Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
  • H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures

Definitions

• the present invention relates to an LED semiconductor body as well as uses of an LED semiconductor body.
• conventional thin-film light-emitting diode chips usually have a layer structure with an active layer whose radiation quantity is limited by the current intensity. Because the current density in the active layer should not exceed a maximum current density, otherwise there is a risk that excessive aging effects adversely shorten the life of the LED semiconductor body.
• a further object of the present invention is to specify uses of an LED semiconductor body with an increased luminance.
• An inventive LED semiconductor body comprises at least a first radiation-generating active layer and at least one second radiation-generating active layer and further comprises a photonic crystal.
• an active layer is to be understood as meaning a radiation-generating pn junction.
• this pn junction can be formed by means of a p-type and an n-type semiconductor layer, which adjoin one another directly.
• the actual radiation-generating layer for example in the form of a doped or undoped quantum layer, is preferably formed between the p-type and n-type active layers.
• the quantum layer can be formed as single quantum well structure (SQW, single quantum well) or multiple quantum well structure (MQW, multiple quantum well) or else as quantum wire or quantum dot structure.
• SQW single quantum well
• MQW multiple quantum well
• the radiation losses caused by total reflection can be reduced by means of the photonic crystal.
• a light beam emanating from the semiconductor body is then totally reflected at the interface between the optically denser semiconductor material having a refractive index nl and the surrounding optically thinner medium, for example air, having a refractive index ⁇ .2 when it impinges on the interface at an angle which is greater is equal to or greater than the critical angle ⁇ of the total reflection, where:
• the angle data refer here to the normal of the interface at the point of impact of the light beam.
• the photonic crystal provided for the LED semiconductor body may cause some of the radiation incident on the photonic crystal at an angle equal to or greater than the critical angle ⁇ to be deflected at an angle smaller than the critical angle ⁇ impinges on a radiation decoupling surface and thus can decouple. Furthermore, by means of the photonic crystal, the original emission angle can be narrowed.
• the photonic crystal comprises a plurality of first regions having a first refractive index and a plurality of second regions having a second refractive index.
• the areas are arranged regularly.
• the regular arrangement may correspond to a one-dimensional, two-dimensional or three-dimensional grid.
• the photonic crystal may have the structure of a two-dimensional lattice.
• the distance between two adjacent first regions or two adjacent second regions corresponds to the lattice constant.
• the photonic crystal achieves its effect best when the lattice constant is adapted to a wavelength of the radiation generated by the semiconductor body.
• the distance between two adjacent first regions or two adjacent second regions preferably corresponds approximately to the wavelength of the radiation generated by the LED semiconductor body.
• the distance is between 10 ⁇ 9 m and 10 ⁇ 6 m.
• the second regions are connected. This means that in each case two second regions have in particular more than one contact point, for example a contact surface.
• the contact point or the contact surface are not to be understood as physical components, but arise due to an imaginary subdivision of the photonic crystal in the same structure "crystal cells".
• the photonic crystal contains a dielectric material.
• the first regions are particularly preferably filled or unfilled depressions in a semiconductor layer of the LED semiconductor body.
• the first regions may be introduced into the semiconductor layer as recesses in a periodic arrangement. Alternatively, it is possible to arrange the first regions in a lattice-like manner, wherein these are formed in the manner of islands and are separated from one another by suitable intermediate spaces, for example a coherent depression.
• the second possibility thus represents the inversion of the first possibility, in that the regions and the depressions are interchanged.
• the recesses or interspaces may advantageously be filled with a filling material, for example a dielectric or another semiconductor material, whose refractive index differs from the refractive index of the first region.
• the first regions have a width and / or depth between 100 nm and 500 nm.
• the first and the second active layer are arranged one above the other in the vertical direction.
• two or more active layers are simultaneously available for generating radiation in an LED semiconductor body with active layers arranged one above the other in comparison to conventional LED semiconductor bodies of the type mentioned above, so that the total amount of radiation generated or the luminance is advantageously increased.
• the luminance is the optical power per emission surface of the semiconductor body and solid angle element.
• the first and second active layers generate radiation of the same wavelength.
• a reflection layer which is provided for reflection of the radiation generated by the active layers as described below.
• the absorption of reflected radiation by the respective other active layer on the emitted total radiation has no adverse effect.
• first and the second active layer can be monolithically integrated in the semiconductor body. This eliminates the manufacturing step of connecting the first layer stack to the second layer stack, for example by means of bonding.
• the LED semiconductor body is expediently arranged on a carrier element.
• an electrically conductive carrier element is preferably used. This allows the formation of a vertically conductive component in which the current flow is substantially in the vertical direction. Such components are characterized by a comparatively homogeneous current distribution within the LED semiconductor body.
• a rear-side contact is expediently arranged on a side of the conductive carrier element facing away from the LED semiconductor body.
• the Staud is different from a AufwachsSubstrat for the LED semiconductor body.
• the growth substrate is removed from the semiconductor body.
• the semiconductor body is in particular a thin-film semiconductor body.
• a thin-film semiconductor body is characterized in particular by at least one of the following characteristic features: on a first main surface of a radiation-generating epitaxial layer sequence facing a carrier element, a reflective layer is deposited or formed which reflects at least a portion of the electromagnetic radiation generated in the epitaxial layer sequence back into it ; the epitaxial layer sequence has a thickness in the range of 20 ⁇ m or less, in particular in the range of 10 ⁇ m; and the epitaxial layer sequence includes at least one semiconductor layer having at least one surface which has a blending structure which, in the ideal case, results in an approximately ergodic distribution of the light in the epitaxial epitaxial layer sequence, i. it has as ergodically stochastic scattering behavior as possible.
• a basic principle of a thin-film light-emitting diode chip is described, for example, in I. Schnitzer et al. , Appl. Phys. Lett. 63 (16), 18 October 1993, 2174 - 2176, the disclosure of which is hereby incorporated by reference.
• a thin-film light-emitting diode chip is to a good approximation a Lambert surface radiator and is particularly suitable for headlight and projection applications.
• the intensity of coupled-out radiation per luminous area is advantageously increased, in particular within a narrow emission angle.
• the removal of the growth substrate can be effected mechanically, thermally or by means of a laser lift-off method.
• Thin-film semiconductor bodies are characterized by an advantageous low forward voltage and a high efficiency in radiation generation.
• thin-film semiconductor bodies are not limited by the boundary conditions necessary for the epitaxy, so that the carrier elements can be optimized, for example, with respect to their thermal conductivity or their cost.
• a reflection layer for reflecting the radiation generated in the LED semiconductor body in the direction of the photonic crystal is arranged between the LED semiconductor body and the carrier element.
• this can additionally increase the luminance.
• the reflection layer preferably contains a metal.
• the reflection layer particularly preferably contains at least one of the materials Au, Al, Zn and Ag.
• the reflective layer may be in the form of a metallic layer or a composite of a metallic one Layer and a TCO (Transparent Conductive Oxide) layer may be formed, wherein the TCO layer may contain, for example, indium oxide, tin oxide, indium tin oxide (ITO) or zinc oxide.
• TCO Transparent Conductive Oxide
• the reflection layer can be formed as a composite of a metallic layer and a structured layer, wherein the structured layer contains in particular an electrically insulating material, for example a silicon nitride or a silicon oxide, and in particular has openings, which are preferably filled with the material of the metallic layer ,
• the reflection layer moreover has sufficient electrical conductivity so that a current can flow through the reflection layer.
• the photonic crystal is arranged on a side of the LED semiconductor body facing away from the carrier element.
• the photonic crystal can take on an electrical function in addition to the optical function and be designed such that it serves for current expansion.
• the photonic crystal is arranged between the reflection layer and the LED semiconductor body. Also in this case, the photonic crystal can contribute to the improvement of the electrical properties in the LED semiconductor body.
• a tunnel junction is formed between the first and the second active layer.
• This tunnel junction serves as an electrical connection between the first and second active layers.
• Tunnel junction may be formed by means of a highly doped layer of a first conductivity type and a highly doped layer of a second conductivity type.
• the first and the second active layer are arranged in the same direction, so that their pn junctions form a pn-pn or np-np structure, wherein the pn junctions are electrically connected in series by means of the intermediate tunnel junction.
• three or more active layers may also be vertically stacked in an LED semiconductor body. are connected in a corresponding manner by a respective tunnel junction formed between two adjacent active layers.
• the pn junctions of the first and the second active layer are formed in opposite directions to each other, so that thus a pn-np or np-pn structure is formed.
• the active layers can be connected in parallel.
• the LED semiconductor body may contain a phosphide-based compound semiconductor material.
• the compound semiconductor material the composition Al n Ga 1 N In I _ n - m P where O ⁇ n ⁇ l, 0 ⁇ m ⁇ 1 and n + m ⁇ . 1
• the LED semiconductor body may contain an arsenide-based compound semiconductor material.
• the compound semiconductor material the composition Al n Ga Tn In 1 - H - In As, wherein 0 ⁇ n ⁇ 1, 0 ⁇ m ⁇ 1 and n + m ⁇ 1.
• the LED semiconductor body preferably one of the two active layers or both active layers, may contain a nitride-based compound semiconductor material.
• the compound semiconductor material has in particular the composition Al n Ga m Ini-. n -. m N, where O ⁇ n ⁇ l, 0 ⁇ m ⁇ 1 and n + m ⁇ 1.
• the LED semiconductor body emits radiation preferably in the vertical direction.
• an emission angle ⁇ ⁇ 30 ° can be achieved.
• the LED semiconductor body with such a narrow radiation angle is particularly suitable for projection applications.
• the LED semiconductor body according to the invention is preferably used as a radiation source in a radiation-emitting component. Both the radiation-emitting component and the LED semiconductor body are particularly suitable for projection applications.
• the figure shows a schematic sectional view of an embodiment of an inventive LED semiconductor body.
• the LED semiconductor body 1 shown in the figure has three radiation-generating active layers 31, 32 and 33, which are arranged one above the other in the vertical direction, that is perpendicular to a main extension direction of the active layers 31, 32 and 33.
• the active layers 31, 32 and 33 each belong to a layer stack I, II and III.
• the layer stacks I, II and III also each have a layer 21, 22, 23 of a first
• Conductive type and a layer 41, 42, 43 of a second conductivity type are respectively disposed between the first conductivity type layer 21, 22, 23 and the second conductivity type layer 41, 42, 43.
• the layer stacks I and II as well as the layer stacks II and III are interconnected by means of a tunnel junction 5.
• the tunnel junction 5 may comprise a highly doped layer of the first conductivity type and a highly doped layer of the second conductivity type. In this way, an efficient tunnel junction can be formed with a low electrical contact resistance during operation.
• the total amount of radiation generated is advantageously increased. Since the dimensions of the LED semiconductor body 1 change only insignificantly compared to an LED semiconductor body with only a single active layer, and in particular the luminous area of the LED semiconductor body 1 is independent of the number of active layers, the luminance is also advantageously increased.
• the semiconductor body 1 is applied to a carrier element 9. Between the support element 9 and the Semiconductor body 1 is preferably a reflection layer 8 is arranged. Particularly preferably, both the reflection layer 8 and the carrier element 9 are electrically conductive. Further, the carrier element 9 is provided on a side facing away from the semiconductor body 1 with a rear side contact 11. Accordingly, a front side contact 10 is formed on a side of the LED semiconductor body 1 opposite the carrier element 9. Thus, a vertically conductive component is formed, which is characterized by a comparatively homogeneous current distribution within the LED semiconductor body.
• the LED semiconductor body 1 is grown on a separate growth substrate and subsequently mounted on the carrier element 9, for example by means of soldering, bonding or gluing, wherein preferably the growth substrate is detached from the LED semiconductor body.
• the reflection layer 8 can be formed, for example, as a Bragg mirror, a metallic layer or a composite of a metallic layer and a TCO layer, wherein the TCO layer may contain, for example indium tin oxide or zinc oxide.
• the reflection layer 8 can be formed as a composite of a metallic layer and a structured layer, wherein the structured layer contains in particular an electrically insulating material, for example a silicon nitride or a silicon oxide, and in particular has openings, which are preferably filled with the material of the metallic layer are.
• the LED semiconductor body 1 On the radiation outcoupling side, the LED semiconductor body 1 has a photonic crystal 6 for increasing the radiation yield or the luminance.
• the photonic crystal 6 has first regions ⁇ a with a first refractive index and second regions 6b with a second refractive index. While the second regions 6b are preferably formed from a semiconductor material used for the semiconductor body 1, the regions 6a are introduced as recesses in a semiconductor layer arranged downstream of the layer 43 of the second conductivity type.
• the depressions may be unfilled or filled with air or, alternatively, filled with a filling material which in particular has a different refractive index than the semiconductor material.
• the second regions 6b are contiguous. Furthermore, the first regions 6a are surrounded by the second regions 6b.
• the first regions 6a are cylindrical. However, the invention is not limited to this form.
• the first regions 6a are regularly arranged in the semiconductor layer, so that a two-dimensional lattice results due to this arrangement.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Led Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=39052746

Family Applications (1)

Country Status (8)

Families Citing this family (9)

Family Cites Families (11)

• 2006
  • 2006-09-28 DE DE102006046037.5A patent/DE102006046037B4/de active Active
• 2007
  • 2007-08-28 KR KR1020097008598A patent/KR101406385B1/ko active IP Right Grant
  • 2007-08-28 EP EP07817459A patent/EP2067179A1/de not_active Withdrawn
  • 2007-08-28 JP JP2009529514A patent/JP2010505245A/ja active Pending
  • 2007-08-28 CN CNA2007800433665A patent/CN101542755A/zh active Pending
  • 2007-08-28 WO PCT/DE2007/001536 patent/WO2008040274A1/de active Application Filing
  • 2007-08-28 US US12/443,338 patent/US8115219B2/en active Active
  • 2007-09-04 TW TW096132818A patent/TWI362764B/zh active

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events