WO2009022078A3 - Procédé de fabrication d'un insert comportant un dispositif rfid - Google Patents
Procédé de fabrication d'un insert comportant un dispositif rfid Download PDFInfo
- Publication number
- WO2009022078A3 WO2009022078A3 PCT/FR2008/051455 FR2008051455W WO2009022078A3 WO 2009022078 A3 WO2009022078 A3 WO 2009022078A3 FR 2008051455 W FR2008051455 W FR 2008051455W WO 2009022078 A3 WO2009022078 A3 WO 2009022078A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- producing
- rfid device
- insert including
- substrate
- substrates
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/703—Isocyanates or isothiocyanates transformed in a latent form by physical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08827452A EP2176371A2 (fr) | 2007-08-03 | 2008-08-01 | Procédé de fabrication d'un insert comportant un dispositif rfid |
US12/671,089 US20100193591A1 (en) | 2007-08-03 | 2008-08-01 | method of fabricating an insert including an rfid device |
BRPI0814788-4A2A BRPI0814788A2 (pt) | 2007-08-03 | 2008-08-01 | Processo de fabricação de um inserto, inserto e documento de segurança |
MX2010001301A MX2010001301A (es) | 2007-08-03 | 2008-08-01 | Procedimiento de fabricacion de un inserto que comprende un dispositivo de identificacion por radiofrecuencia. |
CA2694975A CA2694975A1 (fr) | 2007-08-03 | 2008-08-01 | Procede de fabrication d'un insert comportant un dispositif rfid |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0756931 | 2007-08-03 | ||
FR0756931A FR2919741B1 (fr) | 2007-08-03 | 2007-08-03 | Procede de fabrication d'un insert comportant un dispositif rfid |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009022078A2 WO2009022078A2 (fr) | 2009-02-19 |
WO2009022078A3 true WO2009022078A3 (fr) | 2009-04-09 |
Family
ID=39146940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2008/051455 WO2009022078A2 (fr) | 2007-08-03 | 2008-08-01 | Procédé de fabrication d'un insert comportant un dispositif rfid |
Country Status (9)
Country | Link |
---|---|
US (1) | US20100193591A1 (fr) |
EP (1) | EP2176371A2 (fr) |
BR (1) | BRPI0814788A2 (fr) |
CA (1) | CA2694975A1 (fr) |
FR (1) | FR2919741B1 (fr) |
MX (1) | MX2010001301A (fr) |
RU (1) | RU2010107419A (fr) |
TW (1) | TW200923795A (fr) |
WO (1) | WO2009022078A2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL2256672T3 (pl) * | 2008-02-22 | 2016-11-30 | Transponder i postać książki | |
FR2959581B1 (fr) * | 2010-04-28 | 2012-08-17 | Arjowiggins Security | Insert fibreux constitue en une seule couche et equipe d'un dispositif electronique a communication sans contact. |
WO2014138204A1 (fr) * | 2013-03-05 | 2014-09-12 | Drexel University | Tissus à mailles intelligents |
JP6426738B2 (ja) | 2013-07-30 | 2018-11-21 | エイチ.ビー.フラー カンパニー | ポリウレタン接着フィルム |
JP2017531056A (ja) * | 2014-08-12 | 2017-10-19 | エイチ.ビー.フラー カンパニー | 熱硬化性接着フィルム |
CN105694793B (zh) | 2014-12-15 | 2018-10-19 | H.B.富乐公司 | 对金属表面具有改进的粘合性的反应性粘合剂 |
EP3959657A1 (fr) * | 2019-04-22 | 2022-03-02 | Avery Dennison Retail Information Services, LLC | Bandes auto-adhésives pour dispositifs rfid |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2279907A (en) * | 1993-07-02 | 1995-01-18 | Gec Avery Ltd | Flexible mountings for electronic components in smart cards. |
FR2738838A1 (fr) * | 1995-09-20 | 1997-03-21 | Gemplus Card Int | Procede d'adhesion d'un polyurethanne sur un substrat en polymere |
FR2800087A1 (fr) * | 1999-10-26 | 2001-04-27 | Gemplus Card Int | Procede et moyens pour l'amelioration du collage entre materiaux polymeres, notamment pour carte a puce |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4559273A (en) * | 1984-03-02 | 1985-12-17 | Dai Nippon Insatsu Kabushiki Kaisha | Heat transfer sheet |
JP3044722B2 (ja) * | 1989-08-23 | 2000-05-22 | 凸版印刷株式会社 | 熱転写リボン |
US5322753A (en) * | 1991-07-12 | 1994-06-21 | Ricoh Company, Ltd. | Electrophotographic photoconductor and acrylic acid ester polymer for use in the same |
JP3970117B2 (ja) * | 2001-07-19 | 2007-09-05 | 株式会社リコー | 熱可逆記録媒体、ラベル、カード、ディスクカートリッジ、ディスク、テープカセット及び画像記録消去方法 |
CN1316421C (zh) * | 2001-12-24 | 2007-05-16 | 数字Id系统有限公司 | 激光刻印方法和组合物以及上面有激光刻印的制品 |
JP2004122642A (ja) * | 2002-10-03 | 2004-04-22 | Konica Minolta Holdings Inc | 認証識別カード作成方法及びそれに用いるカード表面保護用転写箔 |
US7226891B2 (en) * | 2003-09-30 | 2007-06-05 | Konica Minolta Photo Imaging, Inc | Image forming method using thermal transfer recording material |
US20060005050A1 (en) * | 2004-06-10 | 2006-01-05 | Supercom Ltd. | Tamper-free and forgery-proof passport and methods for providing same |
-
2007
- 2007-08-03 FR FR0756931A patent/FR2919741B1/fr not_active Expired - Fee Related
-
2008
- 2008-08-01 WO PCT/FR2008/051455 patent/WO2009022078A2/fr active Application Filing
- 2008-08-01 MX MX2010001301A patent/MX2010001301A/es active IP Right Grant
- 2008-08-01 BR BRPI0814788-4A2A patent/BRPI0814788A2/pt not_active IP Right Cessation
- 2008-08-01 RU RU2010107419/05A patent/RU2010107419A/ru not_active Application Discontinuation
- 2008-08-01 US US12/671,089 patent/US20100193591A1/en not_active Abandoned
- 2008-08-01 TW TW097129450A patent/TW200923795A/zh unknown
- 2008-08-01 CA CA2694975A patent/CA2694975A1/fr not_active Abandoned
- 2008-08-01 EP EP08827452A patent/EP2176371A2/fr not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2279907A (en) * | 1993-07-02 | 1995-01-18 | Gec Avery Ltd | Flexible mountings for electronic components in smart cards. |
FR2738838A1 (fr) * | 1995-09-20 | 1997-03-21 | Gemplus Card Int | Procede d'adhesion d'un polyurethanne sur un substrat en polymere |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
FR2800087A1 (fr) * | 1999-10-26 | 2001-04-27 | Gemplus Card Int | Procede et moyens pour l'amelioration du collage entre materiaux polymeres, notamment pour carte a puce |
Also Published As
Publication number | Publication date |
---|---|
BRPI0814788A2 (pt) | 2015-02-03 |
RU2010107419A (ru) | 2011-09-10 |
FR2919741B1 (fr) | 2009-12-18 |
MX2010001301A (es) | 2010-03-01 |
TW200923795A (en) | 2009-06-01 |
US20100193591A1 (en) | 2010-08-05 |
FR2919741A1 (fr) | 2009-02-06 |
WO2009022078A2 (fr) | 2009-02-19 |
EP2176371A2 (fr) | 2010-04-21 |
CA2694975A1 (fr) | 2009-02-19 |
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