DK1898682T3 - Metalliseret plastoverflade og fremgangsmåde til bearbejdning og metallisering af plastoverflader - Google Patents

Metalliseret plastoverflade og fremgangsmåde til bearbejdning og metallisering af plastoverflader

Info

Publication number
DK1898682T3
DK1898682T3 DK07017347.1T DK07017347T DK1898682T3 DK 1898682 T3 DK1898682 T3 DK 1898682T3 DK 07017347 T DK07017347 T DK 07017347T DK 1898682 T3 DK1898682 T3 DK 1898682T3
Authority
DK
Denmark
Prior art keywords
contact area
plastic
machining
metallizing
metallized
Prior art date
Application number
DK07017347.1T
Other languages
English (en)
Inventor
Bernhard Stauffer
Christine Gliss
Michael Graetz
Jens Krause
Original Assignee
Harting Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harting Ag filed Critical Harting Ag
Application granted granted Critical
Publication of DK1898682T3 publication Critical patent/DK1898682T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
DK07017347.1T 2006-09-05 2007-09-05 Metalliseret plastoverflade og fremgangsmåde til bearbejdning og metallisering af plastoverflader DK1898682T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006041610A DE102006041610B3 (de) 2006-09-05 2006-09-05 Metallisierte Kunststoffoberfläche und Verfahren zum Bearbeiten von metallisierten Kunststoffoberflächen

Publications (1)

Publication Number Publication Date
DK1898682T3 true DK1898682T3 (da) 2011-08-29

Family

ID=38812021

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07017347.1T DK1898682T3 (da) 2006-09-05 2007-09-05 Metalliseret plastoverflade og fremgangsmåde til bearbejdning og metallisering af plastoverflader

Country Status (5)

Country Link
EP (1) EP1898682B1 (da)
AT (1) ATE509512T1 (da)
DE (1) DE102006041610B3 (da)
DK (1) DK1898682T3 (da)
ES (1) ES2365936T3 (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011055117A1 (de) 2011-11-08 2013-05-08 Harting Kgaa Verfahren und Lösung zur Metallisierung von Polymeroberflächen
DE102012105257B4 (de) 2012-06-18 2018-06-07 HARTING Electronics GmbH Isolierkörper eines Steckverbinders
DE102012105256A1 (de) 2012-06-18 2013-12-19 HARTING Electronics GmbH Isolierkörper eines Steckverbinders
DE102012111646B4 (de) 2012-11-30 2016-08-18 HARTING Electronics GmbH Isolierkörper mit integriertem Schirmelement
DE102015104838B4 (de) 2015-03-30 2018-07-19 Harting Electric Gmbh & Co. Kg Sensormodul eines modularen Steckverbinders
DE102015105262A1 (de) 2015-04-08 2016-10-13 Harting Electric Gmbh & Co. Kg Kapazitives Sensormodul für einen Steckverbinder

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192015A (en) * 1991-11-20 1993-03-09 Santa Barbara Research Center Method for wire bonding
DE10132092A1 (de) * 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
EP1383360B1 (de) * 2002-07-18 2007-01-03 FESTO AG & Co Spritzgegossener Leiterträger und Verfahren zu seiner Herstellung
DE10256719A1 (de) 2002-12-04 2004-07-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrische Kontaktstruktur sowie Verfahren zur Herstellung derselben
DE10327767A1 (de) * 2003-06-18 2005-01-05 Marconi Communications Gmbh Schaltungsbaugruppe und Herstellungsverfahren dafür

Also Published As

Publication number Publication date
ATE509512T1 (de) 2011-05-15
EP1898682A2 (de) 2008-03-12
EP1898682A3 (de) 2009-07-01
EP1898682B1 (de) 2011-05-11
ES2365936T3 (es) 2011-10-13
DE102006041610B3 (de) 2008-05-08

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