EP2336669B1 - Heat pump hot water supply apparatus - Google Patents

Heat pump hot water supply apparatus Download PDF

Info

Publication number
EP2336669B1
EP2336669B1 EP10192556.8A EP10192556A EP2336669B1 EP 2336669 B1 EP2336669 B1 EP 2336669B1 EP 10192556 A EP10192556 A EP 10192556A EP 2336669 B1 EP2336669 B1 EP 2336669B1
Authority
EP
European Patent Office
Prior art keywords
heat pump
hot water
reservoir tank
pump unit
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP10192556.8A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2336669A3 (en
EP2336669A2 (en
Inventor
Katsuhiro Wada
Toshiaki Andou
Kazuhito Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP2336669A2 publication Critical patent/EP2336669A2/en
Publication of EP2336669A3 publication Critical patent/EP2336669A3/en
Application granted granted Critical
Publication of EP2336669B1 publication Critical patent/EP2336669B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H4/00—Fluid heaters characterised by the use of heat pumps
    • F24H4/02—Water heaters
    • F24H4/04—Storage heaters

Definitions

  • the present invention relates to a structure of a heat pump hot water supply apparatus.
  • Fig. 7 shows a general structure of a conventional heat pump unit.
  • an air heat exchanger 4 and a blast fan 5 constituting a blast circuit are disposed on the left side of a compressor 2
  • a water refrigerant heat exchanger 3 and a pipe connecting tool 6 on the side of a heat pump are disposed on the right side of the compressor 2
  • the blast circuit, the compressor 2 and the water refrigerant heat exchanger 3 are disposed in a widthwise direction of the heat pump unit (see patent document 1 for example).
  • Fig. 8 shows a general structure of a conventional heat pump hot water supply apparatus.
  • a heat pump unit 1 and a hot water reservoir tank unit 10 are disposed on a floor, and the heat pump unit 1 and the hot water reservoir tank unit 10 are connected with each other through a connecting pipe 20 and a connecting pipe 21 (see patent document 2 for example).
  • installation spaces of the heat pump unit 1, the hot water reservoir tank unit 10 and the connecting pipes 20 and 21 which connect water circuits thereof with each other are required on the floor.
  • the installation space is not sufficient, and the heat pump hot water supply apparatus can not be installed, or if the heat pump hot water supply apparatus is installed, living space is affected. Therefore, a heat pump hot water supply apparatus which can be installed on a small floor is required.
  • the configuration of the conventional heat pump unit has problems that a width of the heat pump unit is increased, and the heat pump unit can not be installed in a pipe shaft room and a meter box in an apartment.
  • JP2004132670A discloses providing a low-cost hot-water storage type heat pump hot-water supplier improving durability of a tank, decreasing installation space, and improving water feed pressure and COP property. Height of the tank is lowered by forming and constituting the tank with resin into a rectangular shape. Using the lowered height, a heat pump unit is loaded on the tank and integrally constituted. The tank and the heat pump unit are separable for increasing degree of freedom for installation. A water feed pump of a direct-current drive pump is loaded on the tank for improving water feed pressure. Area of an evaporator of the heat pump unit is enlarged and absorption efficiency of atmospheric heat is increased for improving COP.
  • JP2009204253A discloses a heat pump hot water supply apparatus according to the preamble of claim 1.
  • the present invention is for solving the conventional problems, and it is an object of the invention to provide a heat pump hot water supply apparatus which can be installed in an environment having a small installation space in a detached house or an apartment in a narrow area in an urban area, which can reduce the radiation loss from the connecting pipe, in which material cost of the connecting pipe can be reduced, and the number of man-hours of a piping operation at the site of installation can be reduced.
  • the present invention provides a heat pump hot water supply apparatus comprising a heat pump unit having a water refrigerant heat exchanger which heats low temperature water, a hot water reservoir tank unit having a hot water reservoir tank in which high temperature water heated by the water refrigerant heat exchanger is stored, a water pipe through which low temperature water in a lower portion of the hot water reservoir tank is sent to the water refrigerant heat exchanger, and a boiling pipe through which high temperature water heated by the water refrigerant heat exchanger is sent to an upper portion of the hot water reservoir tank, wherein the heat pump unit is placed on a ceiling surface of the hot water reservoir tank unit, and the boiling pipe is shorter than the water pipe.
  • An air suction space is formed within a range of the ceiling surface on the side of a back surface of the heat pump unit. The air sucked into the heat pump unit is blown from a front of the heat pump unit.
  • a high temperature-side connecting pipe connects a high temperature-side pipe connecting tool of the hot water reservoir tank unit and a high temperature-side pipe connecting tool of the heat pump unit.
  • a low temperature-side connecting pipe connects a low temperature-side pipe connecting tool of the hot water reservoir tank unit and a low temperature-side pipe connecting tool of the heat pump unit. The high temperature-side pipe connecting tool and the low temperature-side pipe connecting tool are provided on a ceiling surface of the hot water reservoir tank unit.
  • the high temperature-side pipe connecting tool and the low temperature-side pipe connecting tool are provided on a back surface of the heat pump unit.
  • the high temperature-side connecting pipe and the low temperature-side connecting pipe are disposed within the range of the ceiling surface and in a space of the side of the back surface of the heat pump unit.
  • a connecting unit which connects the ceiling surface of the hot water reservoir tank unit and a bottom surface of the heat pump unit with each other is disposed in vertical down ward and on the ceiling surface of the hot water reservoir tank unit.
  • the installation spaces for the heat pump unit and the connecting pipe can be constituted within a ceiling surface of the hot water reservoir tank unit. As compared with the conventional heat pump hot water supply apparatus which was constituted on a floor, its installation space can largely be saved.
  • the invention it is possible to provide a heat pump hot water supply apparatus in which the radiation loss from the connecting pipe can be reduced while realizing space-saving of installation of the heat pump hot water supply apparatus in an environment having a small installation space in a detached house or an apartment in a narrow area in an urban area, radiation loss from the connecting pipe can be reduced, material cost of the connecting pipe can be reduced, and the number of man-hours of a piping operation at the site of installation can be reduced.
  • An embodiment provides heat pump hot water supply apparatus comprising a heat pump unit having a water refrigerant heat exchanger which heats low temperature water, a hot water reservoir tank unit having a hot water reservoir tank in which high temperature water heated by the water refrigerant heat exchanger is stored, a water pipe through which low temperature water in a lower portion of the hot water reservoir tank is sent to the water refrigerant heat exchanger, and a boiling pipe through which high temperature water heated by the water refrigerant heat exchanger is sent to an upper portion of the hot water reservoir tank, wherein the heat pump unit is placed on a ceiling surface of the hot water reservoir tank unit, and the boiling pipe is shorter than the water pipe. Since the radiation area of the boiling pipe can be made small, radiation loss from a boiling side pipe can be reduced, and performance of the heat pump hot water supply apparatus can be enhanced.
  • widths of the heat pump unit and the hot water reservoir tank unit are 800 mm or less.
  • the hot water reservoir tank unit and the heat pump unit can be accommodated in the same narrow space in a state where they are vertically connected with each other.
  • a connecting unit which connects the ceiling surface of the hot water reservoir tank unit and a bottom surface of the heat pump unit with each other is disposed on the ceiling surface of the hot water reservoir tank unit. Since the bottom of the heat pump unit and the ceiling surface of the hot water reservoir tank unit are connected with each other, the heat pump unit and the hot water reservoir tank unit can integrally be formed as one unit.
  • installation spaces for the heat pump unit, the high temperature-side connecting pipe and the low temperature-side connecting pipe can be constituted within the ceiling surface of the hot water reservoir tank unit.
  • the heat pump unit, the high temperature-side connecting pipe and the low temperature-side connecting pipe occupied a floor, but according to the third aspect, these members are eliminated from the floor, and the installation space for the heat pump hot water supply apparatus can be saved.
  • the pipes can be connected before installation, and the heat pump unit and the hot water reservoir tank unit can previously be integrally formed as one unit. Therefore, especially when the heat pump hot water supply apparatus is installed in a narrow space in a pipe shaft room or a meter box in an apartment where the piping operation is difficult, the heat pump hot water supply apparatus can be installed extremely easily.
  • a high temperature-side pipe connecting tool to which the boiling pipe is connected, and a low temperature-side pipe connecting tool to which the water pipe is connected are disposed on the ceiling surface of the hot water reservoir tank unit.
  • the high temperature-side pipe connecting tool and the low temperature-side pipe connecting tool of the hot water reservoir tank unit can be disposed near the heat pump unit.
  • a high temperature-side pipe connecting tool and a low temperature-side pipe connecting tool connected to a water circuit of the water refrigerant heat exchanger are provided on a back surface of the heat pump unit, the high temperature-side pipe connecting tool of the hot water reservoir tank unit and the high temperature-side pipe connecting tool of the heat pump unit are connected with each other through a high temperature-side connecting pipe, and the low temperature-side pipe connecting tool of the hot water reservoir tank unit and the low temperature-side pipe connecting tool of the heat pump unit are connected with each other through a low temperature-side connecting pipe.
  • the high temperature-side connecting pipe and the low temperature-side pipe connecting tool can largely be shortened, and the radiation area at the high temperature-side connecting pipe can be reduced. Therefore, the radiation loss can be reduced, and the connecting pipe can be shortened.
  • the material cost of the connecting pipe can be reduced, and number of man-hours can also be reduced.
  • an outwardly swelling convex portion is provided on a back surface of the heat pump unit. Since the convex portion is provided, a new space is generated, and parts such as a refrigerant pipe and water refrigerant heat exchanger can be accommodated in this space. It was necessary to secure a space of 100 mm or more as an air suction space, the space of the back surface was a dead space. This dead space can effectively utilized as a space for accommodating parts.
  • the refrigerant pipe accommodation space, the high temperature-side pipe connecting tool, the low temperature-side pipe connecting tool, the pipe cover and the operation space for connecting pipe which were conventionally constituted in the widthwise direction are disposed in the backward direction in this aspect. According to this configuration, a space in the widthwise direction can largely be reduced.
  • the width of the heat pump unit is equal to or less than the width of the hot water reservoir tank unit.
  • the width of the heat pump hot water supply apparatus is further reduced, and the heat pump hot water supply apparatus can be installed in a narrow space in a pipe shaft room or a meter box in an apartment where the piping operation is difficult.
  • the hot water reservoir tank unit and the heat pump unit can be accommodated in a state where they are integrally formed as one unit.
  • Fig. 1 is a schematic front sectional view of a heat pump hot water supply apparatus according to a first embodiment of the invention.
  • Fig. 2 is a schematic side sectional view of the heat pump hot water supply apparatus.
  • FIGs. 1 and 2 two connecting units 16 are provided on a ceiling surface of a hot water reservoir tank unit 10.
  • a refrigerant compressor 2, a water refrigerant heat exchanger 3, air heat exchangers 4, and a blast fan 5 are provided in a heat pump unit 1.
  • the refrigerant compressor 2, the water refrigerant heat exchanger 3 and the air heat exchangers 4 are connected with each other through refrigerant pipes.
  • a refrigerant compressed in the refrigerant compressor 2 dissipates heat in the water refrigerant heat exchanger 3 and then, is decompressed by a pressure reducing device (not shown), heat of the refrigerant is absorbed by the air heat exchanger 4, and the refrigerant is gasified, and sucked into the refrigerant compressor 2.
  • the blast fan 5 facilitates heat exchange in the air heat exchanger 4.
  • a high temperature-side pipe connecting tool 6 and a low temperature-side pipe connecting tool 7 are provided on a back surface of the heat pump unit 1.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are connected to a water circuit of the water refrigerant heat exchanger 3.
  • Low temperature water flows from the low temperature-side pipe connecting tool 7 to the water refrigerant heat exchanger 3
  • high temperature water heated by the water refrigerant heat exchanger 3 flows out from the high temperature-side pipe connecting tool 6.
  • a hot water reservoir tank 11 is provided in the hot water reservoir tank unit 10.
  • a high temperature-side pipe connecting tool 14 and a low temperature-side pipe connecting tool 15 are provided on a ceiling surface of the hot water reservoir tank unit 10.
  • a lower portion of the hot water reservoir tank 11 and the low temperature-side pipe connecting tool 15 are connected with each other through a water pipe 13 .
  • a boiling circulation pump 17 is provided at the water pipe 13.
  • An upper portion of the hot water reservoir tank 11 and the high temperature-side pipe connecting tool 14 are connected with each other through a boiling pipe 12.
  • a high temperature-side connecting pipe 20 connects the high temperature-side pipe connecting tool 6 of the heat pump unit 1 and the high temperature-side pipe connecting tool 14 of the hot water reservoir tank unit 10 with each other.
  • a low temperature-side connecting pipe 21 connects the low temperature-side pipe connecting tool 7 of the heat pump unit 1 and the low temperature-side pipe connecting tool 15 of the hot water reservoir tank unit 10 with each other.
  • Low temperature water is guided by the boiling circulation pump 17 from a bottom of the hot water reservoir tank 11 into the water circuit of the water refrigerant heat exchanger 3 through the water pipe 13 and the low temperature-side connecting pipe 21.
  • High temperature water heated by the water refrigerant heat exchanger 3 is guided from a top of the hot water reservoir tank 11 into the hot water reservoir tank 11 through the high temperature-side connecting pipe 20 and the boiling pipe 12.
  • the hot water reservoir tank 11 guides low temperature water from a bottom thereof, guides high temperature water from a top thereof, and water in the hot water reservoir tank 11 is not stirred, thereby constituting a lamination type tank.
  • the heat pump unit 1 is disposed on the ceiling surface of the hot water reservoir tank unit 10, and a bottom of the heat pump unit 1 and the ceiling surface of the hot water reservoir tank unit 10 are connected with each other through the connecting units 16.
  • the high temperature-side connecting pipe 20 connects the high temperature-side pipe connecting tool 14 provided on the ceiling surface of the hot water reservoir tank unit 10 and the high temperature-side pipe connecting tool 6 provided on the back surface of the heat pump unit 1 with each other.
  • the low temperature-side connecting pipe 21 connects the low temperature-side pipe connecting tool 15 provided on the ceiling surface of the hot water reservoir tank unit 10 and the low temperature-side pipe connecting tool 7 provided on the back surface of the heat pump unit 1 with each other.
  • the high temperature-side connecting pipe 20 and the low temperature-side connecting pipe 21 are disposed in a space above the ceiling surface of the hot water reservoir tank unit 10 and on the side of the back surface of the heat pump unit 1, and the floor installation space becomes unnecessary.
  • the high temperature-side pipe connecting tool 14 and the low temperature-side pipe connecting tool 15 of the hot water reservoir tank unit 10, and the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 of the heat pump unit 1 are constituted within the ceiling surface of the hot water reservoir tank unit 10 as viewed from above, a distance between respective connecting tools is reduced, and lengths of the high temperature-side connecting pipe 20 and the low temperature-side connecting pipe 21 can be shortened.
  • the high temperature-side pipe connecting tool 6 of the heat pump unit 1, the high temperature-side pipe connecting tool 14 of the hot water reservoir tank unit 10, and the top of the hot water reservoir tank 11 which is an inlet of high temperature water in the hot water reservoir tank 11 come close to each other, and lengths of the high temperature-side connecting pipe 20 and the boiling pipe 12 through which high temperature water flows can be shortened, and the radiation loss can be reduced.
  • the connecting unit 16 is provided on the ceiling surface of the hot water reservoir tank unit 10, the heat pump unit 1 is disposed on the ceiling surface of the hot water reservoir tank unit 10, the bottom of the heat pump unit 1 and the ceiling surface of the hot water reservoir tank unit 10 are connected with each other through the connecting units 16. According to this configuration, installation spaces of the heat pump unit 1, the high temperature-side connecting pipe 20 and the low temperature-side connecting pipe 21 can be constituted within the installation space (within a range of the ceiling surface) of the hot water reservoir tank unit 10.
  • the high temperature-side connecting pipe 20 and the low temperature-side connecting pipe 21 can be made as connecting units formed from metal pipes for connecting the hot water reservoir tank unit 10 and the heat pump unit 1 with each other.
  • the high temperature-side pipe connecting tool 14 and the low temperature-side pipe connecting tool 15 are provided on the ceiling surface of the hot water reservoir tank unit 10, and the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are provided on the back surface of the heat pump unit 1 which is connected to the ceiling surface of the hot water reservoir tank unit 10. According to this configuration, the high temperature-side pipe connecting tool 6, the high temperature-side pipe connecting tool 14, and the top of the hot water reservoir tank 11 which is the inlet of high temperature water in the hot water reservoir tank 11 come close to each other.
  • the lengths of the high temperature-side connecting pipe 20 and the boiling pipe 12 through which heated high temperature water flows can be shortened, the radiation area can be reduced, a radiation amount is suppressed, and the performance of the hot water supply apparatus can be enhanced.
  • the connecting operation of the high temperature-side connecting pipe 20 and the low temperature-side connecting pipe 21 can be carried out before the heat pump unit 1 and the hot water reservoir tank unit 10 are installed, and the heat pump unit 1 and the hot water reservoir tank unit 10 can integrally be formed together before they are installed. Therefore, it becomes extremely easy to install them in a narrow space such as a shaft room and a meter box in an apartment where the connecting operation of pipes is difficult.
  • Fig. 3 is a schematic plan sectional view of a heat pump unit of a heat pump hot water supply apparatus according to a second embodiment of the invention.
  • the heat pump unit 1 of the second embodiment can be used instead of the heat pump unit described with reference to Figs. 1 and 2 .
  • the same members as those of the first embodiment are designated with the same symbols, and explanation thereof will be omitted.
  • the heat pump unit 1 of the second embodiment is constituted within a ceiling surface of the hot water reservoir tank unit 10 as viewed from above as described with reference to Figs. 1 and 2 .
  • a back surface of the heat pump unit 1 is swelled and formed into a convex shape, and a new space generated by this convex shape is used as a refrigerant accommodation space 9.
  • This refrigerant accommodation space 9 may be used as a space for accommodating the water refrigerant heat exchanger 3 therein.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are disposed on the back surface.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are covered with a pipe cover 8.
  • the refrigerant compressor 2 is provided on one side in the heat pump unit 1 in its widthwise direction
  • the refrigerant accommodation space 9 is formed on the side of a back surface of the refrigerant compressor 2
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 project toward the back surface as compared with a position of the air heat exchanger 4. Since the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 project toward the back surface as compared with the air heat exchanger 4, when the heat pump unit 1 is disposed along two intersecting wall surfaces 41, an air suction space 43 is formed on the side of a back surface of the air heat exchanger 4.
  • a symbol 40 represents air flow caused by the blast fan 5.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 were disposed in the widthwise direction (side surface) of the heat pump unit 1. In the present invention, they are disposed on the back surface of the heat pump unit 1. Therefore, the space in the heat pump unit 1 in its widthwise direction which is required for installing the heat pump unit 1 can largely be reduced.
  • the refrigerant accommodation space 9 is provided on the back surface of the refrigerant compressor 2.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 can project toward the back surface as compared with the position of the air heat exchanger 4, and the air suction space 42 can reliably be secured on the back surface of the heat pump unit 1. Since the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are disposed on the back surface of the heat pump unit 1, the pipe cover 8 is also disposed on the side of the back surface of the heat pump unit 1. Therefore, a space in the heat pump unit 1 in its widthwise direction can be reduced. An operation space for piping operation of the connecting pipes can be secured in a backward position.
  • a heat pump hot water supply apparatus was installed in an apartment such that only the hot water reservoir tank was accommodated in the pipe shaft room, and the heat pump unit 1 was installed on a balcony or a shared corridor.
  • the width of the heat pump unit 1 it is necessary to secure the width of the door. More specifically, it is necessary to secure 100 mm or more as the air suction space 42, and a space of 300 mm or more for the piping operation of the connecting pipes, and if a width of the heat pump unit is 820 mm, a total required width is 1220 mm (820 mm + 100 mm 300 mm) .
  • the refrigerant accommodation space 9, the high temperature-side pipe connecting tool 6, the low temperature-side pipe connecting tool 7 and the pipe cover 8 were constituted in the widthwise direction.
  • the refrigerant accommodation space 9, the high temperature-side pipe connecting tool 6, the low temperature-side pipe connecting tool 7 and the pipe cover 8 as well as the piping operation space of the connecting pipes of 300 mm are disposed in the backward direction. Therefore, the width of the heat pump unit 1 can be 800 mm or less, and this size is less than the width of the hot water reservoir tank unit 10.
  • a total size of the width 800 mm of the heat pump unit 1 and the width 100 mm of the air suction space 42 becomes 900 mm, this is the size required in the widthwise direction, and they can be accommodated in the pipe shaft having the door of 900 mm width. This is because that the width in the pipe shaft room usually becomes larger than a width of the door due to a structural reason.
  • Figs. 4 to 6 show an installation example of the heat pump hot water supply apparatus of the invention into the pipe shaft room.
  • Fig. 4 is a schematic front sectional view of a heat pump hot water supply apparatus installed in the pipe shaft room according to a third embodiment of the invention.
  • Fig. 5 is a schematic side sectional view of the heat pump hot water supply apparatus installed in the pipe shaft room according to the third embodiment of the invention.
  • Fig. 6 is a schematic plan sectional view of the heat pump hot water supply apparatus installed in the pipe shaft room according to the third embodiment of the invention. Since configurations of the heat pump unit 1 and the hot water reservoir tank unit 10 are the same as those in the embodiments shown in Figs. 1 and 2 , the same elements are designated with the same symbols, and explanation thereof will be omitted.
  • the heat pump unit in the embodiment shown in Fig. 3 may be applied to the third embodiment.
  • Figs. 4 , 5 and 6 show a pipe shaft room 31 having a door 34, and a width of the door 34 is 900 mm.
  • a width of the heat pump unit 1 is 800 mm or less, and this width is equal to or less than that of the hot water reservoir tank unit 10. It is preferable that a width of the hot water reservoir tank unit is also 800 mm or less.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are disposed behind the heat pump unit 1.
  • the heat pump unit 1 is connected to an upper surface of the hot water reservoir tank unit 10, and the heat pump unit 1 is disposed in a state where the heat pump unit 1 is adjacent to the door 34 in the pipe shaft room 31.
  • the air suction space 42 is adjoined to the heat pump unit 1, and a pipe installing area 35 in which a water supply pipe, a drain pipe and a meter are accommodated is formed behind the air suction space 42.
  • a soft thermal insulation seal material 38 is annularly provided on a front surface of the heat pump unit 1, and the heat pump unit 1 is in intimate contact with an inner wall surface of the door 34 through the thermal insulation seal material 38.
  • An air suction port 32 is provided below the door 34, and an air blowoff port 33 is provided above the door 34.
  • the air blowoff port 33 includes a wind-direction changing plate 33a such that air is blown horizontally or slightly upwardly.
  • the air blowoff port 33 includes the wind-direction changing plate 33a such that air is blown horizontally or slightly upwardly so that cold air does not flow downward.
  • the soft thermal insulation seal material 38 is annularly provided on the front surface of the heat pump unit 1 so that cold air does not leak into the pipe shaft room 31 in association with the inner wall surface of the door 34.
  • the thermal insulation seal material 38 may be fixed to the inner wall surface of the door 34 of the pipe shaft room 31.
  • the width of the heat pump unit 1 is 800 mm or less, and is equal to or less than the width of the hot water reservoir tank unit 10.
  • the high temperature-side pipe connecting tool 6 and the low temperature-side pipe connecting tool 7 are disposed behind the heat pump unit 1, and the heat pump unit 1 is connected to the upper surface of the hot water reservoir tank unit 10.
  • the soft thermal insulation seal material 38 is annularly provided on the front surface of the heat pump unit 1, and the wind-direction changing plate 33a is provided at the air blowoff port 33 so that air is blown horizontally or slightly upwardly. Therefore, it is possible to prevent cold air from entering into the pipe shaft room 31, to prevent the temperature of air in the pipe shaft room 31 from being reduced, and to prevent deterioration in performance of the heat pump hot water supply apparatus. It is possible to prevent dew condensation from being formed on a wall 30 of a building, a pipe or a device such as a meter by cold air. It is possible to prevent cold air from blowing against a pedestrian in a passage.
  • the heat pump hot water supply apparatus of the present invention can be installed in a narrow space.
  • the heat pump unit of the invention can also be applied as an outdoor unit of an air conditioner.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Housings, Intake/Discharge, And Installation Of Fluid Heaters (AREA)
EP10192556.8A 2009-12-09 2010-11-25 Heat pump hot water supply apparatus Not-in-force EP2336669B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009279169A JP5428817B2 (ja) 2009-12-09 2009-12-09 ヒートポンプ給湯機

Publications (3)

Publication Number Publication Date
EP2336669A2 EP2336669A2 (en) 2011-06-22
EP2336669A3 EP2336669A3 (en) 2014-07-30
EP2336669B1 true EP2336669B1 (en) 2017-08-02

Family

ID=43795425

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10192556.8A Not-in-force EP2336669B1 (en) 2009-12-09 2010-11-25 Heat pump hot water supply apparatus

Country Status (3)

Country Link
EP (1) EP2336669B1 (ja)
JP (1) JP5428817B2 (ja)
CN (1) CN102095252B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014102030A (ja) 2012-11-20 2014-06-05 Panasonic Corp ヒートポンプ給湯装置
CN103162417A (zh) * 2013-04-14 2013-06-19 力诺瑞特（上海）新能源有限公司 空气能热水器水箱
CN107328101A (zh) * 2017-06-05 2017-11-07 嘉善睿逸电子科技有限公司 一种热泵热水器
JP2020128833A (ja) 2019-02-08 2020-08-27 パナソニックＩｐマネジメント株式会社 ヒートポンプシステム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4363221A (en) * 1979-08-20 1982-12-14 Singh Kanwal N Water heating system having a heat pump
JP2001116357A (ja) * 1999-08-09 2001-04-27 Sanyo Electric Co Ltd ヒートポンプ式給湯機
JP2004132670A (ja) * 2002-10-15 2004-04-30 Matsushita Electric Ind Co Ltd 貯湯式ヒートポンプ給湯機
JP2005337695A (ja) * 2004-04-27 2005-12-08 Chugoku Electric Power Co Inc:The 集合住宅におけるヒートポンプ式給湯機の設置構造
JP4203663B2 (ja) * 2004-09-22 2009-01-07 日立アプライアンス株式会社 ヒートポンプ給湯装置
JP2007155257A (ja) * 2005-12-07 2007-06-21 Matsushita Electric Ind Co Ltd ヒートポンプ給湯機
JP4823713B2 (ja) 2006-02-17 2011-11-24 株式会社ハウステック 貯湯式給湯機
JP4286273B2 (ja) 2006-06-28 2009-06-24 三洋電機株式会社 ヒートポンプ式給湯装置
JP2009180489A (ja) * 2008-02-01 2009-08-13 Daikin Ind Ltd ヒートポンプ式給湯機
JP2009204253A (ja) * 2008-02-28 2009-09-10 Mitsubishi Electric Corp 貯湯式給湯機
JP2011007461A (ja) * 2009-06-29 2011-01-13 Mitsubishi Electric Corp 貯湯式給湯機

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
CN102095252A (zh) 2011-06-15
JP2011122752A (ja) 2011-06-23
EP2336669A3 (en) 2014-07-30
EP2336669A2 (en) 2011-06-22
JP5428817B2 (ja) 2014-02-26
CN102095252B (zh) 2014-11-12

Similar Documents

Publication Publication Date Title
AU2012353915B2 (en) A heater and an outdoor unit including the same for a refrigerator
CN102405451B (zh) 用于服务器群冷却系统的冷排封装
US8408019B2 (en) Air conditioning device utilizing temperature differentiation of exhausted gas to even temperature of external heat exchanger
EP2314946B1 (en) Radiation heat exchanging air conditioning system and radiation heat exchanging ceiling thereof
US11262111B2 (en) Heat pump apparatus module
RU2541434C2 (ru) Внутренний блок кондиционера воздуха
JP6028221B2 (ja) 熱交換器ユニットおよびそれを備えたヒートポンプ温水暖房装置
JP6254349B2 (ja) ヒートポンプ機器の室外機
EP2336669B1 (en) Heat pump hot water supply apparatus
US20100132914A1 (en) Hot water supply device for house
CN203704184U (zh) 空气调节器的室外机
CN103604171A (zh) 单冷型空调器
CN1419645A (zh) 空气调节装置及其设置方法
US8381541B2 (en) Air conditioning device utilizing temperature differentiation of exhausted gas to even temperature of external heat exchanger
JP2011149593A (ja) 熱交換ユニット
JP5123018B2 (ja) 空調装置
CN101586859A (zh) 一种机柜温控系统和方法
JP2015117924A (ja) エアコンの冷暖房効率を上げる方法
CN101813338A (zh) 空调室外机
JP6126447B2 (ja) 空気調和機
CN205351573U (zh) 一种风冷式机房空调室外机
JP4997782B2 (ja) ヒートポンプ蓄熱装置
KR100846000B1 (ko) 모듈화된 일체형 냉난방시스템
JP2008304167A (ja) 集合住宅用給湯設備
JP3998030B2 (ja) 天井設置型空気調和装置

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: F24H 4/04 20060101AFI20140620BHEP

17P Request for examination filed

Effective date: 20150116

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

17Q First examination report despatched

Effective date: 20151021

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20170228

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 914920

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170815

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602010044023

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170802

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 914920

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170802

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171102

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171202

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171102

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171103

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602010044023

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

26N No opposition filed

Effective date: 20180503

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20171125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171130

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171125

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20171130

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171130

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20101125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20191121

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20191120

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602010044023

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210601