EP2370348A4 - Fabrication de nanostructures conductrices sur un substrat flexible - Google Patents

Fabrication de nanostructures conductrices sur un substrat flexible

Info

Publication number
EP2370348A4
EP2370348A4 EP09836644.6A EP09836644A EP2370348A4 EP 2370348 A4 EP2370348 A4 EP 2370348A4 EP 09836644 A EP09836644 A EP 09836644A EP 2370348 A4 EP2370348 A4 EP 2370348A4
Authority
EP
European Patent Office
Prior art keywords
fabrication
flexible substrate
conductive nanostructures
nanostructures
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09836644.6A
Other languages
German (de)
English (en)
Other versions
EP2370348A2 (fr
Inventor
Ding Wang
Jerome C Porque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2370348A2 publication Critical patent/EP2370348A2/fr
Publication of EP2370348A4 publication Critical patent/EP2370348A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/101—Nanooptics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
EP09836644.6A 2008-12-17 2009-12-02 Fabrication de nanostructures conductrices sur un substrat flexible Withdrawn EP2370348A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13827208P 2008-12-17 2008-12-17
PCT/US2009/066302 WO2010077529A2 (fr) 2008-12-17 2009-12-02 Fabrication de nanostructures conductrices sur un substrat flexible

Publications (2)

Publication Number Publication Date
EP2370348A2 EP2370348A2 (fr) 2011-10-05
EP2370348A4 true EP2370348A4 (fr) 2016-12-21

Family

ID=42310474

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09836644.6A Withdrawn EP2370348A4 (fr) 2008-12-17 2009-12-02 Fabrication de nanostructures conductrices sur un substrat flexible

Country Status (5)

Country Link
US (1) US20110240476A1 (fr)
EP (1) EP2370348A4 (fr)
KR (1) KR20110099039A (fr)
CN (1) CN102300802A (fr)
WO (1) WO2010077529A2 (fr)

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ES2823456T3 (es) * 2009-06-25 2021-05-07 Univ North Carolina Chapel Hill Método y sistema para utilizar postes unidos a una superficie accionados para evaluar la reología de fluidos biológicos
JP5735785B2 (ja) * 2010-11-30 2015-06-17 豊田鉄工株式会社 電子部品用冷却装置及びその製造方法
US9227383B2 (en) * 2011-12-23 2016-01-05 Hong Kong Baptist University Highly flexible near-infrared metamaterials
JP5850574B2 (ja) * 2012-09-20 2016-02-03 株式会社シンク・ラボラトリー 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法
EP2926115B1 (fr) 2012-11-30 2021-05-26 The University of North Carolina At Chapel Hill Procédés et systèmes permettant de déterminer les propriétés physiques d'un échantillon dans un dispositif de diagnostic portable utilisé au chevet du patient
US10040018B2 (en) 2013-01-09 2018-08-07 Imagine Tf, Llc Fluid filters and methods of use
EP2754524B1 (fr) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Procédé et dispositif destinés au traitement basé sur laser de substrats plats, galette ou élément en verre, utilisant un faisceau laser en ligne
EP2781296B1 (fr) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9861920B1 (en) 2015-05-01 2018-01-09 Imagine Tf, Llc Three dimensional nanometer filters and methods of use
US10730047B2 (en) 2014-06-24 2020-08-04 Imagine Tf, Llc Micro-channel fluid filters and methods of use
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
EP3552753A3 (fr) 2014-07-14 2019-12-11 Corning Incorporated Système et procédé de traitement de matériaux transparents utilisant des lignes focales de faisceau laser réglables en longueur et en diamètre
US10124275B2 (en) 2014-09-05 2018-11-13 Imagine Tf, Llc Microstructure separation filters
TWI561462B (en) * 2014-10-07 2016-12-11 Iner Aec Executive Yuan A method for forming dendritic silver with periodic structure as light-trapping layer
US10758849B2 (en) 2015-02-18 2020-09-01 Imagine Tf, Llc Three dimensional filter devices and apparatuses
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
US10118842B2 (en) 2015-07-09 2018-11-06 Imagine Tf, Llc Deionizing fluid filter devices and methods of use
JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
US10479046B2 (en) 2015-08-19 2019-11-19 Imagine Tf, Llc Absorbent microstructure arrays and methods of use
US10900135B2 (en) * 2016-02-09 2021-01-26 Weinberg Medical Physics, Inc. Method and apparatus for manufacturing particles
BR112020009394A8 (pt) * 2016-09-16 2021-09-14 Ericsson Telefon Ab L M Métodos para operação de um nó de rádio de realimentação e de sinalização, nós de rádio de realimentação e de sinalização, produto de programa, e, arranjo de mídia portadora.
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
EP3529214B1 (fr) 2016-10-24 2020-12-23 Corning Incorporated Station de traitement de substrat pour usinage laser de substrats en verre de type à vitre
WO2019202472A2 (fr) 2018-04-17 2019-10-24 3M Innovative Properties Company Films conducteurs

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1527216A2 (fr) * 2002-06-28 2005-05-04 Infineon Technologies AG Procede de production d'une antenne deposee galvaniquement pour des etiquettes d'identification par radiofrequence (rfid) au moyen d'un adhesif applique selectivement
WO2008081904A1 (fr) * 2006-12-27 2008-07-10 Hitachi Chemical Co., Ltd. Plaque gravée et matériau de base ayant un motif de couche conductrice utilisant la plaque gravée

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1003078A3 (fr) * 1998-11-17 2001-11-07 Corning Incorporated Procédé pour reproduire un motif nanométrique
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法
US9040090B2 (en) * 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
KR100606441B1 (ko) * 2004-04-30 2006-08-01 엘지.필립스 엘시디 주식회사 클리체 제조방법 및 이를 이용한 패턴 형성방법
KR100631017B1 (ko) * 2004-04-30 2006-10-04 엘지.필립스 엘시디 주식회사 인쇄방식을 이용한 패턴 형성방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1527216A2 (fr) * 2002-06-28 2005-05-04 Infineon Technologies AG Procede de production d'une antenne deposee galvaniquement pour des etiquettes d'identification par radiofrequence (rfid) au moyen d'un adhesif applique selectivement
WO2008081904A1 (fr) * 2006-12-27 2008-07-10 Hitachi Chemical Co., Ltd. Plaque gravée et matériau de base ayant un motif de couche conductrice utilisant la plaque gravée
US20100021695A1 (en) * 2006-12-27 2010-01-28 Susumu Naoyuki Engraved plate and substrate with conductor layer pattern using the same

Also Published As

Publication number Publication date
KR20110099039A (ko) 2011-09-05
WO2010077529A2 (fr) 2010-07-08
US20110240476A1 (en) 2011-10-06
EP2370348A2 (fr) 2011-10-05
CN102300802A (zh) 2011-12-28
WO2010077529A3 (fr) 2010-08-26

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