EP2387864B1 - Verfahren zur herstellung eines zur lichtemission aktivierbaren bauteils - Google Patents
Verfahren zur herstellung eines zur lichtemission aktivierbaren bauteils Download PDFInfo
- Publication number
- EP2387864B1 EP2387864B1 EP10809264.4A EP10809264A EP2387864B1 EP 2387864 B1 EP2387864 B1 EP 2387864B1 EP 10809264 A EP10809264 A EP 10809264A EP 2387864 B1 EP2387864 B1 EP 2387864B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- printing
- electrical
- component
- produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000005401 electroluminescence Methods 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 48
- 239000010410 layer Substances 0.000 claims description 40
- 239000002346 layers by function Substances 0.000 claims description 27
- 238000007639 printing Methods 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000007649 pad printing Methods 0.000 claims description 11
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 230000004224 protection Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010422 painting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000002184 metal Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
Definitions
- the invention relates to a method for producing a light-emission activatable component, wherein the light emission by electroluminescence (EL) takes place.
- EL electroluminescence
- electroluminescence is the property of certain materials or combinations of materials, according to which light is emitted in the visible range when an electrical alternating voltage is applied.
- Electroluminescent films are known in practice, in which the electroluminescent material is excited by an alternating electric field in a special capacitor configuration. Such electroluminescent films are often also called luminescent films, light foils or capacitor luminescent films. In technical application, they serve to convert electrical energy into light.
- electroluminescent films can be used in an outstanding manner if the components to be illuminated or backlit and, if necessary, also to be transilluminated are components with simple geometries.
- the use of electroluminescent films is only possible to a limited extent.
- the IMD technology In Mold Decoration, cf. DE 197 17 740 C2
- films such as, for example, electroluminescent films
- highly structured surfaces in particular in the case of miniaturized components having an electroluminescent surface, can not be produced by this known method.
- a method for producing an organic electroluminescent display is previously known.
- a first electrode layer 5A is produced on a substrate 1 and a first insulating layer is applied to the substrate 1 or the first electrode layer 5A.
- the first insulating layer is patterned into strip-like webs 10 such that they delimit a region provided for functional layers.
- the functional layers 20 are applied over a large area, for example by pad printing processes, and then a large area of a second electrode layer 25A is produced on the functional layers 20.
- the present invention is based on the object of specifying a method for producing a component which can be activated for the emission of light, in which the light emission is effected by electroluminescence (EL).
- EL electroluminescence
- a carrier is firstly produced or provided, wherein the carrier essentially comprises or comprises the shape of the component and its mechanical and electrical interfaces, the carrier comprising a region serving as a mechanical interface, which is equipped at least with parts of the electrical interface is. It is essential that the carrier is a kind of blank for the component to be produced, namely a blank which does not yet possess the electroluminescent property.
- Mechanical interfaces for example in the form of an integral coupling part, can be an integral part of the carrier.
- Electrical interfaces can also already from be provided in advance or would be produced in the course of the manufacturing process on the surface - at the appropriate place.
- the carrier is provided with functional layers of the EL illumination, wherein at least one of the functional layers, namely the light-emitting layer or layers, as a whole or at least partially, is produced by the pad printing method. become.
- the electrical interfaces are - at least in the field of functional layers - involved in the printing, so that simultaneously with the printing technology production of the light-emitting layer / layers an electrical contact is created. A subsequent contact, usually with a considerable design or manufacturing effort, is not required.
- a transparent or translucent cover is applied to the EL layers, which on the one hand serves as moisture protection and on the other hand as electrical and mechanical encapsulation. Consequently, with the application of the cover, the light-emission activatable component, for example a tachometer needle, is completed.
- the light-emitting layer is produced by means of pad printing.
- This is an indirect printing process, which works according to the so-called gravure printing principle.
- the tampon absorbs the color according to the outer contour of the cavity of the plate and forms it when printing on a component of any surface. These can be bounded or sequential regions and various shapes, also sequentially limited.
- the carrier may have almost any topology on the surface. In principle, this may be a rigid or inherently flexible material, for example in the form of an MID or metal-containing flexible plastics.
- the electroluminescent layer can be applied by means of the pad printing method, the carrier in front of it already being provided with the electrical connections.
- a contacting and also insulation between the different EL layers can be carried out, wherein insulation layers can be applied or produced as desired.
- the injection molding technique can be applied without further ado.
- the electrical connections or the electrodes of the EL functional layers can be produced in different ways, for example by injection molding and / or printing technology. It is conceivable to produce the electrical connections on and / or in the carrier. By overprinting or coating the connections, these can be electrically coupled or insulated, depending on the material used. It is also possible to produce mask-like coatings or layers on the electrical connections / electrodes.
- the light-emitting layer (s) is / are printed in the form of word and / or picture information as needed. Tampon printing can be used to produce structured surfaces along the surface profiles as well as strictly delimited areas with and without light-emitting layers. The variety of information that can be produced in this way has no limits.
- the light-emitting layer can optionally be formed on different levels, for example in such a way that any interruptions and repeated electrical connections are made by directly printing the electrical connections possible are.
- insulating intermediate areas or intermediate layers can also be produced by printing technology or injection molding technology.
- the functional layers are printed in any case with the interposition of insulators, namely to produce the full functionality of the EL functional layers.
- the light-emitting layer (s) is / are produced by the pad printing method.
- further functional layers including further light-emitting layers, both by means of pad printing and by injection molding, lacquer technology, etc.
- insulators that are absolutely necessary for the construction of the EL functional layers.
- EL lighting, using EL functional layers means any structure of such functional layers, for the production of so-called EL lamps. It is not considered necessary to describe at this point a concrete structure or a concrete interconnection, especially as these are well known from numerous reference works.
- EL functional layers are provided in the form of an EL film.
- the EL functional layers or at least the cover which encapsulates the light-emitting layer, can be produced in the so-called 2K reaction process, the CCM process (clear coat moldering) being particularly suitable.
- the CCM process clear coat moldering
- a kind of macroencapsulation of the EL functional layers is possible, whereby the outer contour of the component can be masked or even a shape realized.
- the material used here can be made crystal clear so that it is transilluminated by the underlying EL lamp generated by the EL functional layers. It is also conceivable to color the material of the cover or encapsulation. This makes it possible to generate a color filter in an ideal way.
- the cover which can be generated at any time, can be applied with contours and / or reworked with respect to the surface. Finally, even a processing of the outer contour is possible. This measure (s) also makes it possible to produce any desired surface structures, in which case the EL functional layers are located underneath.
- the carrier can comprise or contain any desired electronic components, in particular in a highly miniaturized form. It is also conceivable to associate the carrier with its own current / voltage source, for example using solar-thermal layers, namely to create a quasi-self-sufficient component. In particular, it is conceivable that the support, for example, by vacuum casting, any functional elements are incorporated or become. Again, there are no limits.
- Fig. 1 shows an embodiment of a device produced by the method according to the invention, which comprises an activatable for light emission EL lamp.
- the in Fig. 1 The construction shown reveals that the component initially comprises a carrier 1. This can be any plastic substrate.
- the concrete form does not matter.
- a back electrode 2 is applied on the carrier 1. Furthermore, a ground line 3 is provided. These are the electrical connections of the component.
- the back electrode 2 is covered by a dielectric 4. Through the dielectric 4, the rear electrode 2 is also isolated from the ground line 3.
- an electroluminescent layer 5 is applied, by pad printing.
- the electroluminescent layer 5 is covered by a conductive ink 6, which simultaneously electrically contacts the ground line 3. All functional layers of the EL lighting can be printed.
- sealing encapsulation 7 acts as a macro-encapsulation, namely in the sense of moisture protection and for electrical and mechanical encapsulation of the entire structure.
- Fig. 2 shows a schematic view of another component, which has been produced by the process according to the invention, namely also with an integrated EL lamp.
- the carrier 1 comprises electrical and mechanical coupling means 8, wherein the contacting with an AC voltage source 9 is indicated. Between the carrier element 1 and an electrically conductive connection pin 10, an insulation 11 made of plastic is provided. Consequently, it is possible to do so in Fig. 2 at the same time coupled mechanically and electrically, namely due to the electrical / mechanical coupling means 8 provided there.
- the EL lamp of the in Fig. 2 shown component is similar to the EL lamp of in Fig. 1 constructed component.
- the return electrode 2 is formed by the connection pin 10. On it sits the dielectric 4, which surrounds the connection pin 10 together with the insulation 11. On the dielectric 4, the EL layer 5 is applied, which in turn is surrounded with conductive ink 6.
- a color layer 12 is applied to the conductive ink 6, which serves in terms of the light emission from the EL layer 5 as a color filter.
- the entire assembly is CCM overmolded, whereby the outer shape of the component is more or less defined according to the predetermined basic shape.
- the CCM encapsulation 13 is made of a transparent material.
- the whole is provided on the surface with a coating 14, which does not let light through.
- the coating 14 is again - partially and with any structure / shape - recessed, namely with at least one viewing window 15, through which the light can emit. Due to the shape of the viewing window 15, the "luminous" surface and thus the information to be conveyed can be defined as desired.
- FIG. 3 shows in a flowchart the implementation of the method according to the invention with alternative method steps. Due to the caption is Fig. 3 of course.
- the carrier is first inserted into a tool holder, wherein the carrier may comprise mechanical and electrical coupling means.
- the individual functional layers for example, in the pad printing process, printed on the two-dimensional or three-dimensional electrical contact surfaces of the carrier or the substrate.
- the carrier it is possible to refine the carrier according to the IMD technique already discussed above, wherein it is conceivable to incorporate electrical components into the carrier.
- a pluggable, ready-to-assemble or insertable or castable macro-encapsulation is possible, for example according to the CCM method. It is also conceivable to put a prefabricated housing over the entire arrangement.
- a translucent cover can be produced on the printed carrier or substrate.
- a seal of the interface between the printed carrier / substrate and the encapsulation is advantageous.
- Such a seal can be produced by gluing, hot stamping, ultrasonic welding, etc.
- the component can be painted or printed again as well as lasers.
- the component carrying the EL layers is painted / lasered and then overmolded in accordance with CCM or encapsulated in accordance with CCM and subsequently painted / lasered. It is an activatable for light emission component corresponding to the description of the Fig. 1 and 2 emerged.
- any components which comprise EL functional layers can be produced by the method according to the invention.
- These can be any display and control elements with integrated EL lighting.
- the EL devices in question here can have information / symbols with the highest position accuracy, which is extremely difficult to implement in the application of the IMD method. It is possible to realize a simplified production with a minimum number of components.
- the shape of the EL component in particular the desired light exit surface, can be freely defined in terms of shape and size. There are hardly any restrictions with regard to the electrical and optical or lighting requirements.
- the method according to the invention makes it possible to produce a simple, safe and temperature-changeable and corrosion-resistant contacting between the electrical connections of a voltage source and the electrodes of the EL lamp.
- the enclosing macroencapsulation prolongs the life of the component, for example by the use of clear casting.
- the EL pigments in the light-emitting layer are spared during the manufacturing process. It is possible to produce an improved UV protection of the EL pigments by coloring the encapsulation material or potting material.
- the component activatable for light emission could be a tachometer needle whose construction is characterized by a few parts.
- a tachometer needle whose construction is characterized by a few parts.
- previously known light guidance systems can be substituted by the EL lamp being printed directly on the blank. This allows a much simpler structure and a streamlined, process-reliable and inexpensive manufacturing possible.
- EL pointers are superior to the conventional components.
- the tachometer needle can achieve optimal illumination or illumination over the entire illuminated area and length. Also, mechanical requirements can be justified by the method according to the invention, in particular with respect to a jerk-free movement of the tachometer needle.
- the weight distribution is almost freely definable.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Planar Illumination Modules (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009059779 | 2009-12-18 | ||
DE102010005865A DE102010005865A1 (de) | 2009-12-18 | 2010-01-26 | Verfahren zur Herstellung eines zur Lichtemission aktivierbaren Bauteils |
PCT/DE2010/001436 WO2011072645A1 (de) | 2009-12-18 | 2010-12-09 | Verfahren zur herstellung eines zur lichtemission aktivierbaren bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2387864A1 EP2387864A1 (de) | 2011-11-23 |
EP2387864B1 true EP2387864B1 (de) | 2016-09-28 |
Family
ID=43726387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10809264.4A Active EP2387864B1 (de) | 2009-12-18 | 2010-12-09 | Verfahren zur herstellung eines zur lichtemission aktivierbaren bauteils |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120255453A1 (zh) |
EP (1) | EP2387864B1 (zh) |
JP (1) | JP5508544B2 (zh) |
CN (1) | CN102754528B (zh) |
CA (1) | CA2784801C (zh) |
DE (1) | DE102010005865A1 (zh) |
HK (1) | HK1175926A1 (zh) |
WO (1) | WO2011072645A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014203543A1 (de) * | 2014-02-27 | 2015-08-27 | Volkswagen Aktiengesellschaft | Fahrzeug-Interieurbauteil mit einem Dekordruck |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0562820U (ja) * | 1992-01-31 | 1993-08-20 | 矢崎総業株式会社 | 発光指針 |
JPH07320868A (ja) * | 1994-05-24 | 1995-12-08 | Yazaki Corp | 電場発光素子およびその製造方法 |
JPH10188524A (ja) * | 1996-12-24 | 1998-07-21 | Sony Corp | 発光部を有する情報記録媒体、情報記録媒体用収納ケース、及び情報記録媒体用シート |
DE19717740C2 (de) | 1997-04-26 | 2001-07-05 | Schoenberg & Cerny Gmbh Wien | Kunststoff-Formkörper mit integriertem optoelektronischem Leuchtfeld und Verfahren zu seiner Herstellung |
US7132804B2 (en) * | 1997-12-17 | 2006-11-07 | Color Kinetics Incorporated | Data delivery track |
JPH11282384A (ja) * | 1998-03-27 | 1999-10-15 | Dainippon Printing Co Ltd | 着色発光面を有するエレクトロルミネッセンスディスプレイ部品及び該部品を組み込んだエレクトロルミネッセンスディスプレイ |
JP2003508890A (ja) * | 1999-09-01 | 2003-03-04 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電界ルミネセンスデバイスおよびその製造法 |
US6762552B1 (en) * | 1999-11-29 | 2004-07-13 | Koninklijke Philips Electronics N.V. | Organic electroluminescent device and a method of manufacturing thereof |
JP3536763B2 (ja) * | 2000-02-04 | 2004-06-14 | 日本電気株式会社 | 封止装置 |
US20020031602A1 (en) * | 2000-06-20 | 2002-03-14 | Chi Zhang | Thermal treatment of solution-processed organic electroactive layer in organic electronic device |
DE10152919A1 (de) * | 2001-10-26 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Organisches elektrolumineszierendes Display |
DE10234125A1 (de) | 2002-07-26 | 2004-02-12 | Siemens Ag | Beleuchtbares Kunststoffspritzgussteil mit einer Anzeigefunktion und Verfahren zu dessen Herstellung |
US7609178B2 (en) * | 2006-04-20 | 2009-10-27 | Pressure Profile Systems, Inc. | Reconfigurable tactile sensor input device |
US20070210703A1 (en) * | 2006-02-28 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Electroluminescent device and method for producing it |
DE102006009217A1 (de) * | 2006-02-28 | 2007-08-30 | Osram Opto Semiconductors Gmbh | Elektrolumineszierende Vorrichtung und Verfahren zu dessen Herstellung |
DE102006031315A1 (de) * | 2006-07-01 | 2008-01-17 | Lyttron Technology Gmbh | 3D-EL-HDVF Element und Herstellungsverfahren und Anwendung |
DE102006037998A1 (de) * | 2006-08-14 | 2008-02-21 | Schreiner Group Gmbh & Co. Kg | Verfahren zur Herstellung eines dreidimensionalen Bauteils |
WO2008063657A2 (en) * | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Light emitting devices and displays with improved performance |
DE102006059203A1 (de) * | 2006-12-13 | 2008-06-19 | Lyttron Technology Gmbh | Biegbares 3D-EL-HDFV Element und Herstellungsverfahren und Anwendung |
WO2010022105A2 (en) * | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | Organic light emitting diode products |
-
2010
- 2010-01-26 DE DE102010005865A patent/DE102010005865A1/de not_active Ceased
- 2010-12-09 JP JP2012543469A patent/JP5508544B2/ja active Active
- 2010-12-09 CN CN201080063855.9A patent/CN102754528B/zh active Active
- 2010-12-09 CA CA2784801A patent/CA2784801C/en active Active
- 2010-12-09 WO PCT/DE2010/001436 patent/WO2011072645A1/de active Application Filing
- 2010-12-09 US US13/516,934 patent/US20120255453A1/en not_active Abandoned
- 2010-12-09 EP EP10809264.4A patent/EP2387864B1/de active Active
-
2013
- 2013-03-14 HK HK13103217.6A patent/HK1175926A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CA2784801C (en) | 2017-07-25 |
CA2784801A1 (en) | 2011-06-23 |
EP2387864A1 (de) | 2011-11-23 |
JP5508544B2 (ja) | 2014-06-04 |
DE102010005865A1 (de) | 2011-06-22 |
HK1175926A1 (zh) | 2013-07-12 |
JP2013514607A (ja) | 2013-04-25 |
US20120255453A1 (en) | 2012-10-11 |
WO2011072645A1 (de) | 2011-06-23 |
CN102754528A (zh) | 2012-10-24 |
CN102754528B (zh) | 2016-02-03 |
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