EP2044500A1 - Kühlvorrichtung und- kühlverfahren - Google Patents

Kühlvorrichtung und- kühlverfahren

Info

Publication number
EP2044500A1
EP2044500A1 EP07766169A EP07766169A EP2044500A1 EP 2044500 A1 EP2044500 A1 EP 2044500A1 EP 07766169 A EP07766169 A EP 07766169A EP 07766169 A EP07766169 A EP 07766169A EP 2044500 A1 EP2044500 A1 EP 2044500A1
Authority
EP
European Patent Office
Prior art keywords
cooling
workstation
heat transfer
air
cooling unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07766169A
Other languages
English (en)
French (fr)
Inventor
David Leatherbarrow
Guy Hutchins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TROX AITCS Ltd
Original Assignee
TROX AITCS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TROX AITCS Ltd filed Critical TROX AITCS Ltd
Publication of EP2044500A1 publication Critical patent/EP2044500A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/06—Compression machines, plants or systems characterised by the refrigerant being carbon dioxide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
    • F25B9/008—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant being carbon dioxide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the air directing formation includes a duct for directing the air.
  • the air directing formation for example duct or hose, may be associated with and/or mounted adjacent an air outlet of the heat-generating equipment and be arranged to direct air towards the heat exchanger.
  • the duct further includes an inlet formation, wherein the inlet formation is adapted to enclose an outlet of the equipment. In this way, efficient collection of warm air exiting the equipment into the duct can be achieved.
  • the inlet formation may include a funnel for directing the air.
  • the hose end or funnel is preferably shaped so that it cannot effect a seal with the heat source; this enables additional air to flow into the device when required, for example when the air flow associated with the heat source is less than the suction fan duty.
  • the heat exchanger unit is adapted to be mountable in a space intended for a standard floor tile.
  • individual floor tiles can be replaced with heat exchanger units where workstations are to be sited on the floors.
  • workstations are arranged, for example in a row, a corresponding row of floor tiles can be replaced by heat exchanger units arranged under the workstations.
  • Also provided is a method of cooling a workstation comprising: circulating fluid through a heat transfer circuit to a heat exchanger disposed such that the heat exchanger effects removal of heat from the workstation.
  • Figure 1 shows schematically a flow diagram of an example of a primary - only cooling system
  • Figure 8 shows a further example of a heat exchanger unit
  • the cooling media system incorporates leak detection and shut-off life safety measures, along with a rejection system to deal safely with any leaked substance.
  • the pressure of CO 2 is 50 Bar which provides a circulating temperature of 14 degrees C.
  • Some arrangements enable loads of up to 5kW per workstation to be dealt with. It is also found that the air emitted at the air outlet 64 in this arrangement is close to room temperature. This can be achieved by, for example choosing an appropriate carbon dioxide flow rate and/or pressure. In some arrangements there may be benefit in providing a temperature sensor for determining the temperature of the emitted air; the output of this sensor may be used to adjust the flow rate and/or pressure to maintain a desired temperature.
  • the workstation comprises a desk including two work surfaces 342 and 344.
  • the desk comprises a back-to-back arrangement for two users and a compartment is arranged under the desk to house computer equipment 360 for both desks.
  • a similar arrangement could be used for a single desk.
  • the dividing plate allows flow in opposing directions and thus avoid the need for the equipment to be positioned so that it all faces in the same direction. Since the equipment is usually arranged such that it faces its user, the use of the dividing plate allows the system to be more flexible with regard to different desk and workstation layout possibilities. It will be appreciated that further dividing plates could be used to provide further variations in air flow and thus further flexibility in the arrangement of equipment in relation to the cooling unit.
  • a cooling unit 918 comprising plurality of floor tile-replacement units (600 mm square) is provided beneath the compartment 914.
  • the cooling unit 918 extends across the width of the desk 910
  • the air channel of the cooling unit 918 is in air communication with the inside of the compartment 914 via air inlet and outlet grilles 924, 926.
  • the computer equipment stands on a raised perforated platform 928 mounted on the floor of the compartment 914 and at least partially over the grilles 924, 926 so that air flow to the grilles is not substantially impeded by the computer equipment 916.
  • the raised platform allows air to pass into the underfloor plenum.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP07766169A 2006-07-07 2007-07-06 Kühlvorrichtung und- kühlverfahren Withdrawn EP2044500A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0613581.8A GB2439977B (en) 2006-07-07 2006-07-07 Cooling apparatus and methods for cooling
PCT/GB2007/002534 WO2008003981A1 (en) 2006-07-07 2007-07-06 Cooling apparatus and methods for cooling

Publications (1)

Publication Number Publication Date
EP2044500A1 true EP2044500A1 (de) 2009-04-08

Family

ID=36926678

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07766169A Withdrawn EP2044500A1 (de) 2006-07-07 2007-07-06 Kühlvorrichtung und- kühlverfahren

Country Status (9)

Country Link
US (1) US20090301688A1 (de)
EP (1) EP2044500A1 (de)
JP (1) JP2009543241A (de)
CN (1) CN101501606A (de)
AU (1) AU2007270954A1 (de)
CA (1) CA2656949A1 (de)
GB (1) GB2439977B (de)
RU (1) RU2009104046A (de)
WO (1) WO2008003981A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101896056A (zh) * 2009-05-21 2010-11-24 富士通株式会社 信息处理装置、控制装置以及设施
CN102026520B (zh) * 2009-09-18 2013-03-27 建准电机工业股份有限公司 散热装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2469303A (en) * 2009-04-08 2010-10-13 Weatherite Mfg Ltd Computer desk with air cooling unit
JP5610839B2 (ja) * 2010-05-11 2014-10-22 株式会社日立製作所 冷却システム
US9561703B2 (en) * 2011-06-01 2017-02-07 Mitsubishi Electric Corporation Vehicle air-conditioning device
DE202018002010U1 (de) * 2018-04-18 2018-05-29 Produktivmöbel GmbH Arbeitstisch mit lufttechnischer Einrichtung
CN112311206B (zh) * 2020-11-12 2022-04-26 苏州汇川技术有限公司 换热系统及变频器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3145774C2 (de) * 1981-11-19 1984-01-19 König & Neurath KG, 6367 Karben Arbeitstisch mit einer schmalen quaderförmigen Klimaeinrichtung
JPS58114215A (ja) * 1981-12-28 1983-07-07 Fujitsu Ltd 電子機器の冷却方法
US4434625A (en) * 1983-04-20 1984-03-06 Control Data Corporation Computer cooling system
CH666170A5 (en) * 1984-07-19 1988-07-15 Lorenz Esposito Working surface for office or bank - has stepped top with sloping extension one end, writing surface, monitor screens and ventilation equipment
DE3623097A1 (de) * 1986-07-09 1988-01-21 Werner Stadler Arbeitsplatz
JPH05184427A (ja) * 1992-01-10 1993-07-27 Hitachi Ltd 機器搭載机の冷却構造
CN2143794Y (zh) * 1992-12-24 1993-10-13 武进县崔桥电脑温控设备厂 电脑温控机台
DE4445818A1 (de) * 1994-12-21 1995-06-14 Bernhard Hilpert Computergehäuse für den Industrie-Einsatz
JPH11223358A (ja) * 1998-02-10 1999-08-17 Sanki Eng Co Ltd 情報化オフィス空間の空調方法及び装置
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US6569158B1 (en) * 1999-01-25 2003-05-27 Cryocath Technologies, Inc. Leak detection system
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
US20020105779A1 (en) * 2001-02-02 2002-08-08 Pei-Chih Lei Cooling system of a computer chassis
DE102004042890A1 (de) * 2004-08-31 2006-03-09 Ltg Ag Mit raumlufttechnischer Einrichtung versehener Tisch, insbesondere Händlertisch, sowie Verfahren zur Kühlung eines mit einem Tisch ausgestatteten Raumes und zur Kühlung von dem Tisch zugeordneten Geräten
GB2419038B (en) * 2004-09-23 2010-03-31 Trox Cooling methods and apparatus
US7617696B2 (en) * 2004-11-12 2009-11-17 Tecumseh Products Company Compact refrigeration system and power supply unit including dynamic insulation
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2008003981A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101896056A (zh) * 2009-05-21 2010-11-24 富士通株式会社 信息处理装置、控制装置以及设施
CN102026520B (zh) * 2009-09-18 2013-03-27 建准电机工业股份有限公司 散热装置

Also Published As

Publication number Publication date
CA2656949A1 (en) 2008-01-10
WO2008003981A1 (en) 2008-01-10
GB2439977A (en) 2008-01-16
GB0613581D0 (en) 2006-08-16
AU2007270954A1 (en) 2008-01-10
JP2009543241A (ja) 2009-12-03
US20090301688A1 (en) 2009-12-10
GB2439977B (en) 2012-05-16
CN101501606A (zh) 2009-08-05
RU2009104046A (ru) 2010-08-20

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