EP2427918A2 - Cellule solaire, module solaire comprenant cette cellule solaire, ainsi que procédés pour sa production et pour la production d'un film de contact - Google Patents

Cellule solaire, module solaire comprenant cette cellule solaire, ainsi que procédés pour sa production et pour la production d'un film de contact

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Publication number
EP2427918A2
EP2427918A2 EP10715883A EP10715883A EP2427918A2 EP 2427918 A2 EP2427918 A2 EP 2427918A2 EP 10715883 A EP10715883 A EP 10715883A EP 10715883 A EP10715883 A EP 10715883A EP 2427918 A2 EP2427918 A2 EP 2427918A2
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
layer
contact points
conductive layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10715883A
Other languages
German (de)
English (en)
Inventor
Michael Sedlacek
Joerg Mueller
Claudio Meisser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komax Holding AG
Original Assignee
Komax Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komax Holding AG filed Critical Komax Holding AG
Publication of EP2427918A2 publication Critical patent/EP2427918A2/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to a solar cell, a solar module comprising this solar cell as well as processes for their production and for the production of a contact film.
  • Conventional solar cells consist of a layer structure which is formed in a plate-shaped semiconductor material, for example monocrystalline or multicrystalline silicon.
  • the semiconductor material forms the p-type base.
  • a thin n-type layer By diffusion of phosphorus, a thin n-type layer, the so-called emitter, is produced on the surface.
  • the base is contacted by means of a full-surface applied aluminum layer.
  • the emitter is contacted via narrow fingers, which are interconnected by one or more so-called busbars. Since the metallic fingers and busbars do not allow light to enter the contacted areas of the cell, but increase the number and width of fingers but the series resistance, the fingers and busbars must be designed to minimize electrical losses and shadowing losses.
  • WO 2007/096752 A2 describes a method for contacting back contact solar cells, in which the contacting takes place through the holes of a mounted on the solar cell perforated, electrically insulating film by means of wave soldering. Such a method has the disadvantage of a comparatively high temperature load the solar cell and the use of a solder, which must first be melted.
  • Object of the present invention is to provide a solar cell of the type Ragakttsolarzelle and a corresponding ' solar module with a variety of back-contact solar cells, in which a simple and inexpensive contacting and electrical interconnection of solar cells is realized.
  • Another object of the invention is to provide a process for producing this solar cell.
  • the invention thus relates to a solar cell comprising the following layers:
  • “Lot-free electrically conductive connection” generally means that the electrically conductive connection contains no material (solder) having a lower melting point than the parts to be connected.
  • the customary materials known to those skilled in the art can be used.
  • the electrically conductive layer may consist of a plurality of electrically conductive materials, as long as this material does not impair the function of an electrically conductive layer in a solar cell.
  • the electrically conductive layer may in particular consist of a metal or an electrically conductive organic polymer.
  • metals for the electrically conductive layer it is preferable to use noble metals, aluminum and aluminum alloys, copper, titanium, or silver.
  • Aluminum, aluminum alloys and copper are particularly preferably used, and very particularly preferably aluminum or aluminum alloys are used. It can be connected to each other the same metals as well as different metals. Also, a multilayer structure (e.g., Al / Cu) is possible.
  • Particularly suitable electrically conductive organic polymers have chains with conjugated double bonds.
  • those derived from a substituted polythiophene are again preferred, the substituents preferably having C 1 -C 10 -alkyl or alkoxy groups.
  • Ultrasonic welding is particularly well suited for bonding the aforementioned metals. By means of ultrasonic welding, it is also possible to produce a connection between electrically conductive thermoplastics with one another or with a metal.
  • the electrically conductive layer preferably has a thickness of 0.05 to 0.2 mm and is in particular an aluminum or copper foil.
  • "monolayer or multilayer film” is to be construed broadly and includes a single film of a particular material, eg, a polyethylene terephthalate (PET) film, but also a laminate composed of multiple bonded films “Layer” can therefore also have the meaning of foil.
  • a polyethylene terephthalate film is preferably used.
  • Such a monolayer film is also referred to herein as an insulator film.
  • a multilayer film is used as the first single-layer or multi-layer perforated film
  • EVA ethylene-vinyl acetate
  • polyethylene phthalate are used as materials.
  • One of these layers or foils is also referred to herein as insulator film; this insulator film is preferably a polyethylene terephthalate film.
  • the first single-layer or multi-layer perforated film made of a non-conductive material may be a backsheet as a backcoat for protecting the solar cell or one of the
  • Backside coating preferably contains a fluorine-containing polymer, in particular a
  • Polyvinyl fluoride (PVF).
  • a particularly suitable polyvinyl fluoride is under the name
  • Tedlar® available from Dupont.
  • the backside coating may be monolayer or multilayer, e.g. a PVF-polyester-PVF composite.
  • a multilayer film as the first single-layer or multi-layer film is preferred according to the invention, since in a preferably soft insulator film used (also referred to as melt film), the punching process is facilitated.
  • An EVA film is soft and is therefore preferably punched together with a second film supporting it.
  • the films or layers used in the first single-layer or multilayer film preferably have a thickness of from 0.01 to 0.5 mm, particularly preferably from 0.2 to 0.4 mm.
  • the first single or multilayer film is generally bonded to the electrically conductive layer with an adhesive. Such adhesives are known per se.
  • the solder-free electrically conductive connection comprises a contact band between the part of the first and second contact points and the structured electrically conductive layer.
  • the material of the contact band is generally selected from the same materials as that of the electrically conductive layer.
  • the size of the contact band is preferably matched to the size of the first and a second hole described below, which preferably have a hole size corresponding to a diameter of 1 to 10 mm, in particular from 2 to 5 mm.
  • the distance between the holes is generally taken into account, so that with a larger distance between the holes usually a larger contact band can be used.
  • solderless electrically conductive connection comprises an electrically conductive adhesive or is obtainable by ultrasonic welding.
  • the electrically conductive connection can advantageously also be obtained by laser welding.
  • a hold-down device for the electrically conductive layer is preferably used, so that electrically conductive layer and contact points can touch.
  • the hold-down is generally transparent or the hold-down has a recess here.
  • the solar cell of the invention has, in addition to the already mentioned layers (semiconducting layer, first single-layer or multi-layer perforated film, structured electrically conductive layer), further layers.
  • the solar cell according to the invention preferably has a second one on the second surface of the semiconductive layer. or multilayer film on, for example an antireflective layer (e.g., of silicon nitride) and / or another protective film (e.g., ethylene-vinyl acetate polymer).
  • an antireflective layer e.g., of silicon nitride
  • another protective film e.g., ethylene-vinyl acetate polymer.
  • a transparent pane is still provided e.g. made of glass or polycarbonate, preferably made of glass.
  • the thickness of the semiconducting layer is preferably 20 to 500 ⁇ m and most preferably 80 to 220 ⁇ m.
  • the thickness of the first single or multi-layered perforated film is preferably 20 to 400 microns.
  • the thickness of the patterned electrically conductive layer is preferably 5 to 200 ⁇ m.
  • solderless electrical connection is obtainable by ultrasonic welding.
  • Ultrasonic welding with or without simultaneous heat input, is a form of welding in which kinetic energy is used in the form of friction, which generally results from an oscillating relative translational movement of the parts to be joined under the influence of a static pressure.
  • friction is used in friction welding, which is mainly caused by a rotating or oscillating relative movement of the parts to be joined under the action of a static pressure. While according to the invention, in principle, friction welding can also be used to produce the electrically conductive connection, ultrasound welding is particularly preferred.
  • an ultrasonic welder includes a lower electrode (referred to as “anvil”) and an upper electrode (called a “sonotrode”).
  • the sonotrode executes vibrations in a connection plane of the surfaces to be connected with a frequency of generally 10 to 200 kHz, preferably from 30 to 100 kHz.
  • the amplitude is generally in the range of 1 to 50 microns and the power generally in the range of 0.01 to 1 kW, with the welding times are generally between 0.1 and 1 sec.
  • the direction of vibration of the ultrasound and the direction of force are generally perpendicular to each other, with the surfaces to be joined rubbing against each other.
  • the use of welding consumables is dispensed with.
  • the ultrasonic welding takes place without supplying additional heat energy.
  • the ultrasonic welding can also be carried out with the supply of additional heat energy, for example by the anvil is additionally heated electrically.
  • the ultrasonic energy sonotrode and anvil can be adapted to the respective connection form.
  • the achievable strength of the electrically conductive connection depends on several parameters. In particular, the type of materials to be welded, the welding power and amplitude of the welding system and the nature of sonotrode and anvil are taken into account. As the material for the sonotrode and the anvil, a variety of different materials can be used as long as the purpose of the invention is achieved.
  • the structured electrically conductive layer is pressed by means of an ultrasonic welding device on the first contact points and the second contact points of the semiconductive layer.
  • the solderless electrical connection is a direct connection between the first and second contact points or a part thereof and the structured electrically conductive layer.
  • direct connection means, in particular, that there is no further material between the first or second contact point and the structured electrically conductive layer
  • the direct connection can preferably be produced by ultrasonic welding.
  • the invention also relates to a solar module, which has a plurality of solar cells described above.
  • the solar cells are generally arranged adjacent to each other and electrically connected to each other.
  • On the back, i. the side facing away from the solar radiation side of the solar cell are arranged in a predetermined arrangement, for example in a matrix arrangement, a plurality of first contact points of a first polarity and second contact points of opposite polarity spaced from each other.
  • the contact portions of opposite polarity are executed interleaved, in correspondence to
  • the contact points of the same polarity on the back of the solar cell per polarity are arranged alternately in parallel rows.
  • a contact foil from the first single-layer or multi-layer perforated film and the structured electrical layer can cover a single row of solar cells (so-called string) or an entire solar module.
  • electrical connection means are provided to electrically connect adjacent solar cells with each other.
  • the planar etching away of the electrically conductive layer e.g. a metal foil made of aluminum or copper, conductor tracks, which connect the solar cells in the desired manner according to the preferred ultrasonic welding, for example in a series circuit to achieve a higher voltage or in parallel to achieve a higher amperage of the electric current generated upon incidence of light on the solar cell. Combinations of these circuits are also possible.
  • connection arrangements for the electrical connection of solar cells are described, for example, in WO 2008/113741 A.
  • the subject matter of the invention is a process for producing a solar cell, which comprises the following layers:
  • a first single or multi-layer, perforated foil consists in an electrically non-conductive material having a plurality of first holes
  • a first single- or multi-layer perforated sheet of an electrically non-conductive material having a plurality of first holes is applied, and on this perforated film, an electrically conductive layer is applied, wherein the perforated film on the semiconducting layer like that applying, that at least a part of the first holes and the first contact points and the second contact points are opposite to each other;
  • “Structuring of the electrically conductive layer” means that parts are removed from an originally compact electrically conductive layer, so that only those parts of the originally compact electrically conductive layer remain which are relevant for an intended contacting of contact points.
  • the electrically conductive layer is provided with a cover layer in such a way that only the structures of the later-obtained structured electrically conductive layer are provided with the cover layer. The parts of the electrically conductive layer not provided with the cover layer can then be removed, for example, in a suitable etching bath.
  • the structured electrically conductive layer is preferably connected to the first contact points and the second contact points by ultrasonic welding or friction welding, particularly preferably by ultrasonic welding.
  • a first monolayer or multilayer film of one or more electrically non-conductive materials is perforated by punching to form a plurality of first holes, and the resulting first monolayer or multilayer perforated film is laminated with an electrically conductive layer ,
  • the structured electrically conductive layer is pressed through the first holes on the first contact points and the second contact points and then connected by ultrasonic welding the structured electrically conductive layer with the first contact points and the second contact points.
  • the pressing of the structured electrically conductive layer on the first contact points and the second contact points is preferably carried out with an ultrasonic welding device.
  • an ultrasonic welding device for this purpose can ⁇
  • the sonotrode be designed at its tip suitable to ensure optimum pressing.
  • the first holes preferably have a round shape.
  • a circular cutout of the electrically conductive layer is therefore generally pressed down. To reduce mechanical stresses can therefore be provided that before pressing down on both sides of a remaining web each a circle section is punched out.
  • the electrically conductive layer is provided by punching with a plurality of second holes, so that the second holes are located above the first holes; attaching a contact band between the part of the first pads and the second pads and the structured electrically conductive layer; and a solderless electrically conductive connection is produced.
  • the first and / or second holes may have different cross sections.
  • both the first holes and the second holes have a circular cross-section.
  • the size of the first holes and / or the second holes generally corresponds to one
  • Holes) and / or between the contact points preferably 1 to 15 cm and more preferably 3 to 7 cm.
  • the production of second holes preferably by punching the electrically conductive layer to form second holes in the electrically conductive layer, before or after the structures of the metallically conductive layer, for example in a Etching bath, done.
  • the contact band is applied over the second holes and brought into physical contact with the semiconductive layer by depression.
  • the physical contact can be direct or indirect.
  • an indirect contact is located between the contact strip and the semiconducting layer and / or the electrically conductive layer, for example, a per se known electrically conductive adhesive.
  • the contact band is generally connected at two locations to the patterned electrically conductive layer and at a location having the semiconductive layer. In these three places, an electrically conductive connection can be realized by various methods such as gluing or ultrasonic welding. Preferably, however, the same type of connection is used for all three locations, so that, for example, the contact band is connected at two points to the electrically conductive layer by means of ultrasonic welding and at one point with the semiconductive layer.
  • the possibly electrically conductive adhesive can be applied to the cells or the contact foil by dispensing or screen printing. They may be single-component or multi-component adhesives that cure at room temperature, at elevated temperature, under pressure or UV radiation.
  • the invention also relates to a method for producing a contact foil comprising a first single- or multi-layer perforated foil of an electrically non-conductive material having a plurality of first holes and a patterned electrically conductive layer, wherein (g) a first on or multilayer film of one or more electrically non-conductive materials is provided; (h) bonding the first single or multilayer film to an electrically conductive layer; (i) a covering layer is applied to at least part of the electrically conductive layer;
  • step (k) by punching at least the first single- or multi-layer film is provided with a plurality of first holes; wherein punching according to step (k) may be performed after each of steps (g) to (j). ⁇
  • a contact foil in the sense of the present invention is an at least two-layered foil in which a layer of an electrically conductive material and a further layer of an electrically insulating material are formed.
  • the application of a covering layer only takes place after the first single-layer or multi-layered film has been connected to an electrically conductive layer.
  • the application of the covering layer is preferably carried out by applying an overcoat to protect the parts of the electrically conductive layer which are not to be etched away in the etching bath.
  • the top coat can be applied by various methods, for example by spraying, spraying or screen printing. In particular, in the case where the overcoat is applied over the entire surface, the method is not particularly limited. On the other hand, if specific structures are to be protected from etching, the cover color is preferably applied by screen printing.
  • the etching bath consists of chemical substances which allow the etching away of the non-protected parts of the electrically conductive layer.
  • the composition therefore depends on the type of metal or electrically conductive polymer used.
  • a cleaning of the contacting film can be carried out, for example, in a further bath (immersion bath).
  • the stamping of the foil can be carried out between the etching step and the cleaning of the resulting contacting foil or after the cleaning of the laminate of structured electrical layer and first single- or multilayer foil after passing through the etching bath;
  • a cleaning step after the etching bath may involve removing the covering layer (e.g., top coat) from the protected sites and / or constituents of the etching bath.
  • a first monolayer or multilayer foil which has a self-adhesive insulator foil on one side of which a second monolayer or multilayer foil, eg a backside foil, is arranged, and on the other side of which a release foil , For example, a siloxane liner, is applied. It is preferred that the first one or ⁇
  • multilayer film is provided on a surface to be connected to the electrically conductive layer with an adhesive.
  • the stamping of the insulator foil is facilitated, in particular if the first single- or multilayered foil consists only of the insulator foil.
  • the present invention enables solar cells to efficiently with a very good electrically conductive connection between the power generation layer, i. the semiconductive layer, and the electrical wiring used to derive the generated solar power can be equipped.
  • the present invention makes it possible for back-contact solar cells to be electrically connected to a flexible printed circuit (contacting film) in an optimum manner and at the same time correctly positioned and fixed relative to one another.
  • FIG. 1 shows a section of a solar module 3, which has a plurality of solar cells 1 according to the present invention in a linear arrangement.
  • FIG. 2 shows an enlarged detail of the solar module shown in FIG. 1 according to the present invention.
  • FIG. 3 shows, in a perspective view of a section of a solar cell, three variants of the invention for electrically conductive variants arranged side by side
  • FIG. 4 shows a section through a solar cell according to an embodiment of the present invention.
  • Fig. 5 shows a section through a solar cell according to another embodiment of the present invention.
  • FIG. 6 shows a perspective view of a first embodiment of a method according to the invention for producing a contact foil.
  • Fig. 7 shows a perspective view of a second "embodiment, for an inventive process for producing a contact foil.
  • Fig. 8 shows a typical Verschaltungstine in a solar module.
  • FIG. 1 shows a detail of a solar module 3 which has a plurality of solar cells 1 in a linear arrangement, the complexity of the layer structure shown increasing from left to right.
  • a perforated foil 8 made of an electrically non-conductive material with first holes 9 is arranged over a semiconducting layer 2 with first contact points 6 of positive polarity and second contact points 7 negative polarity.
  • a perforated foil 8 made of an electrically non-conductive material with first holes 9 is arranged above the perforated film 8.
  • a structured electrically conductive layer 10 is arranged, which via solderless electrical
  • connections 11 with the first and second contact points 6.7 of the semiconductive layer 2 is electrically connected.
  • the first and second contact points 6, 7 of the semiconductive layer 2 therefore lie opposite the first holes 9 of the perforated film 8.
  • FIG. 2 shows an enlarged detail of the solar module according to the present invention shown in FIG. 1, in which two interconnected solar cells 1 are partially visible.
  • a semiconducting layer 2 has a first surface 4, which faces away from the solar radiation during operation of the solar cell, and a second surface 5, which faces the solar radiation during operation of the solar module.
  • the first surface 4 of the semiconductive layer 2 has first contact points 6 of positive polarity and second contact points 7 of negative polarity.
  • On the first surface 4 a perforated foil 8 of an electrically non-conductive material with first holes 9 is arranged so that the first holes 9 lie over the first and second contact points 6,7.
  • a structured electrically conductive layer 10 is arranged, which is electrically conductively connected via solderless electrical connections 11 to the first and second contact points 6, 7 of the semiconducting layer 2.
  • the first contact points 6 and the second ⁇
  • Contact points 7 are each arranged in alternating rows in order to be able to ensure an optimal dissipation of the electricity generated in conjunction with a correspondingly structured electrically conductive layer 10.
  • the size of the first holes 9 in the embodiment of the invention shown in Figures 1 and 2 is 4 mm in each case, with the spacing of the first holes 9 being 6 cm in the embodiment shown here Other sizes and distances are possible.
  • crystalline silicon is used as the material of the semiconductive layer.
  • the solar cells contained in the solar modules shown in FIGS. 1 and 2 are electrically connected to each other in a manner not shown here in detail in a series circuit.
  • FIG. 3 shows, in a perspective view of a section of a solar cell, three variants of electrically conductive connections 11 arranged side by side between the electrically semiconductive layer 2 and the structured electrically conductive layer 10 through a perforated film 8.
  • All variants have in common that located on a semiconducting layer 2 with a first surface 4 and a second surface 5 on the first surface 4 are arranged first and second contact points 6.7 different polarity. Since the nature of the polarity has no effect on the electrical connection, it is not specified here.
  • an electrically conductive connection 11 is realized in that a contact strip 12 located on a structured electrically conductive layer 10 passes through a first hole 9 in the perforated foil 8 and a second hole 19 in the structured electrical Layer 10 is electrically connected to a first or second contact point 6, 7 of the semiconducting layer 2.
  • Compound 11 is realized between the structured electrically conductive layer 10 and the semiconducting layer 2 by a web 27 punched out of the structured layer 10, said web extending onto a first or second contact point 6, 7 of the semiconductive layer 2 pressed and electrically conductively connected by means of ultrasonic welding.
  • the second hole 19 thus consists of two circular section-shaped openings.
  • the electrical connection is realized by pressing the structured electrically conductive layer 10 by the "first hole 9 through a first or second contact point 6.7 of the semiconductive layer 2, for example, using a suitably shaped Sonotrode an ultrasonic welder, and then electrically connected by ultrasonic welding.
  • the electrically conductive connection 11 is produced in the three variants shown in FIG. 3 by ultrasonic welding. However, it is also conceivable that between the structured electrically conductive layer 10 and the semiconductive layer 2, an electrically conductive adhesive is applied, which realizes the electrical connection.
  • the contact strip 12 can also be electrically conductively connected by means of an electrically conductive adhesive to the structured electrically conductive layer 10 on the one hand and to the semiconducting layer 2 on the other hand.
  • the electrically conductive adhesive could be applied to the contact points 6 and 7, for example, before or after the bonding of the perforated film 8 with the semiconducting layer 2.
  • FIG. 4 shows a section through a solar cell according to an embodiment of the present invention.
  • the side of the solar cell facing away from solar radiation is arranged at the top and the side facing the solar radiation /
  • first a protective layer backsheet, eg of a PVF such as Tedlar®
  • backsheet eg of a PVF such as Tedlar®
  • structured electrically conductive Layer 10 e.g of a PVF such as Tedlar®
  • a perforated electrically non-conductive layer 8 with first holes 9 a semiconductive layer 2
  • a second single-layer or multi-layer film 14 the example an antireflection layer and / or an ethylene-vinyl acetate polymer film as a further protective layer
  • a glass pane 15 are arranged.
  • an electrically conductive connection 11 according to the second or third variant of FIG. 3 is realized by the structured electrically conductive layer 10 passing directly through a first hole 9 with a first or second contact point 6 7 is connected to the semiconductive layer 2.
  • the connection 11 was made by ultrasonic welding or laser welding.
  • FIG. 5 shows a section through a solar cell according to a further embodiment of the present invention, in which the solderless electrical connection 11 is realized by means of a contact strip 12.
  • the layer sequence corresponds to that shown in FIG. 4.
  • FIG. 5 the first variant of FIG. 1 can be seen in section on the left.
  • the solderless electrical connection 11 was produced in the first variant by means of ultrasonic welding or laser welding.
  • a fifth variant for the solderless electrical connection 11 is shown, in which a contact strip 12 by means of an electrically conductive adhesive 16 with both the structured electrically conductive layer 10 and with a first or second contact point 6,7 on the semiconducting Layer 12 is electrically connected.
  • FIG. 6 shows a perspective view of a first embodiment of a method according to the invention for producing a contact foil.
  • the arrow indicates the direction of movement of the slides.
  • a single-layered film 17 is used as single-layer or multi-layered film.
  • the single-layer film 17 coming from a supply roll is punched in a punching device 21 and then coated with adhesive in an adhesive application device 22 on the side to be subsequently connected to an electrically conductive layer.
  • the perforated film 8 provided with first holes 9 is brought together with a metal foil coming from another roll as the electrically conductive layer 18.
  • the perforated foil 8 opposite surface of the metal foil 18 is then provided in a first screen printing device 23 at certain locations to be protected with a cover layer 29, which has the function that before a Wegiserung in an etch 20 to be protected locations of the electrically conductive metal foil 18th to protect. There then takes place a further transport of the film laminate to a second screen printing device 32, wherein the back of the electrically conductive layer 18 is provided over its entire surface with a covering layer 29. Subsequently, the film laminate treated in this way passes into an etching bath 20, where the unprotected parts of the metal foil 18 are etched away and only the desired conductor structures of the structured electrically conductive layer 10 remain.
  • the Kunststoffierfolie 27 obtained is then transported on Tra ⁇ sportrollen 25 on, for example in ⁇
  • a cleaning bath not shown here, in order to remove residues of the etching bath 20 and / or the covering layer 29 adhering to the contacting film 27.
  • FIG. 7 shows a perspective view of a second embodiment of a method according to the invention for producing a contact foil.
  • a self-adhesive isolator foil 13 which has a release foil 26a on one side, is first laminated with a melt foil 30.
  • the lamination is supported by the laminating rollers 24.
  • the resulting single or multilayer film 17 of one or more electrically non-conductive materials is then punched in a punching device 21.
  • the stamped release film 26b is pulled upwards, while the single- or multi-layer perforated film 28 is brought together from an electrically non-conductive material with a coming from another role metal foil as an electrically conductive layer 18.
  • the laminating rollers 24 an intimate bond of these two films is produced.
  • the multilayer perforated film 28 opposite surface of the metal foil 18 is provided in a first screen printing device 23 to be protected from etch away places with a cover layer 29, which has the function that before a Wegiserung in an etch 20 to be protected places of electrical conductive metal foil 18 to protect. There then takes place a further transport of the film laminate to a second screen printing device 32, wherein the back of the electrically conductive layer 18 is provided over its entire surface with a cover layer 29. Subsequently, the film laminate treated in this way passes into an etching bath 20, where the unprotected parts of the metal foil 18 are etched away and only the desired conductor structures of the structured electrically conductive layer 10 remain.
  • the contacting foil 27 obtained is then transported further by means of transport rollers 25, for example by a cleaning bath (immersion bath), not shown here, in order to remove residues of the etching bath 20 and / or the covering layer 29 adhering to the contacting foil 27.
  • a cleaning bath immersion bath
  • Fig. 8 shows a typical Verschaltungstage in a solar module. Shown are two solar cells 1 with first contact points 6 positive polarity and second contact points 7 negative polarity. In the solar cell shown on the left, the first contact points 6 are electrically conductively connected to a first contact finger 33, and the second contact points 7 of negative polarity are electric in the solar cell shown on the right ⁇
  • First contact fingers 33 and second contact fingers 34 are in turn connected to each other and thus establish an electrical connection of the two solar cells. In an analogous manner, these two solar cells are connected to further, not shown in Fig. 8 solar cells.

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne une cellule solaire (1) qui comprend les couches suivantes : (a) une couche semi-conductrice (2) ayant une première surface (4) et une deuxième surface (5), une pluralité de premiers points de contact (6) et de deuxièmes points de contact (7) présentant des polarités opposées étant réalisés sur la première surface (4), (b) un premier film perforé monocouche ou multicouche (8, 28) en matériau électriquement non conducteur qui présente une pluralité de premiers trous (9), ainsi que (c) une couche structurée électriquement conductrice (10) sur une surface du film perforé (8, 28) opposée à la couche semi-conductrice (2). Selon l'invention, le film perforé (8, 28) et la couche semi-conductrice (2) sont positionnés l'un par rapport à l'autre de sorte qu'au moins une partie des premiers trous (9) et des premiers (6) et deuxièmes (7) points de contact sont alignés, au moins une partie des premiers (6) et des deuxièmes (7) points de contact étant reliés à la couche structurée électriquement conductrice (10) par le biais d'une connexion électriquement conductrice (11) sans métal d'apport. L'invention concerne également un module solaire comprenant une pluralité de telles cellules solaires, un procédé de production de cette cellule solaire, ainsi qu'un procédé pour la production d'un film de contact.
EP10715883A 2009-05-05 2010-05-03 Cellule solaire, module solaire comprenant cette cellule solaire, ainsi que procédés pour sa production et pour la production d'un film de contact Withdrawn EP2427918A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009002823A DE102009002823A1 (de) 2009-05-05 2009-05-05 Solarzelle, diese Solarzelle umfassendes Solarmodul sowie Verfahren zu deren Herstellung und zur Herstellung einer Kontaktfolie
PCT/EP2010/055991 WO2010128021A2 (fr) 2009-05-05 2010-05-03 Cellule solaire, module solaire comprenant cette cellule solaire, ainsi que procédés pour sa production et pour la production d'un film de contact

Publications (1)

Publication Number Publication Date
EP2427918A2 true EP2427918A2 (fr) 2012-03-14

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EP10715883A Withdrawn EP2427918A2 (fr) 2009-05-05 2010-05-03 Cellule solaire, module solaire comprenant cette cellule solaire, ainsi que procédés pour sa production et pour la production d'un film de contact

Country Status (5)

Country Link
US (1) US20120132251A1 (fr)
EP (1) EP2427918A2 (fr)
CN (1) CN102439729A (fr)
DE (1) DE102009002823A1 (fr)
WO (1) WO2010128021A2 (fr)

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Publication number Publication date
WO2010128021A3 (fr) 2011-09-22
CN102439729A (zh) 2012-05-02
US20120132251A1 (en) 2012-05-31
WO2010128021A2 (fr) 2010-11-11
DE102009002823A1 (de) 2010-11-18

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