EP2093846B1 - Traversée de conducteur, boîtier d'appareillage et méthode de fabrication d'une traversée de conducteur - Google Patents

Traversée de conducteur, boîtier d'appareillage et méthode de fabrication d'une traversée de conducteur Download PDF

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Publication number
EP2093846B1
EP2093846B1 EP08101804A EP08101804A EP2093846B1 EP 2093846 B1 EP2093846 B1 EP 2093846B1 EP 08101804 A EP08101804 A EP 08101804A EP 08101804 A EP08101804 A EP 08101804A EP 2093846 B1 EP2093846 B1 EP 2093846B1
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EP
European Patent Office
Prior art keywords
conductor
separation device
leadthrough
region
external conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP08101804A
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German (de)
English (en)
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EP2093846A1 (fr
Inventor
Johannes Falk
Daniel Schultheiss
Jürgen Motzer
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Vega Grieshaber KG
Original Assignee
Vega Grieshaber KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vega Grieshaber KG filed Critical Vega Grieshaber KG
Priority to EP08101804A priority Critical patent/EP2093846B1/fr
Priority to AT08101804T priority patent/ATE521111T1/de
Priority to US12/372,543 priority patent/US7952035B2/en
Priority to CN2009100076762A priority patent/CN101640320B/zh
Publication of EP2093846A1 publication Critical patent/EP2093846A1/fr
Application granted granted Critical
Publication of EP2093846B1 publication Critical patent/EP2093846B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/42Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches
    • H01R24/44Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/533Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2103/00Two poles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922Contact or terminal manufacturing by assembling plural parts with molding of insulation

Definitions

  • the present invention relates to the field of metrology.
  • the present invention relates to a Porter penting, a housing device, a field device and a method for producing a conductor feedthrough.
  • Field devices in particular field devices, which are used with sensors for measuring levels, limit levels and pressures are often based on transit time measurements.
  • the signal propagation times are determined by radar pulses or by guided microwave pulses.
  • the desired measured variable is determined from these signal propagation times.
  • Radar pulses are radar signals of a specific frequency and duration.
  • the radar signals and the microwave signals can be assigned to the field of high-frequency technology (HF technology).
  • HF technology high-frequency technology
  • signals that are in the field of high-frequency technology while signals in the frequency range up to 2 GHz are used as guided microwave signals and signals in the range of 5 GHz - 7 GHz and 24 GHz to 28 GHz used as radar signals.
  • a conductor feedthrough is intended to designate a connection device for the connection of two conductors.
  • a conductor can be an electrical conductor such as a cable, a Coaxial line, a waveguide, a stripline or other device that is capable of leading signals on a desired path between two locations.
  • the probes in particular radar antennas or microwave probes, often have to operate in harsh environmental conditions.
  • levels of explosive materials in containers may need to be measured.
  • sealed plug connections in particular dense coaxial RF plug connections or conductor bushings, are used which prevent the electronics of the measuring devices, field devices or the evaluation devices from coming into contact with the explosive substances.
  • the area in which the product is located is different from the area in which the measuring electronics are located.
  • the two areas define separate zones.
  • conductor feedthroughs or feedthroughs may be necessary between the zones, although they pass electrical signals but maintain the zone separation.
  • a sealed conductor feedthrough can maintain zone separation.
  • Glass bushings or ceramic bushings are used to seal cable bushings or conductor bushings.
  • these glass-based or ceramic-based feedthrough solutions are expensive to manufacture.
  • the WO 03/098747 A1 relates to a method of sealing coaxial contacts of a portion of a receptacle connector to hermetically seal a connector.
  • the US 2004/0038587 A1 relates to a coaxial connector which is connected to a terminal end with a planar circuit.
  • a conductor feedthrough a housing device, a field device and a method for producing a conductor feedthrough are specified.
  • a conductor feedthrough in particular an HF plug connection for a field device or a measuring device, for connecting two electrical conductors.
  • the conductors may be RF conductors such as strip conductors, coaxial conductors, waveguides and the like.
  • the conductor bushing has an outer conductor and a sealing device.
  • the sealing device in turn has at least a first separating device and a Verguss adopted.
  • the outer conductor has a hollow inner region, which hollow inner region extends along a longitudinal axis of the outer conductor.
  • the at least one first separating device is arranged along the longitudinal axis of the outer conductor such that the at least one first separating device subdivides the hollow inner region of the outer conductor into at least two sections.
  • the Verguss issued is arranged such that the Verguss realized rests against the at least one first separating device and thus the sealing device along the longitudinal axis of the hollow inner region of the outer conductor has a leakage rate whose value is below a predetermined value a leak rate is.
  • the at least one separating device may also be arranged in the inner region in such a way that it substantially propagates the Verguss issued along the longitudinal axis in derogation.
  • the at least one first separating device may be arranged at right angles to the longitudinal axis.
  • an electrical signal with a predetermined frequency can be transmitted.
  • the attenuation of the signal along the longitudinal axis may be substantially constant during transmission.
  • a housing apparatus having a terminal space portion, an electronics space portion, and a housing separation device. Furthermore, the housing device has the conductor bushing according to the invention, wherein the housing separating device separates the Ansehlussraum Scheme and the electronics space area from each other.
  • the conductor leadthrough is arranged in the housing separating device such that an electrical signal exchange and / or an electrical power exchange between the terminal space region and the electronics space region is made possible.
  • a signal exchange between a probe connected in the connection region or in the connection space region or a sensor and an evaluation electronics system arranged in the electronics region or in the electronics region may be made possible.
  • the conductor leadthrough is arranged in the housing separating device such that a connection between the connection region and the electronics region can be sealed by means of the sealing device with a predeterminable leakage rate.
  • the value of the leak rate is below a predefinable value of a leak rate or corresponds to the predefinable value of the leak rate.
  • Sealing may substantially suppress matter exchange, gas exchange, or fluid exchange between the terminal compartment and the electronics compartment.
  • the material exchange between a first spatial region, ie the connection space region, and a second spatial region, ie the electronics region may be reducible to a predeterminable extent.
  • this may mean that by means of the sealing device it can be determined which leak rate or helium leak rate exists between two spatial regions.
  • the leak rate may be in mbar l sec be measured.
  • a field device which comprises the conductor leadthrough and / or the housing device.
  • a method of making a conductor feedthrough comprising providing an outer conductor.
  • the outer conductor has a hollow inner region into which at least one first separating device is introduced.
  • the at least one first separating device is introduced into the hollow inner region of the outer conductor such that the hollow inner region of the outer conductor is subdivided into at least two sections. At least one of the divided or separated at least two sections of the hollow inner region is at least partially filled with a pouring device.
  • the filling with the Verguss takes place so that the Vergusscin Vietnamese comes to rest on the at least one first separating device and that the at least one first separating device and the Verguss responded form a sealing device.
  • the sealing device which comprises the separating device and the Verguss responded has along the longitudinal axis of the hollow Inside the outer conductor leakage rate, the value is below a predetermined value of a leak rate.
  • An electrical signal having a predeterminable frequency can be transmitted along the longitudinal axis of the outer conductor of the conductor feedthrough.
  • a filling needle For filling a filling needle can be used, which is guided at a suitable location by the jacket of the outer conductor in the hollow interior.
  • the gravitational force may be used by a separate section is filled cup-like with the Verguss issued.
  • a glass feedthrough or ceramic feedthrough ie the use of a corresponding material for sealing two areas of space, may have a leak rate or helium leak rate of approximately 1x10 -9 mbar l sec provide.
  • the use of melted glass in the interior of an outer conductor may require the use of an inner soldering sleeve.
  • a combination of different special materials may be necessary. These materials may need to be coordinated to produce a consistent performance from these materials. The use of glass may thus require that expensive special material or specially matched material be used.
  • an inner conductor and the brazing sleeve of the outer conductor may be made of a controlled thermal expansion material or an adapted coefficient of expansion material to avoid differential expansion of the fused glass and braze sleeve.
  • a material with adapted expansion coefficients for example, by the company VACUUMSCHMELZE GmbH & Co. KG in Hanau sold under the name VACON ®.
  • the material with the material number 1.3981 may have a correspondingly adapted expansion coefficient.
  • VACON ® with the material number 1.3981 is also referred to below as 1.3981.
  • soldering tube By means of the soldering tube may be carried out a sealing of the coaxial glass feedthrough with respect to the outer conductor.
  • 1.3981 may have a similar or adjusted coefficient of expansion as the molten glass. Ie. When using this special material of fused glass and 1.3981, a customized glass feedthrough may be feasible.
  • the tuned or matched glass feedthrough may prevent the adhesion between the glass feedthrough and the outer conductor solder tube from being lost or torn off as the temperature changes.
  • zone separation by means of such a coaxial glass feedthrough i. a conductor leadthrough having a glass for sealing may be allowed for high pressures.
  • the cost of providing and making the customized glass feedthrough may be costly.
  • a material may be used to seal the conductor feedthrough having such a discontinuity, particularly in the form of a relative permittivity ⁇ r , which may differ from the relative dielectric constant of an adjacent material
  • an adjustment of conductor diameters may be necessary to compensate for the discontinuity be.
  • the ratio of the outer diameter of the inner conductor to the inner diameter of the outer conductor according to the formula 60 ⁇ ⁇ r ⁇ ln Inner diameter of the external manager Outer diameter of the inner conductor determine. This formula may essentially determine the characteristic impedance of a coaxial line or the coaxial conductor feedthrough.
  • the ratio of the inner diameter of the outer conductor to the outer diameter of the inner conductor may be determined by introducing the separating devices and the potting device into the hollow inner region of the outer conductor.
  • a first separation device and / or a second separation device may be an aid that allows the potting device to be held in the desired position when the potting device is placed in the severed portion.
  • the Verguss manufactured may be liquid when arranging or injecting into the separated portion and cure only after injection.
  • a glass feedthrough may be very complicated and expensive.
  • a glass feedthrough using solder tubes must be soldered into the outer conductor of the coaxial connector, connector or the coaxial connector to provide a necessary degree of sealing.
  • the soldering process by means of which the soldering is carried out may also be very complicated and complicated and make the production more difficult.
  • a spring contact on both sides of the inner conductor may be necessary. Ie. if the connector or conductor bushing to connect two conductors together, the use of slotted inner conductors for contacting the corresponding conductors may be required. For the production of the resilient contacts, it may also be necessary to slit the inner conductor once or twice. However, the production of slotted inner conductors may be very expensive.
  • the plug-in connection may be equipped, for example, in SMD technology (Surface Mounted Device), wherein the plug-in connections have to be soldered in the so-called reflow oven.
  • SMD technology Surface Mounted Device
  • the material may have a longer time, for example 40 seconds, a temperature of For example, be exposed to 260 ° C. It can not be avoided that the hardened spring contacts are exposed to the high temperature of 260 ° C over this time. However, if the spring contacts are exposed to the high temperature for such a long time, it may feel that the mated contacts may yield, ie lose their hardness.
  • the spring contacts of the inner conductors can be made of CuBe (copper beryllium).
  • CuBe copper beryllium
  • the relaxation resistance of spring contacts made of CuBe may yield for a long time under the influence of the high temperature.
  • soldering may jeopardize safe long-term contacting with separately constructed inner conductor constructions.
  • this Vergusssystems or the sealing device like a sealing effect or a leak rate or helium leak rate of about 1x10 -7 mbar l sec be achievable.
  • This value may be above the requirements for zone separation according to the standard of the European Standard EN 60079-26: 2004 lie, ie below a predefinable value.
  • the standard likes a leak rate of 1x10 -4 mbar l sec prescribe.
  • the potting system may continue to serve as a gas seal in accordance with European Standard EN 60079-11. It may therefore be possible to prevent gas exchange above a predefinable lower leak rate.
  • the potting system may prevent an explosive gas from entering a room with a non-intrinsically safe circuit or with non-intrinsically safe circuit parts of dangerous dimensions.
  • the measuring probe may provide measured values in the form of raw data which must be further processed by an evaluation electronics.
  • a field device may, for example, have such a measuring probe.
  • the measured values may be transmitted via the conductor feedthrough while the gases should not be able to escape from the container.
  • An evaluation unit may be realized as a non-intrinsically safe circuit. This means that during the design of the circuit, for example, it may not have been ensured that current inputs and current outputs are galvanically separated from one another.
  • An intrinsically safe circuit may provide power limiting to prevent sparking which could cause a gas mixture to explode.
  • a seal may be used which substantially inhibits the flow of matter or gas exchange between the zones.
  • the seal may have a low leakage rate.
  • the means that the flow of matter through the seal towards a non-intrinsically safe circuit or a non-explosive (explosion proof) circuit may be below a certain predetermined rate.
  • a field device which has a corresponding zone separator may be approved for corresponding explosive environments.
  • a sealing device having a correspondingly low leak rate or leak rate that is below a predetermined leak rate threshold or below a predetermined value of a leak rate may assure compliance.
  • the inner conductor of a Koaxial Arthurssystems or a conductor bushing may be slotted and hardened in the one-piece construction only on one side.
  • the leadership of the inner conductor may be realized on plastic supports, in particular on plastic supports made of PTFE or PEEK.
  • PEEK polyether ether ketone
  • PEEK polyether ether ketone
  • PTFE polytetrafluoroethylene
  • separator may be used because of its chemical inertness where aggressive chemicals occur.
  • PTFE may be used in industry because of its good resistance and may also be suitable as a separating device.
  • the use of the sealing device according to the invention comprising at least one first separating device, a second separating device and a Verguss adopted may avoid a complex solder joint on the outer conductor of a glass feedthrough.
  • the sealing device may make the additional contact of the inner conductor superfluous.
  • Electrical conductors may have two lines.
  • the conduction of electrical signals may require contact of the leads.
  • physical zone separation may be desirable in order to prevent an explosive gas from getting near a non-intrinsically safe circuit or coming to a dangerous extent in the vicinity of a non-intrinsically safe circuit.
  • two conflicting principles may be faced.
  • it may be desirable to allow good conduction through direct contact of the conductors of the two zones but on the other hand, it may be desirable to separate the zones as well as possible. Consequently, it may be useful to provide a seal having the sealing device and the lines, wherein the sealing device conforms as well as possible to the lines.
  • the filling of a hollow conductor section by means of a Verguss adopted or a dielectric may on the one hand allow electrical insulation by means of the corresponding separating device relative to an outer conductor.
  • the Verguss issued may seal gaps that arise between a separator and the outer conductor, in which the liquid Verguss issued may flow into existing column or may be pressed.
  • the filled Verguss may be prevented that a contact between a separating device and the outer conductor of a conductor bushing tears off.
  • a coaxial line or waveguide may have a hollow interior.
  • This hollow interior may allow hazardous substances or materials to move from one room area to another room area. Let the waveguide act like a pipe. Therefore, it may be necessary to seal the hollow interior or the substantially hollow interior of a corresponding conductor. By sealing, however, the electrical property of the waveguide should be influenced as little as possible.
  • One idea may thus be to use a dielectric or electrical insulator of an electrical conductor to seal or isolate a material flow. Despite sealing the cavity from material flow, electrical conductivity should be substantially maintained.
  • An epoxy resin or silicone for example a one-component potting system, a two-component potting system or a UV-curing potting system may be used as potting device.
  • Such materials may have sufficient elasticity to adhere to the outer conductor or the inner conductor even at different temperatures or at changing temperatures. This nestling may prevent a flow of matter inside the outer conductor along the longitudinal axis of the outer conductor. By nestling likes a flow of matter between the Verguss issued and the outer conductor or between the Verguss issued and the inner conductor prevented or restricted at least in predetermined masses.
  • the viscous or elastic Verguss worn may be kept at a predetermined location.
  • a corresponding sealing device having a Verguss issued, a first separation device and / or a second separation device may meet the requirements of a proof of adhesion or adhesive evidence, so that a corresponding conductor bushing can be used in a hazardous area or may be used.
  • the first separator and the second separator may hold the potting device in the desired position.
  • the Verguss issued may be made of elastic material and therefore may serve the separation means to stabilize the Verguss noticed.
  • the Vergusseinrichtwig may be responsible essentially alone for the sealing. Thus, it may be possible that the separators are to be manufactured with low tolerances.
  • the outer conductor is designed in several parts composed of a plurality of outer conductor parts, so that the Verguss issued is accessible in a disassembled state.
  • UV light may be deliverable to the Verguss announced, which UV light can be used to cure the Verguss announced.
  • the External conductor parts may be connectable or producible by means of a screw connection, a press connection or a solder connection.
  • the outer conductor parts may be shaped accordingly. For example, they may have threads or flanges, grooves or springs.
  • the conductor leadthrough comprises a second separation device, wherein the second separation device and the at least one first separation device are spaced along the longitudinal axis of the outer conductor. As a result of the spacing, the at least one first separating device and the second separating device separate a section of the hollow inner region of the outer conductor.
  • the chamber By separating a portion of the hollow inner region of the outer conductor may arise a chamber which can be filled with the Verguss announced.
  • the chamber may be filled in any position with the Verguss issued.
  • the conductor leadthrough has a coaxial inner conductor, wherein the coaxial inner conductor is arranged along the longitudinal axis in the hollow inner region of the outer conductor.
  • the sealing device in particular the at least one first separating device, the second separating device and the Verguss adopted are arranged such that they align the coaxial inner conductor in a central region of the hollow inner region of the outer conductor.
  • the sealing device may align, fix or center the inner conductor coaxially with the outer conductor.
  • the outer conductor may be a metallic cylinder or a metallic tube and the inner conductor a solid cylinder with a correspondingly smaller radius than the outer conductor. Between the inner conductor and The outer conductor may be present a distance. To keep this distance constant over the length of the conductor leadthrough, a sealing device may be used as a spacer.
  • the sealing device may be made of different materials.
  • the at least one first separating device, the second separating device and the Verguss may be made of different materials with different material properties. Consequently, the sealing device may be inhomogeneous.
  • the at least one first separating device, the second separating device and the gasifying device may have a different relative permittivity. These different material properties along the longitudinal axis may lead along the longitudinal axis corresponding to discontinuities of the electrical properties. Thus, sudden changes in the relative permittivity may result in effects on the electrical propagation of electromagnetic waves or electromagnetic signals along the conductor feedthrough.
  • the construction of the sealing device from the at least one first separating device, the second separating device and the Verguss may lead to joints between the different devices of different material. Due to the different relative dielectric constants ⁇ r of the materials, the propagation behavior of an electrical signal can be influenced. In particular, an influence on a guided electromagnetic wave may arise. Thus, the provision of the inhomogeneous sealing device could result in joints which may lead to undesirable damping behavior of an electrical signal such as a guided electromagnetic wave. The sealing device could therefore have negative effects on the propagation behavior of the electrical signal.
  • the damping behavior or the propagation behavior of a guided electromagnetic wave may be influenced.
  • the outer diameter of the inner conductor and in particular the ratio of the outer diameter to the inner diameter the negative effects can be counteracted by joints.
  • the aim may be to keep constant the characteristic impedance of the overall arrangement substantially at 50 ⁇ along the longitudinal axis of the outer diameter.
  • the coaxial inner conductor has at least one spring contact.
  • the inner conductor has at least one bend, wherein the bend is configured to contact an electrical conductor.
  • the bending of the inner conductor may allow by means of the lateral surface of the inner conductor to provide a large-area connection surface for contacting a printed circuit board.
  • the placement of a conductor feedthrough on a printed circuit board may be simplified by means of a bent inner conductor.
  • a contacting by means of a curved inner conductor may avoid that a spring contact must be used for contacting.
  • a spring contact may be impaired by thermal or mechanical stress in its function.
  • At least one separation device selected from the group of separation devices consisting of the at least one first separation device and the second separation device is arranged by means of an interference fit on an inner wall of the outer conductor.
  • the at least one first separation device or the second separation device may be manufactured with an oversize.
  • the separating device may have an outer diameter whose shape corresponds to the shape of an inner diameter of the outer conductor, wherein a radial distance of the contour of the separating device is greater than the radial distance from the longitudinal axis of the inner contour of the outer conductor.
  • the contour of the separating device When introducing a separating device into the hollow inner region of the outer conductor, the contour of the separating device may consequently be adapted to the contour of the outer conductor. To fit a heating of the outer conductor or the separating device may be necessary.
  • the separating device may be pressed against the outer conductor, whereby a tight fit of the separating device can be made in the outer conductor.
  • the separating device may thus prevent a flow of matter that would like to move in the inner region of the outer conductor in the direction of the longitudinal axis.
  • a low leakage rate for the propagation of a material, substance or fluid in the direction of the longitudinal axis may be set.
  • the introduction of a separator may also affect the propagation of an electromagnetic wave along the outer conductor.
  • the Choice of the shape of the inner contour of the outer conductor, and in particular the shape of the outer contour of the inner conductor may be counteracted by the deterioration of the propagation characteristics of an electromagnetic wave. Ie.
  • the impairment of the propagation characteristic of an electromagnetic wave may be compensated by a sealing device.
  • the outer conductor and the inner conductor may be made of metal.
  • the outer and inner conductors may be gold plated.
  • the second separation device and the Verguss may be produced.
  • the at least one first separator and the second separator may be made of PTFE (e.g., Teflon) or PEEK.
  • the potting device may be made of epoxy resin, silicone, a one-component potting system, a two-component potting system or a UV-curing potting system.
  • the combination of the at least one first separation device, the second separation device and / or the Verguss may form a sealing device with a low leakage rate.
  • Teflon may have a DK value, a dielectric constant ⁇ r or a relative permittivity ⁇ r of 2.2.
  • the Verguss Marie may have a DK value of 3.
  • the outer conductor has a protrusion, wherein the protrusion extends from an inner surface of the outer conductor into the hollow inner region of the outer conductor.
  • the survey extends in the hollow interior, such that when the protrusion is constrained with at least one device selected from the group of devices consisting of the potting device in contact with at least one first separation device and the second separation device, movement of the sealing device along the longitudinal axis is restricted.
  • the bump, edge, flange or shoulder may serve as a support to prevent displacement of the sealing device within the outer conductor.
  • a shift may be prevented by the frictional force, which arises due to the interference fit between separating device and outer conductor.
  • the survey may represent a mechanical barrier.
  • the outer conductor is formed as a housing coupler.
  • a case coupler may have the property that an outer shape of the case coupler or the conductor feedthrough is arranged such that the case coupler may engage with a case or a partition wall of a case device, so that the case coupler is integrated in the case. That is, there may be close contact between the package coupler and the package.
  • the housing coupler may be made of copper zinc (CuZn) and may be part of the outer conductor or form the outer conductor.
  • the housing coupler can be a turned part or a milled part into which the inner conductor is inserted.
  • the inner conductor may for example be made of copper beryllium (CuBe).
  • the contour of the conductor leadthrough may be adapted to a housing shape, it may be possible to avoid using an additional installation material when attaching the conductor leadthrough to the housing.
  • the conductor bushing in particular the outer conductor, a flange, by means of which the conductor bushing can be integrated into a housing.
  • the conductor leadthrough can be secured against displacement by means of the housing coupler.
  • the outer conductor has at least one hole, wherein the at least one hole forms a passage from an outer region of the outer conductor into the hollow inner region of the outer conductor.
  • the at least one hole is positioned along the longitudinal axis such that the portion of the hollow inner region of the outer conductor which is separated from the at least one first separation device and / or the second separation device is accessible via the hole, so that the Verguss worn means of the hole in the section can be introduced.
  • the inside of a coaxial conductor or a waveguide may be accessible and fillable via the hole. That as long as the separated section is not yet filled, filling can take place via the hole.
  • Positioning the hole such that the severed hollow interior or at least a portion of the partitioned hollow interior of the outer conductor is accessible may allow injection of the potting device into the cavity during manufacture of the conductor duct.
  • a dispenser needle may be used for injection.
  • the injection may also allow, by means of the potting element, a pressure in the direction of To build separation devices, so that the potting material is pressed and held in possibly existing spaces between the separating device and the outer conductor.
  • the potting material may be the material from which the potting device is made.
  • the potting material may be epoxy or silicone.
  • a hole By using a hole, it may be possible to penetrate the potting device after insertion of the severing device.
  • another hole can be used, which makes it possible to escape air from the cavity when filling the cavity.
  • the at least one first separating device is formed as a disk.
  • the at least one first separating device is designed as a Teflon disk, which is adapted to the inner dimensions of an outer conductor. The adjustment may take into account the corresponding excess for a fit.
  • the making as a disk may make it possible to determine the central position of the inner conductor in the outer conductor.
  • the second separating means is formed as a bushing.
  • the second separation device may form a compact connection device in combination with the inner conductor and in particular with the slotted inner conductor or the spring contact of the inner conductor and the outer conductor which a plug can be connected.
  • the shape of this connection device or socket may be adapted such that the connection device is a standard RF connector, for.
  • SMB Subminiature Coaxial Connector
  • SMC Subminiature Coaxial Connector
  • SMP micro-miniature coaxial connector
  • mini-SMP forms.
  • At least one separation device selected from the group of separation devices consisting of the at least one first separation device and the second separation device is made of Teflon.
  • Teflon may have a DK value of 2.2, which may result in a small dip in the DK value compared to a DK value of a potting device of 3.
  • one end of the conductor feedthrough is formed as a standard radio frequency (RF) connector.
  • RF radio frequency
  • an end of the conductor bushing as an RF connector may serve to connect probes, which also have standard RF connectors. For example, it may also be ensured that the characteristic impedance is adapted to 50 ⁇ , for example.
  • Conductor feed-through for the field device and for the method for producing the conductor feedthrough.
  • the housing device has a printed circuit board, wherein the printed circuit board is arranged in the Etektronikraum Suite such that the printed circuit board can contact an inner conductor of the conductor feedthrough. Furthermore, the outer conductor may contact the printed circuit board. For this example, the outer conductor may be soldered to the circuit board.
  • the circuit board may for example be connected or soldered to the bent end of an inner conductor of a conductor bushing. Due to the bending radius of the bent end of the inner conductor, the circuit board may well be attached to the inner conductor.
  • the housing device includes a shield, wherein the shield is configured to shield electromagnetic interference from the electronics compartment area, which interferes with the electronics space area from the direction of the terminal region.
  • a probe may be connected in the terminal compartment area.
  • This probe may generate an EMC (Electromagnetic Compatibility) disturbance that could interfere with evaluation electronics present in the electronics compartment.
  • the evaluation electronics could also generate EMC interference, which could have negative effects on the measuring probe or the measuring sensor. Disturbances, which could move both in the direction of the measuring probe and in the direction of the evaluation, like by means of a Shielding be held.
  • an electrical shield or an electrical grid may be used.
  • the shield is configured to space the circuit board from the housing separator such that an air-filled cavity is formed between the circuit board and the housing separator.
  • the air filled cavity may provide conditions under which the circuit board, particularly a circuit on the circuit board, has been tested.
  • the electronics area has a potting.
  • the encapsulation may protect a printed circuit board in the electronics area from penetrating hazardous substance, such as acid, alkalis or condensation.
  • potting may also avoid sparking which could ignite an explosive gas.
  • the use of a potting in the electronics area may also allow approval for a hazardous area.
  • the field device is selected from the group of field devices consisting of a level gauge, a flow meter, a radar gauge or a measuring device based on the principle of the guided microwave.
  • the field device could also be a pressure gauge.
  • a second or further separating device is introduced into the hollow inner region of the outer conductor, so that the at least one first separating device and the second separating device are arranged at a distance along the longitudinal axis of the outer conductor.
  • the at least one first separating device and the second separating device separate a section of the hollow inner region of the outer conductor.
  • the filling of the portion of the hollow inner conductor with the Verguss takes place through at least one hole in the outer conductor.
  • the inner conductor is rotated, slotted bent and hardened. Furthermore, the inner conductor is galvanized, for example, with gold and introduced into the outer conductor such that the inner conductor is aligned by means of at least one device selected from the group of devices consisting of the at least one first separator, the second separator and the Verguss adopted inside the cavity of the outer conductor , The filling of the separated portion of the hollow inner region of the outer conductor takes place in time after the introduction of the inner conductor in the outer conductor.
  • turning may refer to manufacturing by means of a turning process.
  • the potting system or the potting device may be evacuated prior to introduction into the outer conductor. When evacuating air inclusions or gas inclusions may be removed, so that a homogeneous structure is created.
  • the potting system may alternatively be a UV (Ultra Violet) adhesive.
  • a UV-glue can be cured by irradiation with a UV-lamp.
  • it may be necessary to use a two-part outer conductor to allow exposure to UV light from the UV lamp.
  • the two parts of the outer conductor can be formed screwable or pressable to allow after curing of the UV adhesive to connect the outer conductor by means of screws or pressing.
  • the at least one first separating device may be formed, for example, as a Teflon disk.
  • the second separating device may be formed, for example, as a Teflon bushing or Teflon pipe.
  • Both the at least one first separating device and the second separating device may already have a central bore for introducing the inner conductor. This central bore could lead to the escape of the Verguss owned when filling the cavity. Therefore, the introduction of the inner conductor into the hole of the disc or in the hole of the sleeve may prevent the Verguss adopted can escape through the holes.
  • Fig. 1 shows the conductor bushing 100 with the outer conductor 101 or the housing coupler 101 and the inner conductor 102.
  • the inner conductor 102 extends centrally in the outer conductor 101 along a longitudinal axis of the outer conductor 101st
  • the inner conductor 102 essentially has four sections. In the region of a first end 103, a spring contact for receiving the inner conductor of a plug, not shown, is shown. A second section 104, in which the inner conductor has a diameter which is predetermined by the shape of the spring contact 103, extends as far as the shoulder 105.
  • the diameter of the inner conductor 102 changes abruptly.
  • the diameter is reduced compared to the diameter in the region of the spring contact 103.
  • the jump takes place inside the Teflon disk 114.
  • the inner conductor has a large diameter on the side of the Teflon disk facing the spring contact 103.
  • the inner conductor has a narrow diameter on the side of the Teflon disk 114 facing the curved end 108 of the inner conductor.
  • the region in which the inner conductor 102 runs with a smaller diameter forms the third subsection of the inner conductor 106.
  • This narrow subsection 106 of the inner conductor runs essentially in an air-filled, hollow inner region 124 of the outer conductor 101.
  • the inner conductor 102 also has a fourth section 107, wherein the section 107 is bent substantially at 90 degrees relative to the profile of the inner conductor 102 in the areas 103, 104, 105 and in particular with respect to the orientation of the longitudinal axis of the outer conductor 101. Due to the bending of the inner conductor 102 and the curved course of the inner conductor in the section 107, it is achieved that a lateral surface 108 of the inner conductor extends substantially parallel to that of the surface 109 of a flange-shaped end of the outer conductor 101. Thus, the conductor feedthrough 100 can be soldered to the shell surface 108 and to the flange-shaped end portion 109 on a printed circuit board which is in Fig. 1 not shown.
  • the ratio of the outer diameter of the inner conductor 102, inner diameter of the outer conductor 101 and the relative dielectric constant ⁇ r of the bush 119, the relative dielectric constant ⁇ r of the potting device 117, is the relative dielectric constant ⁇ r of the Teflon disk 314 or the relative dielectric constant ⁇ r of the air in the region 124 selected so that the characteristic impedance of the conductor feedthrough 100 is 50 ⁇ .
  • the support device 110 is an insulating support 110.
  • the support device 111 is a Insulating ring 111.
  • the insulating ring 111 spaces the inner conductor 102 from an end edge 112 of the outer conductor 101 in a plane extending through 90 degrees to the longitudinal axis of the outer conductor 101.
  • the insulating support 110 spaces the inner conductor 102 from an inner edge 113 of the outer conductor 101, wherein the inner edge 113 extends parallel to the longitudinal axis of the outer conductor 101. Again, a characteristic impedance of 50 ⁇ applies.
  • the support means 110 and 111 thus provide for a constant distance of the inner conductor 102 relative to the outer conductor 101.
  • the at least one first separating device 114 or the teflon disk 114 ensures a constant spacing of the inner conductor 102 relative to the outer conductor 101.
  • the Teflon disk 114 rests against the shoulder 115, wherein the shoulder 115 moves the Teflon disk 114 in the direction of the curved end 107 of FIG Inner conductor 102 prevents.
  • Such a movement in the direction of the curved end 108 of the inner conductor 102 is also avoided by a press fit due to the resulting frictional action, with which press fit the Teflon disk 114 is pressed into the outer conductor 101.
  • the transition of the wide diameter of the inner conductor 102 to the narrow diameter of the inner conductor 102 takes place within the Teflon disk 114. This transition is stepped.
  • the Verguss prepared 117 is disposed within a chamber-shaped cavity.
  • the chamber-shaped cavity is a portion of the hollow inner portion of the outer conductor 101.
  • the chamber-shaped cavity is bounded by the inner surface of the outer conductor 101, the Teflon disk 114 and the sleeve 119 and is accessible through the holes 118.
  • the Teflon disk 114 and the bushing 119 each have at least one surface, which are arranged parallel to each other.
  • the Vergusssystem 117 can be injected into a cavity between the Teflon disk 114 and the sleeve 119 (Die Fig. 1 shows the conductor bushing 100 with injected Verguss adopted 117. The cavity is thus in Fig. 1 shown as a filled cavity).
  • the bushing 119 is also arranged so as to be shift-proof by means of an interference fit and a shoulder within a cavity of the outer conductor 101.
  • the bushing 119 connects to the Vergusssystem 117 along the longitudinal axis of the outer conductor 101 at. Together with the inner conductor 102 and in particular the spring contact 116 of the inner conductor 102, the socket 119 forms an electrical contact for connecting a plug.
  • the outer conductor 101 is made of conductive material.
  • a plug which contacts the socket 119 and the spring contact and the outer conductor 101 also has a coaxial design.
  • the plug in Fig. 1 is not shown, has an inner conductor which comes into contact with the spring contact 116.
  • the plug has an outer conductor, which is plugged by an insulator in the vicinity of the Buchbebeireichs 120 over the outer conductor 102 of the conductor bushing 100 galvanically isolated.
  • the plug and the socket overlap, for example, by ⁇ / 4, where ⁇ is the wavelength of the transported electromagnetic wave. It is in this case a ⁇ / 4 Steckverhindung.
  • the round toothed element 121 and the edged toothed element 122 of the inner conductor 102 form an additional displacement securing of the inner conductor 102 within the outer conductor 101. Furthermore, the toothing element 123 prevents which extends from the outer conductor 101 in an inner region of the outer conductor 101, a displacement of the sleeve 119 within the outer conductor 101st
  • a direction starting from the bush-shaped end 120 of the conductor bushing 100 in the direction of the angled end 108 of the inner conductor 102 is formed by the arrangement of the sealing device 114, 117, 119, a sequence of materials with different relative permittivity ⁇ r .
  • the propagation of an electromagnetic wave moving along the longitudinal axis is determined by the relative permittivity ⁇ r of the bushing 119.
  • the propagation is determined by the relative dielectric constant ⁇ r of Vergusssystems 117 and then by the relative permittivity ⁇ r of the Teflon disk 114.
  • the propagation of the electromagnetic wave by the relative permittivity ⁇ r of air certainly. In this area 106, air surrounds the inner conductor 102.
  • a hollow inner region 124 between inner conductor 102 and outer conductor 101 is sealed substantially in the longitudinal direction of the outer conductor 101.
  • the material which can still pass from a first space area 125 into a second space area 126 outside the conductor leadthrough 100 is determined by the leak rate or helium leak rate of the combined sealing device 114, 117, 119 and the pressure difference between the two space areas 125, 126.
  • the conductor leadthrough with the bent end of the inner conductor 108 can be held in the direction of the earth's surface.
  • the potting means 117 may be filled via the first end 103 or the bushing portion 120 from the side of the first space portion 125. After the curing of the Verguss Rhein 117 optionally bushing 119 can be introduced to increase the sealing property.
  • the separating devices 114, 119 form a seal to the outer conductor 101 by the press fit.
  • the separating devices 119, 114 likewise form a press fit and thus a seal relative to the inner conductor 102.
  • the separation devices 114, 119 are made of hard, heat-resistant material. Despite their interference fit, they can not adapt well to the contour of the inner region of the outer conductor 101. Thus, a gap formation can occur between the inner conductor and the separating device 119, 114 and the outer conductor and the separating device 119, 114, which can lead to a small material flow.
  • a small flow of material through the bodies of the separation devices 114, 119 can take place along the longitudinal axis of the outer conductor 101.
  • the introduction of the potting system 117 which is pressed with pressure between the separators 114, 119, closes potentially existing crevices and decreases the leakage rate of the sealing device 114, 117, 119.
  • the potting system 117 or seal 117 serves as a buffer between the zones.
  • the main seal is provided by the potting device 117.
  • Teflon has a DK value of 2.2, ceramic has a DK value of 9.9, glass has a DK value of 4.9, the Vergusssystem 117 has a DK value of 3 on.
  • the jump of the DK value of Teflon on ceramic or the jump of the DK value of Teflon on glass is much larger than the DK value jump of Teflon on the Vergusssystem 117. If the DK values of adjacent materials differ only slightly, then there are only Less discontinuities before and it comes only to small jumps in the characteristic impedance. Thus, better transitions can be produced and, furthermore, a better transmission behavior can be achieved.
  • the inner diameter of the outer conductor 101 is 4.1 mm and the outer diameter of the inner conductor 102 is 1.26 mm.
  • the inner diameter of the outer conductor 101 is 3.5 mm and the outer diameter of the inner conductor 102 is 1.26 mm.
  • the inner diameter of the outer conductor 101 is 1.9 mm and the outer diameter of the inner conductor 102 is 0.6 mm.
  • the length of the potting device 117 along the longitudinal axis of the outer conductor 101 should be at least 1 mn.
  • the two holes 118 are used both for introducing a dispenser needle for filling the cavity with potting material 117 and for the escape of air during filling.
  • the first separation device 114 and the second separation device 119 prevent the potting system 117 from entering undesirable regions such as the air-filled hollow interior 124 of the outer conductor 101 during filling.
  • the housing coupler 101 or outer conductor 101 has the collar 127 or flange 127, which can be used for attachment to a housing, in particular to an HF housing.
  • the spring action of the contact 116 is achieved by means of a slot 128, wherein when inserting an inner conductor into the spring contact 116 of the spring contact 116 genes the bushing 119 is pressed.
  • the pressure By the pressure, the frictional force acting on the inner conductor of a plug can be increased. Consequently, the hold of the plug in the socket 119 can be strengthened.
  • About the inner conductor 102 and the outer conductor 101 can be carried out a transport of electromagnetic signals or electrical power.
  • An electromagnetic wave is guided along the outer conductor 101 and allows signals to be exchanged between the spatial regions 125, 126, via the sealing device 114, 117, 119.
  • the signals can transmit measured values, for example.
  • the choice of the geometric shape of the components of the conductor leadthrough 100 as well as the choice of materials for the conductor feedthrough 100 can optimize the transport of electromagnetic signals or of power.
  • the conductor bushing 100 has in each case on the connection side 125, in particular in the connection space region 125 and in the electronics space 126, a characteristic impedance Z w of 50 ⁇ .
  • the conductor bushing 100 is thus adapted to conductors or lines which are used in high-frequency engineering.
  • a sealing effect can be achieved, which is comparable to the sealing effect of a glass seal, when the glass seal is soldered to the outer conductor 10 or when the glass seal is glued into the outer conductor 101.
  • the effort for gluing or soldering can with the in Fig. 1 shown construction can be avoided.
  • the danger can be substantially avoided that the adhesive seal between separating device 114, 119 and outer conductor 101 tears off.
  • the socket 119 with the spring contact 116 form a coaxial connector with a special interface.
  • the conductor bushing 100 of Fig. 1 is a variant of a coaxial RF connector with Vergusssystem 117 for the frequency range around 26 CHz.
  • the conductor bushing 100 is integrally formed as an SMD variant. Ie. the conductor feedthrough can be mounted on a circuit board by means of an SMD placement machine.
  • the electrical data of the conductor bushing 100 have a characteristic impedance of 50 ⁇ , the frequency range is in the range of 5 GHz to 7 GHz.
  • the circuit board material has a thickness of 0.635 mm.
  • the printed circuit board material has a thickness of 0.254 mm.
  • Such printed circuit boards are manufactured, for example, by the company Rogers and sold under the name Rogers RO3010 or RO3003.
  • the return loss, ie the damping parameter S 11 or the wave parameter S 11 , is at least 18 dB and the withstand voltage is more than 500 V.
  • the inner conductor 102 is made of CuBe hardened and gold plated and the outer conductor 101 is made of a gold-plated copper alloy.
  • the insulation, seal, sealing or sealing device 114, 117, 119, in particular the insulating ring 111 and the insulating support 110 are made of PTFE or PEEK.
  • the copper alloy of the outer conductor 101 is, for example, CuZn.
  • the bush 119 is made of PTFE.
  • the reflow soldering temperature which withstands the conductor feedthrough, is 260 ° C over 40 seconds.
  • the conductor feedthrough 100 can be used in a temperature range from -50 ° C to + 90 ° C.
  • a permissible gas density which is specified by the standard EN60079-26: 2004 and which is complied with by the conductor bushing 100, is less than 1x10 -4 mbar l sec . ie in units of millibar times liters per second.
  • the thickness of the Vergusssystems 117 along the longitudinal axis is at least 1 mm, for the Vergusssystem 117, the requirements for a proof of adhesion can be met.
  • Fig. 2 shows a layout 200 of a printed circuit board structure.
  • the square cross-section of the connection surface 201 can be seen, which has a contour for the connection of the outer conductor 101, which corresponds to the shape of the outer conductor 109 at one end 126 of the conductor leadthrough 100.
  • the connection surface 201 serves to support and solder the outer conductor 101 on the printed circuit board.
  • the inner conductor 108 is terminated on the rectangular connection structure 202 by means of soldering, which lies opposite the U-shaped recess 203.
  • the course of the U-shaped recess 203 corresponds to the course of the inner edge 113 of the outer conductor 101.
  • the printed circuit board can be produced.
  • This layout 200 is transferred to the circuit board during manufacture of the circuit board and corresponds to conductive areas on the circuit board.
  • the Fig. 3 shows a conductor bushing 101, which as a variant of the coaxial RF connector with Vergusssystem for the frequency range up to max. 3 GHz is designed as an SMD variant in one piece.
  • the potting system 117 ' has a larger diameter than the first separation device 114' and the second separation device 119 '.
  • the bush-shaped end 120 'of the conductor bushing 100' is in Fig. 3 as a standard RF connector such. B. SMB trained.
  • the socket-side end 120 'of the inner conductor 102' is designed as a pin 300 or pin 300.
  • the sleeve 119 ' has a cup-shaped recess 301 on the socket-side end.
  • the dimensions of the pin 300 and the cup-shaped receptacle 301 correspond to the standard for the corresponding standard HF plug connector.
  • the conductor feedthrough 100 ' is used for the electrically conductive connection of two lines when using a guided microwave in the range of 3 GHz.
  • the joint 302 can be seen, which allows a multi-part construction of the outer conductor 101 '.
  • the outer conductor 101 ' can be assembled and disassembled, for example, by means of a pressing method or a screwing method.
  • the potting device 117 ' can be introduced in one direction along the inner conductor 102', while during injection, the potting device is introduced essentially at right angles to the inner conductor 102 '.
  • UV light can act on the Verguss issued 117 ', whereby the hardening of the Verguss owned 117' is favored.
  • Fig. 4 shows a perspective view of a conductor bushing 100, which is soldered onto a circuit board 400.
  • Port 2 denotes the spring contact 116 of the conductor feedthrough 100
  • port 1 denotes the end of a strip line 401, wherein the strip line 401, microwave circuit 401 or the strip conductor 401 is applied to the circuit board 400.
  • the angled section 108 of the inner conductor 102 is soldered to the strip conductor 401 by means of a soldering point.
  • the angled portion of the inner conductor 108 protrudes from the insulating ring 111 out. Furthermore, in Fig. 4 to see the rectangular end portion 109 of the outer conductor 101, which is also soldered to the circuit board 400. At a greater distance from the printed circuit board on the outer conductor 101 of the flange 402, 127 or collar 402, 127 can be seen.
  • the filling hole 118 is directed in the same direction as the angled inner conductor 108 and disposed between the flange 402, 127 and the sleeve-shaped end 120 of the outer conductor 101.
  • the outer shape of the outer conductor 101 in the region of the filler hole 118 has a larger diameter than the outer region of the outer conductor 101 in the region of the bush-shaped connection region 120.
  • the spring contact 116 is embedded in the bushing 119.
  • the sleeve 119 is disposed between the outer conductor 101 and the spring contact 116 and centers the spring contact 116 in the center of the outer conductor 101.
  • Port2 conductors can be connected, which are to be connected by means of the conductor bushing 100 and the circuit board 400.
  • the conductor feedthrough 100 enables a transmission of signals between the ports Port 2 and Port 1.
  • Por1. 1 to be connected to an assembly for evaluation.
  • the flattened portion 404 of the outer conductor 101, in which the hole 118 is located, has the flattening 405.
  • the flattening 405 serves as a rotational stop when mounted in a housing 2700, as in FIG Fig. 27 is shown.
  • the Fig. 5 shows a side view looking towards the hole 118 of the housing coupler 100 and the outer conductor 100th Der Fig. 5 It can be seen that an asymmetrical structure of the housing coupler 100 is present through the flattening 405 of the outer conductor region 404.
  • the dimensions of the bushing end portion 120 correspond to a plug that is in Fig. 5 not shown.
  • the plug which fits to the socket can be plugged over the socket end region 120 so that electrical transmission can take place between the plug and the outer conductor 101. This means that a signal can be coupled into the conductor feedthrough 100.
  • capacitors may be used to provide galvanic isolation between different regions of the inner conductor.
  • the diameter of the outer conductor 100 increases stepwise via the hole section 404 as far as the flange 402 in the direction of the square end region 403 of the outer conductor 100. From the flange 402 in the direction of the square end 403, the diameter first decreases, whereas in the region of the square end portion 403 again increases.
  • Fig. 5 It can also be seen that the square end portion 403 has a U-shaped opening 500 which is used to exclude the insulating ring 111 (in FIG Fig. 5 not drawn) is used.
  • Fig. 6 is a plan view of the square end portion 403 of the conductor bushing 100 can be seen.
  • the flange 402 is circular.
  • the U-shaped receptacle 500 can be seen for the insulating ring.
  • the Fig. 7 shows a bottom view of the housing coupler 100, wherein a concentric structure of the flange 402, the hole portion 404 and the sleeve portion 120 can be seen.
  • the flattening 405 of the hole portion 404 of the conductor bushing 100 deviates.
  • the circular structure of the abutment points 115 for the separation devices 114, 119 can be seen.
  • the air-filled passage 124 can be seen.
  • the Fig. 8 shows a cross section through the Leiter micflandung 100 from Fig. 5 , It can be seen from this cross-section that the holes 118 constitute a connection from an outer region outside of the outer conductor 101 in the inner region of the outer conductor.
  • the inner area of the outer conductor 101 is in Fig. 8 not filled or filled with air.
  • the Vergusssystem 117 can be injected.
  • the shoulder 115 can be seen, which serves for the at least one first separating device 114 as a stop.
  • the collar-shaped elevations 123 and 800 can be seen, which represent an additional safeguard against displacement of the at least one first separating device 114 and the second separating device 119.
  • the bottle-shaped transition 801 between the bush-shaped end portion 120 and the hole portion 404 of the outer conductor 101 serves to attach a thread, by means of which the conductor bushing can be screwed into a housing. About the external thread, a spring washer and a nut can be mounted.
  • the sealing device is in Fig. 8 Not shown.
  • Fig. 9 shows a detailed view of the survey 123, which serves to prevent displacement of the sleeve 119.
  • Fig. 10 shows a detailed view of the survey 800, which serves the additional displacement assurance of the Teflon disk 114.
  • Fig. 11 shows a perspective view of the conductor bushing 100 without inner conductor.
  • the perspective view also shows the bushing region 120 of the outer conductor 101, the hole region 404, which has the filling hole 118 and the flange 402, and the square-shaped earth region 403 with the surface 109.
  • the conductor bushing is gold plated.
  • Fig. 12 shows the inner conductor 102 according to an embodiment of the present invention in unverbauter form.
  • the structure of the spring contact 116 with the slot 128 can be seen.
  • the portion of the spring contact 116 of one end of the inner conductor 102 is shown in section.
  • the spring contact 116 is designed substantially as a bore with a slot 128.
  • the hook element 122 is formed, which is tapered along the inner conductor 102 spreads, and then abruptly decrease to the radius of the inner conductor, which has the radius of the inner conductor in the region of the spring element 116.
  • the hook-shaped element 122 serves to fix the inner conductor in the bushing 119, which in Fig. 12 not shown.
  • the Fig. 12 to take the bulge 121, which serves the attachment of the inner conductor 102 in the Vergusssystem 117, the Vergusssystem 117 in Fig. 12 also not shown.
  • a jump-shaped reduction of the radius 105 of the inner conductor takes place.
  • the region of the inner conductor with a reduced radius is in an installed state in the evacuated cavity 124 of the outer conductor 101 after Fig. 1 to lie.
  • the radius remains constantly smaller than the radius in the area of the spring element 116 until the turn 1200 and the inner conductor 102 is recovered at the bending point 1200 by 90 ° with respect to the longitudinal axis 1201.
  • the Fig. 13 shows a plan view of the spring contact 116 of the inner conductor 102.
  • the angled portion of the inner conductor 108 is also shown.
  • the plan view of the spring contact 116, the four slots 128 can be seen, which provide the spring action of the spring contact.
  • the spring contact 116 is in the Fig. 14 shown in compressed form.
  • compressed form means that the end regions of the slot 128 are compressed.
  • Fig. 15 shows a further view of the inner conductor 102, wherein in the view of Fig. 15 the viewing direction is directed to the bend 1200. Since the inner conductor 102 is constructed substantially symmetrical, also the hook element 122 of the gap 128 and the elevation 121 and the discontinuity 105 can be seen.
  • Fig. 16 shows a detailed view of the shape of the survey 121st
  • Fig. 17 shows a plan view of the Teflon disk 114 which is the first separator 114.
  • the concentric structure of the Teflon disk 114 can be seen.
  • the disc 114 has a circular hole 1700, through which hole the inner conductor 102 can be guided.
  • the diameter of the hole 1700 is slightly smaller than the diameter of the inner conductor in the region between the discontinuity 105 and the end region 103 of the conductor leadthrough, which has the spring contact 116.
  • the Fig. 18 shows a sectional view through the Teflon disk 114 according to Fig. 17 ,
  • the outer diameter of the Teflon disk 114 is selected so as to coincide with an inner portion of the outer conductor 101 of the conductor bushing 100, which in Fig. 18 is not shown, forms a press fit or an interference fit.
  • Fig. 19 shows the concentric sleeve 119.
  • the socket 119 has the hole 1900, wherein the inner conductor 102 can be inserted through the hole 1900.
  • the choice of the diameter of the hole 1900 is made so that it forms a press fit with the inner conductor 102.
  • Fig. 20 shows a cross section through the bush 119.
  • the Fig. 20 lets recognize a rectangular cross-section of the bushing 119, since the bushing is tubular.
  • Fig. 21 shows a top view of the insulating support 110.
  • the insulating support 110 has a circular structure with a U-shaped portion 2100, wherein the U-shaped portion is adapted to the inner conductor 102 in a bent portion 108, so that the insulating support 110 can ensure a distance of the angled inner conductor 108 of an outer conductor 101.
  • Fig. 22 shows a plan view of the U-shaped portion 2100 of the insulating support 110th
  • the Fig. 23 shows a perspective view of the insulating support 110 together with U-shaped notch 2100.
  • Fig. 24 shows the insulating ring 111 in a plan view.
  • the insulation 111 has a disc-shaped construction, wherein a portion of the insulation along a chord outside a center hole 2400 is cut off, so that a flat bearing surface 2401 is formed.
  • the support surface 2401 allows a secure hold on the circuit board 400 and provides insulation from a circuit board 400.
  • the diameter of the opening 2400 is dimensioned so that the inner conductor in the region of the bend 108 through the opening 2400 fits.
  • Fig. 25 shows a plan view of the flattened side 2401 of the insulating ring 111.
  • the flattened side 2401 together with the flattened side 109 of the outer conductor, forms a flat surface which can rest on a printed circuit board 400.
  • Fig. 26 shows the insulating ring 111 in a perspective view, wherein it can be seen that the flattening 2401 is located outside the hole 2400.
  • Fig. 27 1 shows a housing device 2700 with an attachment device 2709, the housing device 2700 having a conductor leadthrough 100.
  • the conductor bushing 100 or plug connection 100 connects a connection space region 2708 of the housing device to an electronics space region 2703 of the housing device 2700.
  • the electronics space region 2703 is removed from the wall 2704 is limited and the terminal area 2708 is bounded by the wall area 2705.
  • the electronics space portion 2703 and the terminal space portion 2708 are separated from each other by the separator 2706.
  • the separator 2706 prevents, for example, that a gas or matter existing in the terminal portion 2708 and having, for example, a high pressure, enters the electronics space portion 2703 and contacts a non-intrinsically safe electronic assembly such as the circuit board 400.
  • the conductor leadthrough 100 is provided, which is configured to transmit signals but substantially prevent matter from the terminal area 2708 from entering the electronics area 2703 arrives.
  • the boundary wall 2704 forms an electronics cup 2704.
  • the electronics cup 2704 may be made of metal or plastic. Since the connection area 2708, in particular the socket area 120 of the conductor leadthrough 100, is provided for the connection of high-frequency signals, the HF housing 2707 is arranged in the electronics cup 2704.
  • the RF housing 2707 is made of metal and serves to shield from interference. Further, the RF package 2707 makes the package 2700 EMI (Electromagnetic Compatibility).
  • the HF housing 2707 serves to shield interference signals which originate from the connection area 2708 and also reduces interference effects in the opposite direction which would act on the terminal space area 2708 from the electronics space area 2703.
  • the RF housing 2707 or the shield 2707 is shaped such that in connection with the circuit board 400, the cavities 2701 between the circuit board 400 and the HP housing 2707 form.
  • the cavities 2701 are filled with air and can prevent the microwave circuit or the strip conductor 401, which is arranged on the surface of the circuit board 400, from coming into contact with the potting 2702. If the microwave circuit 401 came into contact with the potting, the RF characteristics of the microwave circuit 401 could change.
  • the microwave circuit 401 is in a built-in state in the cavity 2701 and facing in the direction of the RF housing 2707. Thereby, the microwave circuit comes into contact with air present in the cavity 2701.
  • the grout 2702 for example made of silicone, is intended to increase the explosion protection.
  • the grout 2702 encapsulates unnecessary voids.
  • the flange 402 of the conductor bushing 100 is in conductive contact with the RF housing 2707 and serves the ground terminal.
  • the nut 2710 is used to attach the conductor bushing 100 in the housing device.
  • the diagram in the Fig. 28 shows on the abscissa 2800 the frequency in GHz at intervals of 2 GHz in the range of 20 to 30 GHz and at the coordinate 2801 the S-parameter size in dB.
  • the curve 2802 shows the course of the transmission loss, ie the course of the S parameter S 21 . It can be seen that the transmission loss is in the range of 0.1 to 1 dB.
  • the curve 2803 shows the reflection attenuation, ie the S parameter S 11 . It can be seen that the reflection attenuation in the range of 24 to 28 GHz is about -30 dB.
  • the proposed conductor bushing for passing electrical signals through a Housing separator 2706 is suitable.
  • the signals are in the range of 24 to 28 GHz and thus the conductor bushing 100 is suitable for radar signals.
  • the conductor feedthrough 100 can be used to transmit measurement signals from the terminal space area 2708 into the electronics space area 2703.
  • the Fig. 29 11 shows a flowchart for a manufacturing method for a conductor feedthrough 100. After initializing the method in step S0, the outer conductor 101 is provided in step S1. The outer conductor 101 has a hollow inner region.
  • step S2 the at least one first separating device 114 and / or the second separating device 119 is introduced into the hollow inner region, so that a portion of the hollow inner region between the at least one first separating device 114 and the second separating device 119 is separated.
  • the hollow inner region of the outer conductor 101, 101 ' is subdivided into at least two sections.
  • step S3 at least one of the sections formed in step S2 is filled with the potting device 117.
  • the Fig. 30 shows a field device.
  • the field device 3000 has the measuring probe 3001. Electrically, the measuring probe 3001 is connected to the field device via a conductor feedthrough 100 (in FIG Fig. 30 not shown). Thus, the measuring probe 3001 can forward its measured raw data to an evaluation electronics in the field device 3000.
  • the transmitter is also in Fig. 30 Not shown.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Claims (26)

  1. Traversée de conducteurs (100) pour un appareil de champ (3000) destinée à la liaison de deux conducteurs électriques la traversée de conducteurs (100) comprenant :
    un conducteur extérieur (101) ;
    un dispositif d'étanchéité ;
    le dispositif d'étanchéité présentant :
    au moins un premier dispositif de séparation (114) ;
    le conducteur extérieur (101) présentant une zone intérieure creuse (124), laquelle zone intérieure creuse (124) s'étend le long d'un axe longitudinal du conducteur extérieur (101) ; et
    un signal électrique pouvant être transmis par la traversée de conducteurs (100) le long de l'axe longitudinal du conducteur extérieur (101) ;
    caractérisé en ce que le conducteur extérieur (101) présente au moins une trou (118) ;
    le au moins un premier dispositif de séparation (114) étant disposé le long de l'axe longitudinal de telle sorte qu'il subdivise la zone intérieure creuse du conducteur extérieur (101) en au moins deux sections ;
    le au moins un trou (118) réalisant un passage d'une zone extérieure du conducteur extérieur (101) dans la zone intérieure creuse du conducteur extérieur (101) ;
    le au moins un trou (118) étant positionné dans le conducteur extérieur (101) le long de l'axe longitudinal du conducteur (101) de telle sorte qu'une section de la zone intérieure creuse du conducteur extérieur (101),
    séparée par le au moins un premier dispositif de séparation (114), est accessible au travers du trou (118), si bien qu'un dispositif de scellement (117) peut être introduit dans la section au moyen du trou (118) ; et
    de sorte que le dispositif de scellement (117) et le au moins un premier dispositif de séparation (114) forment le dispositif d'étanchéité, pour étanchéifier la zone intérieure creuse.
  2. Traversée de conducteurs (100) suivant la revendication 1, dans laquelle le conducteur extérieur (101, 101') peut être composé en plusieurs parties d'une multiplicité de parties de conducteur extérieur, si bien que le dispositif de scellement (117) est accessible dans un état de désassemblage.
  3. Traversée de conducteurs (100) suivant la revendication 1 ou 2, le dispositif d'étanchéité comprenant en outre :
    un second dispositif de séparation (119) ;
    le au moins un premier dispositif de séparation (114) et le second dispositif de séparation (119) étant disposés à distance le long de l'axe longitudinal du conducteur extérieur (101) de sorte que le au moins un premier dispositif de séparation (114) et le second dispositif de séparation (119) séparent une section de la zone intérieure creuse du conducteur extérieur (101).
  4. Traversée de conducteurs (100) suivant l'une des revendications 1 à 3, comprenant en outre :
    un conducteur intérieur coaxial (102) ;
    le conducteur intérieur coaxial (102) étant disposé le long de l'axe longitudinal du conducteur extérieur (101) dans la zone intérieure creuse du conducteur extérieur (101) ;
    le dispositif d'étanchéité étant conçu pour orienter le conducteur intérieur coaxial (102) dans une zone centrale de la zone intérieure creuse du conducteur extérieur (101).
  5. Traversée de conducteurs (100) suivant l'une des revendications 1 à 4, dans laquelle le diamètre intérieur du conducteur extérieur (101), sélectionné en fonction des dimensions d'au moins un dispositif, est réalisé de le au moins un premier dispositif de séparation (114), du second dispositif de séparation (119) et du dispositif de scellement (117).
  6. Traversée de conducteurs (100) suivant la revendication 4 ou 5, dans laquelle le conducteur intérieur coaxial (102) présente au moins un contact à ressort (116).
  7. Traversée de conducteurs (100) suivant l'une des revendications 4 à 6, dans laquelle le conducteur intérieur coaxial (102) présente au moins une courbure (108, 1200), la courbure (108, 1200) étant conçue pour entrer au contact d'un conducteur électrique (401).
  8. Traversée de conducteurs (100) suivant l'une des revendications 1 à 7, dans laquelle au moins un dispositif de séparation, sélectionné parmi le groupe des dispositifs de séparation constitué du au moins un premier dispositif de séparation (114) et du second dispositif de séparation (119), est disposé par ajustement serré sur une paroi intérieure du conducteur extérieur (101).
  9. Traversée de conducteurs (100) suivant l'une des revendications 1 à 8, le conducteur extérieur (101) comprenant en outre :
    un épaulement (115) ;
    l'épaulement (115) s'étendant de la surface intérieure du conducteur extérieur (101) dans la zone intérieure creuse du conducteur (101) ;
    l'épaulement (115) s'étendant dans la zone intérieure creuse de telle sorte que l'épaulement, lorsqu'il entre au contact d'au moins un dispositif sélectionné par le groupe des dispositifs constitué de le au moins une premier dispositif de séparation (114), du second dispositif de séparation 119 et du dispositif de scellement (117), limite un déplacement du dispositif d'étanchéité le long de l'axe longitudinal.
  10. Traversée de conducteurs (100) suivant l'une des revendications 1 à 9, dans lequel le conducteur extérieur (101) est réalisé sous forme de coupleur de boîtier (101).
  11. Traversée de conducteurs (10) suivant l'une des revendications 3 à 10, dans laquelle le au moins un trou (118) est positionné dans le conducteur extérieur (101) le long de l'axe longitudinal du conducteur (101) de telle sorte qu'une section de la zone intérieure creuse du conducteur extérieur (101), séparée par le au moins un premier dispositif de séparation (114) et le second dispositif de séparation (119), est accessible au travers du trou (118), de sorte que le dispositif de scellement (117) peut être introduit dans la section au moyen du trou (218).
  12. Traversée de conducteurs (100) suivant l'une des revendications 1 à 11, dans laquelle le au moins un premier dispositif de séparation (114) est réalisé sous forme de rondelle (114).
  13. Traversée de conducteurs (100) suivant l'une des revendications 3 à 12, dans laquelle le second dispositif de séparation (119) est réalisé sous forme de douille (119).
  14. Traversée de conducteurs (100) suivant l'une des revendications 1 à 13, dans laquelle au moins un dispositif de séparation, sélectionné parmi le groupe des dispositifs de séparation constitué du au moins un premier dispositif de séparation (114) et du second dispositif de séparation (119), est en Téflon.
  15. Traversée de conducteurs (100) suivant l'une des revendications 1 à 14, dans laquelle au moins une extrémité de la traversée de conducteurs (100) est réalisée sous forme d'un connecteur standard à haute fréquence (120, 301).
  16. Traversée de conducteurs (100) suivant l'une des revendications 4 à 13, dans laquelle la traversée (100) comporte un dispositif d'appui (110, 111) pour le guidage du conducteur intérieur coaxial (102).
  17. Système de boîtier (2700) comprenant :
    une zone d'espace de raccordement (2708) ;
    une zone d'espace électronique (2703) ;
    un dispositif de séparation de boîtier (2706) ;
    une traversée de conducteurs (100) suivant l'une des revendications 1 à 16 ;
    système de boîtier dans lequel
    le dispositif de séparation de boîtier (2706) sépare la zone d'espace de raccordement (2703) et la zone d'espace électronique (2703) ;
    la traversée de conducteurs (100) est disposée dans le dispositif de séparation de boîtier (2706) de telle sorte qu'un échange de signaux et/ou un échange de puissance est permis entre la zone d'espace de raccordement (2708) et la zone d'espace électronique (2703) ; et
    la traversée de conducteurs (100) est en outre disposée dans le dispositif de séparation de boîtier (2706) de telle sorte que la zone d'espace de raccordement (2708) et la zone d'espace électronique (2703) peuvent être mutuellement étanchéifiées au moyen du dispositif d'étanchéité.
  18. Système de boîtier (2700) suivant la revendication 17, comprenant en outre :
    une carte imprimée (400) ;
    la carte imprimée (400) étant disposée dans la zone d'espace électronique (2703) de telle sorte que la carte imprimée (400) peut entrer au contact d'un conducteur intérieur (102, 108) de la traversée de conducteurs (100).
  19. Système de boîtier (2700) suivant la revendication 17 ou 18. comprenant en outre :
    une blindage (2707) ;
    le blindage (2707) étant conçu pour protéger la zone d'espace électronique (2703) d'effets parasites électromagnétiques, lesquels effets parasites agissent de la direction de la zone d'espace de raccordement (2708) sur la zone d'espace électronique (2703).
  20. Système de boîtier (2700) suivant la revendication 19, dans lequel le blindage (2707) est conçu pour écarter la carte imprimée (400) du dispositif de séparation de boîtier (2706) de telle sorte qu'il en résulte un espace creux (2701) rempli d'air entre la carte imprimée (400) et le dispositif de séparation de boîtier (2706).
  21. Système de boîtier (2700) suivant l'une des revendications 17 à 20, dans lequel la zone d'espace électronique (2703) présente un scellement (2702).
  22. Appareil de champ (3000) comprenant une traversée de conducteurs (100) suivant l'une des revendications 1 à 16 et/ou un système de boîtier (2700) suivant l'une des revendications 17 à 21.
  23. Appareil de champ (3000) suivant la revendication 22, l'appareil de champ (3000) étant sélectionné parmi le groupe des appareils de champs constitué d'un appareil de mesure de niveau, d'un débitmètre, d'un appareil de mesure radar ou d'un appareil de mesure, basé sur le principe de la micro-onde guidée.
  24. Procécé de fabrication d' une traversée de conducteurs (100) suivant l'une des revendications 1 à 16, comprenant :
    la préparation d'un conducteur extérieur (101), le conducteur extérieur (101) présentant une zone intérieure creuse (124) ;
    l'introduction d'au moins un premier dispositif de séparation (114) dans la zone intérieure creuse du conducteur extérieur (101), de sorte que la zone intérieure creuse du conducteur extérieur (101) est subdivisée en au moins deux sections ;
    le remplissage d'au moins l'une des deux sections de la zone intérieure creuse du conducteur extérieur (101) par un dispositif de scellement (117) au travers d'au moins un trou (118) du conducteur extérieur (101), de sorte que le dispositif de scellement (117) et le au moins un premier dispositif de séparation (114) forment un dispositif d'étanchéité, pour étanchéifier la zone intérieure creuse ;
    un signal électrique pouvant être transmis par la traversée de conducteurs (100) le long de l'axe longitudinal du conducteur extérieur (101).
  25. Procédé suivant la revendication 24, comprenant en outre :
    l'introduction d'un second dispositif de séparation (119) dans la zone intérieure creuse du conducteur extérieur (101), de sorte que le au moins un premier dispositif de séparation (114) et le second dispositif de séparation (119) sont disposés à distance le long de l'axe longitudinal du conducteur extérieur (101), et de sorte que le au moins un premier dispositif de séparation (114) et le second dispositif de séparation (119) séparent une section de la zone intérieure creuse du conducteur extérieur (101).
  26. Procédé suivant la revendication 24 ou 25, comprenant en outre :
    le tournage d'un conducteur intérieur (102) ;
    le fendage du conducteur intérieur (102) ;
    la flexion du conducteur intérieur (102) ;
    la trempe du conducteur intérieur (102) ;
    la galvanisation du conducteur intérieur (102) ;
    l'introduction du conducteur intérieur (102) dans le conducteur extérieur (101), de sorte que le conducteur intérieur (102) est orienté dans l'intérieur de l'espace creux du conducteur extérieur (101) au moyen d'au moins un dispositif, sélectionné parmi le groupe des dispositifs constitué de le au moins un premier dispositif de séparation (114), du second dispositif de séparation (119) et du dispositif de scellement (117) ;
    le remplissage de la section de la zone intérieure creuse du conducteur extérieur (101) s'effectuant après l'introduction du conducteur intérieur (102).
EP08101804A 2008-02-20 2008-02-20 Traversée de conducteur, boîtier d'appareillage et méthode de fabrication d'une traversée de conducteur Active EP2093846B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08101804A EP2093846B1 (fr) 2008-02-20 2008-02-20 Traversée de conducteur, boîtier d'appareillage et méthode de fabrication d'une traversée de conducteur
AT08101804T ATE521111T1 (de) 2008-02-20 2008-02-20 Leiterdurchführung, gehäusevorrichtung, feldgerät und verfahren zur herstellung einer leiterdruchführung
US12/372,543 US7952035B2 (en) 2008-02-20 2009-02-17 Conductor leadthrough, housing device, field apparatus and method for producing a conductor leadthrough
CN2009100076762A CN101640320B (zh) 2008-02-20 2009-02-20 导体引入器、壳体装置、现场设备以及用于制造导体引入器的方法

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EP08101804A EP2093846B1 (fr) 2008-02-20 2008-02-20 Traversée de conducteur, boîtier d'appareillage et méthode de fabrication d'une traversée de conducteur

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EP2093846A1 EP2093846A1 (fr) 2009-08-26
EP2093846B1 true EP2093846B1 (fr) 2011-08-17

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EP (1) EP2093846B1 (fr)
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US6733336B1 (en) * 2003-04-03 2004-05-11 John Mezzalingua Associates, Inc. Compression-type hard-line connector
US7364451B2 (en) * 2004-02-24 2008-04-29 Ring John H Hybrid glass-sealed electrical connectors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202019100659U1 (de) 2019-02-05 2020-05-07 Sick Ag Sensor zum Bestimmen einer Prozessgröße
DE102019102812A1 (de) 2019-02-05 2020-08-06 Sick Ag Sensor zum Bestimmen einer Prozessgröße
EP3693712A1 (fr) 2019-02-05 2020-08-12 Sick Ag Capteur permettant de déterminer une grandeur de processus

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CN101640320B (zh) 2013-01-02
ATE521111T1 (de) 2011-09-15
EP2093846A1 (fr) 2009-08-26
US20090211808A1 (en) 2009-08-27
CN101640320A (zh) 2010-02-03
US7952035B2 (en) 2011-05-31

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