EP2218804A4 - Bain d'électrodéposition d'alliage cuivre-zinc et procédé de déposition utilisant le bain d'électrodéposition d'alliage cuivre-zinc - Google Patents

Bain d'électrodéposition d'alliage cuivre-zinc et procédé de déposition utilisant le bain d'électrodéposition d'alliage cuivre-zinc

Info

Publication number
EP2218804A4
EP2218804A4 EP08854020A EP08854020A EP2218804A4 EP 2218804 A4 EP2218804 A4 EP 2218804A4 EP 08854020 A EP08854020 A EP 08854020A EP 08854020 A EP08854020 A EP 08854020A EP 2218804 A4 EP2218804 A4 EP 2218804A4
Authority
EP
European Patent Office
Prior art keywords
copper
zinc alloy
electroplating bath
alloy electroplating
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08854020A
Other languages
German (de)
English (en)
Other versions
EP2218804A1 (fr
Inventor
Yukiko Yamamoto
Takeshi Ohba
Shinichi Toyosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bridgestone Corp
Original Assignee
Bridgestone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007304377A external-priority patent/JP5274817B2/ja
Application filed by Bridgestone Corp filed Critical Bridgestone Corp
Publication of EP2218804A1 publication Critical patent/EP2218804A1/fr
Publication of EP2218804A4 publication Critical patent/EP2218804A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP08854020A 2007-11-26 2008-11-26 Bain d'électrodéposition d'alliage cuivre-zinc et procédé de déposition utilisant le bain d'électrodéposition d'alliage cuivre-zinc Withdrawn EP2218804A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007304377A JP5274817B2 (ja) 2007-11-26 2007-11-26 銅−亜鉛合金電気めっき浴およびこれを用いためっき方法
JP2007304376 2007-11-26
PCT/JP2008/071470 WO2009069669A1 (fr) 2007-11-26 2008-11-26 Bain d'électrodéposition d'alliage cuivre-zinc et procédé de déposition utilisant le bain d'électrodéposition d'alliage cuivre-zinc

Publications (2)

Publication Number Publication Date
EP2218804A1 EP2218804A1 (fr) 2010-08-18
EP2218804A4 true EP2218804A4 (fr) 2011-08-24

Family

ID=40678562

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08854020A Withdrawn EP2218804A4 (fr) 2007-11-26 2008-11-26 Bain d'électrodéposition d'alliage cuivre-zinc et procédé de déposition utilisant le bain d'électrodéposition d'alliage cuivre-zinc

Country Status (4)

Country Link
US (1) US20100243466A1 (fr)
EP (1) EP2218804A4 (fr)
CN (1) CN101874128B (fr)
WO (1) WO2009069669A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2491067C2 (ru) 2007-08-06 2013-08-27 Байотай Терапис, Инк Способы лечения зависимости
CN105154935A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种铜锌合金电镀液及其电镀方法
CN105002534A (zh) * 2015-08-25 2015-10-28 无锡桥阳机械制造有限公司 一种稀土铈-铜-锆合金电镀液及其电镀方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1498212A (en) * 1974-03-18 1978-01-18 Mcgean Chem Co Inc Electroplating bath for producing zinc-copper alloys
EP0752484A1 (fr) * 1995-07-07 1997-01-08 PIRELLI COORDINAMENTO PNEUMATICI S.p.A. Procédé de revêtement électrolytique d'un élément métallique avec une couche de laiton

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3980532A (en) * 1975-03-28 1976-09-14 Abbco, Inc. Deposition of brass by electroplating
JPS59215492A (ja) * 1983-05-19 1984-12-05 Nippon Kagaku Sangyo Kk 亜鉛合金の電気鍍金浴
JPS63203790A (ja) * 1987-02-17 1988-08-23 Oosakashi シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴
JPH0320478A (ja) 1989-06-16 1991-01-29 Mazda Motor Corp 高合金再溶融カムの製造方法
US5100517A (en) 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
JP3361914B2 (ja) * 1995-04-05 2003-01-07 大阪市 印刷回路用銅箔の製造方法
TW420729B (en) * 1996-02-12 2001-02-01 Gould Electronics Inc A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1498212A (en) * 1974-03-18 1978-01-18 Mcgean Chem Co Inc Electroplating bath for producing zinc-copper alloys
EP0752484A1 (fr) * 1995-07-07 1997-01-08 PIRELLI COORDINAMENTO PNEUMATICI S.p.A. Procédé de revêtement électrolytique d'un élément métallique avec une couche de laiton

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2009069669A1 *
SENNA L F ET AL: "ELECTRODEPOSITION OF COPPER-ZINC ALLOYS IN PYROPHOSPHATE-BASED ELECTROLYTES", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 33, no. 12, 1 December 2003 (2003-12-01), pages 1155 - 1161, XP001211549, ISSN: 0021-891X, DOI: 10.1023/B:JACH.0000003756.11862.6E *

Also Published As

Publication number Publication date
US20100243466A1 (en) 2010-09-30
EP2218804A1 (fr) 2010-08-18
CN101874128B (zh) 2012-07-04
WO2009069669A1 (fr) 2009-06-04
CN101874128A (zh) 2010-10-27

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