Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6461—Means for preventing cross-talk
  • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6461—Means for preventing cross-talk
  • H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/6608—Structural association with built-in electrical component with built-in single component
  • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
  • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
  • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
  • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R31/00—Coupling parts supported only by co-operation with counterpart
  • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0393—Flexible materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors

Definitions

• the invention relates to wired connection devices for local area network (in English: Local Area Network).
• the LAN cables are of the four-pair type of twisted conductors and that the sockets and plugs used for the connection of such cables comprise a series of eight metal contacts arranged in a predetermined manner, the most often according to the RJ45 format.
• the local network connection devices generally comprise, between the two connection units formed for example by the contacts of an RJ45 socket and the terminal block. connection to a LAN cable, a compensation circuit.
• This compensation circuit is generally made in the form of a rigid printed circuit often comprising two layers, or even more for the high performance plugs.
• Such a compensation circuit comprises couplings of the inductive and capacitive type, forming an LC cell or several LC cells in cascade.
• Inductive couplings magnetic coupling or major inductive effect
• the capacitive couplings are made by the proximity of two conductors, but it is the coupling between the surfaces of these conductors that is sought.
• Capacitive couplings are conventionally made in the form of comb capabilities arranged on the same layer of the circuit or involve metallized holes made in the thickness of the circuit.
• the invention aims to provide such a connection device that is efficient in terms of transmissions while being simple and economical.
• connection device for local network, comprising two connection units and a compensation circuit provided with connection points for contacts that comprise said connection units and conductive tracks for connecting two connection points in pairs.
• said circuit having capacitive coupling means between at least a first said conductive track and a second said conductive track; characterized in that said capacitive coupling means comprise a conductive element electrically insulated from said first track and second track while it has a surface having a portion facing, through a dielectric, a surface of the same orientation of a portion of the first track and another portion facing, through said dielectric, a surface of the same orientation of a section of the second track Because the conductive element is not connected to any of the tracks to be coupled , intrinsic parasitic components capacitive couplings are weak, which allows the connection device according to the invention to offer good performance in terms of transmissions while the compensation circuit it contains remains simple and economical to implement.
• said dielectric comprises a substrate interposed between said conductive element and said first track and second track.
• Such a substrate is particularly convenient for implementing the compensation circuit, in particular for carrying the conductive tracks and / or the conductive element.
• said dielectric comprises a flexible sheet material.
• such a material is thin and with reduced thickness tolerance.
• said flexible sheet material is shaped into a strip. According to other preferred features, for reasons of simplicity and convenience of implementation:
• said section of the first track and said section of the second track are in the form of a ribbon
• said section of the first track and said section of the second track are arranged in comb, with each of said first track and second track having teeth arranged nested;
• said conductive element is a block comprising a main face forming said surface;
• said block is rectangular;
• said conductive element is a screw whose said surface is located at one end;
• said device comprises a nut portion in which the barrel of said screw is received, whereby the distance between said end surface and said first conductive track and second conductive track can be adjusted;
• said compensation circuit comprises a central portion which is flexible and two end portions which are rigid;
• connection points are provided in said end portions; at least one of said connection units is a connection unit for an RJ45 socket;
• connection units are connection units for an RJ45 socket
• the device comprises at least one housing for receiving an RJ45 plug; and or
• the device comprises two receiving slots of an RJ45 plug opening respectively in one and the other of two opposite faces of a housing.
• FIG. 1 is a perspective view showing a connection device according to the invention comprising two RJ45 sockets connected to each other, and showing two RJ45 male plugs each arranged in front of a respective receiving housing of this connector; device, in a position where it is ready to be inserted;
• FIG. 1 is an exploded perspective view of the connecting device
• FIG. 3 is a perspective view of an assembly forming part of the device illustrated in FIG. 1, this assembly comprising two connection units for an RJ45 socket and a compensation circuit connecting these two units to each other;
• FIG. 4 is a perspective view showing, in isolation, one of the connection units;
• FIG. 5 is a perspective view showing the compensation circuit in isolation;
• FIG. 7 is a schematic plan view of one of the two outer layers of the compensation circuit
• FIG. 10 is a schematic perspective view showing a portion of the compensation circuit; and - Figures 11 and 13 are similar views, but for variations of the compensation circuit.
• connection device 10 illustrated in FIGS. 1 and 2 comprises a housing 11 having two housings 12A and 12B for receiving an RJ45 plug such as the plugs 100A and 100B shown in FIG. 1, each located at one end of the socket. a LAN cable, respectively 101 A and 101 B.
• the housings 12A and 12B open respectively in a face 13A and in a face 13B of the housing 11, opposite to each other.
• the housing 11 comprises two shells 102A and 102B ( Figure 2), identical and arranged head to tail.
• the shells 102A and 102B are associated with each other by snapping.
• the housing 11 encloses an assembly 14 illustrated in the assembled state in FIG.
• the assembly 14 comprises two connection units 15A and 15B intended to form part of an RJ45 socket, these two units being identical and arranged upside down while they are connected to each other by a circuit of FIG. 16.
• the connection unit 15A will now be described more particularly with reference to FIG. 4. This description also applies to the connection unit 15B, which is identical.
• connection unit 15A comprises an insulating support 17 in which is disposed an insert 18, which comprises an insulating plate 19 carrying eight metal contacts 1 to 8.
• the reference numerals 1 to 8 are here identical to the standard numbering for the contacts of the RJ45 connection units.
• Each of the metal contacts 1 to 8 comprises a contact portion, disposed in a window 20 of the support 17, and a tail, respectively 1A, 2A, 3A, 4A, 5A, 6A, 7A and 8A, protruding from the plate 19 on the side opposite to the window 20.
• Each contact portion disposed in the window 20 is provided to make electrical contact with the corresponding metal contact of an RJ45 plug such as 100A or 100B inserted in the housing 12A (12B for the unit of connection 15B).
• the unit 15A is mounted in the device 10 by snapping the support 17 onto the housing 11, and more specifically on the shell 102A (102B for the connection unit 15B), at the housing 12A (12B for the connection unit 15B).
• Each of the tails 1A to 8A is provided for connecting the metal contact to which it belongs to the rest of the device 10.
• these tails have a pinhead shape and are each designed to be forced into a connection port. a rigid printed circuit board.
• connection units 15A and 15B For more details on the connection units 15A and 15B, reference may be made to the French patent application 2,826,788.
• the compensation circuit 16, illustrated in isolation in FIG. 5, comprises a central portion 21 which is flexible and two end portions 22 and 23, which are rigid.
• the rigid portion 22 has eight connection ports, respectively 1B 1 2B, 3B, 4B, 5B, 6B, 7B and 8B, provided to receive the tails 1A, 2A, 3A, 4A, 5A 1 6A, 7A and 8A, respectively, of the connection unit 15A.
• the rigid end portion 23 has eight connection ports 1C, 2C, 3C, 4C, 5C, 6C, 7C and 8C, provided for the tails 1A 1 2A, 3A, 4A, 5A 1 6A 1 7A and 8A respectively, of the connection unit 15B.
• the links operated by the compensation circuit 16 are illustrated schematically and in a simplified manner in FIG.
• the circuit 16 comprises eight conductive tracks 1D, 2D, 3D, 4D 1 5D, 6D, 7D and 8D.
• the track 1D connects the connection port 1 B of the end portion 22 to the connection port 1 C of the end portion 23.
• the orifices 2B and 2C are connected to each other by the 2D track 1 and so on, the orifices xB and xC being connected to each other by the track xD, with x ranging from 1 to 8.
• the tracks 1D and 2D intersect with a first crossing zone 24 situated near the connection orifices 1B and 2B and a second crossing zone 25 situated near the connection orifices 1C and 2C.
• the 3D and 6D tracks do not cross any other track.
• the contacts 1 to 8 are intended to be connected to a cable, such as 101 A and 101 B, with eight conductors arranged in four twisted pairs terminating in the pairs of contacts 1-2, 3-6, 4-5 and 7-8, respectively.
• a cable such as 101 A and 101 B
• the capacitor 26B is disposed between the conductive tracks 3D and 5D near the connection ports 3B and 4B.
• the capacitor 26C is disposed between the conductive tracks 3D and 5D, but near the connection ports 3C and 4C.
• each of the capacitors 26B and 26C is disposed in an area where the conductive track 5D is, thanks to its intersection with the track 4D, disposed opposite and close to the 3D track.
• the capacitive coupling between the tracks 4D and 6D is also realized by two capacitors 27B and 27C, arranged in a similar manner.
• the capacitor 27B is disposed between the conductive tracks 4D and 6D near the connection ports 5B and 6B while the capacitor 27C is disposed between the conductive tracks 4D and 6D near the connection ports 5C and 6C, with each of the capacitors 27B and 27C which is arranged between the conductive tracks 4D and 6D in an area where, thanks to the intersection between the tracks 4D and 5D, the track 4D is opposite and in the vicinity of the conductive track 6D.
• the circuit 16 has two outer layers 30 shown in isolation in FIG.
• Each layer 30 has two printed circuit boards 31 and 32 and, disposed between the plates 31 and 32, a strip 33 of flexible insulating thin sheet material.
• the printed circuit boards 31 and 32 are provided to be part respectively of the rigid end portion 22 and the rigid end portion 23.
• the band 33 is provided to be part of the flexible central portion 21.
• In the plate 31 are formed orifices with a metallized edge 1E,
• connection ports 1B to 8B respectively.
• the printed circuit board 32 has metallized orifices 1F, 2F, 3F, 4F, 5F, 6F, 7F and 8F serving to implement the connection ports 1C to 8C, respectively.
• the first inner layer 34 illustrated in FIG. 8 comprises a strip 35 of flexible thin-film insulating material forming a substrate on which the conductive tracks 1D 1 3D, 5D and 7D are arranged as well as two conductive blocks 36 and 37, here of shape rectangular.
• connection ports 1B to 8B are provided at one end of the metallized periphery orifices 1G, 2G, 3G, 4G, 5G, 6G, 7G and 8G for the implementation of the connection ports 1B to 8B, respectively.
• the track 1D is disposed between the orifices 1G and 1H, the 3D track between the orifices 3G and 3H, the track 5D between the orifices 3G and 3H and finally the track 7D between the orifices 7G and 7H.
• the conductive blocks 36 and 37 have a layout similar to that of the capacitors 27B and 27C.
• the second inner layer 38 illustrated in FIG. 9 comprises a strip 39 of flexible thin-film insulating material forming a substrate on which the conductive tracks 2D, 4D, 6D and 8D are arranged, as well as two conductive blocks 40 and 41, here in the form of rectangular.
• connection ports 1 B to 8B are formed at one end of the metallized periphery orifices 11, 21, 31, 41, 51, 61, 71 and 81 for the implementation of the connection ports 1 B to 8B, respectively.
• metallized orifices U, 2J, 3J, 4J, 5J, 6J, 7J and 8J are formed at the other end.
• the 2D track is disposed between the orifices 21 and 2J
• the track 4D is disposed between the orifices 41 and 4J
• the track 6D is disposed between the orifices 61 and 6G
• the track 8D between the orifices between the orifices 81 and 8J.
• the conductive blocks 40 and 41 have a layout similar to that of the capacitors 26B and 26C. Thus, the block 40 is disposed near the orifices 31 and 41 while the block 41 is disposed near the orifices 3J and 4J.
• the external orifices are connected by conductive tracks carried by the substrate 35 and that the internal orifices (even numbering) are connected by conductive tracks carried by the substrate 39.
• the inner layers 34 and 38 are arranged one against the other so that the different metallized holes are exactly superimposed (the hole 11 is superimposed with the hole 1G, the 21 with the hole 2G and so on and, similarly, the hole U is superimposed with the hole 1H, the hole 2H with the hole 2J, and so on).
• Conductive tracks 1D to 8D are thus arranged as described in support of FIG. 6.
• the insulating nature of the substrate 35 makes it possible to avoid short circuits between the intersecting conductive tracks, each track crossing another track being arranged on a separate layer.
• One of the outer layers 30 is disposed against the layer 34, on the opposite side to the layer 38 while the other outer layer 30 is disposed against the layer 38 on the opposite side to the layer 34.
• the metallized holes 1E are superimposed on the 1 G and 11 metallized holes, the metallized holes 2E are superimposed on the metallized holes 21 and 2G, and so on; and likewise the metallized holes 1F are superimposed on the metallized holes 1 H and U 1 the metallized holes 2F are superimposed on the metallized holes 2 J and 2H, and so on.
• the outer layers 30 mechanically reinforce the inner layers 34 and 38 and, in addition, the outer layer 30 disposed against the layer 34 electrically isolates the latter from the outside, except of course at the connection points that constitute the orifices 1B to 8B and 1C to 8C.
• the rigid nature of the printed circuit boards 31 and 32 allows for force insertion of the deformable shanks 1A to 8A into the end portions 22 and 23 of the compensation circuit 16, the units 15A and 15B. can thus be connected to the circuit 16 without soldering.
• connection units 15A and 15B are connected by welding.
• the flexible nature of the central portion 21 makes it easy to easily turn up the connection units 15A and 15B.
• the relative arrangement of the block 36 and the conductive tracks 4D and 6D will now be described more particularly with reference to FIG. 10.
• tracks 4D and 6D have the same width.
• the track 4D and 6D are parallel to each other with their internal longitudinal edges 45 which are directly opposite one another.
• the block 36 here has a rectangular shape with a width (gap between its long sides 47) which is substantially equal to the distance between the outer longitudinal edges 46 of the conductors 4D and 6D.
• the main face 49 of the block 36 located on the side of the substrate 35 thus constitutes a surface comprising a portion which looks, through the dielectric that constitutes the substrate 35, a surface of the same orientation of a section of the conductive track 4D, the surface that the face 49 also comprises another portion which looks, through the substrate 35, a surface of the same orientation of a section of the conductive track 6D.
• the conductive pad 36 reduces the electric field lines that connect these two conductors, which produces, at the pad 36, a capacitive effect between the 4D tracks. and 6D.
• the capacitor 27C also arranged between the conductive tracks 4D and 6D, is similarly made by the conductive pad 37, the relative arrangement of the pad 37 and the tracks 4D and 6D being identical to the relative arrangement of the pad 36 and 4D and 6D tracks.
• the capacitors 26B and 26C coupling the conductive tracks 3D and 5D are also similarly made thanks to the conductive blocks 40 and 41, the relative arrangement of the conductive tracks 3D, 5D and the block 40 (respectively 41) being similar to the relative arrangement of tracks 4D and 6D and conductive pad 36.
• a capacitor formed of two comb conductors would be disposed distally (i.e. opposite the conductive tracks) on one of the layers such as between the metallized holes 3E and 5E of the printed circuit such as 31 and between the metallized holes 4F and 6F of the printed circuit such as 32, and, on the other layer 30, between the metallized holes 4E and 6E of the printed circuit such as 31 and between the metallized holes 3F and 5F of the printed circuit board such as 32.
• connection device 10 Because of this size reduction, the parasitic components intrinsic to the capacitive couplings are smaller and consequently the coupling obtained is more efficient, which allows the connection device 10 to offer better performance in terms of transmissions, in particular for impedance matching of pair 3-6 and NEXT between pair 3-6 and pair 4-5.
• FIG. 6 the electrical diagram illustrated in FIG. 6 is particularly simplified. For the sake of clarity, only the capacitive couplings between the 3D and 5D conductors on the one hand and between the 4D and 6D conductors on the other hand are illustrated.
• 8D are much more complex, including an inductive component between the different conductive tracks arranged parallel to each other close to each other.
• FIG. 11 shows a variant of the portion of the compensation circuit 16 illustrated in FIG. 10.
• the conductive tracks 4D 'and 6D', the substrate 35 'and the pad 36' are exactly identical to the conductive tracks 4D and 6D 1 to the substrate 35 and to the conductive pad 36.
• a conductive pad 51 similar to the pad 36' and disposed symmetrically therewith.
• the conductive pad 51 has a surface including a portion which looks, through the dielectric that constitutes the substrate 39', a surface of the same orientation of a section of the track 4D 'and a portion which looks, through the dielectric that constitutes the substrate 39 ', a surface of the same orientation of a section of the track
• FIG. 12 shows another variant of the portion of the coupling circuit 16 illustrated in FIG. 10.
• the same reference numerals have been kept for the similar elements, but with an exponent ".
• the conductive tracks 4D “and 6D” are arranged in comb, with here each of the tracks 4D “and 6D” which has teeth, respectively 52 and 53, projecting towards the other track, these teeth being arranged in a nested manner.
• a conductive block 55 On the side of the substrate 39 "opposite to that where the conductive tracks 4D" and 6D “are arranged, there is provided a conductive block 55 whose dimensions are such that its surface facing the substrate 39" is opposite, through the dielectric constituting the substrate 39 ", all the surfaces, of the same orientation, tracks 4D” and 6D ", in the area where the teeth 52 and 53 are provided.
• the surface facing the substrate 39 has a portion which looks, through the substrate 39", a surface of the same orientation of a section of the track 4D "and a portion which looks, under the same conditions, a surface same orientation of a section of track 6D ". Since the block 55 is electrically insulated from each of the conductive tracks 4D “and 6D”, it provides a capacitive coupling between the tracks 4D “and 6D”, which is added to the capacitive coupling providing the comb arrangement of these conductive tracks.
• FIG. 13 shows another variant of the portion of the coupling circuit 16 illustrated in FIG. 10.
• the same reference numerals have been kept for the similar elements, but with an exponent '".
• this housing comprising a portion 60 forming a nut and a support (not shown) allowing the conductive tracks 4D '"and 6D'" to be arranged in a predetermined manner relative to the portion 60.
• the latter has a threaded bore 61 in which is engaged the threaded barrel 62 of a screw 63.
• the head 64 of the screw 63 has a recess 65 for controlling the angular position of the screw 63 with respect to the part 60.
• the end surface 66 of the screw 63 is arranged in line with the conductive tracks 4D "'and 6D'", the substrate 35 '"and the air gap situated between the surface 66 and the substrate 35" constituting a dielectric .
• a portion of the surface 66 looks, through this dielectric, a surface of the same orientation of a section of the track 4D '"and another portion of the surface 66 looks, through this dielectric, a surface of the same orientation of a section of the conductive track 6D '".
• the screw 63 being electrically isolated from the tracks 4D '"and 6D'", provides a capacitive coupling between these tracks.
• the thickness of the air gap existing between the substrate 35 '' and the surface 66 is varied.
• the value of the capacitive coupling produced is thus varied. This allows a fine adjustment of this capacitive coupling.
• the conformation of the two conductive tracks to capacitively couple and / or the conformation of the element (s) conductor (s) is still different, with for example the conductive tracks which have changes of direction and the conducting block which is electrically insulated from the two conductive tracks and which has recesses, with each time the conductive element which has a surface having a portion facing, through a dielectric, a surface of a section a conductive track and another portion facing, through a dielectric, a surface of a section of the other conductive track.
• the conductive element is made differently from a conductive pad disposed on a substrate or a screw whose end surface looks at the conductive tracks.
• the accuracy of the capacitive coupling achieved depends on the tolerance of the dielectric thickness between the conductive tracks and the surface of the conductive element; and that the coupling will be all the more effective as this thickness is small.
• the compensation circuit is made differently, for example with double-sided layers rather than single faces; being entirely rigid or fully flexible; and / or by being made by multilayer screen printing or multiband molding.
• connection units connected by the compensation circuit are of another type, for example a unit such as 15A or 15B and a terminal block for connection to a wall cable; two terminals for connection to such a cable; and / or at least one connection unit to another format such as RJ 12 or Sub-D.

Landscapes

• Structure Of Printed Boards (AREA)
• Combinations Of Printed Boards (AREA)
• Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
• Near-Field Transmission Systems (AREA)
• Microwave Amplifiers (AREA)

Applications Claiming Priority (2)

Publications (2)

Family

ID=38002144

Family Applications (1)

Country Status (7)

Families Citing this family (14)

Family Cites Families (14)

• 2006
  • 2006-10-09 FR FR0654161A patent/FR2906939B1/fr not_active Expired - Fee Related
• 2007
  • 2007-09-20 CL CL200702703A patent/CL2007002703A1/es unknown
  • 2007-10-05 US US12/444,853 patent/US7909649B2/en active Active
  • 2007-10-05 CN CN2007800422336A patent/CN101536273B/zh active Active
  • 2007-10-05 EP EP07858400.0A patent/EP2076942B1/de active Active
  • 2007-10-05 WO PCT/FR2007/001630 patent/WO2008043902A2/fr active Application Filing
  • 2007-10-05 RU RU2009117444/07A patent/RU2427950C2/ru not_active IP Right Cessation

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events