EP1950849A2 - Connecteur de filtre avec écran haute fréquence - Google Patents

Connecteur de filtre avec écran haute fréquence Download PDF

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Publication number
EP1950849A2
EP1950849A2 EP07021702A EP07021702A EP1950849A2 EP 1950849 A2 EP1950849 A2 EP 1950849A2 EP 07021702 A EP07021702 A EP 07021702A EP 07021702 A EP07021702 A EP 07021702A EP 1950849 A2 EP1950849 A2 EP 1950849A2
Authority
EP
European Patent Office
Prior art keywords
board
trace
shield
pins
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07021702A
Other languages
German (de)
English (en)
Other versions
EP1950849A3 (fr
Inventor
Neil Allan Mahaffy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITT Manufacturing Enterprises LLC
Original Assignee
ITT Manufacturing Enterprises LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITT Manufacturing Enterprises LLC filed Critical ITT Manufacturing Enterprises LLC
Publication of EP1950849A2 publication Critical patent/EP1950849A2/fr
Publication of EP1950849A3 publication Critical patent/EP1950849A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H01R13/7195—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with planar filters with openings for contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]

Definitions

  • One type of filter connector includes a pair of flexible circuit boards or board portions, with holes though which pins extend.
  • a signal trace that extends is a ring around each hole is electrically connected by a solder joint to a corresponding pin.
  • Filter components such as capacitors, each has one terminal connected to the signal trace and another terminal connected to a ground plane.
  • There is a gap between the signal trace and ground piane, and high frequency (500MHz to 1000 MH) stray signals may pass though such a gap, to circuitry that is connected to one end of the pins.
  • Such stray signals constitute EMI (electromagnetic interference) that results in "noise” in the circuitry.
  • EMI electromagnetic interference
  • a high frequency EMI (electromagnetic interference) shield is provided for a filter connector of the type wherein there is a gap between a ground trace and each of a plurality of signal traces. Also, the EMI shield is constructed to facilitate soldering of the signal traces to pins that project though holes in the signal traces.
  • the filter connector is of the type wherein filter components such as capacitors are positioned on a first insulative board with one capacitor terminal connected to a signal trace (that connects to a pin) and with a second terminal connected to a ground plane on the board. A gap must be left between the ground and signal traces to prevent short circuiting.
  • the present invention provides a second insulative board that carries a conductive trace that functions as an EMI shield.
  • the shield trace lies in a plane that is only slightly spaced from the first board (with a dielectric layer between them).
  • the shield trace covers the gap, and the shield trace may be coupled to the signal trace. Any EMI passing though the gap between the ground and signal traces, is intercepted by the shield trace and does not reach circuitry that is connected to one end of the pins.
  • Each pin is soldered to a signal trace that lies on the first circuit board that lies below the second board.
  • the pin-receiving holes in the second board have notches.
  • Each hole in the second board includes a circular portion that closely receives a pin and a notch that extends from the circular portion.
  • a dispenser that dispenses a quantity of solder (and solder flux) can be inserted though the notch to dispense solder at the ievei of the signal trace on the first board, to assure a large area connection thereat.
  • the solder also may flow to part of the shield trace at the circular part of the hole, to connect the shield trace to the pin and the signal trace.
  • Fig 1 shows a prior art filtered connector 10, which includes a plurality of pins 12 mounted on a pair of circuit board combinations 14, 16.
  • a filter connected to each pin includes a ferrite bead 20 and a pair of capacitors each mounted on one of the circuit board assemblies.
  • the ferrite bead and pair of capacitors form a Pi filter, as is described in US patent 6,896,552 .
  • the filtered connector is designed to be mounted in a grounded metal shell 18 as shown in Fig. 2 .
  • One end of the pins connects to sensitive circuitry 22 that lies in an extension of the grounded metal shell, the shell protecting such circuitry from EMI (electromagnetic interference).
  • EMI electromagnetic interference
  • Fig. 3 shows a portion of one of the pins 12 and of the two circuit board combinations 14, 16 that lie along the pin.
  • Each circuit board combination such as 14 includes a first circuit board assembly 24 that includes a dielectric board 26, which may be a flexible board.
  • the board 26 has pin receiving holes 28 that each receives one of the conductive pins 12.
  • a ground plane 30 in the form of a conductive layer or trace, lies primarily on the upper face of the first board, and a plurality of conductive signal traces 32, 60 each lies on the first board.
  • Each upper signal trace 60 extends in a ring around the pin hole.
  • the lower signal trace 32 may lie on only one side of the pin hole to reach a capacitor terminal 44.
  • a filter component 40 such as a capacitor, has one terminal 42 connected to the ground plane 30 and has another terminal 44 connected to the signal trace 32.
  • the circuit board has a plated-through aperture 50 that extends the ground plane to a ground trace 52 on the lower surface of the first board for ease in soldering to the capacitor terminal.
  • the upper signal trace is connected through a solder joint 90 to the lower signal trace. There is a gap 62 between the upper ground trace 30 and the upper signal trace 60.
  • High frequency EMI electromagnetic interference
  • EMI electromagnetic interference
  • the present invention is directed to an improvement that blocks much of such EMI from passing though the connector and reaching such circuitry.
  • Applicant provides a pair of second dielectric circuit board 70 assemblies, each with a dielectric board 75 and a conductive trace 72 thereon to serve as an EMI shield.
  • Each second board assembly is mounted facewise adjacent, and preferably against, a corresponding first board assembly.
  • the first board is a flexible circuit board
  • the second board is preferably a stiffener board.
  • the conductive shield trace 72 serves as an EMI shield trace, and lies over the gaps 62 between each signal trace 60 and the ground plane 30. Some of the high frequency EMI in the environment moves along paths 76, 78 through the gaps 62. Such EMI is intercepted by the shield trace 72 and prevented from reaching the sensitive circuitry that is connected to the pins.
  • a dielectric cover layer 74 lies against the shield trace 72 and electrically isolates it from the ground and signal traces 30, 60 on the upper surface of the first board.
  • Applicant provides the shield trace with overlapping ends 80, 82 that extend beyond a shield trace middle portion 84 that lie directly over the gap 62.
  • the overlapping ends 80, 82 lie directly over the ground and signal traces.
  • the overlapping ends block EMI that passes along an angle to the vertical V.
  • the amount of overlap required for good shielding depends upon how close the shield trace 72 is from the gaps.
  • Applicant places the shield trace so it lies vertically no more than one millimeter, and preferably no more than 0.5 millimeter from the closest gap, and places the shield trace closer to the gap than one-tenth the width of the gap. In some cases, the shield trace will lie over a majority of each gap, and preferably at least 90% of each gap, though not all of it.
  • the shield trace 72 be electrically connected to the pin 12 and to the signal trace 32.
  • the signal trace 32 (and 60) be connected to the pin.
  • Such connection is usually done though a solder joint 90.
  • the second circuit board assembly 70 would tend to block downward vertical access to the region between the pin 12 and the hole walls 32h of the signal trace 32 where solder is to be deposited.
  • Applicant facilitates the deposit of solder (which is later melted as by wave soldering in an oven) by forming the pin-receiving hole 92 in the second board 75 with a notch 100.
  • a dispenser 102 with a narrow dispenser nozzle 104 passes though the notch 100 to dispense solder into or against the region 106 that lies adjacent (preferably within one mm) to both the pin 12 and the signal trace hole walls 32h.
  • Fig. 5 shows the pin-receiving holes 92 in the second board 75.
  • Each pin-receiving hole 92 includes a circular hole portion 110 that preferably extends by an angle A of more than 180 degrees about the hole axis 112.
  • the angle A is preferably at least 220°, and is actually 300°.
  • the notch 100 projects radially away from the axis.
  • the circular hole portion 110 accurately positions the second board hole around the pins.
  • the notch 100 receives the nozzle 104 of the dispenser 102 shown in Fig. 3 , so a quantity of tiny balls of solder surrounded by solder flux is deposited at the hole walls.
  • the molten solder fillet 90 has a portion 114 that also solders the pin to the shield trace 72 at a side of the hole opposite the notch, which connects the shield trace to the signal trace 32.
  • the solder fillet should always connect to the upper and lower signal traces 32, 60.
  • applicant first constructs the lower and upper assemblies. Then applicant assembles the lower circuit board combination 16 onto the multiple pins 12. This includes placing the lower second circuit board assembly 70 ,which includes the second board 75, the shield trace 72 and dielectric cover layer 74, over the lower first circuit board assembly 24 which includes the ground and signal traces 50, 32 on a dielectric board 26 and a capacitor 40 soldered in place at each pin-receiving hole, with the pins projecting through the holes. Then, the dispenser 102 (and preferably with many more just like it) is used to lay solder deposits at the walls of the holes in the signal trace.
  • the ferrite beads 20 are placed onto the pins and the upper circuit board assembly, which is identical to the lower board assembly, is placed onto the pins.
  • the dispenser is used to lay solder deposits at the signal trace hole walls.
  • the assembly is placed in an oven to melt the solder, to produce the final assembly shown in Fig 3 .
  • solder fillet 90 is usually slightly higher at the initial deposit location.
  • each pin-receiving hole at 32h had a diameter of 30 mils (one mil equals one thousandth inch).
  • the first board 26 had a thickness of 5 mils and each second board had a thickness of 30 mils.
  • the invention provides an improvement to a connector of the type that has at least one first circuit board assembly with ground and signal traces and with a gap between them though which high frequency EMI (electromagnetic interference) energy can pass if not blocked.
  • the invention provides a second circuit board, such as a stiffener board, with a shield trace thereon, and preferably with a dielectric separation layer over the shield trace.
  • the second circuit board is laid facewise against the first circuit board, and preferably with the separation layer lying against a surface (such as the surface of a ground trace) on the first circuit board.
  • the shield trace covers most, and preferably all, of the gap between signal and ground traces of the first circuit board, and preferably overlaps most of the gap, to intercept EMI that otherwise would pass though the gap.
  • the second circuit board preferably has pin-receiving holes with circular portions and with notches that extend radially away from the hole axes.
  • a dispenser can be inserted through each notch to lay a solder deposit at the walls of the holes in the signal traces that lie on the first board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP07021702A 2006-11-20 2007-11-08 Connecteur de filtre avec écran haute fréquence Withdrawn EP1950849A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86011706P 2006-11-20 2006-11-20

Publications (2)

Publication Number Publication Date
EP1950849A2 true EP1950849A2 (fr) 2008-07-30
EP1950849A3 EP1950849A3 (fr) 2008-08-13

Family

ID=39110491

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07021702A Withdrawn EP1950849A3 (fr) 2006-11-20 2007-11-08 Connecteur de filtre avec écran haute fréquence

Country Status (4)

Country Link
EP (1) EP1950849A3 (fr)
JP (1) JP4740220B2 (fr)
KR (1) KR100962631B1 (fr)
IL (1) IL187101A0 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2405538A1 (fr) * 2010-07-06 2012-01-11 Thales Connecteur d'ensembles électroniques blindant et sans soudure électrique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115055952B (zh) * 2022-07-06 2024-03-08 珠海格力电器股份有限公司 用于功率器件装配的螺钉自动旋拧装置及旋拧方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2670054A1 (fr) 1990-11-29 1992-06-05 Radiall Sa Connecteur filtre multicontacts.
US6896552B2 (en) 2003-05-06 2005-05-24 Itt Manufacturing Enterprises, Inc. Filtered connector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131279A (ja) * 1988-11-11 1990-05-21 Konica Corp トナー回収装置
JP2868376B2 (ja) * 1992-09-07 1999-03-10 日本カーバイド工業株式会社 Ｌｃ基板及びその製造方法
JPH1027987A (ja) * 1996-07-10 1998-01-27 Hitachi Ltd 低ｅｍｉ回路基板及び低ｅｍｉケーブルコネクタ
DE10064969B4 (de) * 2000-01-20 2007-11-15 Heidelberger Druckmaschinen Ag Filtervorrichtung für mindestens eine von außen an ein Gehäuse anzuschließende elektrische Leitung
JP3678658B2 (ja) * 2001-02-21 2005-08-03 日本電気通信システム株式会社 Ｅｍｉ対策用電源ケーブルコネクタ
US7014507B1 (en) * 2004-09-01 2006-03-21 Itt Manufacturing Enterprises, Inc. Filtered connector that blocks high frequency noise

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2670054A1 (fr) 1990-11-29 1992-06-05 Radiall Sa Connecteur filtre multicontacts.
US6896552B2 (en) 2003-05-06 2005-05-24 Itt Manufacturing Enterprises, Inc. Filtered connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2405538A1 (fr) * 2010-07-06 2012-01-11 Thales Connecteur d'ensembles électroniques blindant et sans soudure électrique
FR2962601A1 (fr) * 2010-07-06 2012-01-13 Thales Sa Connecteur d'ensembles electroniques blindant et sans soudure electrique
US8598963B2 (en) 2010-07-06 2013-12-03 Thales Connector for electronic assemblies that screens and does not require soldering

Also Published As

Publication number Publication date
EP1950849A3 (fr) 2008-08-13
KR100962631B1 (ko) 2010-06-11
KR20080045624A (ko) 2008-05-23
JP2008135389A (ja) 2008-06-12
IL187101A0 (en) 2008-02-09
JP4740220B2 (ja) 2011-08-03

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