EP2160514A1 - Procédé pour dissiper de la chaleur à partir de composants électroniques, afin d'actionner une pompe à liquides - Google Patents

Procédé pour dissiper de la chaleur à partir de composants électroniques, afin d'actionner une pompe à liquides

Info

Publication number
EP2160514A1
EP2160514A1 EP08759772A EP08759772A EP2160514A1 EP 2160514 A1 EP2160514 A1 EP 2160514A1 EP 08759772 A EP08759772 A EP 08759772A EP 08759772 A EP08759772 A EP 08759772A EP 2160514 A1 EP2160514 A1 EP 2160514A1
Authority
EP
European Patent Office
Prior art keywords
electronic components
shaped element
plate
flussigkeitspumpe
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08759772A
Other languages
German (de)
English (en)
Inventor
Rajko Colic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP2160514A1 publication Critical patent/EP2160514A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0686—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P3/00—Liquid cooling
    • F01P3/12—Arrangements for cooling other engine or machine parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit

Definitions

  • the invention relates to a method for heat dissipation of electronic components for operating a
  • the invention further relates to an apparatus for carrying out the method and to a use of the device.
  • the invention is therefore based on the object to provide a method for heat dissipation of electronic components for operating a Flusstechnikspumpe, in which only the heat must be dissipated by the electronic components and at the same time constructively relatively expensive arrangements within the Flusstechnikspumpe for heat dissipation from the electronic components avoided become.
  • the invention is also based on the object, a corresponding Device for carrying out the method and to provide a use of the device.
  • the object underlying the invention is achieved by a method for heat dissipation of electronic components for operating a Flusstechnikspumpe, wherein the electronic components are contacted with an existing metallic materials Trager, which integrated from one in the supply line or in the derivative of the Flusstechnikspumpe Stromungsrohr consists and has on its outer side a plate-shaped element for contacting the electronic components and in which the heat dissipation of the electronic components via the plate-shaped element and the flow tube of the carrier takes place in the liquid medium to be flowed.
  • the term "electronic components” is to be understood as meaning those electronic components which are necessary for the operation of the fluid pump or for its control.
  • the carrier is made of metallic materials, preferably aluminum is used, the flow tube of the carrier usually has preferably a circular flow cross-section. However, it is also possible to provide a different shape of the flow cross section.
  • the plate-shaped element of the carrier serves to support or assemble the electronic components. It has surprisingly been found that the heat dissipation can be done relatively quickly over the arranged in the supply line or in the discharge carrier, while constructive expenses within the Flusstechnikspumpe can be avoided for heat dissipation. Furthermore, it does not lead to adverse heat radiation of the pump drive on the pump electronics. The process also allows the use of liquid pumps higher Power classes that are in the 400W range and allow high currents of over 3OA.
  • a preferred embodiment of the invention is that the heat dissipation of the electronic components via a housing that surrounds the electronic components at least partially and which is connected to the plate-shaped element. It may be possible that the housing and the plate-shaped element are made as a single part. In this way, the connection of the electronic components to the plate-shaped element is advantageously facilitated.
  • the heat dissipation from the electronic components takes place at a distance of 5 mm to 30 cm from the inlet E or from the outlet A for the liquid medium to be flowed from the liquid pump.
  • the carrier can be particularly easy to integrate in the supply line or in the discharge for the Flusstechnikspumpe and realize the heat dissipation easy.
  • a device for carrying out the method which consists of a carrier consisting of metallic materials, which is formed from a flow tube and a plate-shaped element arranged on its outside.
  • the carrier is made of metallic materials, aluminum is preferably used.
  • the plate-shaped element has a rectangular support surface for the electronic components for operation a Flusstechnikspumpe on. Since many electronic components are formed rectangular or housed in rectangular housings, thereby the device can be used in a particularly advantageous manner for many applications.
  • the invention further relates to the use of the device as Kuhlvorraum for cooling of electronic components for operating a Kuhlwasserpumpe in a motor vehicle.
  • Coolant pumps in motor vehicles generally have to have a very small installation space, so that, as a rule, they must not have any additional structural designs for the heat dissipation of electronic components.
  • the use of the device thus enables the realization of an optimally small space for the liquid pump to be used in the motor vehicle.
  • Fig. 1 the carrier for connection to the entrance of the Flusstechnikspumpe, the electronic components and the Flusstechnikspumpe are three-dimensional in the form of an exploded view.
  • Fig. 2 the electronic components, the Flusstechnikspumpe, and the flow tube in the assembled state shown in FIG. 1 are shown in three dimensions.
  • Fig. 3 the carrier for connection to the outlet of the Flusstechnikspumpe, the electronic components 2 and the Flusstechnikspumpe three-dimensional in the form of an exploded view.
  • FIG. 3 the metallic materials existing carrier 1, the electronic components 2 and the Flusstechnikspumpe 3 are three-dimensionally shown in the form of an exploded view in the event that it is provided, the carrier 1 with the inlet E for the medium to be flowed fluid pump 3 to connect.
  • the liquid pump 3 also has an outlet A for the medium to be flowed.
  • the electronic components 2 are shown here baukastenformig, with only the outer housing can be seen.
  • the carrier 1 should thus be integrated in the supply line for the liquid pump 3. It has a flow pipe Ia, on the outside of which a plate-shaped element Ib for contacting the electronic components 2 is formed. In general, there are the flow tube Ia and the plate-shaped
  • Element Ib from a single item. However, it is also possible to form the flow tube 1 a and the plate-shaped element 1 b in multiple parts (not shown). In the method for heat removal of electronic components 2 for operating the Flusstechnikspumpe 3, the heat from the electronic components 2 via the plate-shaped element Ib and the flow pipe Ia in the liquid to flow medium (not shown) dissipated, that then inside the flow pipe Ia flows.
  • the electronic components 2 and the Flusstechnikspumpe 3 and the integrated flow pipe Ia in the assembled state shown in FIG. 1 are shown in three dimensions.
  • the flow tube Ia is together with its plate-shaped element Ib with the inlet for the medium to be flowed (not shown) with the
  • the carrier 1 which consists of the integrated flow pipe Ia and the plate-shaped element Ib, shown together with the electronic components 2 and the liquid pump 3 in the form of an exploded view in the event that it is provided, the carrier 1 with the outlet A for the liquid to be flowed medium of the liquid pump 3 to connect directly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compressor (AREA)

Abstract

L'invention concerne un procédé selon lequel un contact est établi entre des composants électroniques (2) et un support (1) à base de matériaux métalliques. Ledit support se compose d'un tuyau d'écoulement(1a) intégré dans la conduite d'amenée ou dans la conduite d'évacuation pour la pompe à liquides (3), ainsi que des composants électroniques (2), disposés sur sa face extérieure, pour faire contact avec un élément sous forme de plaque (1b). Le dégagement de chaleur s'effectue à partir des composants électroniques (2), par l'intermédiaire de l'élément sous forme de plaque (1b) et du tuyau d'écoulement (1a) du support (1), dans la substance liquide à faire circuler. L'invention concerne en outre un dispositif permettant de mettre ledit procédé en oeuvre et l'utilisation dudit dispositif comme dispositif de refroidissement pour refroidir des composants électroniques (2) pour actionner une pompe à eau de refroidissement dans un véhicule automobile.
EP08759772A 2007-06-26 2008-05-20 Procédé pour dissiper de la chaleur à partir de composants électroniques, afin d'actionner une pompe à liquides Withdrawn EP2160514A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007029377A DE102007029377A1 (de) 2007-06-26 2007-06-26 Verfahren zur Wärmeabfuhr von elektronischen Bauteilen zum Betrieb einer Flüssigkeitspumpe
PCT/EP2008/056156 WO2009000601A1 (fr) 2007-06-26 2008-05-20 Procédé pour dissiper de la chaleur à partir de composants électroniques, afin d'actionner une pompe à liquides

Publications (1)

Publication Number Publication Date
EP2160514A1 true EP2160514A1 (fr) 2010-03-10

Family

ID=39831658

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08759772A Withdrawn EP2160514A1 (fr) 2007-06-26 2008-05-20 Procédé pour dissiper de la chaleur à partir de composants électroniques, afin d'actionner une pompe à liquides

Country Status (5)

Country Link
EP (1) EP2160514A1 (fr)
JP (1) JP2010531405A (fr)
KR (1) KR20100037036A (fr)
DE (1) DE102007029377A1 (fr)
WO (1) WO2009000601A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016122702B4 (de) 2016-11-24 2023-11-16 Nidec Gpm Gmbh Elektrische Kühlmittelpumpe mit ECU-Kühlung
KR102120045B1 (ko) 2019-04-19 2020-06-09 금덕펌프산업(주) 열방출장치를 갖는 고온용 수중펌프
DE102021208474A1 (de) 2021-08-04 2023-02-09 Mahle International Gmbh Fluidpumpe zum Fördern eines Fluides
DE102021125982A1 (de) 2021-10-06 2023-04-06 Nidec Gpm Gmbh Axialpumpe mit Axialflussmotor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765506B2 (ja) * 1987-09-30 1995-07-19 株式会社日立製作所 自動車用電子制御装置
KR20010041509A (ko) * 1998-03-04 2001-05-25 마에다 시게루 유체기계의 성능조정장치
DE19817333C5 (de) * 1998-04-18 2007-04-26 Conti Temic Microelectronic Gmbh Elektrische Antriebseinheit aus Elektromotor und Elektronikmodul
WO2000003142A1 (fr) * 1998-07-08 2000-01-20 Ebara Corporation Ensemble convertisseur de frequence
DE10058374B4 (de) * 2000-11-24 2011-09-15 Robert Seuffer Gmbh & Co. Kg Vorrichtung zur Temperaturregulierung einer Brennkraftmaschine
US6587338B2 (en) * 2001-12-13 2003-07-01 Carter Group, Inc. Electronic controller modules and methods for making and using same
DE10246349A1 (de) 2002-10-04 2004-04-29 Siemens Ag Kühlvorrichtung für ein Kraftfahrzeug mit einem Kühlkanal für ein Kühlmedium
JP4621065B2 (ja) * 2005-04-21 2011-01-26 アスモ株式会社 流体ポンプ
JP2006339229A (ja) * 2005-05-31 2006-12-14 Toyota Motor Corp 電子部品の冷却に適した筐体
DE102005029074B3 (de) * 2005-06-23 2006-08-10 Wieland-Werke Ag Wärmeaustauscher für Kleinbauteile

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2009000601A1 *

Also Published As

Publication number Publication date
KR20100037036A (ko) 2010-04-08
DE102007029377A1 (de) 2009-01-08
JP2010531405A (ja) 2010-09-24
WO2009000601A1 (fr) 2008-12-31

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