Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/50—Wavelength conversion elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/52—Encapsulations
  • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

• An optoelectronic semiconductor component is specified.
• Luminescence conversion element is given in the document US 2007/0018102 A1.
• An object to be solved is to specify an optoelectronic semiconductor component which is particularly resistant to aging.
• the housing base body is an injection molded part of a plastic, a resin or a silicone, which may be formed on electrical lead frames. It is also possible that the housing base body comprises or consists of a printed circuit board.
• the printed circuit board can have a ceramic carrier or a metal carrier, on and / or in which electrically insulating and / or electrically conductive coatings can be applied to form conductor tracks and / or connection points.
• the optoelectronic semiconductor component comprises at least one optoelectronic semiconductor chip which is attached to the base body.
• the optoelectronic semiconductor chip is to arranged to emit a primary radiation, wherein the primary radiation contains an ultraviolet radiation component, short UV radiation component.
• the optoelectronic semiconductor chip is a light emitting diode or a semiconductor laser chip.
• the UV radiation component can be any UV radiation component.
• ultraviolet radiation may mean that the radiation has wavelengths between 200 nm and 400 nm inclusive.
• the latter comprises a filter means which is set up to absorb the UV radiation component of the primary radiation. That is, by the filter means of the UV radiation fraction after passing through the filter means to at least 50%, preferably at least 80%, more preferably at least 95% attenuated.
• the filter medium is located completely or partially between the semiconductor chip and the housing base body. At least part of the UV radiation component of the primary radiation emitted by the semiconductor chip is thus prevented by the filter medium from reaching the housing base body.
• the filter medium is located partly or completely between the semiconductor chip and an optical component.
• the optical component may be a lens and / or a reflector. It is possible that the optical component is a component of the semiconductor device itself.
• the filter means is that is, the amount of UV radiation that reaches the optical component can be reduced, compared to a semiconductor component without such a filter medium.
• the UV radiation component at a total optical power of the primary radiation makes up a proportion of between 0.1% and 4.0%.
• the UV radiation fraction based on the total optical power, is preferably between 0.2% and 3.0%, in particular between 0.25% and 2.5%.
• the remaining radiation fraction which for example only has wavelengths greater than 400 nm, is preferably in the visible spectral range. That is, the amount of UV radiation emitted from the semiconductor chip
• the optoelectronic semiconductor component has a housing base body and at least one optoelectronic semiconductor chip, which is attached to the housing base body.
• the optoelectronic semiconductor chip emits a primary radiation, the primary radiation having a UV radiation component. Furthermore, this includes
• a filter means which is adapted to absorb the UV radiation component of the primary radiation, wherein the filter means at least partially between the semiconductor chip and the housing base and / or between the semiconductor chip and an optical
• the UV radiation fraction based on a total optical power of the primary radiation, is between 0.1% and 4.0% inclusive.
• short-wave radiation ie in particular ultraviolet radiation with wavelengths less than or equal to 400 nm
• discoloration of a housing base body, of a potting body surrounding the semiconductor chip or of optical elements molded from a plastic may occur.
• a discoloration for example, a reflectance of a housing base body is lowered and thereby a Lichtauskoppeleffizienz also reduced from the semiconductor device.
• Such discoloration can be prevented or significantly slowed down by preventing ultraviolet radiation from reaching the housing base or the optical element. This can be realized by the filter means, which is preferably in spatial proximity to the semiconductor chip.
• the UV radiation component of the primary radiation is absorbed near the chip, or at least greatly reduced, so that the UV radiation component, for example, does not reach the housing base body. Since the proportion of UV radiation is relatively low, an efficiency of the semiconductor device is not significantly deteriorated by the filter means itself.
• the filter medium is epitaxially deposited on the semiconductor chip in at least one layer.
• the filter medium can thus consist of an epitaxially grown layer.
• the filter means preferably has a different material composition than the semiconductor chip.
• the filter means then comprises one or more InGaN layers epitaxially deposited on the semiconductor chip, which preferably exhibit an absorption edge at about 400 nm.
• the filter medium can be directly on a Be grown semiconductor material of the semiconductor chip or be separated by an intermediate layer, for example by an electrically conductive layer of the semiconductor material of the semiconductor chip.
• the filter medium comprises or consists of a titanium oxide, such as titanium dioxide, and / or a zinc oxide.
• a titanium oxide or a zinc oxide is embedded in a matrix material of the filter medium.
• the filter medium is attached in the form of a layer to the semiconductor chip.
• the layer of the filter medium is completely or partially in direct
• the semiconductor chip may be completely enclosed by the filter medium and the housing base body.
• the filter means is sealed on a side facing away from the semiconductor chip with a silicon-containing layer.
• the filter means then has a rough or porous surface facing away from the semiconductor chip, which is susceptible to oxidation, for example.
• the silicon-containing for example, with a glass, a silicone or an epoxy-silicone hybrid material molded or existing layer, the filter medium is protected from environmental influences.
• a material of the layer is different, in particular, from a material of a potting body.
• the filter means is in direct contact with the semiconductor chip. That is, at least in places, the filter medium is in direct physical
• the semiconductor material to which the filter medium is in direct contact is preferably grown epitaxially.
• the filter medium is shaped as a small plate.
• the plate is preferably mechanically self-supporting, that is, on a length scale of an edge length of the semiconductor chip, the plate does not bend or not significantly.
• the platelet preferably comprises at least one phosphor.
• the platelet may have as a matrix material for filter particles of the filter medium and / or for phosphor particles a silicone or a silicone epoxide.
• the filter medium is located between a material in which the phosphor is embedded and the semiconductor chip.
• the material with the phosphor may be in direct contact with the filter means and the filter means may be in direct contact with the semiconductor chip.
• the chip with the filter particles is attached to the semiconductor chip and is preferably in direct contact therewith.
• the plate covers a side facing away from the housing base top of the semiconductor chip completely. Between the plate and the semiconductor chip may be a bonding agent.
• the platelet preferably has a thickness of between 5 ⁇ m and 100 ⁇ m inclusive, in particular between 10 ⁇ m and 60 ⁇ m inclusive.
• the filter medium is added to a potting body, wherein the potting body partially or completely surrounds the semiconductor chip.
• the potting body partially or completely surrounds the semiconductor chip.
• the potting body fills a recess of the housing base, in which the semiconductor chip is mounted.
• the filter medium is homogeneously distributed in the potting.
• the filter medium is distributed inhomogeneous in the potting.
• the potting body can be formed as an optical component.
• a material of the potting body is for example a silicone, an epoxy and / or a plastic.
• the filter medium comprises or consists of nanoparticles.
• the nanoparticles preferably have an average diameter of between 0.5 nm and 100 nm.
• the nanoparticles are designed as indicated in US 2004/0007169 A1, the disclosure of which is incorporated by reference to the nanoparticles.
• the filter means is on at least one boundary surface of the housing base body and / or a optical component, which may be part of the semiconductor device applied.
• the filter means may thus be present as a layer with a thickness of preferably at most 50 ⁇ m on at least one side of the housing base body and / or at least one side of the optical component.
• the optical component is in places in direct contact with the housing base body and / or with the filter medium. That is, a material of the housing main body may be in direct contact with a material of the optical component.
• the housing base body is formed from a transparent or white plastic.
• photo damage can be caused by ultraviolet radiation, that is, in particular by radiation having wavelengths of between 200 nm and 400 nm inclusive.
• the housing base body may therefore discolor, for example yellow.
• the filter means a use of such materials for the housing base body is made possible, whereby manufacturing costs can be lowered.
• Housing body can be used.
• High temperature resistant in this case preferably means that the housing base body survives the occurring during soldering temperatures of, for example, at least 245 0 C over a period of at least 10 s non-destructive.
• Such materials are for Example polyamides, especially polyphthalamide or short PPA, or provided with fillers and / or stabilizers polyamides, which show only a comparatively low stability to ultraviolet or blue radiation. The cost-increasing, a development of photo damage delaying fillers can be eliminated by the use of the filter means at least in part.
• the filter medium is designed as a foil.
• a layer thickness of the film is preferably between 10 ⁇ m and 100 ⁇ m inclusive, in particular between 25 ⁇ m and 75 ⁇ m inclusive.
• the fact that the filter medium is a film may mean that the filter medium is made mechanically flexible.
• the filter means on a length scale, which corresponds to an edge length, for example, of the optoelectronic semiconductor chip, be bendable. It is possible that the designed as a film filter medium is not mechanically self-supporting.
• the filter means comprises a scattering means, wherein the scattering means is preferably made transparent or reflective for visible radiation.
• the scattering agent is designed in particle form and introduced into the matrix material of the filter medium.
• the filter medium is permeable, in particular clear, for visible light.
• the filter means affects visible radiation, unlike ultraviolet radiation, not or not significantly.
• FIGS 1 to 6 are schematic sectional views of embodiments of optoelectronic semiconductor devices described herein.
• Figure 7 is a schematic representation of the dependence of a reflectance of titanium dioxide as a function of the wavelength.
• a housing base 2 which is formed for example by a reflective, white, injection-molded plastic material, has a recess 10.
• an optoelectronic semiconductor chip 3 for example, a light emitting diode, mounted.
• electrical contacts or lead frames to which the semiconductor chip 3 is attached are not shown in the figures.
• the recess 10 of the housing base body 2 is preferably completely filled with a potting body 6, so that the semiconductor chip 3 is completely surrounded by the potting body 6 and the housing base body 2.
• the filter means 4 absorbs an ultraviolet radiation component, in short UV radiation component, of a primary radiation emitted by the semiconductor chip 3. This prevents that the UV radiation fraction of the primary radiation to the
• Housing base 2 passes, or at least this UV radiation fraction of the primary radiation, the
• Housing body 2 passes, considerably reduced. As a result, for example, a discoloration of the plastic material of the housing base body 2 is prevented or slowed down.
• the UV radiation component only makes up a small proportion of the total radiation emitted by the semiconductor chip 3.
• a visible radiation component emitted by the semiconductor chip 3 can preferably pass through the potting body 6 with the filter means 4 uninfluenced or substantially uninfluenced.
• the filter means 4 is designed as an epitaxial layer 13.
• the filter means 4 may be integrally formed with the semiconductor chip 3, indicated in Figure 2 by a dashed line. In one piece, it can mean that the filter means 4 is connected to the semiconductor chip 3 in a mechanically fixed and connectionless manner.
• the filter means 4 is in direct contact with an epitaxially grown semiconductor material of the semiconductor chip 3.
• the semiconductor chip 3 with the filter means 4 is located in the recess 10 of the housing base body 2.
• lateral boundary surfaces of the recess 10 appear as straight line sections in a sectional illustration
• lateral boundary surfaces according to FIG. 2 are the recess 10 curved.
• the lateral boundary surfaces of the recess 10 can serve as a reflector, which reflects the emitted radiation from the semiconductor chip 3 targeted.
• FIG. 3 shows that the filter means 4 is in the form of a layer on the semiconductor chip 3.
• the filter medium 4 preferably comprises or consists of titanium dioxide.
• the filter medium 4 is generated by sputtering or by a vapor deposition.
• the filter means 4 and the semiconductor chip 3 are encapsulated by a silicon-containing layer 8.
• the silicon-containing layer 8 for example, silicon dioxide, silicon nitride, a silicone or a glass, a photoreactivity of the filter means 4, ie in particular of
• Titanium dioxide be suppressed.
• an optical component for example in the form of a converging lens, is formed.
• the optical component 7 may also be designed Fresnel-lens-like.
• a mirror 11 which has a reflective effect on the primary radiation emitted by the semiconductor chip 3, is located between the housing base body 2 and the semiconductor chip 3. lateral
• Boundary surfaces of the recess 10 are covered by the filter means 4, which is applied as a layer on the lateral boundary surfaces.
• the layer is for example imprinted, vapor-deposited or sputtered on.
• the filter means 4 preferably acts in a reflective manner for the proportion of primary radiation emitted by the semiconductor chip 3 with wavelengths in the visible spectral range.
• a bottom surface of the recess 10, on which the semiconductor chip 3 and the mirror 11 are mounted is uncovered or substantially uncovered by the filter means 4, unlike in the exemplary embodiment according to FIG. 4B.
• the semiconductor chip 3 furthermore has a comparatively large distance from the bottom surface of the recess 10. It is located between the semiconductor chip 3 and the bottom surface of the recess 10, an intermediate carrier 12, which is designed for example as a connection platform. With this configuration, it is particularly efficiently prevented that a UV radiation component of the primary radiation reaches the housing base body 2.
• the filter means 4 is formed by a preferably mechanically self-supporting plate 5, which has a thickness of for example between 10 .mu.m and 100 .mu.m.
• the filter means 4 prevents the UV radiation portion of the primary radiation from reaching the potting body 6 designed as an optical component 7, which, together with the planar-shaped housing base body 2, completely surrounds the semiconductor chip 3.
• the filter medium 4 unlike, for example, in Figures 3 to 5, be formed as a mechanically flexible film. It is likewise possible for the filter medium to be applied in the form of a silicone paste, which in particular is admixed with a titanium oxide or a zinc oxide, on the semiconductor chip or else on boundary surfaces of the recess 10 or of the housing base body 2. The paste can then be cured in particular thermally.
• Filter means 4 together with the housing base 2, the semiconductor chip 3 completely.
• a mirror 11 not shown in FIG. 6 can be located between the semiconductor chip 3 and the housing base body 2.
• the filter means 4 can also surround the semiconductor chip 3 in a lens-like shape. Such forms arise, for example, by the application of the filter means 4 in a dripping process.
• a matrix material of the filter means 4 may be adapted to a material of the potting body 6, so that these materials show good adhesion properties to each other.
• FIG. 7 illustrates a profile of a reflectivity R as a function of a wavelength ⁇ for titanium dioxide. Below about 400 nm, the reflectivity of titanium dioxide decreases significantly. In particular, in multiple reflections, for example when the filter means 4 has a plurality of filter particles on which the primary radiation is reflected many times, a UV radiation component with wavelengths below 400 nm from the primary radiation by such a filter means 4 effectively be filtered out. The non-reflected UV radiation component is absorbed in particular by the titanium dioxide.
• the potting body and / or the filter medium may in each case also be accompanied by a phosphor, for example on yttrium-aluminum-garnet: cerium-based, which is adapted to convert a blue radiation component of the primary radiation partially or completely into a longer-wave radiation.
• a phosphor for example on yttrium-aluminum-garnet: cerium-based, which is adapted to convert a blue radiation component of the primary radiation partially or completely into a longer-wave radiation.
• the semiconductor chip 3 exhibits a maximum radiation emission at a wavelength of approximately 444 nm, with a total optical power of approximately 0.4105 W and a radiation power below 400 nm of at most 0.0064 W. This corresponds to a proportion of the ultraviolet radiation in the total optical power of about 1.6%.
• the total optical power can be about 0.3902 W and the UV component about 0.0047 W, for example, at a wavelength of about 457 nm and a total optical power of about 0.3956 W in the UV at about 0.0025 W, and at a wavelength of about 465 nm and a total optical power of about 0.3353 W at about 0.0013 W in the ultraviolet spectral range.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Led Device Packages (AREA)

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• 2009
  • 2009-06-17 DE DE102009025266.5A patent/DE102009025266B4/de not_active Expired - Fee Related
• 2010
  • 2010-05-12 EP EP10720408A patent/EP2443674A2/de not_active Withdrawn
  • 2010-05-12 JP JP2012515407A patent/JP2012530365A/ja active Pending
  • 2010-05-12 KR KR1020127001375A patent/KR101673457B1/ko active IP Right Grant
  • 2010-05-12 WO PCT/EP2010/056602 patent/WO2010145893A2/de active Application Filing
  • 2010-05-12 US US13/318,624 patent/US8569782B2/en not_active Expired - Fee Related
  • 2010-05-12 CN CN201080027028.4A patent/CN102460745B/zh not_active Expired - Fee Related

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