EP1976806A4 - Methods and apparatus for processing a substrate - Google Patents

Methods and apparatus for processing a substrate

Info

Publication number
EP1976806A4
EP1976806A4 EP06844980A EP06844980A EP1976806A4 EP 1976806 A4 EP1976806 A4 EP 1976806A4 EP 06844980 A EP06844980 A EP 06844980A EP 06844980 A EP06844980 A EP 06844980A EP 1976806 A4 EP1976806 A4 EP 1976806A4
Authority
EP
European Patent Office
Prior art keywords
substrate
methods
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06844980A
Other languages
German (de)
French (fr)
Other versions
EP1976806A2 (en
Inventor
Erik C Wasinger
Gary C Ettinger
Sen-Hou Ko
Wei-Yung Hsu
Liang-Yuh Chen
Ho Seon Shin
Donald Olgado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1976806A2 publication Critical patent/EP1976806A2/en
Publication of EP1976806A4 publication Critical patent/EP1976806A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
EP06844980A 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate Withdrawn EP1976806A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/299,295 US7993485B2 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/298,555 US20070131653A1 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
PCT/US2006/046765 WO2007070353A2 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Publications (2)

Publication Number Publication Date
EP1976806A2 EP1976806A2 (en) 2008-10-08
EP1976806A4 true EP1976806A4 (en) 2011-08-10

Family

ID=38163413

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06844980A Withdrawn EP1976806A4 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Country Status (5)

Country Link
EP (1) EP1976806A4 (en)
JP (2) JP2009518872A (en)
KR (1) KR101236855B1 (en)
TW (1) TWI362697B (en)
WO (1) WO2007070353A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993485B2 (en) 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US7976361B2 (en) 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP5274993B2 (en) * 2007-12-03 2013-08-28 株式会社荏原製作所 Polishing equipment
JP2014083647A (en) * 2012-10-25 2014-05-12 Avanstrate Inc Magnetic fluid for glass substrate polishing
KR102203498B1 (en) * 2013-01-31 2021-01-15 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for post-chemical mechanical planarization substrate cleaning
KR102229920B1 (en) 2013-10-25 2021-03-19 어플라이드 머티어리얼스, 인코포레이티드 Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
DE102015008814A1 (en) 2015-07-10 2017-01-12 Thielenhaus Technologies Gmbh Pressure shoe with expansion chamber
JP2017087305A (en) * 2015-11-02 2017-05-25 日本電気硝子株式会社 Polishing method and polishing device for disk-shaped work-piece
JP6920849B2 (en) * 2017-03-27 2021-08-18 株式会社荏原製作所 Substrate processing method and equipment
JP6414353B1 (en) * 2018-03-27 2018-10-31 株式会社不二越 Film wrap processing equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US20040185751A1 (en) * 2003-02-03 2004-09-23 Masayuki Nakanishi Substrate processing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
JPH081494A (en) * 1994-06-27 1996-01-09 Sanshin:Kk Wafer material edge end part polishing device
JP2924890B2 (en) * 1998-04-20 1999-07-26 トヨタ自動車株式会社 Polishing method
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP2002154041A (en) * 2000-11-17 2002-05-28 I M T Kk Polishing device
JP4156200B2 (en) * 2001-01-09 2008-09-24 株式会社荏原製作所 Polishing apparatus and polishing method
JP2005186176A (en) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd Wafer end face polishing device
CN100429752C (en) * 2004-02-25 2008-10-29 株式会社荏原制作所 Polishing apparatus and substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US20040185751A1 (en) * 2003-02-03 2004-09-23 Masayuki Nakanishi Substrate processing apparatus

Also Published As

Publication number Publication date
WO2007070353A2 (en) 2007-06-21
EP1976806A2 (en) 2008-10-08
JP2009518872A (en) 2009-05-07
TWI362697B (en) 2012-04-21
KR20080075001A (en) 2008-08-13
WO2007070353A3 (en) 2007-11-29
TW200735200A (en) 2007-09-16
KR101236855B1 (en) 2013-02-26
JP2012183637A (en) 2012-09-27

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080708

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CHEN, LIANG-YUH

Inventor name: KO, SEN-HOU

Inventor name: WASINGER, ERIK C.

Inventor name: HSU, WEI-YUNG

Inventor name: OLGADO, DONALD

Inventor name: ETTINGER, GARY C.

Inventor name: SHIN, HO, SEON

A4 Supplementary search report drawn up and despatched

Effective date: 20110707

RIC1 Information provided on ipc code assigned before grant

Ipc: C03C 15/00 20060101AFI20110701BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120207

DAX Request for extension of the european patent (deleted)