EP2168748A1 - Wasserdichte Lampe und Herstellungsverfahren dafür - Google Patents

Wasserdichte Lampe und Herstellungsverfahren dafür Download PDF

Info

Publication number
EP2168748A1
EP2168748A1 EP08165108A EP08165108A EP2168748A1 EP 2168748 A1 EP2168748 A1 EP 2168748A1 EP 08165108 A EP08165108 A EP 08165108A EP 08165108 A EP08165108 A EP 08165108A EP 2168748 A1 EP2168748 A1 EP 2168748A1
Authority
EP
European Patent Office
Prior art keywords
lamp
housing
component unit
electric component
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08165108A
Other languages
English (en)
French (fr)
Other versions
EP2168748B1 (de
Inventor
Sami Yllikäinen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella Lighting Finland Oy
Original Assignee
Hella Lighting Finland Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella Lighting Finland Oy filed Critical Hella Lighting Finland Oy
Priority to DE602008003582T priority Critical patent/DE602008003582D1/de
Priority to PT08165108T priority patent/PT2168748E/pt
Priority to ES08165108T priority patent/ES2355774T3/es
Priority to PL08165108T priority patent/PL2168748T3/pl
Priority to EP08165108A priority patent/EP2168748B1/de
Priority to AT08165108T priority patent/ATE488348T1/de
Publication of EP2168748A1 publication Critical patent/EP2168748A1/de
Application granted granted Critical
Publication of EP2168748B1 publication Critical patent/EP2168748B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/006—Joining parts moulded in separate cavities
    • B29C45/0062—Joined by injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1642—Making multilayered or multicoloured articles having a "sandwich" structure
    • B29C45/1643—Making multilayered or multicoloured articles having a "sandwich" structure from at least three different materials or with at least four layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern

Definitions

  • the present invention relates to a method for manufacturing a watertight lamp comprising a housing, a lens attached to the housing, an electric component unit comprising a light source, and an outer connector for connecting a power supply to the lamp, the method comprising the steps of injection moulding the lens, injection moulding the housing, inserting the electric component unit into the housing, and attaching the lens to the housing in a watertight manner.
  • the present invention relates also to a watertight lamp comprising a housing, a lens attached watertight to the housing, an electric component unit comprising a light source, and an outer connector for connecting a power supply to the lamp.
  • a method and a lamp of the aforementioned kind are known e.g. from the automotive industry when manufacturing signal lamps for vehicles.
  • An object of the present invention is to provide a method which solves the above mentioned problems and enables a very quick manufacturing process for a lamp of the aforementioned kind.
  • This object of the invention is achieved by a method which is characterized by a first moulding step comprising feeding a first plastic compound into a first cavity of a mould comprising at least three cavities and a second moulding step comprising feeding at the same time a second plastic compound into a second cavity of the mould and producing by said moulding steps the injection moulded housing and the injection moulded lens, respectively, of the lamp; opening the mould and inserting in the housing the electric component unit comprising the light source; closing the mould and producing in a third moulding step conductive parts of the outer connector to the lamp, by feeding into the closed mould an electro conductive compound comprising a polymer, said conductive parts providing an electro conductive path from the connector to the electric component unit; and a fourth moulding step comprising feeding a sealing compound into a third cavity of the mould and thus producing a seal which attaches the lens to
  • the manufacturing of the lamp is made totally automatic whereby preferably a robot is used for inserting the electric component unit into the housing.
  • the electro conductive compound is a thermoplastic mixed with copper fibres.
  • the method preferably comprises a further moulding step comprising feeding a thermally conductive compound to the lamp and thus producing a cooling member attached to the electric component unit for cooling the electric component unit, said cooling member comprising a heat emitting surface, said further moulding step preceding the fourth moulding step.
  • ABS is chosen as the plastic compound for the housing and PMMA is chosen as the plastic compound for the lens.
  • the most important advantages of the method of the invention is that it enables a very fast manufacturing of a lamp said manufacturing needing only little floor area at the manufacturing site. Further, it makes it possible to manufacture the lamp fully automatically.
  • An object of the invention is also to provide a lamp the construction of which enables a very fast manufacturing requiring very little floor area at the manufacturing site.
  • the lamp according to the invention is characterized in that the outer connector comprises conductive parts of electro conductive compound comprising a polymer, said conductive parts providing an electro conductive path to the electric component unit.
  • electro conductive paths made of electro conductive compound comprising a polymer, said electro conductive paths being positioned between the conductive parts of the connector and the electric component unit for electrically connecting the former to the latter.
  • the lamp preferably comprises a cooling member made of a thermally conductive compound and attached to the electric component unit for cooling the electric component unit, said cooling member comprising a heat emitting area.
  • the most important advantages of the lamp according to the invention is that the manufacturing thereof is very fast and requires only little floor area at the manufacturing site.
  • the outer design of the lamp can also be chosen very freely.
  • Figure 1 shows a lamp of the invention seen from the front, i.e. from the lens side.
  • the lamp comprises two apertures 1, 2 for mounting the lamp to a wall or other structure.
  • the connector 6 comprises conductive parts formed of two pins 4, 5 of electrically conductive material.
  • the pins 4, 5 are surrounded by a guide structure, generally designated with reference numeral 3 and having a circular periphery which encloses partition walls which surround the pins 4, 5.
  • FIG. 4 is a exploded view showing the components of the lamp.
  • the base or housing is designated with reference numeral 7.
  • the lens is designated with reference numeral 8.
  • An electric component unit is designated with reference numeral 9.
  • Electro conductive parts are designated 4, 5, 10 and 11.
  • the sealing which is for hermetically sealing the housing 7 to the lens 8 is designated 12.
  • reference numeral 13 schematically represents a 3-component injection moulding machine. If a lamp with a more sophisticated structure is to be manufactured one can use a 4-component injection moulding machine.
  • the moulding machine 13 comprises a mould 14 comprising a first cavity 15, a second cavity 16 and a third cavity 17.
  • ABS acrylonitrile butadiene styrene
  • PMMA polymethyl methacrylate plastic
  • the lens 8 of the lamp is manufactured in the second cavity 16.
  • the lens 8 and the housing 7 are preferably manufactured at the same time, i.e. ABS plastic and PMMA plastic are simultaneously fed into respective cavities. Although these materials are preferable, one could use instead e.g. a polycarbonate, PC, as the material for the housing and/or the lens.
  • the mould 14 is kept closed during the manufacture of the housing 7 and the lens 8.
  • the mould 14 is next opened and a robot 20 is used to insert the electric component unit 9 in the housing 7.
  • the components of the electric component unit 9 are positioned separately into a fixed half of the mould.
  • the electric component unit comprises a LED 21, a resistor 22 and a diode 23, see figure 4 .
  • the mould 14 is closed and in a third moulding step an electro conductive compound 30 comprising a polymer is fed (injected) into the mould 14.
  • the electro conductive compound is fed straight to the LED 21, the resistor 22, diode 23 and also to flow channels forming the pins 5, 6.
  • the third moulding step provides electro conductive paths 10, 11 between the components 21, 22, 23 of the electric component unit and provides also an electro conductive path from the connector 6 to the electric component unit 9, and creates an electrical circuit.
  • thermoplastic includes thermoplastic elastomer (TPE) which is a thermoplastic having characteristics similar to rubber and which can repeatedly be reshaped. Nearly all commercially available thermoplastics (and thermoplastic elastomers) can be used as matrix material.
  • TPE thermoplastic elastomer
  • the amount of copper fibre can be e.g. 55 w.-%, the amount of thermoplastic e.g.15 w.-% and the amount of the low-melting alloy e.g. 30 w.-%.
  • the low-melting alloy may advantageously be an alloy of led, bismuth and tin, e.g.
  • HEK Low Melting Alloy MCP 96 Article number 10191384 from Siemens AG, having a melting temperature of about 96 °C.
  • Such electro conducive compound is e.g. SCHULATEC®TinCo.
  • this compound can be ordered from several countries including Great Britain, where the contact address is A. Schulman Inc. Ltd.; Croespenmaen Industrial Estate; Crumlin; Newport; GB-Gwent; NP11 3AG. In U.S.A. it can be ordered from A. Schulman Inc. ; Corporate Headquarters 3550 West Market Street; Akron; Ohio 44333; USA.
  • this compound SCHULATEC®TinCo is similar to steel (about 80 dB in the frequency range between 30 kHz and 1.2 GHz when the sample thickness is 1.5 mm).
  • a sealing compound 31 which can be ABS or PMMA, is fed in a fourth moulding step into the closed mould 14.
  • the sealing compound 31 forms a sealing 12 which connects the lens 8 to the housing 7 in a watertight and hermetic manner.
  • Figures 6-8 show a second embodiment of the lamp according to the invention seen from below.
  • Figure 6 shows the lamp from the front and figure 7 from below.
  • Figure 6 illustrates a sectional view taken along line VIII-VIII in figure 7.
  • Figure 7 does not show any lid 24' (seen in figure 8 ) on the connector 6 so that the connector better can be seen in the figure.
  • the embodiment in figures 6-8 differs from the embodiment in figures 1-3 in that the conductive parts 4', 5' are designed in a different way.
  • Each conductive part 4', 5' comprise three conductive members 25' forming a zigzag path for receiving a voltage supply wire 26'.
  • Each member 25' comprises a slot 27' for receiving the wire 26' along the zigzag path. Said construction enables to connect the free end of the wire 26', as such, to the connector 6', i.e. without any need of an additional connector at the free end of the wire.
  • the lid 24' which is attached to the connector 6' by pressing, comprises two protrusions which set into the grooves formed between the members 25' of the conductive parts 4', 5'. Instead of a lid 24' one may use glue or some other substance to secure the wire 26' to the connector 6'. The glue not only secures the wire 26' to the connector 6' but ensures also that the lamp will be hermetically sealed against its environment.
  • Figures 9-11 illustrate a third embodiment of the invention.
  • the reference numerals used in figures 9-11 correspond to those used in figures 1-4 and 6-8 for corresponding parts.
  • reference numeral 28" refers to a cooling member made of a thermally conductive compound (see 32" in figure 5 ) and having a heat emitting surface 33".
  • the cooling member 28" is required if the electric component unit 9" of the lamp generates much heat.
  • the compound 32" may have a similar composition as the electro conductive compound 30 used for the conductive parts of the connector (c.f. items 4, 5, 10 and 11 in Fig. 4 ). The more copper fibres the compound 32" contains, the better will be the thermal conductivity and cooling properties of the cooling member 28".
  • the cooling member 28" By choosing the amount of copper in the compound 32" one may achieve a cooling member 28"' having the required cooling properties for each specific application.
  • the cooling member 28" When attaching the cooling member 28" to the electric component unit 9" of the lamp one must arrange that no unwanted short circuits can take place.
  • One way to avoid such short circuits is to apply a thin electrical insulation 29" between the cooling member 28" and the electro conductive parts 10", 11".
  • the thickness of such an insulation is small, typically e.g. 0.01-0.03 mm; and in any case preferably less than 0.1 mm.
  • the cooling member 28" is manufactured as a further moulding step comprising feeding thermally conductive compound 32" to the lamp before the sealing compound (31) is fed to the lamp.
  • All embodiments of the lamp are made complete in the moulding machine 13 in such a way that all moulding steps take place in the mould 14 where a complete and finished lamp is manufactured.
  • the lamp illustrated in figures 9-11 may be manufactured in such a way that the cooling member 28" is manufactured outside the mould 14 and is subsequently attached to the electric component unit 9" after which the electric component unit 9" and the cooling member 28" are inserted by a robot 20 into the housing 7".
  • the invention has been disclosed above only by three embodiments. Accordingly, the invention may be implemented in many various ways within the scope of the claims.
  • the number of cavities in the mould may vary; the selected materials may vary; the parts of the electric component unit may vary and the electric component unit can be positioned as an unit (i.e. not necessary as separate components) into the housing; and the parts/components of the electric component unit, including the type of light source, may vary.
  • the composition of the electro conductive compound may vary.
  • the electro conductive compound is a thermoplastic mixed with copper fibres, but more generally it is a polymer mixed with metal. Instead of copper fibres, aluminium fibres or silver fibres can be used. This is also true for the thermally conductive compound.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
EP08165108A 2008-09-25 2008-09-25 Wasserdichte Lampe und Herstellungsverfahren dafür Active EP2168748B1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE602008003582T DE602008003582D1 (de) 2008-09-25 2008-09-25 Wasserdichte Lampe und Herstellungsverfahren dafür
PT08165108T PT2168748E (pt) 2008-09-25 2008-09-25 Farolim estanque relativamente à água e método para o seu fabrico
ES08165108T ES2355774T3 (es) 2008-09-25 2008-09-25 Lámpara estanca al agua y método de fabricación de la misma.
PL08165108T PL2168748T3 (pl) 2008-09-25 2008-09-25 Wodoszczelna lampa i sposób jej wytwarzania
EP08165108A EP2168748B1 (de) 2008-09-25 2008-09-25 Wasserdichte Lampe und Herstellungsverfahren dafür
AT08165108T ATE488348T1 (de) 2008-09-25 2008-09-25 Wasserdichte lampe und herstellungsverfahren dafür

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08165108A EP2168748B1 (de) 2008-09-25 2008-09-25 Wasserdichte Lampe und Herstellungsverfahren dafür

Publications (2)

Publication Number Publication Date
EP2168748A1 true EP2168748A1 (de) 2010-03-31
EP2168748B1 EP2168748B1 (de) 2010-11-17

Family

ID=40298664

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08165108A Active EP2168748B1 (de) 2008-09-25 2008-09-25 Wasserdichte Lampe und Herstellungsverfahren dafür

Country Status (6)

Country Link
EP (1) EP2168748B1 (de)
AT (1) ATE488348T1 (de)
DE (1) DE602008003582D1 (de)
ES (1) ES2355774T3 (de)
PL (1) PL2168748T3 (de)
PT (1) PT2168748E (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011161241A1 (en) * 2010-06-25 2011-12-29 Dsm Ip Assets B.V. Assembly of polymeric parts

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040036417A1 (en) * 2002-08-20 2004-02-26 Guide Corporation Lamp housing with integral circuit grid
US20040076417A1 (en) 2001-04-02 2004-04-22 Yoshito Miyatake Zoom lens and electronic still camera using it
DE112006000583T5 (de) 2005-03-15 2008-01-10 Oshima Electric Works Co., Ltd., Ota Mit einer Schicht versehenes Formstück, Verfahren und Vorrichtung zum Herstellen desselben

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040076417A1 (en) 2001-04-02 2004-04-22 Yoshito Miyatake Zoom lens and electronic still camera using it
US20040036417A1 (en) * 2002-08-20 2004-02-26 Guide Corporation Lamp housing with integral circuit grid
DE112006000583T5 (de) 2005-03-15 2008-01-10 Oshima Electric Works Co., Ltd., Ota Mit einer Schicht versehenes Formstück, Verfahren und Vorrichtung zum Herstellen desselben

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011161241A1 (en) * 2010-06-25 2011-12-29 Dsm Ip Assets B.V. Assembly of polymeric parts
CN103038045A (zh) * 2010-06-25 2013-04-10 帝斯曼知识产权资产管理有限公司 聚合物部件的组件
CN103038045B (zh) * 2010-06-25 2015-05-20 帝斯曼知识产权资产管理有限公司 聚合物部件的组件

Also Published As

Publication number Publication date
DE602008003582D1 (de) 2010-12-30
PL2168748T3 (pl) 2011-05-31
PT2168748E (pt) 2011-02-03
ES2355774T3 (es) 2011-03-30
EP2168748B1 (de) 2010-11-17
ATE488348T1 (de) 2010-12-15

Similar Documents

Publication Publication Date Title
CN102640581B (zh) 包覆模制的led照明组件及其制造方法
CN106061158B (zh) 电子设备组件和相关方法
JP4741969B2 (ja) 自動車の電気電子モジュールおよびその取り付け方法
CN1773164B (zh) 照明装置及其制造方法
US6818839B2 (en) Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
JP2001273851A (ja) 管球および管球用樹脂ケースの製造方法
CN101364585A (zh) 一种支架、具有支架的芯片封装结构及其制造方法
JP2001160449A (ja) 集積導電路を含む電気または電子デバイス用ハウジング
KR19980071825A (ko) 도전성 플라스틱, 그들로 형성된 도전회로 및 도전회로 형성방법
US6974615B2 (en) Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
JP6789371B2 (ja) 電気光学素子のための電気接続
US20070000118A1 (en) Method and apparatus for automated manufacture of a probe tip
US8257110B2 (en) Light emitting diode light bar module with electrical connectors formed by injection molding
CN107636390A (zh) 用于照明设备的塑料散热件
EP2168748B1 (de) Wasserdichte Lampe und Herstellungsverfahren dafür
CN105612824A (zh) 电模块、包括这样的电模块的电系统、和相应的制造方法
CN109314169B (zh) 包括热能管理的照明组件
JP4233304B2 (ja) 電子モジュール及びその製造方法
US6212963B1 (en) Piezo-transducer and cabling configuration
JPH07156725A (ja) ドア用ワイヤーハーネス及びその製造方法
JP6699584B2 (ja) 導電性ペースト層と給電部を備えた樹脂部材の製造方法、および導電性ペースト層と給電部を備えた樹脂部材と外部給電部材の接続方法
TWI748571B (zh) 具加熱功能之裝置之電連接部
KR101679686B1 (ko) 센서 유니트, 센서 유니트 제조 방법 및 센서 유니트 제조 장치
JPH11342522A (ja) 導電部を有する樹脂成形品およびその製造方法
WO2005091955A2 (en) Conductive circuits or cables manufactured from conductive loaded resin-based materials

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20090904

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

RIN1 Information on inventor provided before grant (corrected)

Inventor name: YLLIKAEINEN, SAMI

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 602008003582

Country of ref document: DE

Date of ref document: 20101230

Kind code of ref document: P

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 20110128

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: NL

Ref legal event code: T3

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2355774

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20110330

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20101117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110217

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110317

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110217

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

REG Reference to a national code

Ref country code: PL

Ref legal event code: T3

REG Reference to a national code

Ref country code: HU

Ref legal event code: AG4A

Ref document number: E010285

Country of ref document: HU

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20110818

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602008003582

Country of ref document: DE

Effective date: 20110818

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110930

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20101117

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120930

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120930

REG Reference to a national code

Ref country code: GR

Ref legal event code: EP

Ref document number: 20110400202

Country of ref document: GR

Effective date: 20110218

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20180921

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20180424

Year of fee payment: 10

Ref country code: SE

Payment date: 20180917

Year of fee payment: 11

Ref country code: GR

Payment date: 20180919

Year of fee payment: 11

Ref country code: GB

Payment date: 20180917

Year of fee payment: 11

Ref country code: HU

Payment date: 20180828

Year of fee payment: 11

Ref country code: NL

Payment date: 20180917

Year of fee payment: 11

Ref country code: AT

Payment date: 20180926

Year of fee payment: 11

Ref country code: PL

Payment date: 20180903

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 20180910

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20181001

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190926

REG Reference to a national code

Ref country code: SE

Ref legal event code: EUG

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20191001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191001

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200416

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200428

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 488348

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190926

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190925

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20190925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190925

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190925

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20210129

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190926

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190925

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FI

Payment date: 20230912

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230802

Year of fee payment: 16