EP1898682B1 - Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen - Google Patents

Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen Download PDF

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Publication number
EP1898682B1
EP1898682B1 EP07017347A EP07017347A EP1898682B1 EP 1898682 B1 EP1898682 B1 EP 1898682B1 EP 07017347 A EP07017347 A EP 07017347A EP 07017347 A EP07017347 A EP 07017347A EP 1898682 B1 EP1898682 B1 EP 1898682B1
Authority
EP
European Patent Office
Prior art keywords
plastic
contact region
metallized
component
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP07017347A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1898682A3 (de
EP1898682A2 (de
Inventor
Bernhard Stauffer
Christine Gliss
Michael Grätz
Jens Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harting AG
Original Assignee
Harting AG
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Filing date
Publication date
Application filed by Harting AG filed Critical Harting AG
Publication of EP1898682A2 publication Critical patent/EP1898682A2/de
Publication of EP1898682A3 publication Critical patent/EP1898682A3/de
Application granted granted Critical
Publication of EP1898682B1 publication Critical patent/EP1898682B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to a plastic component according to the preamble of claim 1 and to a method for processing and metallizing plastic surfaces.
  • MID Molded Interconnect Device
  • MEMS microelectromechanical systems
  • Circuit carriers in the form of injection-molded plastic connection parts are a logical further development, in which the electrical and mechanical properties are combined to obtain a high level of integration.
  • MID's are mostly three-dimensional molded parts, which are injected from thermoplastic materials. Subsequently, the structure of the pattern is applied to the surface of the molding. There are essentially two methods. The two-component injection molding process (2K) and the laser direct structuring or LDS process.
  • EP 1 383 360 A1 discloses an injection molded conductor carrier and a method of making the same using a two-component injection molding method.
  • a material for a second carrier substrate a non-metallizable plastic material is used, which allows a laser beam activation.
  • the LDS method is in the patent application DE 101 32 092 A1 described.
  • the basis for the LDS process is doped thermoplastics.
  • a laser selectively activates areas that are subsequently metallized in a chemical bath. There are various techniques for contacting the areas activated by the laser.
  • the wire-bonding method is used.
  • the contact is made by friction or Thermoreibsch docken by means of ultrasound.
  • Wire-Bond technology is the most cost-effective solution of a bonding technique. It is therefore by far the most common technique.
  • the wires for contacting consist of gold, aluminum or copper. The diameters range from 15 - 50 ⁇ m up to several 100 ⁇ m in high current applications.
  • the end of the bonding wire is pressed by means of a needle onto the surface to be contacted and welded with a short ultrasonic pulse.
  • the ball-bonding or thermocompression method is analogous with the difference that the bonding wire is melted by means of an arc and forms a bead at the end, which then with Help of an ultrasonic pulse is welded to the contacting surface.
  • a capillary is used instead of a needle, so that the wire is guided perpendicular to the contact surface and not laterally as in wedge bonding.
  • Ball bonding is limited to gold and copper wire because heat energy is usually required.
  • wedge bonding either gold or aluminum wire is used, whereby the supply of heat energy is only necessary for gold wire.
  • a connection of the wire is made with a contact surface with a combination of pressure, heat energy and ultrasonic energy, which causes a fusion of the components.
  • the quality or durability of the bonding process is determined by various external parameters. These are composed of the parameters resulting from the process. These include contact pressure of the bonding wire to the contact surface, temperature, time and ultrasonic power. Furthermore, the quality of the bonding process depends on the materials used, the deformation, diffusion properties and their solid-state physical reactions between the different layer systems.
  • the invention is therefore based on the object to ensure a process-reliable contacting of Al or Au wires with a diameter of 20, 33 or 50 microns on a contact area consisting of electrically conductive material.
  • the plastic material is compressed below the contact area, so that in the contact area pores and / or cavities of the roughened surfaces are reduced and / or eliminated.
  • the metallized plastic surface consists of 4-10 ⁇ m Cu, 5-9 ⁇ m Ni and 0.05-0.2 ⁇ m Au and has an electrical conductor track structure, wherein the contact area for the connection of aluminum or Au bonding wires, with a diameter of 18-50 microns, is provided.
  • the object of the invention is also achieved by a method for metallizing plastic components with the features of claim 6, wherein the surface to be metallized of the component including the contact areas is roughened by laser irradiation prior to metallization, then a compression step is performed at designated contact areas, in which the surface is at least partially compressed, so that pores and / or cavities of the roughened surface are reduced and / or eliminated, and that subsequently the roughened surface is metallized.
  • the compression step is carried out by means of a punch, which was preferably heated prior to pressing on the plastic surface.
  • the advantage achieved with this invention is that the number of Fehlbondungen and thus the waste costs are significantly reduced if there are no voids or pores in the plastic below the area to be contacted. This ensures that the contact surface under pressure or pulling forces and the vibrations generated by the ultrasound is not deformed or vibrated. Furthermore, a reproducible introduction of the ultrasonic energy required for bonding is made possible. This is an essential prerequisite for a process-reliable bonding process.
  • a section through a metallized plastic surface is shown.
  • the layers consist of a gold layer 1, a nickel layer 2 and a copper layer 3.
  • a gold layer 1 a gold layer 1
  • a nickel layer 2 a nickel layer 2
  • a copper layer 3 a copper layer 3.
  • the gold layer can not be distinguished from the nickel layer due to the relative thickness of approx. 0.1 ⁇ m and therefore can not be recognized on the picture.
  • the Fig. 2 shows a section through a metallized plastic surface by a controlled coating.
  • the still existing strong formation of pores 5 prevents a secure bonding process.
  • the Fig. 3 shows the compressed plastic surface according to the invention.
  • the absence of pores below the metallization ensures a process-reliable bonding process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
EP07017347A 2006-09-05 2007-09-05 Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen Not-in-force EP1898682B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006041610A DE102006041610B3 (de) 2006-09-05 2006-09-05 Metallisierte Kunststoffoberfläche und Verfahren zum Bearbeiten von metallisierten Kunststoffoberflächen

Publications (3)

Publication Number Publication Date
EP1898682A2 EP1898682A2 (de) 2008-03-12
EP1898682A3 EP1898682A3 (de) 2009-07-01
EP1898682B1 true EP1898682B1 (de) 2011-05-11

Family

ID=38812021

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07017347A Not-in-force EP1898682B1 (de) 2006-09-05 2007-09-05 Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen

Country Status (5)

Country Link
EP (1) EP1898682B1 (da)
AT (1) ATE509512T1 (da)
DE (1) DE102006041610B3 (da)
DK (1) DK1898682T3 (da)
ES (1) ES2365936T3 (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014082623A1 (de) 2012-11-30 2014-06-05 HARTING Electronics GmbH Isolierkörper mit integriertem schirmelement
DE202016101579U1 (de) 2015-04-08 2016-04-25 Harting Electric Gmbh & Co. Kg Kapazitives Sensormodul für einen Steckverbinder

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011055117A1 (de) 2011-11-08 2013-05-08 Harting Kgaa Verfahren und Lösung zur Metallisierung von Polymeroberflächen
DE102012105257B4 (de) 2012-06-18 2018-06-07 HARTING Electronics GmbH Isolierkörper eines Steckverbinders
DE102012105256A1 (de) 2012-06-18 2013-12-19 HARTING Electronics GmbH Isolierkörper eines Steckverbinders
DE102015104838B4 (de) 2015-03-30 2018-07-19 Harting Electric Gmbh & Co. Kg Sensormodul eines modularen Steckverbinders

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192015A (en) * 1991-11-20 1993-03-09 Santa Barbara Research Center Method for wire bonding
DE10132092A1 (de) * 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
DE50209164D1 (de) * 2002-07-18 2007-02-15 Festo Ag & Co Spritzgegossener Leiterträger und Verfahren zu seiner Herstellung
DE10256719A1 (de) 2002-12-04 2004-07-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrische Kontaktstruktur sowie Verfahren zur Herstellung derselben
DE10327767A1 (de) * 2003-06-18 2005-01-05 Marconi Communications Gmbh Schaltungsbaugruppe und Herstellungsverfahren dafür

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014082623A1 (de) 2012-11-30 2014-06-05 HARTING Electronics GmbH Isolierkörper mit integriertem schirmelement
DE102012111646A1 (de) 2012-11-30 2014-06-05 HARTING Electronics GmbH Isolierkörper mit integriertem Schirmelement
DE202016101579U1 (de) 2015-04-08 2016-04-25 Harting Electric Gmbh & Co. Kg Kapazitives Sensormodul für einen Steckverbinder
DE102015105262A1 (de) 2015-04-08 2016-10-13 Harting Electric Gmbh & Co. Kg Kapazitives Sensormodul für einen Steckverbinder

Also Published As

Publication number Publication date
DK1898682T3 (da) 2011-08-29
EP1898682A3 (de) 2009-07-01
ES2365936T3 (es) 2011-10-13
DE102006041610B3 (de) 2008-05-08
ATE509512T1 (de) 2011-05-15
EP1898682A2 (de) 2008-03-12

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