EP2064596B1 - Zweistufiges positionierungs- und schaltsystem - Google Patents

Zweistufiges positionierungs- und schaltsystem Download PDF

Info

Publication number
EP2064596B1
EP2064596B1 EP06828232.6A EP06828232A EP2064596B1 EP 2064596 B1 EP2064596 B1 EP 2064596B1 EP 06828232 A EP06828232 A EP 06828232A EP 2064596 B1 EP2064596 B1 EP 2064596B1
Authority
EP
European Patent Office
Prior art keywords
object stage
connector
stage
supporting structure
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP06828232.6A
Other languages
English (en)
French (fr)
Other versions
EP2064596A1 (de
EP2064596A4 (de
Inventor
Xiaoping Li
Yingsheng Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Publication of EP2064596A1 publication Critical patent/EP2064596A1/de
Publication of EP2064596A4 publication Critical patent/EP2064596A4/de
Application granted granted Critical
Publication of EP2064596B1 publication Critical patent/EP2064596B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Definitions

  • the present invention relates to the field of motion positioning techniques, particularly to a dual stage positioning and switching system.
  • a dual stage positioning and switching system is used for the switch of two wafer stages.
  • the wafer stages cooperate with the base, X-direction guide bars, Y-direction guide bars, motion positioning detectors, linear gratings, etc. to complete the switching process.
  • the above system can be used in the field of lithography machine manufacturing.
  • a lithography machine which exposes and transfers the design pattern of a chip onto the photoresist coated on a wafer, is one of the important devices used in IC chip manufacturing.
  • a main part of a lithography machine is the wafer stage positioning and switching system, whose operation accuracy and running speed greatly influences the throughput of a lithography machine.
  • a complete exposure process comprises such sub-processes as wafer loading, pre-alignment, alignment, level adjustment detection, exposure, wafer unloading, etc.
  • the wafer stage of the pre-processing workstation carries out wafer loading/unloading, pre-alignment, alignment, level adjustment detection and other pre-processing steps, while the wafer stage of the exposure workstation carries out the exposure steps.
  • the two workstations operate simultaneously to shorten the cycle of the exposure process of a wafer, and thereby improving the throughput of the lithography machine.
  • a lithography machine adopting dual stage structure comprises from the top down an illumination system 17, a reticle stage positioning system 16, a projection object lens system 15, a focus and level adjustment detecting system 14, an alignment system 13, a first wafer stage positioning unit 2a for the pre-processing workstation, a second wafer stage positioning unit 2b for the exposure workstation, and a base 1.
  • Present dual stage structures can achieve the positioning and switching of two wafer stages, for example, the multi-table lithographic apparatus described in EP1111471A , in which substrate tables (WTa, WTb) may be exchanged between a first working zone where substrates (Wa, Wb) are loaded onto and removed from the table and a second working zone where wafers are exposed, collision prevention means are provided to present collisions between tables in the exchange process.
  • the collision prevention means may be formed of a labyrinth or a revolving door.
  • the exchange process may be controlled by shuttles, optionally including drive means, that are interlinked so that the tables can only be exchanged between zones together.
  • a wafer stage has a lot of cables connected thereto, such as the gas supplying pipelines, the control lines for adjusting the vertical (Z-direction) positions of the wafer stages, cables of the sensors for detecting the X and Y direction positions of the wafer stages and other sensor circuits, cables of the circuit that controls the loading and unloading of the wafer, etc.
  • a cable stage is needed to collect all the above cables, and it must be controlled to move synchronously with the wafer stage.
  • the operation of the cable stage directly influences the motion positioning accuracy and the dynamic performance of the wafer stage, thus increasing the cost of the dual stage structure as well as the difficulty in the positioning and switching of the two stages.
  • the stages are likely to interfere with each other, and the paths of the stages may also overlap. Therefore, devices for preventing collision between the stages are needed, so that the manufacturing cost is raised.
  • the present invention is set forth as follows: the system comprises at least a base, a first object stage positioning unit disposed on the base for a first workstation, and a second object stage positioning unit for a second workstation; each of the object stage positioning units comprising at least a supporting structure, an X-direction guide bar, a Y-direction guide bar, and a motion positioning detector.
  • the supporting structure comprises an object stage connector, and an object stage moving relative to the object stage connector.
  • the object stage positioning unit further comprises a driver connecting to the object stage connector and driving the connector to move along the X-direction guide bar.
  • the X-direction guide bars are positioned on and movable along the Y-direction guide bars.
  • the system further comprises an object stage connector for transitional use during a switching process, which is positioned on one side of the base; during the switching process, the supporting structure of the second object stage positioning unit can be connected to the object stage connector for transitional use and also connected to the supporting structure of the first object stage positioning unit such that the supporting structures and the object stage connector for transitional use are located on a central axis of the base so that the object stage can move from the object stage connector of the supporting structure of the second object stage positioning unit to the object stage connector for transitional use and the object stage of the supporting structure of the first object stage positioning unit can be moved to the object stage connector of the supporting structure of the second object stage positioning unit.
  • the first workstation will be a pre-processing workstation, and the second workstation will be an exposure workstation.
  • the object stage positioning unit is a wafer stage positioning unit.
  • the supporting structure is a wafer supporting structure.
  • the object stage is a wafer stage, and the object stage connector is a wafer stage connector.
  • the supporting structures are connected to the base via gas levitation or magnetic levitation to reduce the friction between the structures and the X, Y-direction guide bars during movement.
  • the supporting structure further comprises a linear motor, a gas levitation bearing, a pair of circuit contacts respectively belonging to the object stage and the object stage connector, a fastener, and a vacuum pipeline unit, wherein, the linear motor, including a permanent magnet and a winding, is used for driving the supporting structure during dual stage switching; the fastener is used to fix the object stage with the object stage connector of the supporting structure; the circuit contacts are used to connect the object stage with the object stage connector; the vacuum pipeline unit, including a vacuum pipeline and an energy storage device, is used to create a temporary vacuum environment during the switching process.
  • the object stage is supported by the object stage connector via gas levitation bearings.
  • the gas levitation bearings can be vacuum preload gas levitation bearings or permanent magnetic preload gas levitation bearings, which are used to reduce the friction during the switching movements of the object stages.
  • the motion positioning detector is a laser interferometer, used for level adjustment detection and alignment at the pre-processing workstation and for exposure position measurement and positioning at the exposure workstation.
  • a linear grating is disposed on at least one of the X-direction guide bars and at least one of the Y-direction guide bars. The linear gratings cooperate with the motion positioning detectors to measure and feedback the position information of the wafer supporting structures.
  • the present invention has the advantage that the two workstations of the dual stage structure do not overlap, eliminating the interference between the two stages, and thereby improving the reliability of the system.
  • the present invention will be described in detail by reference to the drawings and the preferred embodiment.
  • the preferred embodiment is a dual stage positioning and switching system used in the field of lithography machine manufacturing.
  • Fig. 2 shows a layout of the dual stage positioning system of the present invention.
  • the system comprises a base 1, a first wafer stage positioning unit disposed on the base 1 for a pre-processing workstation, and a second wafer stage positioning unit disposed on the base 1 for an exposure workstation.
  • the first wafer stage positioning unit for the pre-processing workstation comprises a wafer supporting structure 2a, a driver 22a, motion positioning detectors 50a, 51a, an X-direction guide bar 30a, Y-direction guide bars 31a, 31b, and linear gratings 40a, 41a, 42a disposed respectively on the guide bars.
  • the second wafer stage positioning unit for the exposure workstation comprises a wafer supporting structure 2b, a driver 22b, motion positioning detectors 50b, 51b, an X-direction guide bar 30b, Y-direction guide bars 31a, 31b, and linear gratings 40b, 41b, 42b disposed respectively on the guide bars.
  • Y-direction guide bars 31a and 31b belong to both of the workstations.
  • Motion positioning detectors 50a, 51a, 50b, 51b are used for real-time detection and control of the alignment, level adjustment detection at the pre-processing workstation and the exposure position determination at the exposure workstation.
  • the motion positioning detectors are laser interferometers.
  • Linear gratings 40a, 41a, 42a, 40b, 41b, 42b are used as position feedback devices of the X-direction guide bars, the Y-direction guide bars and the wafer supporting structures. The linear gratings cooperate with the laser interferometers to control the process of dual stage switching.
  • Each of the X-direction guide bars 30a, 30b and Y-direction guide bars 31a, 31b has a long-distance linear motor installed therein (not shown in the figure).
  • X-direction guide bars are positioned on Y-direction guide bars, and can move along Y-direction guide bars driven by the linear motors.
  • Wafer supporting structures 2a, 2b are connected to the base 1 via gas levitation or magnetic levitation.
  • the apparatus 2a, 2b are driven by the linear motors to move in the X or Y direction without friction.
  • the wafer supporting structure 2a comprises a wafer stage 20a and a wafer stage connector 21a.
  • the wafer supporting structure 2b comprises a wafer stage 20b and a wafer stage connector 21b.
  • the wafer stages and the wafer stage connectors can move relative to each other.
  • a third wafer stage connector 21c is positioned at the center of the Y-direction guide bar 31b, for transitional use during the switching process.
  • Fig. 3 is a schematic view of the wafer supporting structure of the present invention.
  • the wafer supporting structure comprises a wafer stage 20, and a wafer stage connector 21 supporting the wafer stage 20.
  • the stage 20 and the connector 21 are connected and driven by the following structure comprising: a permanent magnet 230 of the linear motor, a winding 240 of the linear motor, a gas levitation bearing 220, a pair of circuit contacts 200, a fastener 260, and a vacuum pipeline unit 250.
  • the vacuum pipeline unit 250 is composed of a vacuum pipeline and an energy storage device.
  • the unit 250 keeps the wafer stage 20 under a temporary vacuum status under the control of the vacuum pipeline controller set inside the wafer stage connector 21, so that the wafer will be kept absorbed to the wafer stage when the two stages are switching.
  • the wafer stage 20 is supported by the gas levitation bearing 220, and is driven by the linear motor to perform frictionless movements.
  • the gas levitation bearing 220 can be a vacuum preload gas levitation bearing or a permanent magnetic preload gas bearing.
  • a fastener 260 is used to fix the wafer stage 20 to the wafer stage connector 21.
  • the circuit contacts 200 separate with each other during the switching process, and connect to each other under other circumstances.
  • Figs. 4-11 show the switching process of the two wafer stages of the present invention.
  • Fig. 4 is a top plan view of the two wafer stages at the switching position.
  • the wafer supporting structure 2b of the exposure workstation is connected to the transitional wafer stage connector 21c, and is also connected to the wafer supporting structure 2a of the pre-processing workstation. These three components are all located on the central axis of the base.
  • Fig. 5 is a top plan view of the wafer stage 20b moving to the wafer stage connector 21c.
  • the pair of circuit contacts 200 separate with each other, so that the wafer stage 20b can move from the wafer stage connector 21b to the transitional wafer stage connector 21c under the drive of the linear motor.
  • the wafer is kept absorbed to the wafer stage under the vacuum enviromnent provided by the vacuum pipeline of the wafer stage.
  • Fig. 6 is a top plan view of the wafer stage 20b moved to the wafer stage connector 21c. At this time, the wafer stage connector 21b of the exposure workstation is ready to receive the wafer stage 20a of the pre-processing workstation.
  • Fig. 7 is a top plan view of the wafer stage 20a moved to the wafer stage connector 21b. At this time, the process of switching the wafer from the pre-processing workstation to the exposure workstation is finished.
  • Fig. 8 is a top plan view of the wafer stage 20a and the wafer stage connector 21b at the exposure position.
  • the wafer stage positioning unit at the exposure workstation i.e. the wafer stage 20a and the wafer stage connector 21b, is moved to the right portion of the Y-direction guide bar (the exposure workstation) with the X-direction guide bar 30b.
  • a series of predetermined exposure steps can be carried out without interfering with the wafer stage connector 21a at the pre-processing workstation.
  • the wafer stage connector 21a is ready to move in the X-direction to the transitional wafer stage connector 21c and connect with the connector 21c, in order to receive the wafer stage 20b presently supported by the wafer stage connector 21c.
  • Fig. 9 is a top plan view of the wafer stage connector 21a connected to the wafer stage connector 21c.
  • the wafer stage connector 21a moves to and connects to the wafer stage connector 21c, ready to receive the wafer stage 20b, which has finished the exposure process and is presently supported by the connector 21c.
  • Fig. 10 is a top plan view of the wafer stage 20b moved to the wafer stage connector 21a.
  • the wafer stage 20b originally supported by the transitional wafer stage connector 21c is driven by the linear motor to move to the wafer stage connector 21a of the pre-processing workstation. At this time, the process of switching the wafer from the exposure workstation to the pre-processing workstation is finished.
  • Fig. 11 is a top plan view of the wafer stage 20b and the wafer stage connector 21a at the pre-processing position.
  • the wafer stage positioning unit at the pre-processing workstation i.e. the wafer stage 20b and the wafer stage connector 21a, is moved to the left portion of the Y-direction guide bar (the pre-processing workstation) with the X-direction guide bar 30a, so that a series of pre-processing steps such as wafer loading/unloading, pre-alignment, alignment, level adjustment detection can be carried out at the pre-processing workstation.
  • the two wafer stage positioning units move to the switching position (see fig. 4 ) and repeat the cycle of dual stage switching as shown in figs. 4-11 , thereby continuously and completely carrying out the wafer exposure processes.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Claims (11)

  1. Ein Zwei-Bühnen-Positionier- und Wechselsystem, welches aufweist mindestens eine Basis (1), eine auf der Basis (1) angeordnete erste Objektbühnen-Positioniereinheit für eine erste Arbeitsstation und eine zweite Objektbühnen-Positioniereinheit für eine zweite Arbeitsstation, wobei jede von den Objektbühnen-Positioniereinheiten mindestens eine Stützstruktur (2a/2b), eine X-Richtungs-Führungsschiene (30a/30b), eine Y-Richtungs-Führungsschiene (31a/31b) und einen Bewegungspositionierdetektor (50a, 51a/50b, 51b) aufweist, wobei die Stützstruktur (2a/2b) ein Objektbühnen-Verbindungsstück (21a/21b) und eine Objektbühne (20a/20b) aufweist, die sich relativ zu dem Objektbühnen-Verbindungsstück (21a/21b) bewegt, wobei die Objektbühnen-Positioniereinheit ferner ein Antriebselement (22a/22b) aufweist, das mit dem Objektbühnen-Verbindungsstück (21a/21b) verbunden ist und das Verbindungsstück (21a/21b) antreibt, um sich entlang der X-Richtungs-Führungsschiene (30a/30b) zu bewegen, wobei die X-Richtungs-Verbindungsschienen (30a, 30b) auf den Y-Richtungs-Führungsschienen (31a, 31b) positioniert und entlang diesen bewegbar sind, dadurch gekennzeichnet, dass das System ferner ein Objektbühnen-Verbindungsstück (21c) für eine Übergangsnutzung während eines Wechselvorgangs aufweist, das auf einer Seite der Basis (1) positioniert ist,
    weiter dadurch gekennzeichnet, dass das System derart konfiguriert ist, dass während des Wechselvorgangs die Stützstruktur (2b) der zweiten Objektbühnen-Positioniereinheit mit dem Objektbühnen-Verbindungsstück (21c) für eine Übergangsnutzung verbunden und auch mit der Stützstruktur (2a) der ersten Objektbühnen-Positioniereinheit verbunden werden kann, so dass die Stützstrukturen (2a, 2b) und das Objektbühnen-Verbindungsstück (21c) zur Übergangsnutzung auf einer zentralen Achse der Basis (1) angeordnet sind, so dass sich die Objektbühne (20b) von dem Objektbühnen-Verbindungsstück (21b) der Stützstruktur (2b) der zweiten Objektbühnen-Positioniereinheit zum Objektbühnen-Verbindungsstück (21c) zur Übergangsnutzung bewegen kann und die Objektbühne (20a) der Stützstruktur (2a) der ersten Objektbühnen-Positioniereinheit zu dem Objektbühnen-Verbindungsstück (21b) der Stützstruktur (2b) der zweiten Objektbühnen-Positioniereinheit bewegt werden kann.
  2. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass die erste Arbeitsstation eine Vorbearbeitungs-Arbeitsstation ist und die zweite Arbeitsstation eine Belichtungs-Arbeitsstation ist.
  3. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass die Objektbühnen-Positioniereinheit eine Waferbühnen-Positioniereinheit ist.
  4. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass die Stützstruktur (2a/2b) eine Wafer-Stützstruktur ist.
  5. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass die Objektbühne (20a/20b) eine Waferbühne ist, das Objektbühnen-Verbindungsstück (21a/21b/21c) ein Waferbühnen-Verbindungsstück ist.
  6. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 oder 4 beansprucht, dadurch gekennzeichnet, dass die Stützstruktur (2a/2b) über Gasschweben oder Magnetschweben mit der Basis (1) verbunden ist.
  7. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 oder 4 beansprucht, dadurch gekennzeichnet, dass die Stützstruktur (2a/2b) ferner einen Linearmotor, ein Gas-Schwebe-Lager (220), ein Paar von Schaltkreiskontakten (200), eine Befestigungsvorrichtung (260) und eine Vakuumleitungseinheit (250) aufweist, wobei die Objektbühne (20a/20b) über das Gas-Schwebe-Lager (220), die Schaltkreiskontakte (200) und die Befestigungsvorrichtung (260) mit dem Objektbühnen-Verbindungsstück (21a/21b) verbunden ist.
  8. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 7 beansprucht, dadurch gekennzeichnet, dass die Vakuumleitungseinheit (250) eine Vakuumleitung und eine Energiespeichervorrichtung aufweist.
  9. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 7 beansprucht, dadurch gekennzeichnet, dass das Gas-Schwebe-Lager (220) aus der Gruppe bestehend aus einem Vakuumvorspannungs-Gas-Schwebe-Lager und einem Permanentmagnetvorspannungs-Gas-Schwebe-Lager ausgewählt ist.
  10. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass der Bewegungspositionierdetektor (50a/51a/50b/51b) ein Laserinterferometer ist.
  11. Das Zwei-Bühnen-Positionier- und Wechselsystem wie in Anspruch 1 beansprucht, dadurch gekennzeichnet, dass ein lineares Gitter (40a/40b; 42a, 42b/41a, 41b) auf mindestens einer der X-Richtungs-Führungsschienen (30a/30b) und mindestens einer der Y-Richtungs-Führungsschienen (31a/31b) positioniert ist.
EP06828232.6A 2006-09-22 2006-12-04 Zweistufiges positionierungs- und schaltsystem Active EP2064596B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2006101164536A CN100468212C (zh) 2006-09-22 2006-09-22 双台定位交换系统
PCT/CN2006/003270 WO2008037131A1 (en) 2006-09-22 2006-12-04 Dual stage positioning and switching system

Publications (3)

Publication Number Publication Date
EP2064596A1 EP2064596A1 (de) 2009-06-03
EP2064596A4 EP2064596A4 (de) 2011-02-02
EP2064596B1 true EP2064596B1 (de) 2017-09-06

Family

ID=37817398

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06828232.6A Active EP2064596B1 (de) 2006-09-22 2006-12-04 Zweistufiges positionierungs- und schaltsystem

Country Status (4)

Country Link
US (1) US8134689B2 (de)
EP (1) EP2064596B1 (de)
CN (1) CN100468212C (de)
WO (1) WO2008037131A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2938172Y (zh) * 2006-07-18 2007-08-22 上海微电子装备有限公司 双台轮换曝光精密定位系统
CN100470379C (zh) 2007-07-19 2009-03-18 清华大学 一种光刻机硅片台双台交换系统
TWI547769B (zh) * 2007-12-28 2016-09-01 尼康股份有限公司 An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method
US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8760629B2 (en) 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8902402B2 (en) 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) * 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
CN101551598B (zh) * 2009-04-03 2010-12-01 清华大学 一种光刻机硅片台双台交换系统
CN101551599B (zh) * 2009-04-03 2011-07-20 清华大学 一种光刻机硅片台双台交换系统
US8970820B2 (en) * 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
CN102566292B (zh) * 2010-12-30 2014-06-18 上海微电子装备有限公司 双工件台交换结构及其交换方法
WO2013143777A2 (en) * 2012-03-27 2013-10-03 Asml Netherlands B.V. Substrate table system, lithographic apparatus and substrate table swapping method
CN102707578B (zh) * 2012-05-28 2014-06-18 清华大学 一种双台交换激光尺测量信号切换装置及方法
CN107278279B (zh) * 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
KR20230107706A (ko) 2015-02-23 2023-07-17 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고디바이스 제조 방법
CN111158220A (zh) 2015-02-23 2020-05-15 株式会社尼康 测量装置及方法、光刻系统、曝光装置及方法
CN112147849B (zh) * 2019-06-28 2022-02-18 上海微电子装备（集团）股份有限公司 一种曝光装置、光刻设备及曝光方法
CN113917792A (zh) * 2021-09-22 2022-01-11 哈尔滨工业大学 一种工件台移动装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1582932A2 (de) * 2004-03-31 2005-10-05 Canon Kabushiki Kaisha Positionierungsvorrichtung, Belichtungsapparat, und Verfahren zur Herstellung einer Vorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3265670B2 (ja) * 1993-01-21 2002-03-11 株式会社ニコン ステージ装置、ステージ駆動方法、及び露光装置
TWI242113B (en) * 1998-07-17 2005-10-21 Asml Netherlands Bv Positioning device and lithographic projection apparatus comprising such a device
JP3687389B2 (ja) 1999-02-16 2005-08-24 ウシオ電機株式会社 基板処理装置
TWI223734B (en) * 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
EP1111471B1 (de) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung
TW591342B (en) * 2000-11-30 2004-06-11 Asml Netherlands Bv Lithographic projection apparatus and integrated circuit manufacturing method using a lithographic projection apparatus
CN1332268C (zh) 2002-07-11 2007-08-15 Asml荷兰有限公司 基底固定件以及器件制造方法
JP4604452B2 (ja) 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
KR101861493B1 (ko) 2003-04-11 2018-05-28 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
JP2005038874A (ja) 2003-07-15 2005-02-10 Nikon Corp ステージ装置及び露光装置
CN100504614C (zh) 2006-04-14 2009-06-24 上海微电子装备有限公司 步进扫描光刻机双台交换定位系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1582932A2 (de) * 2004-03-31 2005-10-05 Canon Kabushiki Kaisha Positionierungsvorrichtung, Belichtungsapparat, und Verfahren zur Herstellung einer Vorrichtung

Also Published As

Publication number Publication date
WO2008037131A1 (en) 2008-04-03
CN100468212C (zh) 2009-03-11
US8134689B2 (en) 2012-03-13
US20100045961A1 (en) 2010-02-25
EP2064596A1 (de) 2009-06-03
CN1924712A (zh) 2007-03-07
EP2064596A4 (de) 2011-02-02

Similar Documents

Publication Publication Date Title
EP2064596B1 (de) Zweistufiges positionierungs- und schaltsystem
EP2041622B1 (de) Präzises positionierungssystem für die belichtung mit zwei austauschbaren trägerplatten
US7289194B2 (en) Positioning apparatus, exposure apparatus, and device manufacturing method
EP1197801B1 (de) Lithographisches Gerät mit zwei Objekthaltern
CN100470371C (zh) 曝光装置及器件制造方法
USRE40043E1 (en) Positioning device having two object holders
US6414742B1 (en) Stage apparatus, and exposure apparatus and device manufacturing method using the same
TWI689793B (zh) 曝光裝置及曝光方法、以及元件製造方法
WO2007118376A1 (en) Dual stage switching positioning system for step and scan lithography machine
US20030076482A1 (en) Two stage method
US9030648B2 (en) Dual wafer stage exchanging system for lithographic device
JPH10163099A (ja) 露光方法及び露光装置
JP2010072615A (ja) スキャン露光装置およびスキャン露光装置の基板搬送方法
KR20060052089A (ko) 위치결정장치, 노광장치 및 디바이스 제조방법
CN103534787A (zh) 基板的更换装置
JPH10289943A (ja) ステージ装置およびデバイス製造方法
US6318538B1 (en) Device for treatment of a substrate
CN108663907B (zh) 基底台系统、光刻设备和光刻方法
KR100536209B1 (ko) 2개의물체홀더를구비한위치결정장치
EP1450208A1 (de) Lithographischer Apparat mit zwei Objekthaltern
JP2003332218A (ja) 露光装置および露光方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20090327

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR GB NL

A4 Supplementary search report drawn up and despatched

Effective date: 20110103

17Q First examination report despatched

Effective date: 20150121

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20170331

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB NL

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO.,

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602006053572

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 12

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602006053572

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20180607

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231107

Year of fee payment: 18

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20231219

Year of fee payment: 18

Ref country code: FR

Payment date: 20231106

Year of fee payment: 18

Ref country code: DE

Payment date: 20231214

Year of fee payment: 18