Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10688—Adjustment of the adherence to the glass layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0016—Plasticisers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/101—Esters; Ether-esters of monocarboxylic acids
  • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/048—Encapsulation of modules
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/048—Encapsulation of modules
  • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy

Definitions

• Photovoltaic modules with plasticized films based on polyvinyl acetal with high specific resistance are plasticized films based on polyvinyl acetal with high specific resistance
• the invention relates to the production of photovoltaic modules using plasticized films based on polyvinyl acetal with high resistivity.
• Photovoltaic modules consist of a photosensitive semiconductor layer, which is provided to protect against external influences with a transparent cover.
• a photosensitive semiconductor layer monocrystalline solar cells or polycrystalline, thin semiconductor layers can be used on a support.
• Thin-film solar modules consist of a photosensitive semiconductor layer coated on a mostly transparent plate, e.g. by vapor deposition, vapor deposition, sputtering or wet deposition is applied.
• Both systems are typically sandwiched between a pane of glass and a rigid, rear cover plate, e.g. laminated from glass or plastics using a transparent adhesive.
• the transparent adhesive must completely enclose the photosensitive semiconductor layer and its electrical connection lines, be UV-stable and insensitive to moisture and be completely bubble-free after the lamination process.
• thermosetting adhesive systems are the use of plasticized films based on polyvinyl acetals, such as the polyvinyl butyral (PVB) known from the manufacture of laminated glass.
• PVB polyvinyl butyral
• PVB films Processes for the production of solar modules by means of PVB films are, for. Example by DE 40 26 165 C2, DE 42 278 60 Al, DE 29 237 70 C2, DE 35 38 986 C2 or US 4,321,418.
• the use of PVB films in solar modules as composite safety glazings is known e.g. in DE 20 302 045 Ul, EP 1617487 Al, and DE 35 389 86 C2 discloses.
• these documents contain no information about the mechanical, chemical and electrical properties of the PVB films used.
• the electrical properties of the adhesive films are becoming increasingly important as the performance of the photosensitive semiconductor layers and the global spread of solar modules increases. Charge losses or even Short circuits of the semiconductor layer must also be extreme
• Photovoltaic modules are subjected to a variety of tests according to CEI 61215
• Adhesive films have an extremely high resistivity
• the object of the present invention is therefore to provide plasticized films based on polyvinyl acetal with high specific (electrical) resistance for the production of photovoltaic modules.
• films having an increased glass transition temperature Tg have an increased specific resistance. Without being bound by the theory, this is attributed to decreased ion mobility in a glassy or highly viscous environment.
• the present invention therefore relates to photovoltaic modules comprising a laminate of a) a transparent front cover b) one or more photosensitive semiconductor layers c) at least one plasticizer-containing polyvinyl acetal-based film and d) a rear cover wherein the plasticizer-containing, polyvinyl acetal-based Films c) have a glass transition temperature Tg of at least 20 0 C.
• the glass transition temperature Tg of the films used in the invention is preferably at least 22 0 C, 24 0 C, 26 0 C, 27 0 C, 30 0 C or 35 ° C.
• the maximum limit for the glass transition temperature Tg 40 0 C can be specified.
• the glass transition temperature Tg of plasticized films based on polyvinyl acetal is determined to a large extent by the proportion and the polarity or softening effect of the plasticizer used. Thus, the specific resistance of the film can be easily adjusted via the plasticizer.
• the films used according to the invention preferably have a specific resistance of at least 1E + 11 ohm.cm, preferably at least 5E + 11 ohm.cm, preferably 1E + 12 ohm.cm, preferably 5E + 12 ohm * cm, preferably 1E + 13, preferably 5E + 13 ohm * cm, preferably 1E + 14 ohm * cm. These values should be reached at each point of the film, especially at the edge of the module.
• the films based on plasticized polyvinyl acetal preferably contain uncrosslinked polyvinyl butyral (PVB), which is obtained by acetalization of polyvinyl alcohol with butyraldehyde.
• PVB polyvinyl butyral
• crosslinked polyvinyl acetals especially crosslinked polyvinyl butyral (PVB) is also possible.
• Suitable crosslinked polyvinyl acetals are e.g. in EP 1527107 Bl and WO 2004/063231 Al (thermal self-crosslinking of carboxyl-containing polyvinyl acetals), EP 1606325 Al (with
• terpolymers of hydrolyzed vinyl acetate / ethylene copolymers can also be used as the polyvinyl alcohol. These compounds are usually hydrolyzed to greater than 98% and contain from 1 to 10 wt. Ethylene-based units (e.g., "Exceval" type from Kuraray Europe GmbH).
• polyvinyl acetals also contain units resulting from vinyl acetate and vinyl alcohol.
• the polyvinyl acetals used according to the invention preferably have a polyvinyl alcohol content of less than 21% by weight, less than 18% by weight, less than 16% by weight or in particular less than 14% by weight. A polyvinyl alcohol content of 12% by weight should not be exceeded.
• the polyvinyl acetate content is preferably below 5% by weight, preferably below 3% by weight and in particular below 2% by weight. From the polyvinyl alcohol content and the residual acetate content, the degree of acetalization can be determined by calculation.
• the inventively required high specific resistance of the films can be adjusted by the type and / or amount of the plasticizer.
• the films have a plasticizer content of at most 26% by weight, more preferably of at most 24% by weight and in particular of not more than 22% by weight, with a plasticizer content of 15% by weight not being exceeded for reasons of processability of the film.
• Films or photovoltaic modules may contain one or more plasticizers.
• plasticizers whose polarity, expressed by the formula: 100 ⁇ O / (C + H) is less than or equal to 9.4, where O, C and H represent the number of
• Molecule stands.
• the following table shows plasticizers which can be used according to the invention and their polarity values according to the formula 100 ⁇ O / (C + H).
• the adhesion of Polyvinylacetalfolien to glass is usually by the addition of adhesion regulators such.
• Alkaline earth salts of organic acids set. When Particularly suitable potassium acetate and / or magnesium acetate have been found.
• polyvinyl acetals from the manufacturing process often contain alkali and / or alkaline earth salts of inorganic acids, such as sodium chloride.
• plasticized polyvinyl acetal based films at less than 50 ppm, more preferably at less than 30 ppm, and most preferably at less than 20 ppm metal ions, is desirable. This can be accomplished by appropriate washing of the polyvinyl acetal and by the use of particularly effective anti-adherents such as the magnesium, calcium and / or zinc salts of organic acids (e.g., acetates) known to those skilled in the art.
• particularly effective anti-adherents such as the magnesium, calcium and / or zinc salts of organic acids (e.g., acetates) known to those skilled in the art.
• the plasticizer-containing films based on polyvinyl acetal preferably contain 0.001 to 15% by weight, preferably 2 to 5% by weight, of pyrogenic SiO 2.
• the lamination of the photovoltaic modules takes place with fusion of the films, so that bubble-free and schlierenoker inclusion of the photosensitive semiconductor layer is obtained with the films.
• the photosensitive semiconductor layers are applied to the cover d) (eg by vapor deposition, vapor deposition, sputtering or wet deposition) and bonded by a film c) to the transparent front cover a).
• the photosensitive semiconductor layers are applied to the transparent front cover a) and glued to the rear cover d) by the film c).
• the photosensitive semiconductor layers can be embedded between two films c) and thus bonded to the covers a) and d).
• the thickness of the plasticized polyvinyl acetal-based films is usually 0.38, 0.51, 0.76, 1.14, 1.52 or 2.28 mm.
• Films used according to the invention fill out the cavities present on the photosensitive semiconductor layers or their electrical connections during the laminating process.
• the transparent front cover a) is usually made of glass or PMMA.
• the back cover d) (so-called backsheet) of the photovoltaic module according to the invention may consist of glass, plastic or metal or their composites, wherein one of the carriers may be transparent. It is also possible to make one or both covers as composite glazing (ie as a laminate of at least two glass panes and at least one PVB film) or as double glazing with a gas gap. Of course, the combination of these measures is possible.
• the photosensitive semiconductor layers used in the modules need not have any special properties. Mono-, polycrystalline or amorphous systems can be used.
• the photosensitive semiconductor layer is applied directly to a carrier.
• An encapsulation is not possible here. Therefore, the laminated body of a support (e.g., the back cover) having the photosensitive semiconductor layer and the transparent front cover is collapsed by at least one interposed plasticized polyvinyl acetal based film of the present invention and adhered thereto at an elevated temperature.
• the photosensitive semiconductor layer may be applied to the transparent front cover as a carrier and bonded to the back cover by at least one interposed plasticized polyvinyl acetal based film of the present invention.
• vacuum laminators are used to produce the photovoltaic modules according to the invention. These consist of a heatable and evacuable chamber in which Laminated glazing can be laminated within 30 - 60 minutes. Reduced pressures of 0.01 to 300 mbar and temperatures of 100 to 200 0 C, in particular 130 - 160 0 C have proven in practice.
• a laminated as described above laminated body between at least one pair of rollers at a temperature of 60 to 150 0 C are pressed into a module according to the invention.
• Systems of this type are known for the production of laminated glazing and usually have at least one heating tunnel before or after the first press shop in systems with two pressing plants.
• the invention relates to the use of plasticizer-containing polyvinyl acetal-based foils having a glass transition temperature Tg of at least 20 0 C for the production of photovoltaic modules.
• Inventive photovoltaic modules can be used as a facade component, roofs, conservatory cover, soundproof wall, balcony or parapet or as part of windows.
• the determination of the glass transition temperature of the film is effected by means of differential scanning calorimetry (DSC) according to DIN 53765 using a heating rate of locomotive / min in the temperature interval -50 0 C - 150 0 C. It is a first heating ramp, followed by a cooling ramp, followed by drove a second heating ramp.
• the position of the glass transition temperature is determined on the measurement curve of the second heating ramp according to DIN 51007.
• the DIN mid-point (Tg DIN) is defined as the intersection of a horizontal line at half-step height with the measured curve.
• the Step height is defined by the vertical distance of the two points of intersection of the central tangent with the baseline of the trace before and after glass transition.
• melt index mass flow: MFR
• ISO 1133 mass flow: MFR
• MFR value is given at 100 ° C. and 140 ° C. with the 2 mm nozzle at a weight load of 21.6 kg in grams per 10 minutes (g / 10 min).
• the measurement of the volume resistivity of the film is carried out in accordance with DIN IEC 60093 at a defined temperature and ambient humidity (23 0 C and 85% RH) after the film was conditioned at these conditions at least 24 hours.
• a plate electrode type 302 132 from Fetronic GmbH and an ohmmeter ISO-Digi 5 kV from Amprobe were used.
• the test voltage was 2.5kV, the waiting time after application of the test voltage up to the data acquisition 60 sec.
• the polyvinyl alcohol and polyvinyl alcohol acetate content of the polyvinyl acetals was determined according to ASTM D 1396-92.
• the analysis of the metal ion content was carried out by atomic absorption spectroscopy (AAS).
• the water or moisture content of the films is determined by the Karl Fischer method. For the simulation of the moisture keeping under humid conditions, the film is previously stored for 24 h at 23 0 C and 85% RH. The method can be carried out both on the unlaminated film and on a laminated photovoltaic module as a function of the distance to the edge of the film.
• DBEEA di-2-butoxyethoxyethyl adipate
• DBEA di-2-butoxyethyl adipate
• Mowital PVB High viscosity polyvinyl butyral with viscosity 60 -
• Polyvinyl acetate content 1.1% by weight
• a reduction in the proportion of plasticizer (Ex 1) causes a significant increase in the glass transition temperature and the specific resistance. This can, in addition to an increase in the Flowability can be further improved by using plasticizers of low polarity (Ex. 2 vs Ex.
• Ex. 1 and 2 show that can be achieved by the inventively used films with increased glass transition temperature Tg, an improvement in the resistivity. Films of this type are suitable for photovoltaic applications.

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• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Organic Chemistry (AREA)
• Polymers & Plastics (AREA)
• Medicinal Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Computer Hardware Design (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Power Engineering (AREA)
• Photovoltaic Devices (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Laminated Bodies (AREA)
• Manufacture Of Macromolecular Shaped Articles (AREA)
• Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
• Joining Of Glass To Other Materials (AREA)

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• 2007
  • 2007-10-05 DE DE102007000816A patent/DE102007000816A1/de not_active Withdrawn
• 2008
  • 2008-10-03 TW TW097138011A patent/TW200936663A/zh unknown
  • 2008-10-06 EP EP08837750A patent/EP2195854A2/de not_active Ceased
  • 2008-10-06 US US12/680,139 patent/US20100193023A1/en not_active Abandoned
  • 2008-10-06 WO PCT/EP2008/063303 patent/WO2009047221A2/de active Application Filing
  • 2008-10-06 RU RU2010117653/04A patent/RU2471267C2/ru not_active IP Right Cessation
  • 2008-10-06 CN CN2008801101500A patent/CN101933161B/zh not_active Expired - Fee Related
  • 2008-10-06 JP JP2010527468A patent/JP2010541268A/ja active Pending

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