375B2/en not_active Expired - Fee Related
- 2010-09-09 WO PCT/EP2010/063222 patent/WO2011029865A1/fr active Application Filing
- 2010-09-09 JP JP2012528357A patent/JP2013504864A/ja active Pending
- 2010-09-09 KR KR1020127009640A patent/KR20120083885A/ko not_active Application Discontinuation
- 2010-09-09 EP EP10754717A patent/EP2478752A1/fr not_active Withdrawn
- 2010-09-09 CN CN2010800409475A patent/CN102668731A/zh active Pending
-
2012
- 2012-03-13 ZA ZA2012/01845A patent/ZA201201845B/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2011029865A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102668731A (zh) | 2012-09-12 |
WO2011029865A1 (fr) | 2011-03-17 |
US20120234585A1 (en) | 2012-09-20 |
KR20120083885A (ko) | 2012-07-26 |
US8815375B2 (en) | 2014-08-26 |
ZA201201845B (en) | 2013-08-28 |
JP2013504864A (ja) | 2013-02-07 |
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