EP2044623A4 - Procédé et système d'intégration séquentielle de traitement isolé et discret - Google Patents

Procédé et système d'intégration séquentielle de traitement isolé et discret

Info

Publication number
EP2044623A4
EP2044623A4 EP07840397A EP07840397A EP2044623A4 EP 2044623 A4 EP2044623 A4 EP 2044623A4 EP 07840397 A EP07840397 A EP 07840397A EP 07840397 A EP07840397 A EP 07840397A EP 2044623 A4 EP2044623 A4 EP 2044623A4
Authority
EP
European Patent Office
Prior art keywords
isolated
process sequence
sequence integration
discretized
discretized process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07840397A
Other languages
German (de)
English (en)
Other versions
EP2044623A2 (fr
Inventor
Tony P Chiang
Richard R Endo
James Tsung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intermolecular Inc
Original Assignee
Intermolecular Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/672,473 external-priority patent/US8815013B2/en
Application filed by Intermolecular Inc filed Critical Intermolecular Inc
Publication of EP2044623A2 publication Critical patent/EP2044623A2/fr
Publication of EP2044623A4 publication Critical patent/EP2044623A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
EP07840397A 2006-07-19 2007-07-12 Procédé et système d'intégration séquentielle de traitement isolé et discret Withdrawn EP2044623A4 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83224806P 2006-07-19 2006-07-19
US11/672,473 US8815013B2 (en) 2006-07-19 2007-02-07 Method and system for isolated and discretized process sequence integration
US11/672,478 US7867904B2 (en) 2006-07-19 2007-02-07 Method and system for isolated and discretized process sequence integration
PCT/US2007/073368 WO2008011329A2 (fr) 2006-07-19 2007-07-12 Procédé et système d'intégration séquentielle de traitement isolé et discret

Publications (2)

Publication Number Publication Date
EP2044623A2 EP2044623A2 (fr) 2009-04-08
EP2044623A4 true EP2044623A4 (fr) 2012-10-03

Family

ID=38957500

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07840397A Withdrawn EP2044623A4 (fr) 2006-07-19 2007-07-12 Procédé et système d'intégration séquentielle de traitement isolé et discret

Country Status (5)

Country Link
EP (1) EP2044623A4 (fr)
JP (1) JP5389645B2 (fr)
KR (1) KR101412398B1 (fr)
CN (1) CN101490834A (fr)
WO (1) WO2008011329A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102075528B1 (ko) * 2013-05-16 2020-03-03 삼성디스플레이 주식회사 증착장치, 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0150129A2 (fr) * 1984-01-24 1985-07-31 Hewlett-Packard Company Procédé et appareil pour le traitement lithographique répétitif et rotatif
US20020013022A1 (en) * 2000-05-12 2002-01-31 Shunpei Yamazaki Method of manufacturing a semiconductor device
US20020030443A1 (en) * 2000-09-08 2002-03-14 Toshimitsu Konuma Light emitting device, method of manufacturing the same, and thin film forming apparatus
US20050239294A1 (en) * 2002-04-15 2005-10-27 Rosenblum Martin P Apparatus for depositing a multilayer coating on discrete sheets
US20060012771A1 (en) * 2004-07-19 2006-01-19 Samsung Electronics Co., Ltd. System and method for manufacturing a flat panel display

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6830663B2 (en) * 1999-01-26 2004-12-14 Symyx Technologies, Inc. Method for creating radial profiles on a substrate
US6675469B1 (en) * 1999-08-11 2004-01-13 Tessera, Inc. Vapor phase connection techniques
JP2004349508A (ja) * 2003-05-22 2004-12-09 Applied Materials Inc 基体処理方法、マスク部材セット、基体処理装置、素子又は半導体装置の製造方法、及び、素子又は半導体装置の製造条件決定方法
JP2005294584A (ja) * 2004-03-31 2005-10-20 Eudyna Devices Inc 半導体装置および不純物導入用マスクならびに半導体装置の製造方法
US7491431B2 (en) * 2004-12-20 2009-02-17 Nanogram Corporation Dense coating formation by reactive deposition
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0150129A2 (fr) * 1984-01-24 1985-07-31 Hewlett-Packard Company Procédé et appareil pour le traitement lithographique répétitif et rotatif
US20020013022A1 (en) * 2000-05-12 2002-01-31 Shunpei Yamazaki Method of manufacturing a semiconductor device
US20020030443A1 (en) * 2000-09-08 2002-03-14 Toshimitsu Konuma Light emitting device, method of manufacturing the same, and thin film forming apparatus
US20050239294A1 (en) * 2002-04-15 2005-10-27 Rosenblum Martin P Apparatus for depositing a multilayer coating on discrete sheets
US20060012771A1 (en) * 2004-07-19 2006-01-19 Samsung Electronics Co., Ltd. System and method for manufacturing a flat panel display

Also Published As

Publication number Publication date
KR101412398B1 (ko) 2014-06-25
WO2008011329A3 (fr) 2008-03-20
JP2009544173A (ja) 2009-12-10
EP2044623A2 (fr) 2009-04-08
KR20090060261A (ko) 2009-06-11
WO2008011329A2 (fr) 2008-01-24
JP5389645B2 (ja) 2014-01-15
CN101490834A (zh) 2009-07-22

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DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: INTERMOLECULAR, INC.

A4 Supplementary search report drawn up and despatched

Effective date: 20120905

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 51/52 20060101ALI20120830BHEP

Ipc: C23C 14/56 20060101ALI20120830BHEP

Ipc: B05D 3/06 20060101ALI20120830BHEP

Ipc: H01L 21/67 20060101ALI20120830BHEP

Ipc: H01L 27/32 20060101ALI20120830BHEP

Ipc: H01L 21/20 20060101ALI20120830BHEP

Ipc: C23C 16/00 20060101ALI20120830BHEP

Ipc: H01L 21/677 20060101AFI20120830BHEP

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