Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/005—Processes
  • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/005—Processes
  • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
  • H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/26—Materials of the light emitting region
  • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/26—Materials of the light emitting region
  • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
  • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/30—Structure or shape of the active region; Materials used for the active region
  • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
  • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
  • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
  • H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP

Definitions

• the invention relates to an optoelectronic
• Semiconductor device in particular an LED having an indium-containing phosphide compound semiconductor material or nitride compound semiconductor material.
• the formation of indium clusters can be reduced, but also here take the pre-reactions of the process gases to and increase the cost of providing NH 3,.
• the material of the epitaxial layers deposits in such an order that regions with a more or less pronounced alternating arrangement of the group III atoms are formed. This effect is also called "ordering". These regions are separated by grain boundaries, which can reduce efficiency in the active layer of the LED as centers of non-radiative recombinations.
• the active layer is usually surrounded by barrier layers, which are more electronic
• the ordering can be at least partially reduced by using high growth temperatures, but this also increases unwanted diffusion of dopants in the epitaxial layers.
• the invention has for its object to provide an optoelectronic semiconductor device based on an indium-containing phosphide compound semiconductor or nitride compound semiconductor, which has an increased efficiency.
• the above-described adverse effects which have a negative effect on the efficiency, should be reduced.
• Phosphide compound semiconductor material as an additional element of the V main group of at least one of the elements Bi or Sb contains.
• the phosphide compound semiconductor material contains Bi or Sb as an additional element of the main group V, the so-called ordering, ie the formation of ordered regions in the semiconductor layers, which in an alternating sequence predominantly indium-containing layers and Al- or Ga-containing layers contained, diminished. By reducing the order, the number of grain boundaries in the
• Phosphide compound semiconductor material which as centers of non-radiative recombinations the efficiency of the radiation-emitting optoelectronic could reduce semiconductor device.
• the band gap of the compound semiconductor increases with the same stoichiometric composition.
• Reduction of ordering is based on the heavy atoms Sb or Bi reducing the mobility of the atoms on the surface of the semiconductor layer during epitaxial growth. Since the mass of the additional atom of the main group V is important for this mechanism, the addition of the heavier element Bi or more effective than the addition of Sb. Furthermore, the additional atoms can change the electronic structure of the surface so that the Ordering diminished.
• the cladding layers surrounding the active layer contain Bi and / or Sb as an additional element of the main group V.
• the cladding layers advantageously have a larger electronic band gap than the active layer.
• the cladding layers cause in this way an inclusion of the charge carriers in the active layer, whereby the efficiency of the radiation-emitting optoelectronic component increases. It has been found that addition of Bi and / or Sb as an additional major group element not only reduces ordering but also results in an increase in the electronic bandgap of the phosphide compound semiconductor material.
• the effect of the cladding layers is enhanced by such an increase in the bandgap and in this way increases the efficiency of the optoelectronic semiconductor component, which may be, in particular, an LED, a semiconductor laser or a solar cell.
• the additional element of the V. main group Bi and / or Sb is incorporated in the cladding layers, but not in the active layer.
• the increase of the electronic band gap occurs only in the cladding layers, thereby increasing the difference of the electronic band gaps between the active layer and the cladding layers, and thus further improving the charge carrier confinement in the active layer.
• both the cladding layers and the active layer contain Bi and / or Sb, or that only the active layer contains Bi and / or Sb, since even the reduction of the order in the phosphide compound semiconductor material of the active layer Increased efficiency of the optoelectronic device by reducing the grain boundaries.
• the phosphide compound semiconductor material of the cladding layers and / or the active layer can in particular the
• the phosphide compound semiconductor material may also contain both elements Sb and Bi.
• the phosphide compound semiconductor material contains, as group III elements, both In, Ga and Al. In this case we have x> 0, y> 0 and x + y ⁇ 1.
• the Phosphide compound semiconductor material is therefore preferably a quinternary semiconductor material.
• the proportion z of the at least one additional group V element in the phosphide compound semiconductor material is 0 ⁇ z ⁇ 0.03.
• Ordering is greatest at an indium content of about 0.5.
• Semiconductor material 0.3 ⁇ x ⁇ 0.7, preferably 0.4 ⁇ x ⁇ 0.6 and more preferably 0.45 ⁇ x ⁇ 0.55.
• an optoelectronic semiconductor component contains an active layer, the one indium-containing
• Nitride compound semiconductor material wherein the nitride compound semiconductor material of the active layer as an additional element of the V main group at least one of the elements As, Bi or Sb contains.
• indium clusters is reduced by the addition of at least one of the elements As, Bi or Sb in the preparation of the nitride compound semiconductor material.
• the optoelectronic semiconductor component which may be in particular an LED, a semiconductor laser or a solar cell.
• indium clusters are based on the fact that the atoms As, Sb or Bi, which are comparatively heavy compared to N, reduce the migration length of the indium compounds on the crystal surface during epitaxial growth, in particular due to collisions.
• the heavy atoms on the surface appear to reduce the mobility of the indium compounds so that the indium atoms near the site are incorporated into the crystal lattice, where they impinge on the surface before they cluster with other indium atoms can unite.
• indium clusters is reduced in this way, without requiring an increased growth temperature or an increased V / III ratio with the associated adverse effects. Furthermore, it is advantageous that the elements As, Sb or Bi are installed isoelectronically on the group V-site in the crystal lattice and thus produce no additional doping.
• the additional element As, Sb or Bi can be supplied to the reactor in the form of an additional process gas such as TESb or AsH 3 .
• As, Sb or Bi can also be supplied as targeted contamination in process gases such as TMGa or TMAl.
• the nitride compound semiconductor material preferably has the composition of In x Ga y Al x - y Ni_ z As z, In x Ga y Al x - y Sb z z Ni_ or In x Ga y Al x - y Ni_ z Bi z, respectively 0 ⁇ x ⁇ 1, O ⁇ y ⁇ l, x + y ⁇ 1 and 0 ⁇ z ⁇ 1.
• the nitride compound semiconductor material may also contain two or three of As, Sb or Bi.
• the nitride compound semiconductor material the composition In x Ga y Al x _ y Ni_ z (u As v Sb Bii- u _ v) z with 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, x + y ⁇ l ⁇ O u ⁇ l, O ⁇ v ⁇ l, u + v ⁇ l and 0 ⁇ z ⁇ 1.
• the nitride compound semiconductor material may in particular comprise all three group III elements In, Ga and Al, which If x> 0, y> 0 and 1-x-y> 0, then the nitride compound semiconductor material is in this case preferably a quinternary semiconductor material.
• Nitride compound semiconductor material is added only a very small amount of the additional element of the V main group, the structural and electronic properties of the semiconductor material are only insignificantly influenced apart from the advantageous reduction of the formation of indium clusters.
• Nitride compound semiconductor material has a relatively large content of indium, since with increasing indium content also increases the risk of formation of indium clusters.
• the indium content in the semiconductor material is x ⁇ 0.1, preferably x ⁇ 0.2 and particularly preferably x ⁇ 0.3.
• Such indium contents which are comparatively high for a nitride compound semiconductor material, are required in particular for the production of green-emitting optoelectronic semiconductor components.
• the band gap of the semiconductor material decreases with increasing indium content, the wavelength of the radiation emitted by the active layer shifts towards larger wavelengths as the indium content increases.
• the ultraviolet or blue spectral emitting instead of the usually in the ultraviolet or blue spectral emitting
• Nitride compound semiconductor devices can also be implemented efficient green emitting devices.
• Figure 1 is a schematic representation of a cross section through an optoelectronic semiconductor device according to a first embodiment of the invention
• Figure 2 is a schematic representation of a cross section through an optoelectronic semiconductor device according to a second embodiment of the invention.
• the optoelectronic semiconductor component shown in FIG. 1 is an LED.
• the LED has an epitaxial layer sequence 8 applied to a substrate 1, which can be produced in particular by means of MOVPE.
• the epitaxial layer sequence 8 contains a radiation-emitting active layer 4.
• the active layer For example, as a single layer, as
• Double heterostructure be designed as a single quantum well structure or multiple quantum well structure.
• quantum well structure does not specify the dimensionality of the quantization. It thus includes quantum wells, quantum wires and quantum dots and any combination of these structures.
• the active layer 4 is arranged between a first cladding layer 3a and a second cladding layer 3b.
• the cladding layers 3a, 3b advantageously have a larger electronic band gap than the active layer 4, whereby a charge carrier confinement in the active layer 4 is effected.
• the cladding layers 3a, 3b can also be constructed as a layer sequence of several sub-layers.
• the substrate 1 and the first cladding layer 3 a may be arranged between the substrate 1 and the first cladding layer 3 a.
• one or more further semiconductor layers 2 may be arranged between the substrate 1 and the first cladding layer 3 a.
• the second cladding layer 3b may also have one or more others
• the semiconductor layers 2, 3a arranged between the substrate 1 and the active layer 4 are n-doped and the semiconductor layers 3b, 5 arranged on the side of the active layer 4 facing away from the substrate 1 are p-doped.
• the substrate 1 may be, for example, a GaAs substrate.
• the cladding layers 3a, 3b and / or the active layer 4 contain a phosphide compound semiconductor material containing indium, wherein the
• Phosphide compound semiconductor material in addition to P at least one of the elements Sb or Bi as an additional element of the main group V.
• the white st phosphide of the cladding layers 3a, 3b and / or the active layer 4 the wetting Caribbeanset In x Ga y Al x - y Sb z z pi_ or In x Ga y Al x - y z Bi z 0 PI_ ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, x + y ⁇ l and 0 ⁇ z ⁇ 1.
• the phosphide compound semiconductor material may also have both additional group-V elements Sb and Bi.
• the phosphide wei st al so the Caribbeanset wetting In x Ga y Al x _ y pi_ z (Sb Bii_ u u) z with 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, x + y ⁇ l, O ⁇ u ⁇ l and 0 ⁇ z ⁇ 1.
• Sb and / or Bi as an additional element of the main group V reduces the so-called ordering in the phosphide compound semiconductor, which also reduces the formation of grain boundaries in the semiconductor material. Since the grain boundaries between ordered regions of the semiconductor material act as centers for non-radiative recombinations of charge carriers, reducing the grain boundaries increases the efficiency of the LED. This is the case in particular when the active layer 4 contains Sb or Bi as an additional element.
• the additional element Sb and / or Bi is in the Phosphide compound semiconductor material of the cladding layers 3a, 3b included. It has been found that the addition of Sb and / or Bi increases the electronic bandgap of the phosphide compound semiconductor material. The effect of the cladding layers in terms of
• Charge carrier confinement in the active layer 4 is enhanced in this way.
• Phosphide compound semiconductor material already occurs at comparatively small amounts of the additional material of main group V.
• the proportion z of the element Sb and / or Bi in the phosphide compound semiconductor material is advantageously z ⁇ 0.03, preferably z ⁇ 0.02 and particularly preferably z ⁇ 0.005.
• Phosphide compound semiconductor material has an indium content of about 0.5, since the tendency of the semiconductor material to order at an indium content of about 0.5 is greatest.
• the indium content in the semiconductor material is 0.3 ⁇ x ⁇ 0.7, preferably 0.4 ⁇ x ⁇ 0.6 and more preferably 0.45 ⁇ x ⁇ 0.55.
• the optoelectronic semiconductor component shown schematically in cross section in FIG. 2 is a thin-film LED.
• a thin-film LED is to be understood as an LED in which the original growth substrate has been detached from the epitaxial layer sequence 8 and the epitaxial layer sequence 8 has been replaced at the original one Growth substrate opposite side has been mounted on a support 9.
• the epitaxial layer sequence 8 has, for example, one or more p-doped layers 5, a p-doped second cladding layer 3b, an active layer 4, an n-doped first cladding layer 3a and one or more n-doped layers 2.
• the structure of the epitaxial layer sequence 8 therefore corresponds to the structure shown in FIG. 1, but with the sequence of the semiconductor layers reversed.
• the p-doped semiconductor layers 3b, 5 face the carrier 9 and the n-doped layers 2, 3a face away from the carrier 9.
• Nitride compound semiconductors for example substrates of GaN or sapphire, are advantageous.
• the active layer 4 of the LED is arranged, as in the exemplary embodiment described in FIG. 1, between a first cladding layer 3a and a second cladding layer 3b.
• the active layer 4 contains an indium-containing nitride compound semiconductor material.
• the nitride compound semiconductor material contains, in addition to N, at least one of As, Sb or Bi as an additional element of the main group V.
• the nitride compound semiconductor material of the active layer 4 can be in particular the composition of In x Ga y Al x - y Ni_ z As z, In x Ga y Al x - y Sb z z Ni_ or In x Ga y Ali_ x - y z Bi z Ni_ with 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, x + y ⁇ l and 0 ⁇ z ⁇ 1.
• the nitride compound semiconductor material the composition In x Ga y Al x _ y Ni_ z (u As v Sb Bii- u _ v) z with 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, x + y ⁇ l ⁇ O u ⁇ l, O ⁇ v ⁇ l, u + v ⁇ l and 0 ⁇ z ⁇ 1.
• indium clusters in the nitride compound semiconductor material of the active layer 4 is advantageously reduced by the at least one additional element As, Bi or Sb.
• the reduction of the indium clusters has the advantage that the formation of crystal defects, which could reduce the efficiency of the LEDs as centers of non-radiative recombinations, is reduced. Also, a local charge carrier density increase in the region of indium clusters, which could cause an increased non-radiative Auger recombination rate, is reduced in this way.
• the electrical contacting of the thin-film LED can take place, for example, by means of a contact metallization 7 on the carrier 9, which is preferably reflective for the emitted radiation of the LED, and a further contact metallization 6 on the surface of the epitaxial layer sequence 8 facing away from the carrier 9.
• Radiation-emitting active layer 4 has a comparatively high indium content.
• the indium content of the active layer 4 may in particular be x ⁇ 0.1, more preferably x ⁇ 0.2 or even x ⁇ 0.3.
• the proportion Z of the additional element is advantageously 0 ⁇ z ⁇ 0.03, preferably 0 ⁇ z ⁇ 0.02 and particularly preferably 0 ⁇ z ⁇ 0.005.
• Nitride compound semiconductor materials are advantageously only slightly influenced by such small amounts of the additional element.
• the LED having the epitaxial layer sequence 8 based on a nitride compound semiconductor material can be realized as the thin film LED LED without the growth substrate according to the second embodiment, but also the epitaxial layer sequence 8 based on a phosphide compound semiconductor material of the first embodiment described above.
• the epitaxial layer sequence 8 based on a phosphide compound semiconductor material of the first embodiment described above can be realized as the thin film LED LED without the growth substrate according to the second embodiment, but also the epitaxial layer sequence 8 based on a phosphide compound semiconductor material of the first embodiment described above.
• a nitride compound semiconductor material based on a nitride compound semiconductor material
• Epitaxial layer sequence 8 of the second embodiment may alternatively be realized as an LED with growth substrate, as shown in Fig. 1.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Led Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=42026389

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Family Cites Families (17)

• 2009
  • 2009-01-16 DE DE102009004895A patent/DE102009004895A1/de not_active Withdrawn
• 2010
  • 2010-01-05 CN CN2010800044387A patent/CN102272952A/zh active Pending
  • 2010-01-05 WO PCT/EP2010/050039 patent/WO2010081754A1/de active Application Filing
  • 2010-01-05 US US13/142,885 patent/US8502267B2/en active Active
  • 2010-01-05 KR KR1020117018948A patent/KR20110110804A/ko not_active Application Discontinuation
  • 2010-01-05 JP JP2011545708A patent/JP2012515445A/ja active Pending
  • 2010-01-05 EP EP10704104A patent/EP2380215A1/de not_active Withdrawn

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events