EP2176371A2 - Procédé de fabrication d'un insert comportant un dispositif rfid - Google Patents

Procédé de fabrication d'un insert comportant un dispositif rfid

Info

Publication number
EP2176371A2
EP2176371A2 EP08827452A EP08827452A EP2176371A2 EP 2176371 A2 EP2176371 A2 EP 2176371A2 EP 08827452 A EP08827452 A EP 08827452A EP 08827452 A EP08827452 A EP 08827452A EP 2176371 A2 EP2176371 A2 EP 2176371A2
Authority
EP
European Patent Office
Prior art keywords
adhesive
active substance
support
supports
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08827452A
Other languages
German (de)
English (en)
French (fr)
Inventor
Sandrine Rancien
Pascal Marlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ArjoWiggins Security SAS
Original Assignee
ArjoWiggins Security SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ArjoWiggins Security SAS filed Critical ArjoWiggins Security SAS
Publication of EP2176371A2 publication Critical patent/EP2176371A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/703Isocyanates or isothiocyanates transformed in a latent form by physical means
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor

Definitions

  • the present invention relates to an insert with an RFID device comprising a wire antenna and an integrated circuit chip, this insert being intended to be integrated for example in a security document such as a passport. or an identity card.
  • the invention also relates to the method of manufacturing such an insert.
  • An insert as used in a security document comprises at least two flexible supports, of fibrous or non-fibrous base, the antenna of the RFID device extending on one of the supports, the two supports each optionally including a recess for to house all or part of the chip.
  • the two supports and the RFID device must be irreversibly assembled using one or more adhesives, so that the antenna is found sandwiched between the two supports and that, optionally, the chip is found lodged in the recesses of the two superimposed supports.
  • inviolable assembly is meant an inviolable assembly by its physical and mechanical resistance as well as by its chemical inertia, the assembly being able to prevent any removal of the RFID device by a fraudster for use in another document .
  • the application US 2006/0005050 describes an insert to be integrated into a passport, this insert having specific physical characteristics to make obvious any attempt to falsify, especially during peeling. This evidence of falsification is brought by the presence of weakening zones on the chip and the use of an adhesive with reserves to fix the antenna.
  • the insert is based on Teslin ® or Artysin ® type plastic material.
  • the insert described is manufactured from a single support and offers no protection of the antenna, the latter flush with the surface of the support and not sandwiched between two supports.
  • the publication WO 2006/079904 discloses an identification document insert which comprises a bilayer structure with two paper layers, lying on their inner face with a plastic material, the RFID device being sandwiched after hot assembly between the two layers. made of plastic
  • the plastic material lying on the inner side of the two papers is a thermoplastic material such as polyethylene.
  • Such an insert has the disadvantage of being violable in particular by hot peeling. Indeed, the two thermoplastic layers after hot assembly can be softened or melted again, thus allowing the removal of the device.
  • the application WO 2006/000849 describes an insert which comprises a multilayer structure with at least two flexible layers and an internal flexible support of limited dimension, on which are positioned a module and an antenna.
  • This support and the RFID device are compensated in thickness by different intermediate layers.
  • This publication also provides for the use of plastic or metal rivets instead of glue.
  • the outer layers may be made of fibrous base material or plastic base.
  • Such an insert is resistant to falsification attempts but relatively complicated to achieve, because of the relatively high number of layers involved and the number of operations to be performed.
  • the invention therefore aims to propose a security document insert which is resistant to forgery and relatively simple to manufacture.
  • the object of the invention is, according to one of its aspects, a method of manufacturing such an insert, comprising at least a first flexible support, a second flexible support assembled with the first and an RFID device at least partially located between both supports, the method comprising the steps of: depositing at least one adhesive on one side of at least one of the supports, the other support carrying at least one active substance, assembling the two supports, the active substance being capable of to cause or accelerate a reaction process with the adhesive.
  • bearing must be understood contained in the mass of the support and / or present on its surface, alone or in an adhesive or other coating of the support, such as a varnish for example.
  • the active substance may be a catalyst capable of initiating and / or accelerating a chemical reaction with one of the components of the adjacent adhesive while remaining unchanged at the end of the reaction.
  • the active substance may be a polymerization activator or initiator capable of initiating or promoting the polymerization (transformation of the component to another of multiple molecular weight) of one or more components of the adjacent adhesive.
  • the active substance may also be a hardener or crosslinking agent capable of triggering or promoting the crosslinking of one or more components of the adjacent adhesive, to obtain three-dimensional structures by establishing bridges between molecular chains.
  • the active substance may be able to cause or accelerate the reaction process as soon as it is brought into contact with the adhesive.
  • the active substance can act spontaneously as soon as it comes into contact with one of the components of the adjacent adhesive.
  • the active substance may also need to trigger or accelerate the reaction process using an external stimulus, which may be a rise in temperature, or exposure to UV radiation, among others.
  • an external stimulus such as moisture, heat, UV radiation or the like, for example an electron beam (EB).
  • EB electron beam
  • the action of the active substance can be promoted, if necessary, by the supply of pressure, for example by rolling of the supports or passage to the press.
  • the active substance present in at least one of the supports or in the adhesive may also be released just before the two supports are joined together by adding heat, the two supports not yet being brought against each other .
  • the active substance may be incorporated into one of the flexible supports during its manufacture, by mass incorporation or by surface treatment, by spraying, encapsulating press, impregnation, direct coating or transfer using, for example, gravure printing, offset, reverse roll, slotted system, trailing blade, air knife, threaded bar, this list is not limiting.
  • the active substance can also be applied to one of the flexible substrates by surfacing, printing or coating, after the manufacture of this flexible support.
  • the active substance is applied to the surface of the corresponding flexible support.
  • the active substance can be incorporated or applied in particulate form in or on the flexible support or in the adhesive, and for example change state under the action of an external stimulus, such as for example heat.
  • the active substance can also be incorporated or applied in liquid form in or on the flexible support.
  • the active substance may be incorporated or applied in encapsulated form in or on the flexible support or in the adhesive and be released under the action of an external stimulus, such as, for example, heat or pressure.
  • the active substance can be applied over the entire surface of one of the flexible supports.
  • the active substance may be deposited on discrete areas of at least one of the two supports, for example a region intended to receive the antenna.
  • the active substance is applied or incorporated into a flexible support that does not contain compounds that can prematurely initiate a reaction process with the active substance, even in the event of prolonged storage of the support before assembly. Otherwise, it can be provided that the active substance is dosed in an amount sufficient to be able to initiate a reaction process with the adhesive facing when assembling the two supports.
  • the active substance may be incorporated into one of the adhesives during the manufacture of this adhesive or at the last moment during its implementation, in particular during the deposition of this adhesive on the corresponding support.
  • the adhesive or adhesives concerned by the invention may be emulsion polymers in water, in solution in solvents or exhibiting 100% active material (for example melt fusible adhesive or resin).
  • the adhesive or adhesives, before assembly, may be in the form of fluid or transfer adhesive film.
  • the flexible supports may be of fibrous or non-fibrous material, which may include natural or synthetic materials such as prepolymers, polymers or combinations thereof. Flexible supports in the form of nonwoven, textile woven or knitted, extruded or injected thermoplastic film or sheet may be used.
  • the antenna can be secured to one of the supports, before the assembly of the supports, in various ways, for example by thermocompression, by an ultrasonic method or by gluing, thanks to an adhesive present on the support.
  • At least one of the two supports is at least partially fibrous.
  • the two supports may each comprise cellulosic and synthetic fibers, for example.
  • the RFID device may comprise an antenna, which may be connected at its ends to a chip or module, the RFID device may include at least one integrated microcircuit chip. Alternatively, the antenna is not electrically connected to the chip or module but electromagnetically coupled to the chip or module, which has an integrated antenna.
  • the antenna can be deposited and held on the first support for example by an ultrasound or thermocompression method, one of the supports carrying the active substance, for example in its mass or on the surface, the other support receiving the adhesive, the latter being able to react, in particular crosslink, in the presence of the active substance, the active substance being brought into contact with the adhesive during the assembly of the supports.
  • the carrier carrying the active substance may be the second support.
  • the active substance can be released by the supply of heat.
  • the adhesive also comprises a second active substance, in particular a catalyst capable of triggering or accelerating the process of crosslinking of the adhesive by the first active substance.
  • the method may comprise the steps of: depositing a first adhesive on the first support, at least in a region intended to receive the antenna, depositing the antenna at least on this first adhesive, the latter having sufficient tackiness so that the antenna wire deposited on contact remains on the first support, depositing a second adhesive on the second support, this second adhesive comprising the active substance, the latter being capable of crosslinking both the first and second adhesives, in particular under the action of a stimulus, for example possibly under the action of heat, assembling the first and second supports, especially hot.
  • the first and second adhesives may comprise polymers of the same kind.
  • the method may comprise the steps of: depositing a first adhesive on the first support, at least in a region intended to receive the antenna, the first adhesive comprising an adhesive mass Ai and an active substance S 1 , in particular a hardener, depositing a second adhesive on the second support, in particular over its entire surface, this second adhesive comprising an adhesive mass A 2 and an active substance S 2 , in particular a heat-activatable crosslinking agent, bringing the adhesive masses into contact with each other. and A 2 and subject them to a stimulus, for example a heat input, the active substances Si and S 2 crosslinking in the presence of the stimulus, including heat, the adhesive masses Ai and A 2 .
  • the method may comprise the steps of: depositing on the first support a coating, in particular a varnish, comprising the active substance, in particular a hardener, depositing on the second support the adhesive, this adhesive being capable of polymerizing in contact with the active substance, assemble the two supports, in particular under pressure, to bring into contact the active substance and the adhesive.
  • the method may comprise the steps of: manufacturing the first and second supports each with an active substance, in particular a cationic crosslinking agent, depositing the antenna on the first support, for example by an ultrasound or thermocompression method, depositing on the second support a hot melt adhesive, the active substances of the first and second supports being capable of causing a crosslinking of the adhesive after exposure to a stimulus, for example a radiation source, in particular UV or EB.
  • a stimulus for example a radiation source, in particular UV or EB.
  • the method may comprise the steps of: depositing on the first support a first adhesive mass Ai added with an active substance S 2 , especially over the entire surface of the first support, depositing on the second support a second adhesive mass A 2 added with an active substance S 1 , the active substance Si being chosen to react with the adhesive mass Ai and the active substance S 2 with the adhesive mass A 2 during assembly supports.
  • the method may comprise the steps of: depositing a first adhesive on the first support, at least in a region intended to receive the antenna, this first adhesive comprising an adhesive mass Ai and an active substance S 2 capable of crosslinking at least the adhesive mass A 2 at a temperature T 2 , - depositing a second adhesive on the second support, comprising an adhesive mass A 2 and an active substance Si capable of crosslinking at least the adhesive mass Ai at a temperature T 1 , contacting the adhesive masses A 1 and A 2 and heating them, in particular subjecting the assembly to temperature stages at the temperatures T 1 and T 2 , so as to cause the active substances S 1 and S 2 to crosslink the adhesive masses A 1 and A 2 2 .
  • the insert can be attached to another element by one side of one of the supports or attached to two elements by the opposite faces of the supports.
  • One of the supports may comprise an active substance capable of causing or accelerating a reaction process with an adhesive carried by the element brought into contact with it.
  • the invention further relates to an insert as manufactured by the method above.
  • This insert comprises a first flexible support optionally provided with a recess, a second flexible support optionally provided with a recess, and an RFID device comprising an antenna, at least partially disposed between the two supports.
  • the two supports and the RFID device are assembled irreversibly via one or more adhesives so that the antenna and the chip or the module possibly connected to this antenna are found between the two supports, the chip or the module being optionally housed in superposed recesses of the two supports.
  • At least one of the two supports carries at least one active substance capable of causing or accelerating a reaction process with at least one adhesive carried by the other support.
  • This insert 1 comprises a first support 5, an electronic RFID component, in this case a module 3, a second support 4 and a wire antenna 2, for example made of copper with a skin provided with a heat-sealable varnish.
  • the supports 4 and 5 may be of the same size or not.
  • the supports 4 and 5 may be coated papers or not, with synthetic and / or natural fibers.
  • the module 3 comprises in the example considered a base 7, also called lead frame and a boss 8 housing a RFID chip, such a boss is still called potting.
  • the antenna 2 is electrically connected at its ends to respective contacts located on the base 7, for example on either side of the boss 8.
  • the first 5 and second 4 supports are connected by a seal 10 comprising one or more adhesives.
  • the first support 5 may comprise a recess 11 accommodating the base 7 and the second support 4 a recess 13 accommodating the boss 8.
  • the recesses 11 and 13 may be windows of different dimensions, as illustrated.
  • the insert may also include, where appropriate, a third flexible support, for example attached to the second support to hide the chip or the module.
  • the recesses can be through or not.
  • Such an insert may be intended to be inserted into a security document such as a passport or an identity card, for example.
  • two supports and the RFID device are assembled irreversibly via a single adhesive.
  • the antenna of the RFID device is for example first disposed, in particular unwound and depressed, for example by an ultrasound or thermocompression method, on one side of the first support> and then connected via its two ends to the module.
  • an adhesive is deposited by coating over the entire surface of the second support 4, this adhesive after coating having for example the property of being activatable to a stimulus such as temperature.
  • the first support on which the antenna is arranged can be manufactured so that it comprises in its basic formulation an active substance and more particularly a crosslinking agent, this crosslinking agent having the subsequent function of crosslinking the coated adhesive on the second support with which it will be facing during assembly.
  • the crosslinking of the adhesive by the first active substance can be carried out at ambient temperature or be triggered or favored (reduced crosslinking time) by the supply of heat just before or during the assembly of the two supports and / or by the presence of a second active substance, such as a catalyst, for example in the adhesive.
  • a second active substance such as a catalyst
  • the incorporation of an active substance such as a crosslinker into the first support and not directly into the adhesive has the advantage of preventing premature crosslinking of the adhesive before the two supports are assembled.
  • a temperature-activatable adhesive is deposited on the second support 4, this adhesive comprising an adhesive mass of polyol base and a first active substance, this active substance being for example an amine-type catalyst or amine derivative.
  • the first support 5 on which the antenna 2 is fixed comprises a second active substance, for example a crosslinking agent, for example deactivated diisocyanate particles.
  • a crosslinking agent for example deactivated diisocyanate particles.
  • the two supports and the RFID device are assembled irreversibly via two adhesives.
  • the first adhesive is deposited locally on the first support 5 at least in the area where the antenna extends.
  • This adhesive has the property of presenting a tack (in English tack) sufficient to allow the antenna wire to be unwound from its contact and to remain there until assembly with the second support.
  • the second adhesive is deposited for example by coating on the second support 4, preferably over its entire surface, this adhesive being for example without cold tack after coating and having the property of being reactivated at temperature.
  • This adhesive may have in its composition an adhesive mass of polymer base and an active substance.
  • This active substance is for example a latent crosslinking agent, this crosslinking agent having the function of crosslinking both the adhesive mass in which it is mixed under the action of heat during assembly, but also the adhesive mass of the adhesive carried by the first support and present in the area of the antenna, with which it will be found next during assembly.
  • a crosslinking agent capable of crosslinking the adhesive mass in which it is mixed but also the adhesive mass with which it is facing.
  • the active substance of the adhesive of the second support is not able to crosslink the adhesive present in the zone of the antenna on the first support, it is found that the assembly is no longer inviolable, that is, that is to say that during an attempt to falsify by dry peeling of the assembly, it is found that a separation of the two supports is possible without destroying the supports in the zone where the two adhesives are opposite, thus allowing recover the RFID device without damage.
  • a first adhesive is applied locally on the first support 5 and comprises an adhesive mass in the form of a polyurethane resin in dispersion, having a certain stickiness at ambient temperature to maintain the antenna 2.
  • a resin for increasing the tackiness may optionally be added to the polyurethane resin to increase its tackiness.
  • a second adhesive comprising a one-component reactive polyurethane base adhesive composition curing at a threshold temperature by means of a latent crosslinking agent, for example isocyanate particles deactivated at the surface, is coated on the second support 4, then dried at 30 0 C at a temperature below the curing temperature of the adhesive mass.
  • a latent crosslinking agent for example isocyanate particles deactivated at the surface
  • the isocyanate hardener of the hot-activatable adhesive cross-links the polyurethane mass with which it is mixed but also the adhesive mass of the same nature of the adhesive facing which holds the antenna, thus creating an irreversible assembly both in the area of the antenna than off-air.
  • the two supports are assembled irreversibly via two adhesives.
  • the first adhesive is deposited locally on the first support 5 at least in the zone where the antenna 2 extends.
  • This adhesive comprises a polymer base adhesive mass Ai and an active substance Si and more particularly a hardener.
  • a second adhesive is deposited by coating on for example the entire surface of the second support 4, this adhesive with a slight cold tack after coating, has the property of being activatable at temperature.
  • This adhesive comprises an adhesive mass of polymer base A 2 and also an active substance S 2 and more particularly a heat-acting crosslinking agent. During the hot-mounting of the two supports so that the antenna is sandwiched, the active substance Si cross-links the adhesive mass Ai but also the adhesive mass A 2 opposite and the active substance S 2 cross-links the mass adhesive A 2 but also the adhesive mass Ai opposite.
  • first adhesive comprises an acrylic-based adhesive mass
  • second adhesive also comprises an acrylic-based adhesive mass which hardens at a threshold temperature by means of a crosslinking agent.
  • latent for example a blocked isocyanate.
  • the first adhesive which holds the antenna 2 on the first support 5 comprises a urethane acrylate prepolymer in a solvent medium and an isocyanate type crosslinking agent in a solvent medium.
  • This hardener is capable of crosslinking the prepolymer under the influence of the ambient humidity, thus allowing the antenna 2 to be held before assembly with the second support 4.
  • the second heat-activatable adhesive coated on the second support 4 comprises an acrylate copolymer and a melamine crosslinking agent.
  • the crosslinking of this second adhesive is operational from 140 ° C.
  • the melamine resin of the hot-activatable adhesive cross-links the acrylic polymer with which it is mixed but also the acrylic adhesive urethane, and the isocyanate hardener of the adhesive which holds the antenna and which firstly crosslinked the acrylate urethane prepolymer with which it is mixed, then cross-links the acrylic adhesive opposite, thus creating an irreversible assembly both in the antenna area only off the air.
  • At least one of the two supports is previously surface with a varnish comprising an active substance and more particularly a hardener.
  • This first support is stored until the insertion of the antenna, for example by an ultrasound or thermocompression process, and then assembly with the second support.
  • a coating of an adhesive mass is performed on the second support followed immediately by the application of the first support on the second support and pressurization at room temperature.
  • the adhesive is in contact with the hardener and the polymerization starts.
  • the adhesive on the second support 4 comprises a methacrylate polymer and the hardening varnish on the first support 5 preferably comprises a functional group chosen from one of the following groups: amine, anhydride, diacid, polyamide and di-isocyanate.
  • the adhesive is in contact with the hardener and the polymerization starts. This process does not require any preliminary mixing between the hardener and the adhesive and thus limits the problems of dosage, of proportions in the mixture and of delay of handling.
  • the insert obtained has great physical, mechanical and chemical resistance.
  • the two supports are assembled irreversibly via a single adhesive.
  • the antenna of the RFID device is fixed for example by an ultrasound or thermocompression method on one side of the first support and connected via its two ends with a chip.
  • a hot melt adhesive is deposited by a suitable dispensing system over the entire surface of the second support. This support is then assembled with the first support so as to sandwich the antenna.
  • Heat-fusible adhesives have the advantage of fast setting but poor resistance to heat and solvents.
  • the two flexible supports are manufactured so that they comprise at least at the surface, facing the hot melt adhesive, an active substance and more particularly a cationic crosslinking agent.
  • the crosslinking of the adhesive mass by the cationic crosslinker present in the supports is not done as soon as the two supports come into contact during assembly, but start after UV irradiation.
  • the first support 5 comprises a first active substance, for example a cationic crosslinking agent.
  • the second support 4 comprises a second active substance, for example a cationic crosslinking agent.
  • the antenna 2 is fixed by ultrasonic method on the first flexible support 5.
  • An epoxy base heat-fusible adhesive mass is applied by hotmelt to the flexible support 4 which is then immediately laminated on the second flexible support 5.
  • the cross-linking of the chains epoxy and bridging start when contacting the supports and UV irradiation of the assembly, by the wafer only if the supports are not transparent.
  • the two supports and the RFID device are irreversibly assembled via two adhesives.
  • a first adhesive mass Ai added with an active substance S 2 is deposited, in particular by coating, on the first support 5, in particular over its entire surface.
  • This adhesive mass after coating has the property of being without tack at room temperature just after sizing and being able to enter a reaction process in the presence of another active substance S 1 , this at a temperature Ti.
  • a second adhesive mass A 2 added with an active substance S 1 is deposited, in particular by coating, over the entire surface of the second support 4.
  • This adhesive mass after coating also has the property of being without tack at room temperature just after sizing and being able to enter a reaction process in the presence of another active substance S 2 , this at a temperature T 2 , the temperature Ti may be equal to T 2 .
  • the antenna 2 of the RFID device is unrolled and fixed, for example by a method of thermocompression or ultrasound, at the softening temperature of the adhesive mass Ai coated on the first support 5, and then connected via its two ends with the chip.
  • the active substance S 2 is chosen to react with the adhesive mass A 2 of the second support 4 while the active substance Si is chosen to react with the adhesive mass Ai of the first support 5.
  • the two reaction processes take place simultaneously or successively, with a Ti and T 2 bearing, during the heat-assembly cycle of the two supports, thus creating a three-dimensional network in the joint.
  • the mixture in the coating of the supports of an active substance with an adhesive mass with which there will be no reaction process has the advantage of preventing premature crosslinking of the adhesive mass coated on the two supports, before their assembly .
  • the two supports may have on their outer surface, not in contact with the antenna, intrinsically or not, an active substance capable of causing or accelerating a process reaction with an adhesive, for example a vinyl or acrylic glue, used for assembling the insert with another flexible support or respectively the cover page and the cover of a passport.
  • an adhesive for example a vinyl or acrylic glue
  • This active substance can be activated if necessary by heat input, UV radiation, EB, etc.
  • the invention is not limited to the examples which have just been described. Particularities of implementation of these examples can be combined within non-illustrated variants.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
EP08827452A 2007-08-03 2008-08-01 Procédé de fabrication d'un insert comportant un dispositif rfid Withdrawn EP2176371A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0756931A FR2919741B1 (fr) 2007-08-03 2007-08-03 Procede de fabrication d'un insert comportant un dispositif rfid
PCT/FR2008/051455 WO2009022078A2 (fr) 2007-08-03 2008-08-01 Procédé de fabrication d'un insert comportant un dispositif rfid

Publications (1)

Publication Number Publication Date
EP2176371A2 true EP2176371A2 (fr) 2010-04-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP08827452A Withdrawn EP2176371A2 (fr) 2007-08-03 2008-08-01 Procédé de fabrication d'un insert comportant un dispositif rfid

Country Status (9)

Country Link
US (1) US20100193591A1 (pt)
EP (1) EP2176371A2 (pt)
BR (1) BRPI0814788A2 (pt)
CA (1) CA2694975A1 (pt)
FR (1) FR2919741B1 (pt)
MX (1) MX2010001301A (pt)
RU (1) RU2010107419A (pt)
TW (1) TW200923795A (pt)
WO (1) WO2009022078A2 (pt)

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RU2010107419A (ru) 2011-09-10
FR2919741B1 (fr) 2009-12-18
BRPI0814788A2 (pt) 2015-02-03
FR2919741A1 (fr) 2009-02-06
CA2694975A1 (fr) 2009-02-19
US20100193591A1 (en) 2010-08-05
TW200923795A (en) 2009-06-01
WO2009022078A2 (fr) 2009-02-19
WO2009022078A3 (fr) 2009-04-09
MX2010001301A (es) 2010-03-01

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