EP2390953A1 - Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen - Google Patents

Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen Download PDF

Info

Publication number
EP2390953A1
EP2390953A1 EP10163740A EP10163740A EP2390953A1 EP 2390953 A1 EP2390953 A1 EP 2390953A1 EP 10163740 A EP10163740 A EP 10163740A EP 10163740 A EP10163740 A EP 10163740A EP 2390953 A1 EP2390953 A1 EP 2390953A1
Authority
EP
European Patent Office
Prior art keywords
microwave circuit
posts
curved
microwave
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10163740A
Other languages
English (en)
French (fr)
Inventor
Per-Simon Kildal
Ahmed Kishk
Eva Rajo Iglesias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kildal Antenn Consulting AB
Original Assignee
Kildal Antenn Consulting AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kildal Antenn Consulting AB filed Critical Kildal Antenn Consulting AB
Priority to EP10163740A priority Critical patent/EP2390953A1/de
Publication of EP2390953A1 publication Critical patent/EP2390953A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion

Definitions

  • the present invention represents a new way of packaging passive and active microwave circuits, and in particular circuits involving microstrip transmission lines and similar substrate bound transmission lines, in such a way that the problem associated with cavity mode resonances are avoided.
  • Both passive and active electronics circuits often need to be packaged in a shielded environment such as a closed metal cavity, e.g. a metal box, for mechanical protection, but also to satisfy requirements to electromagnetic compatibility such as radiated emissions and susceptibility. Such requirements are often regulatory (for commercial devices), but can also be user-defined (such as for radio telescopes).
  • Packaging is difficult in the microwave region, because the volume inside the packaging cavity may be large enough to support resonant modes within the frequency range of the microwave circuits, and, if such modal resonances are present, they will completely destroy the operation of the electronic circuit. Such destruction may appear not only at the frequency of the resonance, but even below and above this band due to nonlinearity and saturation effects in the circuits. There is therefore a need for an improved technical solution to this packaging problem.
  • the packaging problem such as reducing the size of the cavity volume and loading the cavity with microwave absorbers.
  • the size reduction may not always be possible due to the given size of the circuit board.
  • the enclosing cavity needs to have at least two dimensions (height and width) smaller than typically 0.5 wavelengths in order to be sure to avoid cavity resonances. The requirement may become even stronger if the substrate of the circuit board has high permittivity or is thick. Also, absorbers inside the cavity may cause undesired losses and therefore reduced performance of the microwave circuit. There is therefore a need for an alternative packaging solution that is easy to apply also when the circuit boards and correspondingly the enclosing cavities are wider than 0.5 wavelengths, and which does not require use of any absorbing material.
  • the microwave devices are realized by a narrow gap between two parallel surfaces of conducting material, by using a texture or multilayer structure on one of the surfaces. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small.
  • the microwave device further comprises one or more conducting elements, such as a metal ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces.
  • the waves propagate along the conducting elements. No metal connections between the two metal surfaces are needed. At least one of the surfaces is provided with means, such as a bed of posts/nails, to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip,
  • WO 2010/003808 describes how at least one of two parallel metal plates can be provided with means that stop wave propagation in the gap between the two surfaces, which may be used as a packaging solution.
  • the bed of posts/posts disclosed in WO 2010/003808 has been demonstrated to be very useful, as described in " Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Posts", by E. Rajo-Iglesias, A. U. Zaman and P-S. Kildal, IEEE Microwave and Wireless Components Letters, Vol. 20, No. 1, January 2010 .
  • Kildal describes also in WO 2010/003808 how wave propagation between two parallel metal plates can be stopped by using a multilayer structure on one of the surfaces, where the posts/posts are replaced by an EBG surface in the form of metal patches. These form a periodic pattern in two directions along the lower surface..”
  • multilayer surfaces are relatively expensive to realize. There is therefore a need for a more cost-efficient solution.
  • the object of the present invention is to provide a compact and cost-efficient way of packaging passive and active microwave circuits that removes or at least strongly reduces problems related to resonances in the cavity inside which the circuit board is located.
  • passive or active microwave circuit package comprising: two conducting surfaces forming a gap therebetween; and a microwave circuit located on a microwave substrate with a ground plane and comprising one or more sections of one or more different transmission lines, e.g.
  • microstrip lines or coplanar waveguides wherein said microwave circuit is enclosed in the gap between said two conducting surfaces, where one of the surfaces may be formed by the ground plane of the microwave circuit board or an extension of this, wherein at least one of the surfaces is provided with at least one conducting element in the form of a curved post of conducting material rising from and being attached to the conducting surface in such a way that wave propagation inside the gap between the two surfaces is stopped, at least at the frequency of operation, and wherein said curved post has on at least part of its extension a helical configuration.
  • a plurality of curved posts having at least partly a helical configuration.
  • the invention is in particular useable for packaging of microstrip circuits, but it is not limited to this.
  • a metal cavity with conducting walls e.g. of metal, that encloses the microwave circuit board, where the ground plane of the microwave circuit board may form at least part of one of the larger walls of the cavity.
  • At least one of the two larger opposing surfaces of the cavity is provided with conducting posts, e.g. of metal, curved in a helical configuration and preferably located in a periodic or nearly-periodic grid over at least part of the surface.
  • the posts are preferably arranged in such a way that there is a narrow or no gap between the ends of the curved posts and the microwave circuits, and in such a way that the posts do not mechanically touch the conducting parts of the transmission lines on the microwave circuit board.
  • the curved posts may be connected only to one of said surfaces each in such a way that the curved posts on either of the surfaces are facing a smooth part of the opposite conducting surface, and preferably the surface not carrying the transmission line.
  • the other end of the posts may form a gap to the other surface. Alternatively, the other end may be touching a dielectric parts of the microwave circuit board, or be touching the ground plane of the microwave circuit board.
  • the microwave circuit packaging solution of the present invention provides a very efficient remedy to the above-discussed problem with resonant modes experienced in many prior art packaging solutions. Further, the present invention provides an alternative packaging solution that is easy to apply also when the circuit boards and correspondingly the enclosing cavities are wider than 0.5 wavelengths, and it does not require use of any absorbing material. Still further, the microwave circuit package of the present invention is relatively simple and cost-efficient to realize, and e.g. more cost-efficient than EBG surfaces.
  • the present invention represents a new, way of packaging passive and active microwave circuits, and in particular circuits involving microstrip transmission lines and similar substrate bound transmission lines. The two surfaces may form the bottom and lid of a cavity with conducting sidewalls.
  • the posts preferably arranged in a periodic grid, creates together with the ground plane of the microwave circuit board, or together with the smooth metal plane below the microwave circuit board, a stopband for waves propagating between the lid of posts and the ground plane.
  • the smooth surface of the present invention may together with the conducting lines on the microwave circuit board work as a waveguide or waveguide circuit, similar to embodiments disclosed in WO 2010/003808 , said document hereby incorporated by reference. Therefore, the present invention is to be considered as a specific realization of the more general invention described in WO 2010/003808 , wherein the present invention provides a new realization which is particularly advantageous at low frequencies, such as in an operation frequency range of 100 MHz to 30 GHz, and preferably within the range 500 MHz to 10 GHz, and most preferably within the range 1-10 GHz.
  • the curved posts of the present inventions have, at least partly, a helical configuration. This is a way to reduce the effective length of the posts at the same time as their electrical function that stops wave propagation between the two plates is maintained. Therefore, they will also prevent cavity mode resonances.
  • the height of curved posts having at least partly a helical configuration can be 3-10 times shorter in effective length, thus resulting in a significantly more compact packaged microwave circuit.
  • the period of the helical configuration can be sub-wavelength.
  • curved posts in "helical configuration” is in the present application meant a helix or coil shape, continuously forming a number of turns.
  • the turns are arranged as concentric rings, but other configurations are feasible as well.
  • the turns need not be circular, but may have other forms, such as an oval shape, a square or hexagonal shape, an octagonal shape, or the like.
  • the helical configuration forms a curve that lies on or abuts a cylinder or cone, at a constant angle to the line segments making up the surface.
  • the angle need not necessarily be constant, and further, other shapes than cylinders and cones are feasible, such as the shape of an hourglass or a barrel, and even flat spirals on a dielectric substrate.
  • Such flat spirals are preferably connected to the surface by means of vertical posts, e.g. connected to the center of the spirals.
  • the shape of the helical configuration, the total height, the diameter of the turns, the thickness of the wire, the number of turns, the angle of the turns, the distance between the posts and the opposite surface, etc. are all parameters that may be modified for optimization of the posts for particular use situations. For example, an increased number of turns, corresponding to an increased electrical length, will move the frequency band inside which cavity mode resonances are avoided to lower frequencies. Similarly, a larger diameter shifts also the stopband down in frequency, corresponding to an increased wire length, and the relative size of the stop band is not much affected.
  • each curved post is ending in a turn with a smaller inclination angle than the rest of the turns, and preferably ends in an essentially flat ring.
  • the end turns/rings are preferably essentially parallel to the opposing surface.
  • the ends of the curved posts define a more unique spacing to the opposite smooth surface than a pointed open-ended curved post.
  • the helical configuration may also be wound around a dielectric rod or similar, or surrounded by dielectric material e.g. foam, both of which will provide good mechanical support.
  • the number of turns of the helical configuration is within the range 2-20, and preferably 3-15 and most preferably 4-10.
  • the curved posts preferably have conductive contact only to one of said surfaces, leaving a gap towards the other surface inside which the microwave circuit board is located.
  • the curved posts comprise a first part connected to one of said surfaces that may have a relatively straight configuration, and a second part having the helical configuration.
  • the provision of such a part with a relatively straight configuration may make production and assembly easier.
  • the height of this relatively straight part is part of the length of the wire, and an increase/reduction will contribute to reduce/increase the frequencies at which the stop band occurs.
  • posts entirely being of a helical configuration it is also feasible to use posts entirely being of a helical configuration.
  • the diameter of the turns of the helical configuration is preferably within the range 10-50% of the axial height of the part having the helical configuration, and preferably within the range 20-40%.
  • the gap inside which the microwave circuit board is located is preferably filled with air, gas or vacuum.
  • a dielectric material can also be surrounded by dielectric material preferable in the form of a foam, or wound around dielectric rods, both providing mechanical support for the curved posts that therefore can be made thinner such as e.g. by the soft copper wires used to wind inductive coils for low frequency circuits.
  • the two surfaces may be connected together for rigidity by a mechanical structure defining the sidewalls of the cavity.
  • the sidewalls may be arranged on all the sides, thereby entirely enclosing the cavity, or along only some sides, leaving at least one opening on the sides. Alternatively, it is possible to use an open solution without sidewalls.
  • the two surfaces may be essentially planar. However, it is also feasible that at least part of the two surfaces are curved in the same way so that the gap between them is kept is so small that wave propagation inside the gap is stopped.
  • the microwave circuit boards enclosed between the two surfaces of the present invention may comprise one or more components such as power amplifiers, low noise amplifiers, ICs, MMICs, filters, matching networks, power dividers and combiners, couplers, antennas and so on.
  • the basic geometry of a microwave circuit package in accordance with the present invention comprises two parallel conducting surfaces forming the two larger walls of a cavity. These surfaces can be the surfaces of two metal bulks, but they can also be made of other types of materials having a metalized surface. They can also be made of other materials with good electric conductivity.
  • One of the surfaces is provided with the curved posts.
  • the two surfaces can be plane or curved, but they are in both cases separated by a very small distance, a gap, between the end of the curved posts the other plate, inside which the microwave circuits are located.
  • the curved posts prohibit wave propagation inside the gap, in such a way that cavity resonances are avoided.
  • Figure 1 shows a sketch of an example of a microwave circuit that is packaged by using a lid of curved posts of helical forms, according to the invention.
  • the lower surface 2 is preferably essentially smooth, and formed by a ground plane 2 on which a microstrip transmission line 5 is arranged.
  • Connectors 9 are arranged on the side of the plane 2 opposite to said transmission line, and connected to the microstrip transmission line through the plane 2.
  • the upper surface 1 is provided with a surrounding rim 3 to which the upper surface can be mounted, and comprises a region which is lower than the rim and thereby provides a gap 4 between the upper and lower surfaces when assembled.
  • the gap 4 is air-filled, but it can also be fully or partly filled with dielectric material.
  • the larger upper surface 1 comprises a bed of curved posts 6 comprising, at least partly, a helical configuration.
  • the posts are preferably equidistantly and evenly distributed over the surface.
  • Fig. 1a the lid of helical posts is shown up-side-down as a bed of posts.
  • the posts 6 provide cut-off conditions for all waves propagating between the lower and upper surfaces except the desired waves along the transmission line 5.
  • the posts work similar to a PMC within the operating frequency band.
  • the rim 3 is preferably arranged to extend to a height exceeding the height of the posts.
  • the microstrip circuit board is shown in Figure 1c , and the microstrip circuit board is shown upside down as located on top of the bed of posts/nails in Figure 1b , thereby together forming a metal cavity where the cavity resonances are avoided by the curved helical posts according to the invention.
  • the upper and lower surfaces may be connected to each other by bolting.
  • screw holes 8 may be arranged at the boundary of the lower upper metal plane, to be used to fix it to the metal rim 3 of the upper metal piece, and there are matching screw holes 7 in this rim.
  • Figure 1d shows a detail of the lid of helical posts.
  • the microwave circuit of Fig 1 is a microstrip line with two 90 deg bends, and the ground plane of the circuit is used as the opposing larger wall of the enclosing cavity.
  • This microwave circuit is too simple to have any special electronic function, and it is here shown only to demonstrate the packaging principle. It is actually the same type of microwave circuit that was used to demonstrate packaging by a lid of straight posts/nails in " Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Posts", by E. Rajo-Iglesias, A. U. Zaman and P-S. Kildal, IEEE Microwave and Wireless Components Letters, Vol. 20, No. 1, January 2010 , and here similar properties are obtained in a significantly more compact realization.
  • the package component may typically have a length of about 10 cm, a width of about 5-6 cm.
  • the posts may typically be arranged in even rows and columns. The distances between each row and between each column are preferably about the same. This distance is typically, from center to center of the adjacent posts, 7.5 mm.
  • Figures 2 and 3 show cross sections of the example similar to the one in Figure 1 , where the microstrip line 5 forms a so-called inverted or suspended microstrip line.
  • the transmission line is here supported by a thin substrate layer 10 located on the top of the posts 6.
  • the space 11 between the posts may e.g. be air-filled, or filled with a dielectric, such as a foam.
  • Such lines have the transmission line fields in an air gap, instead of in the dielectric substrate, and the substrate is only used to mechanically support the microstrip line 5 at distance from helical-shaped curved posts 6 according to the invention, and at distance from the other smooth metal surface acting as a ground plane 2 for the microstrip line.
  • Figure 3 is used to illustrate that the metal walls 3 of the cavity actually can be removed.
  • the curved posts 6 will still stop waves from propagating between the two plates according to the invention.
  • Figures 4 a-h show different embodiments of the curved posts in helical configuration according to embodiments of the invention.
  • the posts may have an entirely helical configuration. Such a post is illustrated in Fig 4a .
  • This post, having an entirely helical configuration may typically have about 10 turns, and a height of about 15 mm.
  • alternative configurations are possible as well.
  • Fig. 4b illustrates an example of a post having a first part having a straight configuration with a height L, and a second part with a helical configuration.
  • the total height of the post is H, and a gap between the post and the opposite surface is g.
  • the diameter of the turns of the helical part is D.
  • g is 2 mm
  • H is 37 mm
  • D is 10.5 mm
  • L is 9 mm.
  • the number of turns is in this example 6.
  • a wide stop band is created when used between the parallel plates, from 0.55 GHz to 1.41 GHz.
  • all of these parameters may be adjusted for optimization of the posts for the intended frequency of operation and the intended application of the microwave device.
  • the posts can be made even more compact if required, by increasing the number of turns.
  • Fig 4c-d illustrates helical configurations similar to the one discussed with relation to Fig 4a , but where the general shape of the helical configuration is in the form of a cone ( Fig 4c ), with the diameters of the turns increasing from one end to the other, and in the form of a barrel ( Fig 4d ), with the diameters of the turns decreasing from the middle towards both ends, instead of the generally cylindrical shape illustrated in Fig 4a .
  • turns of the helical configurations illustrated in Figs. 4a-d are generally circular, as seen from above. However, alternatively the turns may be arranged in other forms. For example, the turns may have a rectangular or square shape, as illustrated in Fig 4f , or have a hexagonal shape, as illustrated in Fig 4g , or an octagonal shape, as illustrated in Fig 4e .
  • the posts having a helical configuration may also be realized as flat spirals on a dielectric substrate, as illustrated in Fig 4h .
  • the curved post is ending in a turn with a smaller inclination angle than the rest of the turns, and preferably ends in an essentially flat ring.
  • the upper turn is hereby preferably essentially parallel to the opposing surface.
  • the ends of the curved posts define a more unique spacing to the opposite smooth surface than a pointed open-ended curved post.
  • the shape of the helical configuration, the total height, the diameter of the turns, the thickness of the wire, the number of turns, the angle of the turns, the distance between the posts and the opposite surface, etc. are all parameters that may be modified for optimization of the posts for particular use situations.
  • the invention is not limited to the embodiments shown here.
  • the invention can be located inside the package of an IC or in the multiple layers on an IC chip.
  • at least one of the conducting surfaces may be provided with penetrating probes, apertures, slots or similar elements through which waves are radiated or being coupled to exterior circuits.
  • the helical configuration of the curved posts may be arranged in many different shapes, as discussed above.
  • the posts may be arranged on either one of the two surfaces, or even on both surfaces.
  • the two surfaces may be connected in various ways, and the cavity need not be closed, but may be open at one or several sides.

Landscapes

  • Waveguide Connection Structure (AREA)
EP10163740A 2010-05-25 2010-05-25 Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen Withdrawn EP2390953A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10163740A EP2390953A1 (de) 2010-05-25 2010-05-25 Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10163740A EP2390953A1 (de) 2010-05-25 2010-05-25 Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen

Publications (1)

Publication Number Publication Date
EP2390953A1 true EP2390953A1 (de) 2011-11-30

Family

ID=42710583

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10163740A Withdrawn EP2390953A1 (de) 2010-05-25 2010-05-25 Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen

Country Status (1)

Country Link
EP (1) EP2390953A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013185807A1 (en) 2012-06-13 2013-12-19 Gapwaves Ab Packaging of active and passive microwave circuits using a grid of planar conducting elements on a grid of vertically arranged substrates
WO2014090290A1 (en) 2012-12-12 2014-06-19 Gapwaves Ab Quasi-planar array antenna
EP2609683A4 (de) * 2011-05-17 2015-09-30 Huawei Tech Co Ltd Mikrowellenmodul
EP2945222A1 (de) * 2014-05-14 2015-11-18 Gapwaves AB Mikrowellen- oder Millimeterwellen-HF-Teil mit Pin-Grid-Array (PGA)- und/oder Ball-Grid-Array (BGA)-Technologien
SE2030209A1 (en) * 2020-06-23 2021-06-22 Gapwaves Ab Inline slotted waveguide antenna
CN114865261A (zh) * 2021-02-04 2022-08-05 广州程星通信科技有限公司 基于电磁禁带结构的空间功率合成器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2373102A (en) * 2001-03-06 2002-09-11 Marconi Caswell Ltd Structures with magnetic properties
EP1763101A1 (de) * 2004-06-30 2007-03-14 Murata Manufacturing Co., Ltd. Hochfrequenzschaltungs-einrichtung und sende-/ empfangseinrichtung
WO2010003808A2 (en) 2008-07-07 2010-01-14 Kildal Antenna Consulting Ab Waveguides and transmission lines in gaps between parallel conducting surfaces

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2373102A (en) * 2001-03-06 2002-09-11 Marconi Caswell Ltd Structures with magnetic properties
EP1763101A1 (de) * 2004-06-30 2007-03-14 Murata Manufacturing Co., Ltd. Hochfrequenzschaltungs-einrichtung und sende-/ empfangseinrichtung
WO2010003808A2 (en) 2008-07-07 2010-01-14 Kildal Antenna Consulting Ab Waveguides and transmission lines in gaps between parallel conducting surfaces

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
E. RAJO-IGLESIAS; A. U. ZAMAN; P-S. KILDAL: "Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Posts", IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, vol. 20, no. 1, January 2010 (2010-01-01)
KAMGAING T ET AL: "Design and Modeling of High-Impedance Electromagnetic Surfaces for Switching Noise Suppression in Power Planes", IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, IEEE SERVICE CENTER, NEW YORK, NY, US LNKD- DOI:10.1109/TEMC.2005.850692, vol. 47, no. 3, 1 August 2005 (2005-08-01), pages 479 - 489, XP011140260, ISSN: 0018-9375 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2609683A4 (de) * 2011-05-17 2015-09-30 Huawei Tech Co Ltd Mikrowellenmodul
US9301426B2 (en) 2011-05-17 2016-03-29 Huawei Technologies Co., Ltd. Microwave module
WO2013185807A1 (en) 2012-06-13 2013-12-19 Gapwaves Ab Packaging of active and passive microwave circuits using a grid of planar conducting elements on a grid of vertically arranged substrates
WO2014090290A1 (en) 2012-12-12 2014-06-19 Gapwaves Ab Quasi-planar array antenna
EP2945222A1 (de) * 2014-05-14 2015-11-18 Gapwaves AB Mikrowellen- oder Millimeterwellen-HF-Teil mit Pin-Grid-Array (PGA)- und/oder Ball-Grid-Array (BGA)-Technologien
SE2030209A1 (en) * 2020-06-23 2021-06-22 Gapwaves Ab Inline slotted waveguide antenna
SE543704C2 (en) * 2020-06-23 2021-06-22 Gapwaves Ab Inline slotted waveguide antenna
CN114865261A (zh) * 2021-02-04 2022-08-05 广州程星通信科技有限公司 基于电磁禁带结构的空间功率合成器

Similar Documents

Publication Publication Date Title
CN111066201B (zh) 相控阵天线
JP5527316B2 (ja) 共振器アンテナ
JP5617836B2 (ja) 共振器アンテナ及び通信装置
EP3621146A1 (de) Hochfrequenzfilter und phasengesteuerte gruppenantenne mit solch einem hochfrequenzfilter
JP5725013B2 (ja) 構造体、配線基板および配線基板の製造方法
EP2390953A1 (de) Verpackung von aktiven und passiven Mikrowellenschaltungen mittels Deckel oder Bett aus gebogenen Stützen
KR20130037083A (ko) 대역폭 조절 가능한 유전체 공진기 안테나
CN102696145A (zh) 微带线和矩形波导间的微波转换设备
US7136028B2 (en) Applications of a high impedance surface
WO2012093603A1 (ja) 電磁波伝播シート
JP3478219B2 (ja) 共振器、共振素子、共振器装置、フィルタ、デュプレクサおよび通信装置
JP3891996B2 (ja) 導波管型導波路および高周波モジュール
JP6146801B2 (ja) 配線基板、及び電子装置
CN112544015B (zh) 波导管缝隙天线
WO2013185807A1 (en) Packaging of active and passive microwave circuits using a grid of planar conducting elements on a grid of vertically arranged substrates
JP6565938B2 (ja) 構造体および配線基板
JP5964785B2 (ja) 高周波伝送線路
JP2012204844A (ja) バンドパスフィルタ
JP2007184868A (ja) 誘電体導波管フィルタ
JP7255997B2 (ja) 導波管スロットアンテナ
JP2017005578A (ja) メタマテリアル構造、アンテナ装置。
JP2005184124A (ja) 誘電体共振器及び誘電体フィルタ並びに高周波モジュール
JP2007096773A (ja) 誘電体装置

Legal Events

Date Code Title Description
AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME RS

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120531